TU-883 High-Speed ​​PCB Manufactures bakeng sa Networking Systems

PCB Laminate ea lebelo le phahameng le e tlase bakeng sa RF, HPC, le Telecom

Ho Highleap Electronics, re sebetsa ka ho khetheha ho hlahiseng le ho kopanya li-PCB re sebelisa thepa e tsoetseng pele ea tahlehelo e tlase joalo ka TU-883, e leng motheo oa ThunderClad® 2 laminate system. E hlophisitsoe ke Taiwan Union Technology Corporation (TUC), TU-883 ke mokhoa o phahameng oa ts'ebetso oa resin o matlafalitsoeng ka lesela la E-glass-e phethahetseng bakeng sa lisebelisoa tse hlokang Df e tlaase, kamehla ea dielectric e tsitsitseng, le botšepehi bo ikhethang ba mocheso le mochine.

Lisebelisoa tsa bohlokoa li kenyelletsa:

• Li-backplane tsa lebelo le holimo le likarete tsa line
• Li-circuits tsa pele tsa RF le microwave
• Liteishene tsa motheo tsa 5G le lisebelisoa tsa marang-rang
• Li-server, polokelo, li-routers le litsamaiso tsa mehala

TU-883 ha e na halogen, e lumellana le RoHS, 'me e tsamaisana le mekhoa e fetotsoeng ea FR-4. E fana ka ts'ebetso e ts'eptjoang ho pholletsa le lipotoloho tsa soldering, khatello ea mocheso, le maemo a feteletseng a tikoloho.

Ke Hobane'ng ha TU-883 e Loketse bakeng sa Tlhahiso e Phahameng ea Lebelo, Multilayer PCB

TU-883 ke laminate e sebetsang hantle haholo e etselitsoeng ho fihlela litlhoko tse thata tsa li-circuits tsa kajeno tsa lebelo le phahameng, tse phahameng haholo tsa digital le RF.

Hore na o rala backplane ea 28G+ SerDes kapa boto ea RF e nang le mekhahlelo e mengata, TU-883 e fana ka botšepehi bo ikhethang ba lets'oao, botsitso ba litekanyo, le ts'epo ea mocheso, e leng se etsang hore e be khetho e tsebahalang ea thepa e nang le tahlehelo e tlase bakeng sa baenjiniere ba batlang ho ntlafatsa ts'ebetso le litšenyehelo.

Melemo ea Bohlokoa ea TU-883 Meralong e Phahameng ea lebelo:

• Thepa e tlase ea tahlehelo bakeng sa matšoao a GHz-speed - e nang le "dissipation factor" (Df) ea 0.0045 feela ho 10 GHz, TU-883 e fokotsa ho fokotseha ha lets'oao ka mesaletsa e telele kapa likhokahano tsa multilayer.
• Dielectric e tsitsitseng kamehla (Dk = 3.39) bakeng sa taolo e sa lebelloang ea impedance le ho nepahala ha papiso.
• E ntle ka ho fetisisa ea Z-axis CTE (2.5%) e netefatsa ts'epo e tsitsitseng ea plated-through-hole (PTH) ho pholletsa le li-stackups tse ngata tse rarahaneng.
• E loketse bakeng sa stackup ea PCB ea multilayer e phahameng ka ho kopanya lebasetere (FR4, polyimide, kapa lisebelisoa tse ling tsa TUC).
• Halogen-free & RoHS e lumellana, e loketse lisebelisoa tsa elektroniki tse tala le mebaraka ea kantle ho naha.
• E hanyetsana le CAF ebile e sebetsa haholo, e etsa hore e tšoanele HDI, BGA, le lits'ebetso tsa line-line.

Haeba u batla li-laminate tsa PCB tsa tahlehelo e tlase bakeng sa li-routers tsa backplane, liteishene tsa motheo tsa 5G, kapa lisebelisoa tsa tlhahlobo ea maqhubu a phahameng, TU-883 ke khetho e tšepahalang har'a baqapi ba lisebelisoa tsa RF le tsa dijithale lefatšeng ka bophara.

TU-883 PCB Fabrication & Assembly Services at Highleap Electronics

Ho Highleap Electronics, re ikhethile ka ho etsa li-PCB ka lebelo le phahameng le lits'ebeletso tsa ho kopanya li-turnkey re sebelisa li-laminate tsa TU-883 tse tsoang ho Taiwan Union Technology Corporation (TUC). TU-883, e ntlafalitsoe bakeng sa meralo ea dijithale e nang le mekhahlelo e mengata, e fana ka drift e tlase ea Drk, taolo e tiileng ea impedance, le ts'epo ea mocheso, e leng se etsang hore e be e loketseng marang-rang, polokelo le li-PCB tsa backplane.

Bokhoni ba rona ba TU-883 PCB bo kenyeletsa:

• Ho etsoa ka mokhoa o nepahetseng ka ± 5% e laoloang ke impedance bakeng sa lipara tse fapaneng, liteishene tsa SerDes, le libese tse lebelo le phahameng (mohlala, PCIe, DDR5).
• Ts'ehetso e felletseng bakeng sa li-prepreg tsa TU-883P le li-stackups tse nyalisitsoeng, ho kenyeletsoa kopanyo ea FR4 + TU-883 bakeng sa ntlafatso ea ts'ebetso ea litšenyehelo.
• E tsoetseng pele ka meaho: ka-ka-pad, ka ho tlatsa, li-microvias tse pakiloeng, le tšehetso ea HDI e entsoeng ka laser.
• Lintlafatso tsa mocheso le mochini: ho leka-lekanya koporo, meaho ea sekoti, le masoba a koahetsoeng ka resin bakeng sa botšepehi ba matšoao le ho ts'epahala ha boto.
• Kopano ea SMT ea ka tlung e nang le liphutheloana tsa 01005, QFN, le BGA. Teko e felletseng: AOI, X-ray, le netefatso ea ts'ebetso e kenyelelitsoe.
• Prototyping e potlakileng le tlhahiso ea molumo oa lefats'e-ho tloha ho 2-layer ho ea ho 40+ multilayer TU-883 boards.

Re sebelisa feela 100% lisebelisoa tsa mantlha tsa TU-883, 'me liboto tsohle li kopana le litekanyetso tsa IPC Class 2/3 tse nang le traceability e felletseng ea thepa.

Fumana Quote kapa Tlhahlobo ea Stackup

Na u na le moralo oa TU-883 o itokisitseng, kapa o hloka thuso ho e rera? Ikopanye le Highleap Electronics ho buisana ka morero oa hau le ho fumana tataiso ea profeshenale mabapi le khetho ea lisebelisoa tsa PCB tsa lebelo le holimo, moralo oa li-stackup, le maqheka a laoloang ke impedance.