Hobaneng Teko ea PCB e Hlokahala: Tataiso e Phethahetseng ea Mekhoa ea Tlhahlobo ea PCBA

Kakaretso ea Phethahatso: Teko ea PCB ke leano la bohlokoa la ho fokotsa likotsi le fetang hole liteko tse bonolo tsa pono. Protocol e felletseng ea teko e kenyelletsa netefatso ea sebopeho (AOI, X-Ray), netefatso ea motlakase (ICT, Flying Probe, Impedance), le netefatso ea botšepehi (Teko ea Khatello ea Kelello le ho Chesa). Tataiso ena e hlalosa mokhoa o mong le o mong oa bohlokoa oa teko ea PCB ho u thusa ho khetha leano le nepahetseng la tlhahlobo le ho thibela ho hloleha ha tšimo ho turang.

1. Litšenyehelo tsa 'Nete tsa ho Tlola Teko ea PCB

Bakeng sa baenjiniere ba disebediswa tsa hardware le batsamaisi ba dihlahiswa, ho fumana phoso e bolayang botong ya potoloho e hatisitsweng ka mora hore e fihle mmarakeng ke toro e mpe ka ho fetisisa. Ke hobaneng ha tlhahlobo ya PCB e hlokahala? Hobane ditjeo tsa ho lokisa phoso di eketseha ka potlako mohatong o mong le o mong wa tlhahiso.

• Mohato oa Moralo: 1x Litšenyehelo tsa ho lokisa (Ho ntlafatsa lifaele tsa Gerber)
• Mokhahlelo oa ho Etsa Li-Prototype: 10x Litšenyehelo tsa ho lokisa (Ho lokisa mapolanka a 'maloa bocha)
• Tlhahiso ka bongata: Litšenyehelo tse 100 tsa ho lokisa (Ho hlakola sehlopha sohle)
• Tšimong: Litšenyehelo tse 1000+ tsa ho lokisa (Ho hopoloa ha sehlahisoa, tšenyo ea lets'oao, le likopo tsa waranti)

Ho Highleap Electronic , re kenya tshebetsong diprothokholo tse matla tsa teko nakong yohle ya tlhahiso le kopano ya PCB ho netefatsa hore dihlahiswa tsa hao di sebetsa hantle maemong ao di rerilweng ho ona.

2. Mokhoa oa Tlhahlobo ea PCB

Ha ho na mokhoa o le mong o lumellanang le tsohle oa tlhahlobo ea PCBA. Sehlopha se setle sa liteko se itšetlehile ka bongata ba likarolo, litlhoko tsa lebelo le phahameng, le tikoloho ea ts'ebetso. Mona ke tlhaloso e felletseng ea mekhoa ea liteko tsa maemo a indasteri.

3. Tlhahlobo ea Pono le ea Sebopeho

Tlhahlobo e Ikemetseng ea Optical Inspection (AOI)

AOI e sebelisa lik'hamera tse nang le qeto e phahameng ho bapisa boto e kopantsoeng le data ea pele ea Gerber/CAD. E sebetsa hantle haholo ho tšoaseng liphoso tsa boemo ba holimo joalo ka ho betla mabitla, likarolo tse sieo, le tataiso e fosahetseng ea likarolo. Leha ho le joalo, AOI ha e bone ka tlas'a likarolo.

Tlhahlobo ea X-Ray e Iketsang (AXI)

Ha meralo e ntse e teteana, dikarolo tse kang Ball Grid Arrays (BGAs) le QFN di pata manonyeletso a tsona a solder tlasa sephutheloana. Tlhahlobo ya 2D le 3D X-Ray e kenella ka hara dipakete tsa IC ho hlahloba manonyeletso a solder ka tlase. Ke yona feela tsela e tshepahalang ya ho lemoha di-solder tse patilweng, ho kolobisa ho sa lekaneng, le di-short tse ka hare, ho netefatsa hore ho se be le di-solder ho dula ho le ka tlase ho moedi o amohelehang wa maemo a IPC (hangata < 25%).

4. Teko ea Botšepehi ba Motlakase le Matšoao

Teko ea Tlhahlobo ea ho Fofa Khahlanong le Teko ea ka Hare ho Potoloho (ICT)

Ho netefatsa dikgokelo tsa motlakase (ho hlahloba di-open tse kotsi le di-short shorts):

• Teko ea ho Fofa ea ho Fofa (FPT): E sebelisa li-probe tsa roboto tse tsamaeang ho leka boto. E loketse bakeng sa Mohlala oa PCB hobane ha e hloke lisebelisoa tse ikhethileng.
• Teko ea Potoloho (ICT): E sebelisa sesebelisoa sa "bethe ea manala" se ikhethileng ho leka boto eohle ka nako e le 'ngoe. E potlakile haholo ebile e theko e tlase bakeng sa tlhahiso e kholo ea bongata.

Teko ea Impedance (TDR)

Bakeng sa meralo ea sejoale-joale ea lebelo le phahameng (joalo ka libese tsa memori tsa DDR, PCIe, kapa lipotoloho tsa RF), ho hlahloba feela ho tsoela pele ha hoa lekana. Time Domain Reflectometry (TDR) e sebelisoa ho lekanya trace impedance. Haeba trace impedance e fetoha ka lebaka la bophara bo sa lokelang ba trace kapa botenya ba dielectric, ponahatso ea lets'oao e tla etsahala, e senya data ea lebelo le phahameng. TDR e netefatsa hore boto ea hau e fihlela mamello e tiileng ea botšepehi ba lets'oao.

5. Teko ea Botšepehi le Khatello ea Tikoloho

Na PCBA ea hau e tla pholoha lefatšeng la 'nete? Bakeng sa lihlahisoa tse sebelisoang libakeng tse thata, liteko tsa 'mele le tsa mocheso lia hlokahala:

• Teko ea ho Chesa le ho Tsofala: Boto e butswe mme e sebetsa ka bokgoni bo phahameng ka ontong e laolwang (hangata ho 85°C ho isa ho 125°C) ka dihora tse 24 ho isa ho tse 168. Sena se qobella dikarolo tse fokolang ho hloleha pele sehlahiswa se tloha fekthering (ho fedisa "lefu la masea").
• Thermal Shock & Cycling: PCB e sisinyeha ka potlako pakeng tsa serame se feteletseng le mocheso o feteletseng. Sena se leka ho se tshwane ha coefficient of thermal expansion (CTE), ho netefatsa hore li-via le li-solder joints li ke ke tsa petsoha tlas'a khatello ea mocheso.
• Khatello ea Maikutlo le ho Thothomela ha Mekaniki: E etsisa ho theoha ha motlakase, maemo a ho romelloa ha motlakase, le ho thothomela ha enjene ho netefatsa hore likarolo tse boima (joalo ka li-inductor kapa li-capacitor tse kholo) ha li senyehe botong.
• Teko ea Matla a Peel le Lamination: E leka ho khomarela ha foil ea koporo ho substrate ea dielectric, ho netefatsa hore likarolo tsa PCB li ke ke tsa arohana tlas'a mocheso o phahameng.

6. Ntlafatsa Boto ea Hao: Moralo oa ho Lekoa (DFT)

Teko e ntle feela ka moralo oa boto. Ho fokotsa litšenyehelo tsa liteko le nako, baenjiniere ba lokela ho sebelisa melao-motheo ea Design for Testability (DFT) nakong ea mohato oa moralo:

• Kenya lintlha tse lekaneng tsa teko (li-pad) bakeng sa li-node tsohle tsa bohlokoa, haholo-holo ka lehlakoreng le leng la boto.
• Design HDI liboto ka ho nahana ka litataiso tse nepahetseng tsa taolo ea impedance ho netefatsa hore o pasa liteko tsa TDR.
• Siea sebaka ho potoloha likarolo tse telele e le hore li-angle tsa X-Ray le li-probe tsa ICT li se ke tsa sitisoa.

7. Netefatsa hore ha ho na diphoso ka Highleap Electronic

Ho Highleap Electronic, ha re kopanye mapolanka feela; re netefatsa ts'ebetso ea 'ona lefatšeng la sebele. Hore na o hloka teko ea botsofali bakeng sa molaoli oa indasteri ea thata, taolo e tiileng ea TDR impedance bakeng sa ho tsamaisa lebelo le phahameng, kapa X-Ray e nepahetseng ea 3D bakeng sa moralo o teteaneng oa BGA, setsi sa rona se na le lisebelisoa tsa tlhahlobo tsa sejoale-joale.

Se ke oa tlohela botšepehi ba sehlahisoa sa hau bo le kotsi. Ho kenyelletsa mekhoa e nepahetseng ea liteko ho tloha qalong ho netefatsa phetoho e boreleli ho tloha tlhahisong ea prototype ho ea tlhahisong e se nang sekoli.

Fumana Khoteshene ea PCBA e Ikhethileng le Morero oa Teko Kajeno