Mokhoa oa Kopano ea PCB ea Chip-on-Board le Botšepehi

Ho utloisisa Chip On Board Technology

Chip On Board ke Eng

Chip ka botong e emela mokhoa oa ho paka moo ho shoang ha semiconductor ho kenngoeng ka kotloloho holim'a liboto tsa potoloho tse hatisitsoeng ho fapana le ho kenngoa ka har'a liphutheloana tsa setso. Lefu le khomarela karolo e ka tlaase ea PCB ka sekhomaretsi kapa solder, ka likhokahano tsa motlakase tse thehiloeng ka li-wire bonding kapa mekhoa ea flip-chip. Mokhoa ona oa ho kopanya ka ho toba o felisa mohato oa ho paka oa bohareng, ho theha kopano e tsitsitseng le e sebetsang hantle.

Evolution from Traditional Packaging

Phetoho ho tloha mekhoeng e tloaelehileng ea ho paka joalo ka QFP le BGA ho ea ho theknoloji ea chip onboard e hlahile ka lebaka la litlhoko tsa mehato e menyenyane ea lisebelisoa le ts'ebetso e ntlafetseng ea mocheso. Liphutheloana tsa setso li eketsa bolelele, boima le khanyetso ea mocheso lipakeng tsa die le PCB. Theknoloji ea COB e sebetsana le mefokolo ena ka ho tlosa mokena-lipakeng oa sephutheloana, e nolofalletsang litsela tse khutšoane tsa khokahano le ho qhala ha mocheso ka kotloloho ka substrate ea boto.

Karolo ea COB ho PCB Manufacturing

Ka har'a ts'ebetso ea kopano ea PCB, kopanyo ea chip holim'a boto e hloka bokhoni bo ikhethang ho feta tekhenoloji e tloaelehileng ea holim'a holim'a metsi. Ts'ebetso e hloka lisebelisoa tse nepahetseng tsa ho beoa, mochini o tlamang mohala, le litsamaiso tsa encapsulation. Baetsi ba PCB ba tlameha ho hokahanya boitokiso ba li-substrate, liphetho tsa bokaholimo, le moralo oa boto ho amohela sehokelo sa lefu le ho netefatsa ts'epahalo nakong eohle ea ts'ebetso ea kopano.

Ts'ebetso ea Kopano ea Chip On Board

Tokiso ea Substrate

PCB substrate e ea kalafong e hlokolosi ea holim'a metsi pele e e-shoa. Ho hloekisa ho tlosa lintho tse silafatsang tse ka senyang ho khomarela, ha khetho ea holim'a metsi-hangata e pentiloe ka khauta e teteaneng kapa ENIG-e tiisa hore ho tlamahanngoa ka terata e tšepahalang. Tšebeliso ea sekhomaretsi kapa deposition ea solder e etsahala libakeng tse khethiloeng tsa lefu, ka nepo ho beoa hoa bohlokoa bakeng sa ts'ebetso e latelang ea bonding.

Die Attachment Mekhoa

Bare dies mount ho boto ka likhomaretsi tse tsamaisang kapa tse se nang conductive, ho latela litlhoko tsa mocheso le motlakase. Li-epoxies tsa conductive li fana ka litsela tsa motheo tsa motlakase, ha li-adhesives tse futhumatsang li ntlafatsa mocheso oa mocheso. Boemo ba sistimi ea ho beoa bo shoa ka nepo ea boemo ba micron, bo lateloa ke lipokoloho tsa pheko tse theha maqhama a mochini lipakeng tsa silicon le substrate.

Mekhoa ea Khokahano

Khokahano ea terata e ntse e le mokhoa o ka sehloohong oa ho hokahanya ha boto, o sebelisa lithapo tse ntle tsa khauta kapa tsa aluminium ho hokela liphaephe le mesaletsa ea PCB. Ultrasonic kapa thermosonic bonding e etsa manonyeletso a metallurgical lipheletsong tse peli tsa terata ka 'ngoe. Flip-chip e atamela ka ho khelosa dae, e hokahana ka maqhutsu a solder kapa litšiea tsa koporo bakeng sa lits'ebetso tse phahameng tse hlokang bolelele bo khuts'oane ba khokahanyo.

Encapsulation le Tshireletso

Kamora ho hokahana, li-glob-top epoxy kapa li-compounds tsa ho bopa li koahela li-bond tsa terata. Lera lena le sireletsang le sireletsa khahlanong le mongobo, khatello ea mechine le litšila tse silafatsang tikoloho. Khetho ea thepa e leka-lekanya li-coefficients tsa katoloso ea mocheso pakeng tsa silicon, sekhomaretsi, le substrate ea PCB ho fokotsa khatello ea maikutlo nakong ea ho palama baesekele.

Teko le netefatso

Teko ea motlakase e netefatsa ts'ebetso pele e kenngoa ka ho qetela ha ho khoneha, le hoja li-chip tse ling li lekoa ka mor'a hore li kenngoe ka ho feletseng. Netefatso ea ts'epo e kenyelletsa ho palama baesekele ea mocheso, ho pepesetsoa mongobo, le tlhahlobo ea khatello ea maikutlo ho netefatsa hore kopano e fihlela litlhoko tse boletsoeng tsa bophelo bohle ho pholletsa le mekhahlelo ea mocheso oa ts'ebetso.

Melemo ea Chip On Board Integration

Phokotso ea Boholo le Litšenyehelo

Theknoloji ea Chip on board e felisa litšenyehelo tsa liphutheloana mme e fokotsa palo ea kopano ka kakaretso. Ntle le liphutheloana tse jang sebaka sa boto, baqapi ba fihlella bongata bo phahameng ba likarolo. Ts'ebetso ena ea sebaka e ipakile e le ea bohlokoa haholo lihlahisoa tse nyane moo milimithara e 'ngoe le e 'ngoe e leng bohlokoa.

Ts'ebetso e Ntlafetseng ea Motlakase

Litsela tse khuts'oane tse hokahantsoeng ka har'a chip ka har'a likopano tsa boto li fokotsa inductance ea parasitic le capacitance. Botšepehi ba mats'oao bo ntlafala ka bolelele bo fokotsehileng ba ho latella lipakeng tsa li-pads le li-circuits tsa PCB. Monyetla ona oa ts'ebetso o thusa lits'ebetso tsa maqhubu a holimo moo inductance ea lead lead e ka fokotsang lebelo la ts'ebetso.

Taolo e Ntlafetseng ea Thermal

Khokahano e tobileng ho li-substrates tsa PCB e theha litsela tse sebetsang hantle tsa mocheso bakeng sa ho qhala mocheso. Ho hanyetsa mocheso ho fokotseha ha ho bapisoa le lisebelisoa tse pakiloeng moo 'mele oa sephutheloana o sitisang ho phalla ha mocheso. Tšobotsi ena e etsa hore chip on board e tšoanelehe bakeng sa lisebelisoa tsa elektroniki tsa matla le li-processor tse sebetsang hantle. Aluminium substrates le ho feta ho ntlafatsa conductivity ea mocheso ha ho hlokahala.

Melemo ea bohlokoa ea COB

Mokhoa oa chip on board o fana ka melemo e ikhethang ho litekanyo tse ngata tsa ts'ebetso:

• Bophahamo bo fokotsehile - Ho felisoa ha 'mele oa liphutheloana ho thusa ho boloka sebaka sa 40-60% ha se bapisoa le likarolo tse lekanang tse pakiloeng.
• Ho hanyetsa mocheso o tlase - Khokahano e tobileng ea "die-to-board" e fana ka litselana tsa mocheso ho isa ho tse tlase ho 1-3 ° C / W.
• Ho sebetsa hantle ka litšenyehelo - Phokotso ea litšenyehelo tsa thepa ea 20-30% e fihletsoeng ka ho felisoa ha sephutheloana ka tlhahiso e phahameng ea molumo
• Botšepehi ba pontšo - Bolelele ba ho hokahanya ka tlase ho 3mm bo fokotsa litlamorao tsa likokoana-hloko lits'ebetsong tsa maqhubu a holimo

Ka kopanelo, melemo ena e etsa hore theknoloji ea chip-on-board e be tharollo e khahlang bakeng sa baenjiniere ba batlang likopano tsa elektroniki tse sebetsang hantle, tse sebetsang hantle le tse baballang chelete e ngata.

Mefokolo le Liqholotso ho Tlhahiso ea Chip On Board

Ts'ebetso e rarahaneng

Chip ka har'a boto kopano e hloka libaka tse laoloang tsa phaposi e hloekileng le lisebelisoa tse khethehileng. Ho sebetsana le lefu ho hloka ho nepahala ho qoba tšenyo kapa tšilafalo. Khokahano ea terata e ama chai, 'me bonto ka 'ngoe e hloka litekanyetso tse nepahetseng. Litlhoko tsena tsa ts'ebetso li eketsa ho rarahana ha tlhahiso ha li bapisoa le kopano e tloaelehileng ea holim'a marulelo.

Bokhoni bo fokolang ba ho Rework

Hang ha e se e kentsoe, li-chipboard tsa likopano li fetoha ka ho sa feleng. E hlolehileng e shoa e ke ke ea tlosoa le ho nkeloa sebaka ntle le ho senya sebaka sa PCB. Baetsi ba tlameha ho fumana lihlahisoa tse phahameng tsa pele, kaha litšenyehelo tsa sekhechana li kenyelletsa lefu le le leng la PCB.

Litšitiso tsa Moralo le ho Tšepahala

Lisebelisoa tse phahameng tsa I/O li ka 'na tsa thulana le mefokolo ea khokahanyo ea terata ka lebaka la ho phahama le ho hlaka ha terata. Li-wire bond tse telele li hlahisa inductance e ka amang botšepehi ba mats'oao ka maqhubu a phahameng. Likamano tse fapaneng tsa katoloso ea mocheso lipakeng tsa silicon, sekhomaretsi, encapsulant le PCB li baka khatello ea maikutlo nakong ea ho palama baesekele.

Litaelo tsa Moralo oa PCB bakeng sa Chip On Board

Litlhoko tsa Qetello ea Bokaholimo

Ho tšepahala ha terata ho itšetlehile ka boleng ba ho qetela le botenya. Electroless nickel mersion gold (ENIG) e fana ka sebaka se bataletseng, se tlamahanoang ka bophelo bo botle ba lishelefo. Ho roala khauta e thata ho fana ka matla a holimo a ho kopanya empa ho eketsa litšenyehelo. Qetello e tlameha ho se be le tšilafalo le oxidation ka nako ea ho kopanya.

Leqephe lena le bua ka mekhoa ea ho kopanya li-chip-on-board, eseng lisebelisoa tsa elektroniki tsa drone tse akaretsang. Bakeng sa khetho ea likarolo tsa drone le moelelo oa ts'ebeliso, bona tataiso ea ts'ebeliso ea li-chip tsa drone ; bakeng sa ts'ehetso ea tlhahiso, Highleap e lekola mosebetsi oa COB ka bokhoni ba eona ba ho kopanya PCB.

Ka Leano la Tsamaiso

Fumana ka ntle ho moeli oa "die footprint" le "encapsulant" ho thibela "epoxy wicking" ka masoba. Haeba vias tlameha ho ba teng ka hare ho libaka tsena, bolela ka ho feletseng plugging ka koporo kapa non-conductive tlatsa, lateloa ke planarization. Li-vias tse sa koaloang li theha lintlha tse fokolang moo ho khomarela ha encapsulant ho hlōleha le mongobo o ka phunyeletsa.

Sebopeho sa Fiducial le Bond Pad

Thepa e ikemetseng le lisebelisoa tsa terata li hloka litšupiso tse nepahetseng tsa boemo. Beha matšoao a mofuta oa crosshair ho fapana le lipaterone tse chitja bakeng sa temoho e nepahetseng ea mochini. Rala meralo ea li-bond pad ho fokotsa le ho leka-lekanya bolelele ba terata ho potoloha periphery ho thibela ho se leka-lekane ha hona joale le phapang ea khatello ea mochini.

Mekhahlelo e Bohlokoa ea Moralo

Katleho ea chip ts'ebetsong ea boto e itšetlehile ka ho khomarela mekhoa e khethehileng ea moralo:

• Khauta qetellong botenya - Bonyane 0.05μm ea khauta e khanyang kapa 0.75-1.25μm khauta e thata bakeng sa khokahanyo ea terata e tšepahalang
• Sekheo sa bond pad - Boloka molumo o tlase oa 150-200μm ho thibela khaello ea terata nakong ea ts'ebetso ea bonding
• Bophahamo ba khoele ea mohala - Fana ka tumello ea 200-400μm ka holim'a sebaka sa lefu bakeng sa tšireletso ea encapsulant
• Thermal ka density - Beha li-vias tse futhumatsang ka har'a 1mm ea perimeter bakeng sa ho hasana ha mocheso hantle

Thermal Design Integration

Ho behoa ha bare die ka ho toba ho susumetsa ts'ebetso ea mocheso. Maemo a matla a phahameng a shoa haufi le tsela ea mocheso kapa libaka tse nang le botenya ba koporo bo matlafalitsoeng. Nahana ka mekhoa ea ho jala mocheso ka har'a likarolo tsa PCB. Bakeng sa meroalo e feteletseng ea mocheso, li-substrates tsa aluminium kapa lichelete tsa tšepe tse kentsoeng tsa koporo li fana ka litsela tse phahameng tsa ho qhala mocheso ho tloha sebakeng sa makhalo ho ea ho lisinki tsa mocheso tse kantle.

Lintlha tsa Tlhahiso bakeng sa Chip On Board PCB

Khetho ea Lintho tsa Boto

Merero ea chip e sebetsang ka har'a boto e hloka li-substrate tsa PCB tse nang le thepa e loketseng ea mocheso le liphetho tsa bokaholimo. FR-4 e sebeletsa lits'ebetso tse akaretsang, ha liboto tse tšehelitsoeng ke aluminium li lumellana le litlhoko tsa matla a phahameng. Li-PCB tsa mantlha tsa tšepe li fana ka ho hasana ho matlafalitsoeng ha mocheso bakeng sa lits'ebetso tse sebelisang mocheso o mongata.

Litlhoko tsa Meaho ea Tlhahiso

Lisebelisoa tsa ho sebetsana le chip ka sekepeng li hloka li-bonders, li-wire bonding system, lisebelisoa tsa ho fana ka likhomaretsi le li-encapsulants, le lionto tse phekolang. Tekanyo le tlhokomelo ea lisebelisoa li ama chai ka kotloloho. Libaka tse hloekileng tsa tlhahiso li thibela tšilafalo ea likaroloana nakong ea ho kopanya le ho tlamahanngoa.

Customer Communication Protocol

Tšebelisano ea pele pakeng tsa baetsi ba PCB le bareki e ipaka e le ea bohlokoa bakeng sa katleho ea chip. Litlhaloso tsa lefu, litšoantšo tse tlamang, mefuta ea li-encapsulant, le litlhoko tsa mocheso li tlameha ho hlalosoa ka ho hlaka. Bafani ba thepa ba lokela ho fana ka litokomane tse qaqileng tsa tšebetso, 'me moo ho loketseng, ba fane ka livideo tsa tšebetso tse bontšang bokhoni.

Likopo tsa indasteri tsa Theknoloji ea Chip On Board

Lisebelisoa tsa Leseli tsa LED

Di-module tsa LED tse nang le chip tse ka hara boto di laola ditshebediso tsa mabone a kganyang haholo. Di-dies tse ngata tsa LED di kenngwa hodima di-substrate tsa aluminium, di hlahisa mehlodi ya mabone a tshwanang ka taolo e ntle ya mocheso. Sebopeho sena se eketsa bokgoni ba kganya ha ka nako e ts'oanang se fokotsa ditjeo tsa diphutheloana maboneng a koloi, mabone a kgwebo le mabone a ikgethang.

Lisebelisoa tse apereng le tsa IoT

Miniaturization e hloka hore chip e amoheloe ka har'a lisebelisoa tsa elektroniki tse aparoang le li-sensor tsa IoT. Li-smartwatches, li-trackers tsa boikoetliso, le lithuso tsa ho utloa li sebelisa theknoloji ea COB ho fihlela lintlha tse nyane. Ho felisoa ha bophahamo ba sephutheloana ho etsa hore meralo e menyenyane ea lihlahisoa ha lisebelisoa tse hokahaneng li ntse li ata.

Menyetla e Hlahang ea Marakeng

Ho nts'etsapele lits'ebetso tsa 5G le lits'ebetso tsa millimeter-wave ho theha menyetla ea chip ka har'a li-module tsa RF moo ho nang le li-parasitics tse nyane tse hokahaneng. Lisebelisuoa tsa motlakase li ntse li tsoela pele ho amohela COB bakeng sa ho khanna likoloi le ho fetola matla, ha lisebelisoa tsa elektroniki tsa likoloi li amohela theknoloji ea li-module tsa taolo tse haelloang ke sebaka.

Melemo ea Kopo ka Lekala

Liindasteri tse fapaneng li sebelisa chip ho thekenoloji ea boto bakeng sa litlhoko tse ikhethang tsa ts'ebetso:

• lighting LED - Lintlafatso tsa matla a mocheso a 25-35% ka ho kenya substrate ka kotloloho ea aluminium
• Wearables - Phokotso ea botenya ba sesebelisoa e nolofalletsang lintlha tse tlase ho bolelele ba kopano ea 5mm
• RF modules - Phokotso ea tahlehelo ea mats'oao ka li-parasite tsa khokahano e fokotsehileng ka 50-70% khahlano le mefuta e meng e pakiloeng
• Lisebelisoa tsa elektronike - Phokotso ea mocheso oa 15-20 ° C ka ho kopanya mocheso o matlafalitsoeng
• Kfz-Händler - Kopano ea ntlafatso ea ts'epo ea AEC-Q100 Litlhoko tsa Kereiti ea 1 bakeng sa -40°C ho isa ho 150°C ts'ebetso

Melemo ena e ikhethileng e totobatsa kamoo theknoloji ea chip-on-board e thusang ts'ebetso e holimo, e ts'epahalang haholoanyane, le meralo e kopaneng ho feta lits'ebetsong tse fapaneng tsa elektroniki.

fihlela qeto e

Theknoloji ea Chip on board e fana ka melemo e matla bakeng sa lits'ebetso tse hlokang boholo ba komporo, katleho ea litšenyehelo, le ts'ebetso e ntlafalitsoeng. Mokhoa o otlolohileng oa "die-to-board" o felisa liphutheloana tsa setso ha o ntse o ntlafatsa litšobotsi tsa mocheso le motlakase. Leha ho le joalo, ts'ebetsong e atlehileng e hloka bokhoni bo khethehileng ba tlhahiso, ho shebisisa moralo o hlokolosi, le taolo e matla ea boleng.

Bakeng sa mekhatlo e hlahlobang litharollo tsa chip holim'a boto, ho khetha balekane ba nang le boiphihlelo ba tlhahiso ho paka bohlokoa. Lekola bokhoni ba barekisi ka tlhahlobo ea lits'ebeletso, tlhahlobo ea litokomane tsa tšebetso, le tlhahlobo ea sampole. Kopa lifitio tsa ts'ebetso ea tlhahiso tse bonts'ang ho nepahala ha ho beoa, ho ts'oara bonding, le boleng ba encapsulation.

Ho Highleap Electronics, bokgoni ba rona ba tlhahiso le ho kopanya PCB bo kenyeletsa mahlale a chip ka hara boto a nang le disetifikeiti tsa ISO 9001, ISO 13485, le IATF 16949. Re tshehetsa bareki ho tloha ditherisanong tsa meralo ho isa tlhahisong ya bongata, ho fana ka boiphihlelo ba botekgeniki le meralo ya motheo ya tlhahiso e hlokahalang bakeng sa kopanyo e atlehileng ya COB. Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka ditlhoko tsa chip ka hara boto ya hao.