Flex PCB ho Likhalase tse Smart: Bokhabane ba Boenjiniere bakeng sa Pono e Aparang ea Moloko o Latelang

Karolo ea Bohlokoa ea Flex PCB ho Nts'etsopele ea Likhalase tse Smart

Likhalase tse bohlale li emela ho kopana ha ponts'o e ncha, komporo e nyane, le moralo oa ergonomic. Moko-taba oa phetoho ena ke theknoloji ea PCB e feto-fetohang, e nolofalletsang kopanyo e bobebe, e bobebe ea likarolo tse rarahaneng tsa elektroniki ka har'a liforeimi tse tšesaane, tse ka roaloang.

Ligalaseng tse bohlale, li-PCB tse tenyetsehang lia hlokahala bakeng sa ho tsamaisa matšoao ho potoloha libaka tse kobehileng, ho hokahanya lipontšo tse nyane haufi le leihlo, le ho mamella liphetoho tse pheta-phetoang tsa mechini ntle le tahlehelo ea ts'ebetso. Moralo oa tsona o tlameha ho fihlela tekano e nepahetseng—ho kopanya ho tenyetseha, ts'epo ea motlakase, botsitso ba mocheso, le ts'ebeliso e ntle ea litšenyehelo—ho fetola likhalase tse bohlale ho tloha likhopolong tsa liteko ho ea lihlahisoa tse sebetsang tsa bareki.

Ho utloisisa Meaho ea Flex PCB bakeng sa Likhalase tse Smart

Litlhoko tsa Theknoloji ea Core bakeng sa Smart Glasses Flex PCB

Moralo oa Flex PCB bakeng sa likhalase tse bohlale o hlahisa liphephetso tse fetang lisebelisoa tse tloaelehileng tsa elektroniki. Litlhoko tsa Optical le ergonomic li hloka li-stack-ups tse tšesaane haholo-hangata ka tlase ho 0.10 mm-ha ho ntse ho bolokoa koporo ea 1 oz bakeng sa bokhoni bo lekaneng ba hajoale le botšepehi ba matšoao. Lipotoloho tsena li tlameha ho sebetsana le likhokahano tsa "ultra-high-density" bakeng sa lipontšo tse fihlang ho 3840 × 2160 resolution ka leihlo le leng, kaofela ka har'a geometry e kobehileng, e nang le sebaka se lekanyelitsoeng sa foreime ea likhalase.

Ntle le ho tsamaisa mats'oao, li-PCB tse flexible ka likhalase tse bohlale li boetse li sebetsa e le likarolo tsa sebopeho tse ts'ehetsang li-micro-displays, tse bolokang pono e nepahetseng ea optical, le ho chesa mocheso ho tsoa ho li-processor tse sebetsang ho fihla ho 2.5 GHz.

Maemo a Tshebetso a Smart Glasses Flex PCB

Li-PCB tse sebetsang hantle haholo bakeng sa likhalase tse bohlale li ba le ts'epo e tiileng le netefatso ea ts'ebetso. Mamello e matla ea ho kobeha e tlameha ho feta lipotoloho tse 50,000 sebakeng sa 5 mm radius, ka mefuta ea maemo a holimo e fihlelang lipotoloho tse fetang 100,000 ho netefatsa ho tšoarella ha nako e telele.

Ho boloka phetiso ea data e potlakileng bakeng sa li-interface tsa 8 Gbps +, ho sitisoa ho laoloang ha 50 Ω ± 10% (e phethiloeng ka bonngoe) le 100 Ω ± 10% (e fapaneng) ke ea bohlokoa. Litlhoko tsa taolo ea mocheso li kenyelletsa ho boloka mocheso oa motsoako o ka tlase ho 85 °C le libaka tse amanang le letlalo ka tlase ho 43 °C. Ho feta moo, lisebelisoa li tlameha ho kopana le tšireletso ea mongobo ea IPX4 le litekanyetso tsa ho hanyetsa UV tse fetang lihora tse 500 ntle le ho fifala kapa ho senyeha ha ts'ebetso.

Khetho ea Lisebelisoa tse Tsoetseng Pele bakeng sa Flex PCB ho Likhalase tse Smart

Theknoloji ea Substrate bakeng sa Ts'ebetso e Ntle

Polyimide e ntse e le eona substrate e ratoang bakeng sa li-PCB tse feto-fetohang ka likhalase tse bohlale, tse fanang ka botsitso bo phahameng ba mocheso (Tg ≈ 285 ° C) le thepa e ka tšeptjoang ea dielectric (Dk ≈ 3.5 @ 1 MHz). E fana ka tlhahiso e tsitsitseng le ho feto-fetoha ha maemo ho hlokehang bakeng sa meralo e ts'oanelang e ka roaloang.

Mefuta e fapaneng ea Thermoplastic polyimide (TPI) e eketsa ts'ebetso hape-ho lumella karolo e ncha ntle le ho senya substrate-e etsa hore e be e loketseng bakeng sa mekhahlelo ea prototype le e pheta-phetoang. Ho sa le joalo, li-substrates tsa crystal polymer (LCP) li fana ka ho monya mongobo o tlase haholo (<0.02%) le botsitso bo botle ba sebopeho. E nang le dielectric constant tsa 2.9 @ 10 GHz, LCP e loketse hantle bakeng sa likhalase tse bohlale tse kopanyang limojule tsa puisano tse se nang mohala tsa millimeter-wave.

Lintlafatso tsa Mokhanni

Rolled annealed (RA) koporo e ntse e le conductor e tloaelehileng bakeng sa likhalase tse bohlale tse feto-fetohang tsa PCB ka lebaka la ho hanyetsa mokhathala o phahameng. Lera la koporo la 18 μm le leka-lekanya conductivity le ho feto-fetoha ha maemo, ha koporo ea 12 μm e tšehetsa ho kobeha ho tiileng bakeng sa ho kopanya foreimi e nyenyane.

Liqeto tse holimo li ntlafatsa ts'ebetso le ts'epahalo. OSP (Organic Solderability Preservative) e fana ka ts'ireletso ea oxidation ea moruo nakong ea lifensetere tse khuts'oane tsa kopano, athe ENIG (Electroless Nickel Immersion Gold) e lelefatsa bophelo ba lishelefo 'me e netefatsa tšebelisano ea terata-e bohlokoa bakeng sa likhokahano tsa mokhanni tse nang le qeto e phahameng.

Mekhoa e meng e hlahang e kenyelletsa lifilimi tsa polymer tse tletseng silevera bakeng sa likhokahano tse otlollang likarolong tse ka fetoloang, le li-conductor tsa carbon nanotube, tse ka fokotsang boima ba potoloho ka kakaretso ho fihla ho 50% ho meralo ea moloko o latelang.

Mekhahlelo ea Tšireletso bakeng sa Smart Glasses Flex PCBs

Lisebelisoa tse koahelang li bapala karolo ea bohlokoa ho ts'epahalang nako e telele. Likoahelo tsa polyimide tse nang le li-adhesive tsa acrylic tse fetotsoeng li fihlela bolelele bo ka holimo ho 100% 'me li boloka ho khomarela ka mekhahlelo ea mocheso ho tloha -40 °C ho ea ho 150 °C.

Bakeng sa meralo e phahameng haholo, limaske tsa solder tse ka bonoang ke lifoto li nolofalletsa menyetla ea ho bula ho fihla ho 75 μm, e loketseng li-processor tse kentsoeng ka BGA le li-module tsa compact display. Li boetse li felisa mathata a ho ikamahanya le maemo a amanang le mekhoa e tloaelehileng ea ho koahela.

Ho fokotsa tšitiso ea motlakase, lifilimi tse kenyellelitsoeng tsa EMI tse sireletsang li kenyellelitsoe ho flex PCB stack-up. Lithebe tsa masela a koahetsoeng ka silevera li fana ka 60 dB attenuation ho 2.4 GHz ha li ntse li eketsa botenya bo sa tsotelleng-ho netefatsa botšepehi ba motlakase le lintlha tse boreleli tse ka roaloang.

Melao e nepahetseng ea Moralo bakeng sa Flex PCB ka Likhalase tse Smart

Mechanical Design Parameters

Moralo oa PCB e Flex ka likhalase tse bohlale o latela litataiso tsa IPC-2223C. Li-kobe tse sa fetoheng li hloka bonyane radius ea botenya ba kakaretso ba 6×, le li-kobe tse matla tsa 12× bakeng sa ts'epo ea nako e telele. Tsela ea ho latela e lokela ho fokotsa khatello ea mechine—ho sebelisoa li-curve tse boreleli ho fapana le likhutlo tse bohale le ho boloka li-conductor li otlolohile ho ea ho axis ea kobeho.

Li-Stiffeners (FR-4 kapa polyimide) li behiloe ka mokhoa o hlophisitsoeng tlas'a likarolo ha li ntse li boloka ho fetoha ha maemo libakeng tse kobehang. Maqhubu a tepeletseng nakong ea liphetoho tse thata-thata a fokotsa khatello ea maikutlo.

Mehopolo ea Moralo oa Motlakase

Li-interfaces tsa MIPI DSI tsa lebelo le phahameng (1.5 Gbps / lane) li hloka taolo ea impedance ka hare ho ± 5% le ho latela bolelele bo lekanang ka hare ho 0.1 mm. Kabo ea motlakase e tlameha ho ts'ehetsa libaka tse ngata tsa motlakase (0.9 V–12 V) ka lifofane tse inehetseng le li-decoupling tse ajoang bakeng sa botsitso ba nakoana.

Ho leka-lekanya ho sireletsa le ho feto-fetoha ha maemo, lifofane tsa fatše tse hahelletsoeng ka ~ 60% ho boloka koporo li boloka botšepehi ba pontšo ha li ntse li fokotsa ho satalla ha li bapisoa le likarolo tse tiileng tsa koporo.

Tsamaiso ea Thermal

Phallo e sebetsang hantle ea mocheso e kopanya likhohola tsa koporo le lisebelisoa tse futhumatsang ka tlas'a li-processor ho tsamaisa mocheso ho ea ho lisinki tse kentsoeng ka foreimi. Sebopeho sa likarolo se jala moroalo oa mocheso ho thibela libaka tse chesang, ka matla a IC a haufi le libaka tsa tempele a sebelisa foreime bakeng sa ho pholisa feela.

Thermal interface materials (TIMs) kapa mekhahlelo e fetolang mocheso e netefatsa hore mocheso o fetisetsoa ka linako tsohle le ho lumellana le mochine ho pholletsa le mefuta eohle ea mocheso oa mochine.

Ho Etsa Bokhabane bakeng sa Flex PCB ka Likhalase tse Smart

Mekhoa e tsoetseng pele ea tlhahiso

Laser Direct Imaging (LDI) e nolofalletsa 35 μm tharollo ea mohala / sebaka, ho netefatsa hore ho na le likhokahano tse nepahetseng tse phahameng ntle le mathata a ho hokahanya ha photomask. Phetoho e fetotsoeng ea semi-additive process (mSAP) e tsoela pele ho ntlafatsa tlhaloso ea mohlala ho 25 μm bophara ka ho khomarela hantle-e loketseng bakeng sa potoloho ea likhalase tse bohlale. Bakeng sa tlhahiso e ngata, tlhahiso ea roll-to-roll e boloka ho nepahala ha ngoliso ea ±0.05 mm 'me e fihlella ho feta 10 m²/hora, e fokotsa litšenyehelo ha e ntse e netefatsa ts'ebetso e ts'oanang.

Ntlafatso ea Kopano

Kopano ea holim'a holim'a polyimide e hloka taolo e hlokolosi - phallo e phahameng ka tlase ho 245 ° C le ho futhumatsa butle-butle ho thibela delamination le warpage. Khokahano ea mohala e ts'ehetsa likhokahano tsa "pitch-pitch die" (25 μm), ha kopano ea flip-chip e eketsa sekhahla sa likhokahano bakeng sa li-processor tse tsoetseng pele. 10 μm Parylene conformal coat e fana ka ts'ireletso e ts'oanang ea tikoloho ntle le ho sekisetsa ho feto-fetoha ha maemo kapa ts'ebetso ea ho kobeha.

boleng tiisetsa

Automated optical inspection (AOI) e lemoha mefokolo ho fihlela ho 10 μm, ho netefatsa botšepehi ba potoloho pele ho kopano. Teko ea sefofane e netefatsa ho tsoelapele le ho beoa ha likaroloana, tse loketseng li-prototype tse feto-fetohang ntle le lisebelisoa tse turang. Teko e felletseng ea ts'epo - ho kenyeletsoa ho palama baesekele ea mocheso, mongobo, le ho feto-fetoha ha mochini - e netefatsa ho tšoarella ha nako e telele tlasa maemo a ts'ebeliso ea 'nete.

Maano a Tsepamiso ea Kopo bakeng sa Flex PCB ka Likhalase tse Smart

Likhalase tsa Augmented Reality (AR).

Likhalase tsa AR li hloka li-PCB tse tenyetsehang tse phahameng tse khonang ho tšehetsa likhalase tse nang le qeto e phahameng, lisensara tse ngata, le khokahanyo ea waelese sebakeng se lekanyelitsoeng. Lipontšo tsa Waveguide li hloka tlhophiso e nepahetseng e bolokiloeng ke libaka tse thata ka har'a kopano e feto-fetohang.

Li-module tsa ho latela leihlo li tsamaisa li-analogue tse hlokolosi le li-digital tsa lebelo le holimo ka ho ts'oana-tse hlokang tšireletso e nepahetseng le ho itšehla thajana ho thibela crosstalk. Li-antenna tse kopantsoeng tsa 5G tse hahiloeng ho flex circuitry li fana ka −10 dB tahlehelo ea ho khutla ho 28 GHz, ho felisa tlhokahalo ea li-module tsa antenna tsa ka ntle.

Ho kopanya ha Virtual Reality (VR).

Likhalase tse bohlale tse nolofalitsoeng ke VR li sebelisa li-PCB tse feto-fetohang ho ts'ehetsa lipontšo tse peli tsa 4K ho 90 Hz, tse hlokang hore MIPI e tsamaisane ka bolelele ba likhokahano tse tenyetsehang. Li-circuits tsa motlakase li sebetsana le boima ba tsamaiso ea 10 W kakaretso ea tsamaiso, li sebelisa litsela tse tšoanang le taolo e ajoang bakeng sa tekanyo ea mocheso. Li-sensor tsa Motion li behiloe lihlekehlekeng tse thata ho fokotsa lerata le bakoang ke ho sisinyeha, ho netefatsa ts'ebetso e tsitsitseng nakong ea ho sisinyeha ha hlooho.

Li-Platforms tsa 'Nete e Kopanetsoeng (MR).

Sistimi ea MR e kopanya bokhoni ba AR le VR, e hlokang meralo e feto-fetohang ea PCB e bolokang botsitso ba matšoao ha e ntse e fetoha lipakeng tsa mekhoa ea ts'ebetso.

Likarolo tsa kh'amera tse utloang botebo li ipapisitse le bolelele ba ho ts'oaroa bo tsamaellanang hantle bakeng sa ho nka setšoantšo se hokahaneng, se nolofalletsang kaho e nepahetseng ea 3D. Bakeng sa lits'ebetso tsa ho lata ka letsoho, li-circuits tse feto-fetohang li ts'ehetsa litefiso tsa data tsa USB 3.2 ka holimo ho 10 Gbps ha li ntse li amohela liphetoho tse nyane tsa mochini hore li lumellane le lintlha tse fapaneng tsa basebelisi.

Boqapi ba Bokamoso ho Flex PCB bakeng sa Likhalase tse Smart

Theknoloji e Hlahang le Lisebelisoa

Meralo e otlollang ea potoloho e sebelisang mesaletsa ea noha e lumella bolelele ba 20% ntle le ho lahleheloa ke conductivity, e nolofalletsang liforeimi tsa likhalase tse bohlale tse feto-fetohang le tse phutholohileng haholoanyane. Li-conductors tsa tšepe tse pepeneneng tse nang le sub-100 nm spacing li tšehetsa lisebelisoa tsa elektroniki tsa lense bakeng sa ho utloa le ho futhumatsa, ntle le ho ama ho hlaka ha pono. Li-substrates tsa biocompatible polyurethane li eketsa tšebeliso ea lisebelisoa tsa bongaka le tsa nako e telele, li kopanya polokeho ea letlalo le maemo a sa feleng.

Tlhahiso ea Moloko o latelang

Tlhahiso e eketsang, ho kenyeletsoa le khatiso ea inkjet ea li-trace tse tsamaisang motlakase, e nolofalletsa li-PCB tse feto-fetohang tse etselitsoeng merero e ikhethileng. Bohlale ba maiketsetso bo ntlafatsa ntlafatso ea sebopeho ka ho sekaseka liphetoho tse ngata tsa moralo ho fihlela tsela e sebetsang ea ho latela le ho beha likarolo. Mekhoa ea tlhahiso e mosa ho tikoloho e amohela lik'hemik'hale tse thehiloeng metsing le li-substrate tse ka sebelisoang hape, e tšehetsang botsitso ha e ntse e boloka ts'ebetso ea motlakase le ea mechini.

Qetello: Ho Tsoela Pele Likhalase Tse Bohlale Ka Boqapi ba Flex PCB

Theknoloji ea Flex PCB e bohareng ba phetoho ea likhalase tse bohlale-ho fetola mehopolo e tsoetseng pele hore e be lisebelisoa tse sebetsang, tse bobebe le tse hokahaneng. Ho fumana katleho lefapheng lena ho hloka khokahano e nepahetseng ea moralo oa motlakase, ts'epahalo ea mochini, le tlhahiso e mpe.

Ha likhalase tse bohlale li ntse li atamela ho nkeloa ka lapeng, tsoelo-pele e tsoelang pele ea thepa e feto-fetohang, ts'ebetso ea mela e metle, le kopanyo ea sistimi e tla hlalosa moloko o latelang oa lihlahisoa. Tšebelisano 'moho le baetsi ba PCB ba nang le phihlelo ke senotlolo sa ho fetola litlhoko tse rarahaneng tsa boenjiniere hore e be litharollo tse ka tšeptjoang, tse itokiselitseng tlhahiso.

Hobaneng u Khetha Highleap Electronics bakeng sa Smart Glasses Flex PCB

• Ka ho feletseng Flex PCB Manufacturing - Tsebo ea li-circuits tse tšesaane haholo, tse teteaneng haholo le tse ngata tse tenyetsehang tse etselitsoeng lisebelisoa tse ka aparoang.
• Taolo ea Ts'ebetso e Tsoetseng Pele - Ponahalo e nepahetseng ea laser, theknoloji ea mSAP, le tlhahlobo e ikemetseng e netefatsang boleng bo tsitsitseng le ts'epahalo.
• Ntlafatso ea Lintho le Moqapi - Ts'ehetso bakeng sa li-polyimide, LCP, le li-stack-ups tse nyalisitsoeng tse nang le impedance e laoloang le bokhoni bo thata ba bend-radius.
• Prototype to Mass Production - Prototyping e potlakileng, scalability ea roll-to-roll, le tharollo ea kopano e ikhethileng bakeng sa ho qalisoa ha sehlahisoa se secha.
• Tiisetso ea Boleng bo Pakiloeng - ISO9001, ISO13485, ISO14001, le litsamaiso tsa IATF16949 tse netefatsang ho lateloa le ho latela maemo a lefats'e.

Highleap Electronics e sebelisana le baetsi ba boqapi ba bopang bokamoso ba theknoloji e aparoang. Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka projeke ea hau ea likhalase tse bohlale le ho fumana hore na litharollo tsa rona tsa PCB tse nepahetseng li ka potlakisa nts'etsopele ea sehlahisoa sa hau joang.