Tsoelo-pele ho Lisebelisuoa tsa Flexible PCB le Tlhahiso

Lilemong tsa morao tjena, lefats'e la li-PCB tse feto-fetohang (liboto tsa potoloho tse hatisitsoeng) le bile le kholo e kholo le tsoelopele ea theknoloji. Lintlafatso tsena li lebisitse keketsehong ea karolo ea mmaraka le lits'ebetso tse atolositsoeng ka lebaka la melemo ea tlhaho ea ho feto-fetoha ha maemo, bosesaane le moralo o bobebe. Sengoliloeng sena se felletseng, re tla hlahloba lisebelisoa tsa mantlha tse sebelisoang ho li-PCB tse tenyetsehang, lintlafatso tsa ts'ebetso ea tsona, le maemo a ntseng a fetoha a mahlale a bonolo a tlhahiso ea PCB.

Ntlafatso ea Ts'ebetso ka Lisebelisoa tsa Substrate

Tshebetso ya di-PCB tse tenyetsehang e itshetlehile haholo hodima thepa ya thepa ya substrate e sebediswang. Di-substrate di bapala karolo ya bohlokwa kaha di sebetsa e le dijari tsa di-conductor le di-insulating mediums pakeng tsa dipotoloho. Ho feta moo, di tlameha ho bontsha bokgoni ba ho kobeha le ho kobeha, e leng ntho ya bohlokwa bakeng sa di-PCB tse tenyetsehang.

Lisebelisoa tse sebelisoang hangata tsa substrate bakeng sa li-PCB tse tenyetsehang li kenyelletsa filimi ea Polyimide (PI) le filimi ea Polyester (PET), 'me lifilimi tse ling tsa polymer joalo ka Polyethylene Naphthalate (PEN), Polytetrafluoroethylene ( PTFE ), le Aramid le tsona li fumana lits'ebetso. Khetho ea thepa ea substrate e lokela ho ipapisa le tlhahlobo e hlokolosi ea ts'ebetso ea tsona le katleho ea litšenyehelo.

Polyimide (PI) Filimi

Filimi ea Polyimide, resin ea thermosetting, ke sesebelisoa se ka sehloohong sa substrate bakeng sa flexible copper-clad laminates (FCCL). Ho fapana le li-resin tse ngata tsa thermosetting, PI ha e nolofatse kapa ha e phalle ka mocheso o phahameng, e etsa hore e tšoanelehe ka mokhoa o ikhethileng bakeng sa li-PCB tse tenyetsehang. PI e na le khanyetso e phahameng ea mocheso le litšobotsi tse ntle tsa motlakase. Leha ho le joalo, e na le tšitiso mabapi le ho monya mongobo le matla a ho taboha. Lifilimi tse ntlafalitsoeng tsa PI li na le mongobo o tlase haholo ho 0.7%, ha li bapisoa le sekhahla se tloaelehileng sa 1.6%. Li boetse li bonts'a botsitso bo ntlafalitsoeng, ka mamello e fokotsehileng ho tloha ho ± 0.04% ho isa ho ± 0.02%.

Filimi ea Polyester (PET).

PET resin e fana ka ts'ebetso e ntle ea mochini le motlakase. Moeli oa eona o ka sehloohong ke ho hanyetsa mocheso o futsanehileng, ho etsa hore e se ke ea tšoaneleha bakeng sa mekhoa ea ho kopanya ka ho toba le ea ho kopanya. Leha ho le joalo, ts'ebetso ea Polyethylene Naphthalate (PEN) e phahametse ea PET empa e haelloa ke litšoaneleho tsa PI, e leng se etsang hore e be mokhoa o mong o loketseng lits'ebetsong tse ling.

Mokelikeli oa Crystal Polymer (LCP)

Bakeng sa meralo e kopaneng ea RF le ea maqhubu a phahameng a ho flex, Highleap e ka boela ea hlahloba projeke ea tlhahiso ea LCP PCB hammoho le sephutheloana sa ho flex stackup le kopano.

Ho sebetsana le mefokolo ea li-substrates tsa Polyimide, Liquid Crystal Polymer (LCP) e hlahile e le mokhoa o mong o tšepisang. LCP ke thepa ea thermoplastic e ka fetoloang hore e be lifilimi tse tšesaane tse loketseng li-PCB. E bonts'a ho monya ha mongobo o tlase (0.04%) le dielectric constant ea 2.85 (1GHz), e etsa hore e tšoanelehe bakeng sa lipotoloho tsa dijithale tsa maqhubu a holimo. Thepa ea LCP, ho kenyeletsoa ho tsamaellana ha maqhubu a phahameng, botsitso ba boemo ba mocheso, le ho monya mongobo o tlase, li lebisitse ho amoheloeng ha eona ho etsoa ka mokhoa o bonolo oa PCB.

Lisebelisoa tsa Halogen-Free Substrate

Indasteri ea lisebelisoa tsa elektroniki e bone phetoho e lebisang boikarabelong ba tikoloho. Melao e kang RoHS (Thibelo ea Lintho Tse Kotsi) le WEEE (Lisebelisoa tsa Motlakase le tsa Elektroniki tse Lahliloeng) li thibetse tšebeliso ea lintho tse kotsi lisebelisoa tsa elektroniki. Ka lebaka leo, thepa ea substrate e se nang halogen e lumellanang le litlhoko tsa tikoloho e ntlafalitsoe 'me joale e sebelisoa haholo ho li-PCB tse thata le tse tenyetsehang.

Lisebelisoa tsa Substrate tse tsoelang pele

Ha tlhoko ea li-PCB tse tenyetsehang e ntse e tsoela pele ho hola, boiteko ba lipatlisiso le nts'etsopele bo ntse bo tsoela pele ho batlisisa thepa e ncha ea substrate e ka ntlafatsang ts'ebetso ea lipotoloho tse tenyetsehang. Ka mefuta e fetang 2000 ea lifilimi tsa polasetiki tse sebetsang tse fumanehang lefatšeng ka bophara, ha ho pelaelo hore ho na le sebaka sa ho sibolloa ha thepa e ka sutumetsang meeli ea moralo oa li-PCB tse tenyetsehang.

Karolo ea Sekhomaretsi ho Li-PCB tse Flexible

Bakeng sa meaho ea polyimide flex e hlokang sistimi e hlalositsoeng ea sekhomaretsi, ts'ebetso ea potoloho e feto-fetohang ea DuPont Pyralux LF ke tšupiso e thusang mabapi le thepa pele kaho e lokolloa.

Sekhomaretsi ke karolo ea bohlokoa ho li-PCB tse tenyetsehang, kaha e na le boikarabello ba ho kopanya filimi ea koporo le filimi ea substrate. Likhomaretsi li arotsoe ka mekhahlelo e fapaneng, ho kenyelletsa le PI resin, PET resin, modified epoxy resin, le acrylic resin. Har'a tsena, resin ea epoxy e fetotsoeng le resin ea acrylic li sebelisoa hangata ka lebaka la matla a tsona a phahameng a sekhomaretsi.

Lintho tse peli tsa PI Substrate Material

Traditional flexible copper-clad laminate (FCCL) hangata e na le likarolo tse tharo: polyimide, sekhomaretsi, le foil ea koporo. Leha ho le joalo, lera la sekhomaretsi ka linako tse ling le ka ama ts'ebetso ea li-PCB tse tenyetsehang, haholoholo mabapi le ts'ebetso ea motlakase le botsitso ba sebopeho. Ho rarolla bothata bona, ho entsoe li-CCL (2L-FCCL) tse se nang sekhomaretsi tse nang le likarolo tse peli. Tsoelo-pele ena ha e ntlafatse feela ho lumellana ha tikoloho ea li-PCB tse tenyetsehang empa hape e kopana le litlhoko tsa ho kopanya ntle le loto ka ho phahamisa moeli oa mocheso ho tloha 220 ° C ho ea 260-300 ° C. Papiso pakeng tsa 2L-FCCL ntle le sekhomaretsi le 3L-FCCL e nang le sekhomaretsi e fanoe ho Lethathamo la 1 ka tlase.

Ho sebelisoa mekhoa e meraro ho etsa 2L-FCCL:

1. electroplating
2. Ho roala filimi
3. Khalemelo

Mokhoa o mong le o mong o na le melemo ea oona mme o khethoa ho latela litlhoko tse itseng. Ka mohlala, electroplating e loketse tlhahiso ea lihlahisoa le lisebelisoa tse fokolang tsa substrate, tse fanang ka tharollo e theko e tlaase. Ho roala filimi ho loketse bakeng sa tlhahiso ea bongata, ho fana ka litšenyehelo tse ngata. Lamination, ka lehlakoreng le leng, e ipabola ka boto e entsoeng ka mahlakoreng a mabeli.

Liquid Crystal Polymer (LCP) Substrate Material

Liquid Crystal Polymer (LCP) ke sesebelisoa sa substrate se batlang se le secha se batlang ho sebetsana le mefokolo ea li-polyimide substrates. Filimi ea LCP e koahetsoe ka foil ea koporo 'me e hatelloa ka ho chesa ho etsa li-laminates tse nang le mahlakore a mabeli a koporo (CCL). Li-CCL tse thehiloeng ho LCP li fana ka thepa e ikhethang, ho kenyeletsoa sekhahla sa ho monya metsi se tlase sa 0.04% feela le dielectric tse sa fetoheng tse lumellanang le li-circuits tsa dijithale tse phahameng haholo (2.85 ho 1GHz). Thepa ea LCP e e etsa khetho e nepahetseng bakeng sa lits'ebetso tsa maqhubu a holimo ho li-PCB tse tenyetsehang.

Lisebelisoa tsa Halogen-Free Flexible Substrate

Melao ea tikoloho e qobelletse indasteri ea lisebelisoa tsa elektroniki ho fetohela ho lisebelisoa tsa substrate tse se nang halogen. Ho tloha 2003, EU e sebelisitse melaoana ea RoHS le WEEE, e thibelang tšebeliso ea lintho tse kotsi tse tšeletseng le ho laola ts'ebetso ea litšila tsa lisebelisoa tsa elektroniki le tsa motlakase. Melao ena e amme lisebelisoa tse sebelisoang ho li-PCB, ho kenyelletsa le li-PCB tse tenyetsehang. Ka lebaka leo, likarolo tse fapaneng tsa li-PCB tse feto-fetohang, tse kang FCCL, coverlay, prepreg, solder mask, le mapolanka a matlafatsang, li tlameha ho finyella ho hanyetsa mollo le litlhoko tsa mahala tsa halogen.

Tsoelo-pele ka Copper Foil

Conductivity ke thepa ea bohlokoa ho li-PCB tse tenyetsehang, 'me foil ea koporo e sebetsa e le thepa ea mantlha ea ho tsamaisa. Ntle le koporo, ka linako tse ling ho sebelisoa lisebelisoa tsa alloy tse kang aluminium, nickel, khauta le silevera. Khetho ea foil ea koporo e itšetlehile ka mokhoa o khethehileng oa kopo le mokhoa oa ho etsa.

Electro Deposit (ED) Copper Foil

ED copper foil ke e 'ngoe ea lisebelisoa tse sebelisoang haholo ho li-PCB tse tenyetsehang. E khetholloa ke sebopeho sa kristale ea tlhapi ea tlhapi, e hlahisang foil e boreleli ea koporo e nang le boima bo botle. ED koporo foil e loketse hantle bakeng sa li-PCB tse feto-fetohang tse hlokang maemo a holimo.

Lesela la Koporo le Rolled le Annealed (RA).

Ka lehlakoreng le leng, foil ea koporo ea RA e na le sebopeho sa kristale se seholo, se hlahisang sebopeho se lekanang le se bataletseng. Mofuta ona oa foil oa koporo o loketse lits'ebetso tsa roughening le etching. Hangata foil ea koporo ea RA e sebelisoa ho li-PCB tse tenyetsehang tse phahameng.

Litlhoko tse Hlahang ho Foil ea Koporo

Ha tlhokahalo ea li-PCB tse tenyetsehang tse phahameng tse nang le li-pitches tse ntle ho tloha ho 40μm ho isa ho 50μm e ntse e eketseha, litlhoko tse ncha li beoa tlhahiso ea foil ea koporo. Litlhoko tsena li kenyelletsa bohloeki bo tlase ba bokaholimo le likhoele tsa koporo tse tšesaane haholo ho fihlela litlhoko tsa tlhahiso ea PCB ea bongata.

Sekhomaretsi sa Silver se conductive

Flexible PCB fabrication e kenyelletsa tšebeliso ea enke ea conductive, e hatisoang filiming ea insulating ho etsa terata kapa likarolo tse sireletsang. Conductive silevera pente ke thepa ea mantlha e sebelisetsoang morero ona. Ho bohlokoa hore lera le hatisitsoeng la conductive le bonts'e khanyetso e tlase, le netefatse khokahano e tiileng, 'me le boloke ho tenyetseha. Ho phaella moo, mokhoa oa ho hatisa o lokela ho sebelisoa habonolo, 'me phekolo e lokela ho potlaka.

Sekhahla sa silevera sa sejoale-joale se kopanang le litlhoko tsena, se nolofalletsang hore ho thehoe lipaterone tsa conductive ho thermosetting kapa thermoplastic polymer lifilimi, masela le pampiri. Theknoloji ena e boetse e fetela ho theheng litšoantšo tse sebelisoang lihlahisoa tsa RFID. Lihlahisoa tsa ho qetela tse nang le pente ea silevera ea conductive li lekoa ka matla bakeng sa polokelo ea mocheso o phahameng, ho hanyetsa mongobo, le ts'ebetso ea libaesekele tse phahameng le tse tlase. Sekhahla sa silevera se tsamaisang se tsamaisana le litlhoko tsa ts'ireletso ea tikoloho le ho boloka litšenyehelo.

Photosensitive Polyimide (PI) Coverlay

Likoahelo tsa setso tsa PI/sekhomaretsi li tobane le mefokolo ho fihlela litlhoko tsa li-PCB tse teteaneng haholo, tse tsitsitseng hantle, le tse baballang tikoloho. Ho arabela, Photo-Imageable Coverlay (PIC) e ntlafalitsoe. PIC, ho ipapisitse le li-epoxy tse fetotsoeng kapa li-resin tsa acrylic, e se e tumme ka lebaka la qeto ea eona e phahameng, matla a matle a tlamahano, le ho feto-fetoha ha maemo. Leha ho le joalo, li-PIC tsena li na le mefokolo, ho kenyeletsoa botsitso bo tlase ho li-PCB tse phahameng haholo, mocheso o tlase oa phetoho ea likhalase (Tg), le ho hanyetsa mocheso o fokolang.

fihlela qeto e

Li-PCB tse feto-fetohang li tsoa hole haholo mabapi le thepa le theknoloji ea tlhahiso. Tsoelo-pele ea thepa ea substrate, foil ea koporo, li-conductive pastes, le likoahelo li butse menyetla e mecha bakeng sa li-PCB tse teteaneng tse phahameng, tse nang le maqhubu a mangata le a tikoloho. Ha tlhoko ea lisebelisoa tsa elektronike tse feto-fetohang e ntse e hola, ho hlakile hore lipatlisiso tse tsoelang pele le boiteko ba nts'etsopele li tla lebisa lits'ebetsong tse ling tsa lisebelisoa le lits'ebetso.

Bakeng sa tlhahiso ea PCB e sebetsang hantle le e tšepahalang, nahana ka ho fihlella Highleap Electronic. Ka lilemo tse fetang leshome tsa boiphihlelo tlhahisong e feto-fetohang ea PCB, re hlomeletsoe ho fihlela litlhoko tsa hau le ho fana ka litharollo tsa boleng bo holimo. Ikopanye le rona kajeno ho buisana le litlhoko tsa hau tsa boto ea potoloho e feto-fetohang le litlhoko tsa kopano kapa u kope qotsulo e feto-fetohang ea PCB. Bokamoso ba lisebelisoa tsa elektroniki tse feto-fetohang boa khanya, 'me re mona ho u thusa ho etsa hore mehopolo ea hau e ncha e phele.