Moqapi oa Heavy Copper PCB bakeng sa Matla a Elektronike: Tataiso e sebetsang ea Boenjiniere

Lisebelisoa tsa motlakase li hloka litharollo tsa PCB tse khonang ho sebetsana le maqhubu a phahameng ha li ntse li boloka botsitso ba mocheso le botšepehi ba nako e telele. Moralo oa PCB oa koporo e boima o sebetsana le liphephetso tsena ka botenya bo eketsehileng ba koporo, maano a ikhethileng a ho rala, le mekhoa e ntlafalitsoeng ea taolo ea mocheso.

Tataiso ena e lekola lintlha tsa bohlokoa tsa moralo bakeng sa lits'ebetso tsa PCB tse boima tsa koporo, ho tloha liqetong tsa mantlha tsa moralo ho isa ho bokhoni ba tlhahiso, e shebaneng le ts'ebetsong e sebetsang ho li-converter tsa DC-DC, li-motor drive, li-inverters le lisebelisoa tsa motlakase tsa indasteri.

PCB e boima ea Koporo ke Eng le Hore na ke Hobane'ng ha e le Bohlokoa ho Matla a Elektronike

Ho hlalosa Kaho ea Koporo e Boima

Li-PCB tse boima tsa koporo li na le boima ba koporo ba 3 oz/ft² kapa ho feta, ha li bapisoa le li-PCB tse tloaelehileng tse atisang ho sebelisa koporo ea 1 oz/ft². Botenya bona bo eketsehileng ba koporo bo ntlafatsa ka ho toba bokhoni ba ho jara motlakase, bo fokotsa tahlehelo ea ho hanyetsa, 'me bo ntlafatsa ho qhalana ha mocheso ka har'a boto.

Melemo ea Ts'ebetso ho Moqapi o Matla oa Koporo oa PCB

Melemo ea mantlha ea kaho ea koporo e boima e kenyelletsa:

• Bokhoni ba hona joale bo phahameng - Koporo e teteaneng e fokotsa khanyetso ea motlakase, e nolofalletsa 20-50A maqhubu a tsoelang pele ka mokhoa o mong ntle le ho futhumatsa ho feteletseng.
• Phallo e phahameng ea mocheso - Ts'ebetso e ntlafalitsoeng ea mocheso e jala mocheso libakeng tse kholo, e fokotsa libaka tse chesang le khatello ea maikutlo.
• Matla a ntlafetseng a mochine - Keketseho ea boima ba koporo e fana ka khanyetso e ntle ho libaesekele tse futhumetseng le khatello ea kelello ea mochini
• Ho theoha ha matla a tlase - Phokotso ea khanyetso ea trace e fokotsa tahlehelo ea matla litseleng tse phahameng tsa hajoale

Libaka tsa kopo

Moralo o boima oa koporo ea PCB o sebeletsa li-inverters tsa makoloi, li-charger tsa onboard, lilaoli tsa makoloi a indasteri, le bakhanni ba matla a phahameng a LED. Lisebelisoa tsena li hloka ts'ebetso e tsoelang pele ea boemo bo holimo, ho tlosa mocheso hantle, le ts'ebetso e tšepahalang tlas'a khatello e tsitsitseng ea motlakase le mocheso.

Moqapi oa PCB o boima oa Koporo: Litaelo tsa ho Beha

Ho fokotsa ho Impedance ea Loop ea Matla

Ntlafatso e nepahetseng ea sebopeho e shebane le ho fokotsa sebaka sa loop ea motlakase. Beha li-capacitor tse kenang haufi le lisebelisoa tsa ho chencha 'me u boloke litsela tse khutšoanyane, tse tobileng tsa hona joale ho fokotsa inductance ea parasitic. Sena se fokotsa ho overshoot ea motlakase, tšitiso ea motlakase, le tahlehelo ea switching.

Leano la Hajoale la Kabo ea Tsela

Fana ka mesaletsa ea morao-rao ka har'a mekhahlelo e mengata ha ho khoneha, ho qoba libaka tse nang le bothata ba metsi moo motlakase o tlamehang ho phunyeletsa likarolong tse moqotetsane. Lifofane tse pharalletseng tsa koporo le lifofane tse tlatsitsoeng li fana ka kabo ea matla a fokolang haholo ha ka tlhaho li hasa mocheso libakeng tse kholo tsa boto.

Litlhoko tsa Creepage le Clearance

Moralo o boima oa koporo ea PCB o tlameha ho ikarabella bakeng sa litlhoko tse eketsehileng tsa sebaka ka lebaka la maqhubu a phahameng. Boloka libaka tse lekaneng tsa creepage pakeng tsa li-node tse phahameng tsa motlakase ho latela litekanyetso tse sebetsang tsa polokeho. Koporo e teteaneng e hloka lits'ebetso tse kholoanyane nakong ea etching ho thibela lifupi lipakeng tsa mesaletsa e haufi.

Khetho ea Botenya ba Koporo le Palo ea Bophara ba Trace

Ho khetholla Boima bo Hlokahalang ba Koporo

Khetha botenya ba koporo bo ipapisitseng le ho phahama ho hoholo ho tsoelang pele le mocheso o amohelehang. Boima ba koporo bo boima bo tloaelehileng bo tloha ho 2 oz/ft² bakeng sa ts'ebeliso ea matla e itekanetseng ho isa ho 10 oz/ft² bakeng sa ho teteana ho feteletseng ha hajoale. E 'ngoe le e 'ngoe ea botenya ba koporo e menahaneng habeli ea hona joale bakeng sa bophara bo fanoeng.

IPC-2152 Maemo le Lipalo

Tekanyetso ea IPC-2152 e fana ka datha e matla bakeng sa lipalo tsa bophara ba tatellano ka moralo o boima oa koporo ea PCB, tlaleho ea boima ba koporo, mocheso o teng, le ho phahama ho lumelletsoeng ha mocheso. Bakeng sa trace ea koporo ea 3 oz e nang le 20A e nang le 30 ° C e nyolohang, lebella bophara bo pota-potileng 5-8mm ho itšetlehile ka hore na trace e ka hare kapa ka ntle.

Litlhahiso tsa ho Mamellana ho Tseba

Botenya bo eketsehileng ba koporo bo ama ho nepahala ha etching, hangata ho baka phapang e kholo ea bophara ba mela. Melao ea moralo e lokela ho ikarabella bakeng sa litlamorao tse fetelletseng tse hlahelletseng ka koporo e teteaneng. Sebetsa ka bophara ba bonyane ba 8-10 mls bakeng sa koporo ea 3-4 oz, u nyollela holimo bakeng sa boima bo boima.

Ka Moralo bakeng sa Tsamaiso e Phahameng ea Hona Joale le ea Mocheso

Phetisetso ea Hona joale ka Arrays

Moralo o boima oa koporo ea PCB o hloka hore o be matla ka meaho ho fetisetsa hajoale lipakeng tsa mekhahlelo ntle le ho theha libotlolo. Tsela e le 'ngoe e paka hore ha e lekane bakeng sa maqhubu a phahameng; ho e-na le hoo, sebelisa mefuta e mengata ea litsela tse bapileng. Bakeng sa tsela ea 20A, aba 10-15 ho pholletsa le sebaka sa khokahanyo ho netefatsa bokhoni bo lekaneng ba hona joale le ts'ebetso ea mocheso.

Thermal Via Kemplementation

Thermal vias ka tlas'a likarolo tsa matla a fana ka litsela tsa bohlokoa tsa ho tsamaisa mocheso ho tloha libakeng tse chesang ho ea ho lifofane tsa ka hare tsa koporo le li-heatsink tse ka tlaase. Hlophisa li-vias tsa mocheso ka lihlopha tse teteaneng tse nang le sebaka se tloaelehileng sa 20-30 mls. Tlatsoa le plated vias fana phahameng tshebetso mogote bapisoa le vias unfilled.

Ka Plating Quality Standards

Boloka bonyane ka bophara ba 0.3mm (12 mils) ho netefatsa tšireletso e tšepahalang ea koporo hohle botebong ba mokoti. Liboto tse boima tsa koporo li hloka plating e teteaneng ho fihlela kabo e lekaneng ea koporo ka moqomo, haholo bakeng sa likarolo tse fetang 8:1.

Tsamaiso ea Mocheso ka Moqapi o Boima oa Koporo ea PCB

Ho hasana ha Mocheso oa Sefofane sa Koporo

Kaho e boima ea koporo ka tlhaho e fana ka mocheso o motle oa lateral o hasang ka lifofane tse teteaneng tsa kahare. Sebelisa koporo ea 2-4 oz bakeng sa matla a ka hare le lifofane tsa fatše ho theha likarolo tse sebetsang tsa kabo ea mocheso tse tsamaisang mocheso hole le libaka tse chesang le ho li aba sebakeng sa boto.

Metal Core Integration

Bakeng sa ditlhoko tse feteletseng tsa mocheso, kopanya moralo o boima wa PCB wa koporo le di-substrate tsa motheo wa tshepe . Di-core tsa aluminium kapa tsa koporo di fana ka ditsela tse tobileng tsa mocheso ho tloha dibakeng tsa ho kenya dikarolo ho ya ho di-heatsink tsa kantle. Mokhoa ona o ipaka o sebetsa haholo bakeng sa di-converter tsa motlakase tse nang le bongata bo boholo le ditshebediso tsa LED.

Strategic Thermal Via Placement

Beha mocheso ka li-arrays ka tlas'a MOSFETs, diode, le likarolo tse ling tse hlahisang mocheso. Matla a tloaelehileng a MOSFET a ka hloka li-vias tse 30-50 tse futhumatsang ka har'a sebaka sa eona sa mocheso oa mocheso ho tsamaisa mocheso ka ho lekaneng hole le mateano.

Lintlha tsa Tlhahiso bakeng sa Moralo oa Heavy Copper PCB

Etching Process Meeli

Koporo e teteaneng e hloka nako e telele ea ho tsitsa, e eketsang kotsi ea ho ts'oaroa ho feta tekano le ho batla ho fokotseha. Lebella bonyane ba boholo ba likarolo ho sekala ka boima ba koporo:

• 2-3 oz koporo - Bonyane sebaka le sebaka sa 6-8 ms
• 4 oz koporo - Bonyane sebaka le sebaka sa 10-12 ms
• 6 oz koporo - Bonyane sebaka le sebaka sa 15-18 ms
• 8-10 oz koporo - Bonyane sebaka le sebaka sa 20+ ms

Plating le Via Filling

Via plating e ntse e thatafalloa le ho feta ha boima ba koporo bo ntse bo eketseha, haholo-holo bakeng sa masoba a karolo e phahameng. Tlatsoa vias ka mapolanka boima koporo hloka khethehileng dithulaganyo plating le lipotoloho multiple plating. Ho buisana le bahlahisi ka liphutheloana le ka litlhoko tsa pele molemong oa moralo.

Moralo oa Stack-Up oa Lera

Mekhahlelo e boima ea koporo e baka liphephetso ho ngolisoeng ha lera-to-layer le ho ts'oara ha lamination ka lebaka la phapang e kholo ea botenya. Etsa li-symmetric stack-ups ha ho khoneha ho leka-lekanya khatello ea kelello le ho thibela warpage ea boto nakong ea ho etsoa kapa ho kopanya.

Malebela a Ntlafatso ea Moqapi

Ketsiso le netefatso

Netefatsa moralo oa PCB oa koporo e boima u sebelisa lisebelisoa tsa ketsiso ea mocheso pele u etsa tlhahiso. Software e kang Ansys SIwave, Altium PDN Analyzer, kapa lisebelisoa tsa thermal FEA li bolela esale pele kabo ea hona joale, liprofaele tsa mocheso, le libaka tse ka bang teng tsa ho chesa. Liketsiso tsena li thusa ho fetola bophara ba mohlala le ntlafatso ea taolo ea mocheso.

Design Rule Balancing

Ntlafatsa ka ho leka-lekanya litlhoko tsa ts'ebetso ea motlakase khahlanong le lithibelo tsa tlhahiso. Le ha koporo ea 6 oz e fana ka bokhoni bo botle ba hajoale, koporo ea 3-4 oz hangata e lekane ha e ntse e fana ka ho nepahala ho hoholo le litšenyehelo tse tlase. Sekaseka linako tsa 'nete tsa ts'ebetso le lipotoloho tsa mosebetsi ho qoba ho qaqisa ho feta tekano.

Tšebelisano ea Moetsi

Kopanya baetsi ba PCB nakong ea moralo ho utloisisa bokhoni ba bona bo boima ba koporo, melao ea moralo, le bakhanni ba litšenyehelo. Kopa moralo bakeng sa tlhahiso ea maikutlo mabapi le kabo ea koporo, ka lipaterone, le likarolo tse fokolang ho thibela ntlafatso e theko e boima.

fihlela qeto e

Moralo o boima oa koporo ea PCB o hloka tlhokomelo e hlophisehileng ho matla a hajoale, taolo ea mocheso, le bokhoni ba tlhahiso. Katleho e ipapisitse le ho utloisisa kamano lipakeng tsa botenya ba koporo, trace geometry, ka kaho, le litsela tsa ho qhala mocheso. Baenjiniere ba tsebang lintlha tsena tse hokahaneng ba theha lisebelisoa tsa elektroniki tse fanang ka ts'ebetso e tšepahalang tlasa maemo a boima.

Ho Highleap Electronics, re fana ka bokgoni bo felletseng ba tlhahiso ya PCB ya koporo e boima :

• Tloaelo koporo botenya - 2 oz ho isa ho 10 oz likhetho tsa boima ba koporo tse tsamaellanang le litlhoko tsa hau tsa hajoale
• E tsoetseng pele ka theknoloji - E tlatsitsoe, e pentiloe, 'me e futhumatsa ka li-arrays bakeng sa ts'ebetso e nepahetseng ea motlakase le mocheso
• Tšehetso ea tsamaiso ea mocheso - Metal core integration le moralo oa leano la sefofane sa koporo bakeng sa ho senya mocheso hantle
• Tšebelisano ea moralo - Tlhahlobo ea boenjiniere le maikutlo a DFM ho netefatsa katleho ea tlhahiso ea pele

Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka litlhoko tsa hau tsa motlakase le ho ithuta kamoo boiphihlelo ba rona ba moralo le tlhahiso ea PCB ea koporo e boima bo ka tšehetsang projeke ea hau e latelang.