Li-PCB tsa Metal Core li Hlakola Mocheso Joang: Ho utloisisa Tsela ea Thermal

Selelekela: Hobaneng ha MCPCB e le Bohlokoa ba ho Felisoa ha Mocheso

Tsamaiso ea mocheso e eme e le ntlha ea bohlokoa e khethollang ho ts'epahala le nako ea bophelo ea lihlahisoa tsa elektroniki tse nang le matla a phahameng, haholo lits'ebetsong tsa mabone a LED, lits'ebetso tsa likoloi le li-module tsa motlakase. Ha likarolo li hlahisa mocheso o moholo nakong ea ts'ebetso, ho senyeha ho sa lekaneng ho lebisa ho hloleha pele ho nako, ho fokotsa ts'ebetso, le ho ameha ka polokeho.

Sena se hlahisa potso ea bohlokoa eo moenjiniere e mong le e mong a lokelang ho e araba: PCB ea mantlha ea tšepe e hlile e qhala mocheso joang? Ho utloisisa tsela ea mocheso ho li-PCB tsa mantlha tsa tšepe ho nolofalletsa baenjiniere ho rala litsamaiso tse laolang mocheso ka katleho ha li ntse li boloka ts'ebetso ea motlakase.

Sebopeho sa Mocheso oa Motheo oa MCPCB

Mochine oa tšepe oa mantlha oa PCB oa ho futhumatsa mocheso o itšetlehile ka sebopeho sa mekhahlelo e meraro se sebetsang ka kutloano ea mocheso:

• Lera la Potoloho ea Koporo - Sebaka se ka holimo bakeng sa ho kenya motsoako le ho hasa mocheso oa pele
• Lera la Dielectric - Thermally conductive empa e le motlakase insulating lera bohareng
• Metal Base - aluminium kapa substrate ea koporo e sebetsang e le sesebelisoa sa mantlha sa mocheso

Karolo ena ea tšepe e etsa hore ho be le tsela e tsoelang pele ea mocheso e tsamaisang mocheso hantle hole le likarolo tsa bohlokoa. Phallo ea mocheso e latela tsela e otlolohileng e otlolohileng ka lera le leng le le leng, e netefatsa ho tlosoa ka potlako ho lisebelisoa tsa elektronike tse hlokolosi.

Thermal Highway Concept

Tsela ea mocheso ho MCPCBs e sebetsa joalo ka tsela e otlolohileng e fetisang mocheso ho tloha mohloling ka kotloloho ho ea substrate ea tšepe . Tsela ena e otlolohileng e fokotsa khanyetso ea mocheso ha e bapisoa le li-PCB tsa FR-4 tsa setso, moo mocheso o lokelang ho tsamaea ka mahlakoreng ka har'a thepa e nang le conductivity e tlase. Boima bo phahameng ba mocheso oa setsi sa tšepe bo monya le ho jala mocheso ka katleho, bo thibela ho phahama ha mocheso sebakeng seo.

Tlhahlobo ea Phallo ea Mocheso oa Lera-ka-Lea MCPCB

Lera la Koporo - Pokello ea Mocheso oa Pele

Likaroloana tse rekisoang holim'a koporo li hlahisa mocheso o qala ho ata ka mahlakoreng ka lera la koporo. Ka mokhoa o ikhethang oa mocheso oa mocheso oa hoo e ka bang 400 W/m·K, koporo e tiisa hore mocheso o ajoa ka potlako sebakeng se seholoanyane. Ketso ena ea pele ea ho hasana e fokotsa khatello ea mocheso ho likarolo tsa motho ka mong ha u ntse u lokisetsa mocheso bakeng sa ho fetisoa ka ho toba.

Botenya ba koporo, hangata bo tlohang ho 35-140 µm, bo ama ka ho toba matla a ho hasanya mocheso. Likarolo tse teteaneng tsa koporo li fana ka kabo e ntle ea mocheso empa li hloka ho nahanoa ka hloko bakeng sa likarolo tsa molumo o hlakileng.

Lera la Dielectric - Borokho bo Bohlokoa ba Thermal

Lera la dielectric le emela ntho ea bohlokoa ka ho fetisisa ho MCPCB e sebetsang hantle ea ho senya mocheso. E sebetsa ka conductivity ea mocheso pakeng tsa 1-3 W / m·K, lera lena le tlameha ho leka-lekanya ho arohana ha motlakase le matla a ho fetisa mocheso. Li-dielectric tsa sejoale-joale tse tlatsitsoeng ka ceramic tsa polymer li ntlafatsa ho leka-lekana hona ka liqapi tse tsoetseng pele tsa thepa.

Dielectric e etsa mesebetsi e 'meli:

• E boloka ho itšehla thajana ha motlakase ho matla a fetang 2kV
• E fokotsa ho hanyetsa mocheso ha o ntse o netefatsa botsitso ba mochine
• E thibela lifupi tsa motlakase lipakeng tsa potoloho le setsi sa tšepe

Mekhoa e tsoetseng pele joale e fihlella ho tsamaisoa ha mocheso ho fihlela ho 5-7 W/m·K ho li-MCPCB tse ikhethileng tse sebetsang hantle . Lintlafatso tsena li ntlafatsa haholo bokhoni ba kakaretso ba ho qhala mocheso.

Metal Core - Lera le Feletseng la ho Fella mocheso

Aluminium kapa koporo ea motheo ea substrate e fumana mocheso ho tloha lera la dielectric 'me e o hasanya holim'a bokaholimo bohle. Li-cores tsa aluminium li fana ka 150-200 W / m · K conductivity, e fana ka tsamaiso e tlaase ea mocheso bakeng sa lisebelisoa tse ngata. Li-cores tsa koporo li fana ka ts'ebetso e phahameng ho 380-400 W / m · K empa li eketsa litšenyehelo tsa thepa.

Ka mor'a ho otloloha ka mekhahlelo e fetileng, mocheso o phahameng oa tšepe o thusa ho aba mocheso o sebetsang hantle. Botenya ba substrate, hangata 1.0-3.0 mm, bo khetholla katleho ea ho hasa mocheso le ho tiea ha mochini. Li-substrates tse teteaneng li fana ka ts'ebetso e ntle ea mocheso empa li eketsa boima le litšenyehelo ho kopano.

Ntlafatso ea Sebopeho sa Mocheso ho MCPCB Heat Dissipation

Interface Resistance Management

Likamano pakeng tsa lihlopha li ama haholo ts'ebetso ea ho senya mocheso oa MCPCB. Kamano e mpe e baka likheo tse nyane tsa moea tse sebetsang e le li-insulator tsa mocheso, tse fokotsang ts'ebetso e ntle haholo. Khokahano e 'ngoe le e' ngoe e kenya letsoho ho hanyetsa mocheso o eketsehileng o kopanyang ho pholletsa le stack.

Mekhoa ea tlhahiso e netefatsang hore lamination e se nang letho e ama ka ho toba katleho ea tsela ea mocheso. Vacuum lamination le khatello e laoloang nakong ea kopano e fokotsa khanyetso ea sebopeho. Netefatso ea taolo ea boleng e tiisa hore sebopeho se seng le se seng se boloka litlhaloso tse entsoeng ka mocheso oa mocheso.

Lisebelisoa tsa Sebopeho sa Thermal

Thermal interface materials (TIMs) e matlafatsa phetisetso ea mocheso lipakeng tsa masela le lisinki tsa mocheso tse kantle. Likhetho tse tloaelehileng tsa TIM li kenyelletsa:

• Likhomaretsi tsa mocheso bakeng sa tlamahano e sa feleng
• Lisebelisoa tsa phetoho ea mohato bakeng sa likhokahano tse ka sebelisoang hape
• Thermal pads bakeng sa ho feto-fetoha ha kopano ea mechine

Khetho e itšetlehile ka mocheso oa ts'ebetso, litlhoko tsa mochine, le mekhoa ea kopano. Lisebelisoa tse sebetsang hantle haholo li ka hloka li-TIM tse khethehileng tse nang le mocheso oa mocheso o fetang 5 W/m·K.

Ho itšehla thajana ho Motlakase ka Metal Core PCB Heat Dissipation

Dielectric Layer Engineering

Substrate ea tšepe e qoba lifupi tsa motlakase ka lera la dielectric le entsoeng ka hloko. Insulation ena e boloka botenya bo tloaelehileng ba 50-150 µm, e netefatsa hore motlakase o lekaneng o khona ho mamella. Sebopeho sa dielectric se leka-lekanya li-filler tsa ceramic bakeng sa conductivity ea mocheso le li-resin tsa polymer bakeng sa ho kenya motlakase.

Li-dielectric tse tšesaane li ntlafatsa phallo ea mocheso empa li fokotsa sekhahla sa motlakase. Baenjiniere ba tlameha ho leka-lekanya ts'ebetso ea mocheso le litlhoko tsa polokeho ea motlakase. Mekhoa ea morao-rao ea ho etsa lihlahisoa e finyella botenya bo tsitsitseng ba dielectric ka hare ho ± 10% mamello.

Litlhaloso tsa Tekanyetso ea Voltage

Li-MCPCB hangata li fana ka litekanyetso tsa ho itšehla thajana tsa 2-4 kV AC, ka mefuta e ikhethileng e fihlang ho 6 kV kapa ho feta. Ho itšehla thajana hoa motlakase ho lumella motheo oa tšepe hore o thehoe ntle le ho ama ts'ebetso ea potoloho. Li-module tsa LED tse nang le matla a phahameng le li-converter tsa matla li rua molemo haholo ts'ebetsong ena e habeli.

Matla a ho itšehla thajana a amana ka kotloloho le botenya ba dielectric le thepa ea thepa. Ts'ebetso e tsoelang pele e hloka derating ho netefatsa ts'epo ea nako e telele. Maemo a indasteri a totobatsa mekhoa ea liteko ho netefatsa botšepehi ba ho itšehla thajana bophelong bohle ba sehlahisoa.

Ho ntlafatsa Ts'ebetso ea Phallo ea Mocheso oa MCPCB

Tšusumetso ea ho Khetha Lintho

Phallo e sebetsang ea mocheso oa MCPCB e itšetlehile ka ho ntlafatsa thepa e 'ngoe le e' ngoe tseleng ea mocheso. Baenjiniere ba tlameha ho nahana ka conductivity ea mocheso, thepa ea motlakase, le lithibelo tsa litšenyehelo. Lisebelisoa tsa Premium li ka fana ka lintlafatso tse nyane ka litšenyehelo tse phahameng haholo.

Tsela e felletseng ea mocheso e ea latela: Karolo → Koporo → Dielectric → Metal Core → Sink ea Mocheso/Moea. Ntho e 'ngoe le e 'ngoe e hloka ntlafatso bakeng sa katleho e kholo ea ho qhala mocheso. Mokhoa oa boemo ba mocheso oa tsamaiso o tiisa khetho ea moralo pele ho tlhahiso.

Manufacturing Consistency

Ho etsa lintho ka mokhoa o ts'oanang ho tiisa hore ho na le mocheso o ka tšeptjoang ho pholletsa le lihlahisoa tsa tlhahiso. Taolo ea ts'ebetso e boloka botenya ba dielectric bo ts'oanang, lamination e se nang letho, le pheletso e nepahetseng ea bokaholimo. Lintlha tsena li ama ts'ebetso ea mocheso ka kotloloho likopanong tse felileng.

Ho utloisisa mechanics ea mocheso ho nolofalletsa khetho ea lisebelisoa tse nepahetseng le li-stackups bakeng sa lits'ebetso tse ikhethileng. Baenjiniere ba batlang tsamaiso e phahameng ea mocheso ba tlameha ho nahana ka thepa ea thepa, boleng ba sebopeho, le litlhoko tsa ho kopanya tsamaiso.

Kakaretso: Ho phahamisa Metal Core PCB Heat Dissipation

Bokhabane ba ho senya mocheso oa MCPCB bo hlaha ho tloha ho finyella khanyetso e tlaase ea mocheso ho pholletsa le tsela eohle ea mocheso. Tšebelisano lipakeng tsa ho hasana ha koporo, phetisetso ea dielectric le dissipation ea mantlha ea tšepe e hlalosa ts'ebetso ka kakaretso. Lera le leng le le leng le kenya letsoho ka tsela e ikhethang ho tlosa mocheso likarolong tse bohlokoa.

Lisebelisoa tsa morao-rao li hloka taolo e tsoetseng pele ea mocheso ha matla a motlakase a ntse a eketseha. Theknoloji ea ho senya mocheso ea Metal core PCB e fetoha ho sebetsana le mathata ana ka lisebelisoa tse ntlafalitsoeng le mekhoa ea tlhahiso. Katleho e hloka ho utloisisa melao-motheo ea theory le menahano e sebetsang ea ts'ebetsong.

Ho Highleap Electronics, sehlopha sa rona sa boenjiniere se ikhethile ka ho ntlafatsa meralo ea MCPCB bakeng sa ts'ebetso e phahameng ka ho fetisisa ea mocheso. Ka bokhoni bo tsoetseng pele ba tlhahiso ea PCB le taolo e matla ea boleng, re fana ka litharollo tsa mantlha tsa PCB tsa tšepe tse fetang litlhoko tsa taolo ea mocheso. Ikopanye le rona ho buisana ka hore na litharollo tsa ho qhala mocheso tsa MCPCB tse ikhethileng li ka rarolla liphephetso tsa hau tse ikhethang tsa mocheso joang.