High Frequency PCB

Tšehetso ea Moralo le Katoloso ea Litšenyehelo bakeng sa li-PCB tsa Maqhubu a Phahameng

Ho rala li-PCB bakeng sa lits'ebetso tsa RF, microwave, le mmWave ho hloka ho feta mekhoa e tloaelehileng ea sebopeho. Ho Highleap Electronics, sehlopha sa rona sa boenjiniere se sebetsa haufi-ufi le bareki ho ntlafatsa botšepehi ba matšoao, taolo ea impedance, le manufacturability ho tloha sethaleng sa moralo. Re u thusa ho qoba maraba a tloaelehileng joalo ka tsela e fetelletseng, lilupu tse telele tsa mats'oao, le litsela tse sa nepahalang tsa morao-rao-ho netefatsa hore sebopeho sa hau se ts'ehetsa phetisetso ea mats'oao a hloekileng esita le ka maqhubu a GHz.

Ho ts'ehetsa ts'ebetso e tšepahalang ea maqhubu a holimo, re latela litataiso tse netefalitsoeng tsa tlhophiso: ho fokotsa crosstalk lipakeng tsa mela ea matšoao, ho sebelisa li-trace 45 ° ho e-na le likhutlo tse bohale, le ho fokotsa tšebeliso ea lossy soldermask litseleng tsa matšoao a bohlokoa. Re boetse re eletsa mabapi le khetho ea thepa e fokotsang tahlehelo ea dielectric le mathata a holim'a metsi a bakoang ke phello ea letlalo ka maqhubu a phahameng. Ebang ke moralo oa li-antenna kapa li-circuits tsa radar, lintlha tsa rona li thusa bareki ho qoba mathata a EMI le ho fumana ts'ebetso e betere ea ho tsamaisa lerata.

Highleap e boetse e fana ka ditharollo tsa ho bokellana ha di-hybrid tse theko e tlase, tse kopanyang di-core tsa RF tse lahlehelwang ke theko e tlase le FR-4 bakeng sa dikarolo tse seng tsa bohlokwa. Sena se leka-lekanya tshebetso le taolo ya tekanyetso. Ho tloha ho rala ho bokellana ho isa ho diteko tsa DFM le tshehetso ya ho bapisa impedance, re mona ho o tataisa mohatong o mong le o mong—ho potlakisa potoloho ya hao ya moralo ha re ntse re fokotsa ditjeo tsa ho pheta-pheta.

Khetho ea thepa ke eona ntho ea bohlokoa ts'ebetsong ea PCB e nang le maqhubu a phahameng. Ho Highleap Electronics, re boloka lethathamo le laoloang hantle la li-laminate tse nang le maqhubu a phahameng ho tšehetsa tlhahiso e potlakileng ea prototyping le tlhahiso e tsitsitseng ea bongata. Feme ea rona e sebetsa haufi-ufi le bafani ba tsebahalang lefatšeng ka bophara ho netefatsa bonnete ba thepa, ts'ebetso e tsitsitseng ea dielectric, le mohloli o tšepahalang. Re na le thepa ea boleng bo holimo ea HF PCB joalo ka laminate e khethehileng e nang le tahlehelo e tlase, Taconic, le Isola, tse khethiloeng ka hloko bakeng sa thepa ea tsona e ntle ea dielectric le botsitso ba mocheso.

Tšehetso bakeng sa Hybrid Stack-Ups le Mixed Lamination

Re fana ka ts'ehetso e felletseng bakeng sa kaho e nyalisitsoeng ea PCB, e kopanyang lisebelisoa tsa maqhubu a holimo le FR4 e tloaelehileng kapa litsamaiso tse tlase tsa tahlehelo ea mantlha / prepreg ho leka-lekanya ts'ebetso, litšenyehelo, le tlhahiso. CAM ea rona e nang le boiphihlelo le lienjineri tsa ts'ebetso li ka ntlafatsa pokello ea hau ea lera ho netefatsa:

• Taolo e tsitsitseng ea impedance ho pholletsa le mehala ea phetisetso
• Tahlehelo e tlase ea ho kenya ka maqhubu a phahameng
• Minimal dielectric skew ka lipara tse fapaneng
• Ho lumellana le litekanyo tse khethehileng tsa koporo le ho qeta holimo

Ithute haholoanyane ka litharollo tsa rona tsa ho bokellana ha li-hybrid.

Theko ea Lintho tse Fetohang le Lisebelisoa tse Fanoang ke Bareki

Ntle le lisebelisoa tsa rona tsa nako e telele, re boetse re tšehetsa:

• Theko e potlakileng ea li-laminate tse boletsoeng ke bareki (ho kenyeletsoa thepa e sa tloaelehang kapa e hlophisitsoeng) ka barekisi ba tšepahalang.
• Ts'ebetso ea thepa e fanoeng ke bareki (phahlo) e nang le ts'ebetso e felletseng ea ts'ebetso
• Litlhahiso tsa ho fetola thepa ho ipapisitsoe le tekano ea motlakase, mochini, le mocheso bakeng sa litšenyehelo kapa ho ntlafatsa nako ea ho etella pele.

Sehlopha sa rona sa ho fumana thepa se sebetsa haufi-ufi le baemeli ba khethehileng ba laminate e nang le tahlehelo e tlase, Taconic, le ba libaka ho netefatsa linako tse potlakileng tsa ho etella pele thepa le ho sireletsa liteishene tsa phepelo ea moetsi oa pele, haholo-holo bakeng sa thepa e thehiloeng ho PTFE le ea DK e phahameng e nang le lipotoloho tse telele tsa theko.

Bokhoni ba Tlhahiso ea PCB ea Maqhubu a Phahameng

Highleap Electronics e fana ka mefuta e mengata e fapaneng ea bokhoni ba ho etsa masela bo tsamaellanang le lits'ebetso tsa maqhubu a holimo, ho tloha ho RF ho ea ho mmWave. Re kopanya tlhahiso e nepahetseng le taolo e thata ea ts'ebetso ho fihlela litlhoko tse thata tsa litsamaiso tsa kajeno tsa lebelo le phahameng, tse phahameng haholo tsa RF.

Bokhoni ba rona bo kenyelletsa:

• Multilayer RF PCB e entsoeng (ho fihla ho lihlopha tse 60 le ho feta)
• Kaho e kopaneng ea li-stack-up (PTFE + FR4, Megtron + Isola, joalo-joalo)
• Tsela e laoloang ea impedance (±5% mamello)
• Etching ea mela e metle (salisa/sebaka ho fihla ho 2/2 mil kapa 50μm)
• Ho cheka ka morao le ka-ka-pad bakeng sa pontšo ea botšepehi
• Plated cavity le bohale plating bakeng sa tšireletso le ntlo ea manakana
• Mehaho ea microwave joalo ka li-filters, li-couplers, le li-antenna
• Taolo e thata ea botenya ba dielectric bakeng sa bolelele bo tsitsitseng ba motlakase
• Liqeto tse tlase tse tlase: ENIG, ENEPIG, silevera e qoelisoang, khauta e bonolo

Re ts'ehetsa li-stack-ups tse tloaelehileng, meaho e kenelletseng, le meralo ea li-antenna-in-substrate bakeng sa lits'ebetso tse kenyelletsang lisensara tsa radar, likhokahano tsa satellite, IoT, le liteishene tse se nang mohala.

Litšebeletso tsa Kopano tse E 'ngoe bakeng sa li-PCB tsa High-Frequency

Highleap e fana ka lits'ebeletso tsa kopano ea li-turnkey tse felletseng le tse sa fellang tsa PCB tse etselitsoeng RF, microwave, le litsamaiso tsa mmWave.

Bokhoni ba Kopano:

• SMT & through-hole assembly for RF modules

• Ho beoa ka nepo ha likarolo tsa RF tse hlokolosi

• Ho sebetsana le lihokelo tsa RF (SMA, SMP, U.FL)

• Likoti tse sireletsang, ho beoa ha mokoti, le ho kopanya sink ea mocheso

• BGA le tlhahlobo ea likarolo tse hlakileng ka X-ray

• Mekhoa ea ho phalla e tlaase bakeng sa bohloeki ba dielectric

• Ts'ehetso ea ho fumana BOM le ho ntlafatsa litšenyehelo

Tiisetso ea Boleng bakeng sa li-PCB le Likopano tsa Maqhubu a Phahameng

Ho Highleap Electronics, boleng ke mantlha ho tsohle tseo re li etsang. Bakeng sa li-PCB tsa maqhubu a phahameng le li-module tsa RF tse kopaneng, re kenya tšebetsong liprothokholo tse khethehileng tsa tlhahlobo le tlhahlobo ho netefatsa ts'epo, ts'ebetso ea mats'oao, le ho latela maemo a indasteri.

PCB Fabrication Quality Control

• 100% Teko ea Motlakase ho bona lifupi le ho bula
• Ho netefatsoa ha setlankana sa Impedance bakeng sa mesaletsa e laoloang
• Automated Optical Inspection (AOI) bakeng sa netefatso ea mela e metle
• Tlhahlobo ea X-ray ea ho hokahanya ha multilayer le ka meaho
• Cross-Section Analysis ho netefatsa botenya ba plating, boleng ba lebota la lesoba, le ngoliso ea lera
• TDR ea boikhethelo, S-Parameter, le Teko ea Tahlehelo ea ho Kena bakeng sa litsela tse mahlonoko tsa matšoao
• Ho lumellana le IPC-6018 (High-Frequency PCBs) le Class 2 / Class 3 maemo a ho tšepahala

PCBA (Kopano) Taolo ea Boleng

• Tlhahlobo ea AOI le X-ray bakeng sa li-BGA, li-IC tsa molumo o motle, le likaroloana tse sa sebetseng.
• Tlhahlobo ea Solder Paste (SPI) bakeng sa boleng ba khatiso le taolo ea molumo
• Tlhahlobo ea In-Circuit (ICT) le Teko ea Ts'ebetso ha u kopa
• ESD e thata le taolo ea mongobo bakeng sa likarolo tse utloang RF
• Tšebeliso ea masala a tlase kapa a sa hloekang ho fokotsa tšusumetso ea dielectric
• Ho sebetsana ka hloko ha lihokelo tsa RF (SMA, SMP, U.FL) ho boloka ts'ebetso
• Melao ea RoHS le REACH bakeng sa phihlello ea 'maraka oa lefats'e

Sehlopha sa rona sa QA se nang le boiphihlelo se netefatsa hore boto e 'ngoe le e 'ngoe le kopano e kopana le litlhaloso tsa moralo oa hau mme e sebetsa ka ts'epahalo maemong a bohlokoa haholo.