Tlhahlobo e Tebileng ea Theknoloji ka Lisebelisoa tsa PCB

Lisebelisoa tse sebelisoang tlhahisong ea PCB ha se feela li-substrate tsa mechini. Li bapala karolo ea bohlokoa ho bopeng mokhoa oa tlhahiso le ho rarahana ha li-platform tsa komporo ea mohala tsa moloko o latelang le masela a switch a setsi sa data. Lisebelisoa tsena li na le tšusumetso e kholo ts'ebetsong ea motlakase, ho mamella mocheso le mechini, nako ea bophelo e sebetsang, le ho ikamahanya le tikoloho ha liboto tse felileng - lintlha tsa bohlokoa haholo lits'ebetsong tse nang le likotsi tse kholo joalo ka lisebelisoa tsa elektroniki tsa likoloi le lihlopha tsa linaleli tsa sathelaete, moo ho tšepahala ho leng bohlokoa haholo.

Ka lipatlisiso tse batsi mabapi le likarolo tsa bohlokoa tsa lik'hemik'hale, tsa motlakase le tsa mochini tsa lihlopha tse kholo tsa lisebelisoa tsa PCB - ho kenyeletsoa polymeric, ceramic, glass, hybrid, le metallic - bahlahisi ba thehile litlolo tse fapaneng tsa lisebelisoa. Lipehelo tsena li leka-lekanya litšenyehelo khahlanong le bokhoni, ho sebetsana le litlhoko tse khethehileng tsa indasteri. Ka ho khetha lisebelisoa tse nepahetseng ho tloha lethathamong lena le pharaletseng, baqapi ba ka hlōla mefokolo ea mekhoa e meng e tlaase.

Tlhahlobo ena e qaqileng ea thekenoloji e hlahloba sebopeho le thepa ea lisebelisoa tse etellang pele tsa PCB tse tšehetsang mekhoa ea puisano le khomphutha ea mehala. E boetse e hlahisa litharollo tse hlahang tse reretsoeng ho sebetsana le mefokolo ea likhetho tsa setso. Mekhoa e metle le mehlala ea ts'ebeliso e fana ka tataiso mabapi le ho ntlafatsa khetho ea lisebelisoa ho ntlafatsa ts'ebetso.

Sebopeho le Lintho tse Bohlokoa tsa Litho tse ka Sehloohong tsa PCB Material

Ho kopanya libopeho tse ikhethang tsa li-polymers, li-ceramics, masela a khalase, li-foil tsa tšepe le liaparo tse khethehileng li fella ka li-laminate tsa potoloho tse hatisitsoeng tse nang le thepa ea motlakase, ea mocheso, ea mechine le ea lik'hemik'hale. Thepa ena e leka-lekanya ho ts'epahala, botšepehi ba matšoao, ho etsoa, ​​​​tokiso, le litšenyehelo nakong eohle ea bophelo ba tlhahiso le ts'ebetso, ho sebetsana le likhahla tse fapaneng tsa tikoloho joalo ka mocheso, vibrate, ts'isinyeho, mongobo, tšilafalo, motlakase le botsofali.

Lisebelisoa tsa Substrate

Kaha li-substrates li etsa 60-90% ea li-volumes tse phethiloeng tsa PCB, thepa e kang dielectric constants, conductivities ea thermal, le mocheso oa phetoho ea khalase li bohlokoa. Thepa ena haholo-holo e tsoa likhethong tsa resin ea dielectric, ka likhetho tsa bohlokoa tse kenyelletsang:

• FR-4 : Li-resin tsa epoxy tse matlafalitsoeng ka lesela la khalase li busa 'marakeng ka lebaka la ho leka-lekana ha tsona le bokhoni ba tsona ba litšenyehelo. FR-4 e fana ka constant ea dielectric ea 4.5, tangent ea tahlehelo e ka tlase ho 0.025, le Tg e ka bang 130°C, leha e na le karolelano ea conductivity ea mocheso.

• Li-substrate tse Phahameng tsa Maqhubu : Metswako ya polymer e kopanyang PTFE kapa di-ceramics e fana ka dibopeho tse tsitsitseng tsa motlakase tse fetang 10 GHz empa e tla ka theko e hodimo ka lebaka la dithibelo tse rarahaneng tsa tlhahiso le phepelo.

• Di-substrate tse Phahameng tsa Thempereichara : Ho eketsa di-filler tse sa pheleng ho di-resin tsa hydrocarbon le silicone ho eketsa haholo ho tsamaisa ha mocheso ho feta 4 W/m/K empa ha ho tsamaisane le tshebetso ya motlakase ya ditharollo tse turang haholo.

• Di-substrate tsa Mocheso o Phahameng : Bakeng sa maemo a feteletseng a fetang 280°C ho soldering kapa mocheso o sebetsang wa 260°C, dikgetho tse tlwaelehileng tsa polymeric di a haella. Diphetoho tsa polymer tsa polyimide, quartz, le kristale ya metsi di a hlokahala bakeng sa ditshebediso tsena tsa mocheso o phahameng.

Matlafatso ea Dielectric

Li-laminate tsa PCB hangata li kenyelletsa likhalase tse lohiloeng, quartz, kapa masela a organic fiber ho matlafatsa matla a tsitsitseng le ho fokotsa liphetoho tsa maemo nakong ea ho fetoha ha mocheso. Mefuta e tsebahalang e kenyelletsa:

• E-Glass e Tloaelehileng : Ka thepa e amohelehang ea dielectric le melemo ea litšenyehelo, E-Glass e atile ho li-PCB tsa bareki ho ea ho tsa lifofane tse sa sutumelleng meeli ea maqhubu a seea-le-moea.

• Masela a Phahameng a Maqhubu : Ho fokotsa tahlehelo ea matla a seea-le-moea le mahlaseli, ho sebelisoa ntlafatso ea likarolo tsa khalase tse fokolang tse lahleheloang kapa li-polymer tse sa lohiloeng tse tsitsitseng tsa kristale ea metsi bakeng sa likarabelo tse tsitsitseng tsa motlakase ho fihlela ho 100 GHz.

Foil ea Copper

Lisebelisoa tsa sejoale-joale li hloka masela a koporo a hloekileng haholo a nang le mamello e nepahetseng, ho tloha ho 9µm ho isa ho 70µm botenya:

• Koporo e phutholohileng e nang le Metswako : Mokhoa ona o kenyelletsa kalafo e pheta-phetoang ya ho phutholla ka serame le ho futhumatsa ho bata le ho hodisa di-nodule tsa koporo tse entsweng ka motlakase, tse fanang ka phokotso e nyane ya ditjeo empa di hloka kalafo ya tshepe e sireletsang.

• Koporo e lahliloeng ka motlakase : Ho hlwekisa ka motlakase ho latelwang ke ho polata ka motlakase hodima di-mandrel tse bentšitsoeng ho hlahisa difoile tse boreledi haholo ho fihlela ho di-micron tse 3, ho nolofatsa dibopeho tse ntle tsa potoloho.

Liqeto tsa ho Qetela tsa Tšireletso

Li-conductor tse tala tsa koporo li na le tšekamelo ea ho ba le oxidation le kutu, ka hona ho sebelisoa lisebelisoa tse sireletsang ho holisa lifensetere tsa latency tsa kopano:

• Li-Preservative tsa ho Solderability Organic (OSP) : Lifilimi tse tšesaane tsa organic li thibela ho oxidation ea koporo ka libeke, leha li ka ba bonolo ebile li ka senyeha habonolo nakong ea ho li sebetsana.

• Silivera e Iqoelisoang : Ho sa tsotellehe litšenyehelo tse phahameng ka lebaka la ho felisoa ha chefo ea chromate, lipekere tsa silevera li hanela oxidation haholoanyane empa li hloka taolo e matla ea tšilafalo.

Bonding Interlayers le Adhesives

Liboto tsa Multilayer li sebelisa mekhoa e fapaneng ea maqhama ho etsa bonnete ba ho khomarela le ho thibela delamination holim'a potoloho ea matla le mocheso:

• Acrylic : Lifilimi tsa acrylic tsa Thermoplastic li fana ka matla a ho kopanya a itekanetseng le sekhahla se potlakileng sa lamination, tse thusang ho etsa prototyping ka potlako.

• Li-fluoropolymer : Bakeng sa lits'ebetso tsa maqhubu a phahameng tse fetang 20 GHz, lifilimi tsa sekhomaretsi sa polymer tse nang le fluorine tse lahleheloang ke boleng bo tlase li boloka ts'ebetso ea motlakase ntle le ho hatella mesaletsa e bonolo, leha li tla ka litšenyehelo tse phahameng.

Ho utloisisa thepa ena le liphetoho tsa eona ho thusa baenjiniere ho sebetsana le ketso e rarahaneng ea ho leka-lekanya e hlokahalang bakeng sa moralo le ts'ebetso e ntle ea PCB.

Litšobotsi tsa Li-substrates tsa PCB tse Amoheletsoeng ka Bophara le Laminates

Li-substrates li etsa karolo e kholo ea liboto tse phethiloeng tsa PCB 'me li bohlokoa ho khethollang litšobotsi tsa bohlokoa tse kang ho feto-fetoha ha maemo, meeli e phahameng ea mocheso, ho hanyetsa mollo, le ho lumellana le mekhoa e fapaneng ea tlhahiso. Baenjiniere ba tlameha ho khetha ka hloko ho tse makholo a lisebelisoa ho fumana tse loketseng litlhoko tsa bona. Mona ke ho shebisisa lisebelisoa tse ling tse sebelisoang hangata:

Li-Woven Fiberglass Reinforced Epoxy Laminates (FR-4)

FR-4 e se e le setsi sa lisebelisoa tsa elektroniki tse bolokang chelete e ngata ka lebaka la ntlafatso ea k'hemistri ea resin, ho loha likhoele le bohloeki ba thepa ka kakaretso. E sebelisoa haholo likhokahanong, likhomphutha, lisebelisoa tsa elektroniki tsa bareki, esita le lits'ebetsong tsa likoloi, hangata moo lisebelisoa tsa sesole kapa tsa boemo ba sefofane e seng tsa bohlokoa.

• Melemo: FR-4 e fumaneha habonolo ka litekanyo tse fapaneng tsa koporo, li-viscosity tsa resin, le masela a matlafatsang, e leng se etsang hore e be khetho ea ho khetha lits'ebetso tse ngata. Ho fumaneha ha eona hohle le ho leka-lekana ha litšenyehelo le ts'ebetso ho thusa ho hlalosa botumo ba eona bo tšoarellang.
• Tradeoffs: Le hoja FR-4 e tšepahala ebile e theko e tlaase, tšebeliso ea eona ea epoxy e tloaelehileng le E-glass e fokotsa ts'ebetso ea eona ea motlakase ha e bapisoa le thepa e khethehileng haholoanyane. E oela libakeng tseo ho tsona botšepehi bo phahameng ba matšoao le tsamaiso ea mocheso e leng tsa bohlokoa.

PTFE le Hydrocarbon Woven Composites

Bakeng sa lits'ebetso tse hlokang tahlehelo e tlase ea motlakase le botsitso bo phahameng, baqapi ba fetohela ho li-substrates tse tsoetseng pele joalo ka PTFE (Teflon) le metsoako ea hydrocarbon. Lisebelisoa tsena hangata li kenyelletsa li-microglass spheres kapa fluoropolymers ho ntlafatsa ts'ebetso.

• Melemo: Likarolo tsa PTFE li fana ka tahlehelo ea dielectric e tlase ka mokhoa o ikhethang (ka tlase ho 0.002) le li-constants tse tsitsitseng tsa dielectric (pakeng tsa 3.0 le 10.2), li li etsa tse loketseng li-circuits tsa microwave le lits'ebetso tsa maqhubu a phahameng ho fihla ho 100 GHz.
• Tradeoffs: Litšenyehelo tse phahameng, litlhoko tsa lisebelisoa tsa tloaelo, le mekhoa e thata ea ho etsa maqheka e fokotsa tšebeliso e atileng ea PTFE. Ho sa tsotellehe matla a eona a matla a motlakase, lintlha tsena li etsa hore li se ke tsa fumaneha habonolo ha li bapisoa le lisebelisoa tse tloaelehileng.

High Thermal Conductivity Metal-Matrix Laminates

Ho sebetsana le mefokolo ea lisebelisoa tsa polymeric lits'ebetsong tsa matla a phahameng, li-laminate tsa tšepe-matrix li sebelisa likaroloana tse kang aluminium nitride, boron nitride, silicon carbide, kapa daemane ho matlafatsa conductivity ea mocheso.

• Melemo: Likarolo tsena li sebetsa hantle haholo ho felisoeng ha mocheso, 'me mocheso oa mocheso o fihla ho li-watts tse 85 ka mithara-Kelvin, haholo ho feta 0.25 watts tse fanoang ke lisebelisoa tsa setso tsa FR-4. Sena se lumella ho pholisa ka katleho ha likarolo tse phahameng tsa matla.
• Tradeoffs: Metal-matrix laminates li na le mocheso o fokolang (o ka bang 200 ° C) 'me ka kakaretso li bitsa chelete e ngata. Lintlha tsena, hammoho le matla a dielectric a fokotsehileng, li fokotsa tšebeliso ea tsona ho lisebelisoa tse khethehileng tsa morao-rao.

Polyimide le Liquid Crystal Polymer Laminates

Ha FR-4 e sa lekana ka lebaka la litlhoko tsa mocheso o phahameng, polyimide le li-polymer tsa kristale tsa metsi li fana ka tharollo. Lisebelisoa tsena li bohlokoa lits'ebetsong tse hlokang ho tšoarella mochesong o ka holimo ho 300 ° C bakeng sa ho soasoa le 260 ° C bakeng sa maemo a ts'ebetso, joalo ka thepa ea sefofane le lisebelisoa tsa ho cheka mekoti.

• Melemo: Li-laminate tsa Polyimide li boloka thepa ea tsona esita le mochesong o fihlang ho 340 ° C, e leng se etsang hore li tšoanelehe bakeng sa tikoloho e boima joaloka ka mor'a lihlooho tsa li-cylinder tsa enjene kapa lilaoli tsa li-jet. Li feta meeli ea lisebelisoa tse ling tsa thermoset.
• Tradeoffs: Theko e phahameng (e ka bang $ 500 ka mithara ea lisekoere) le lihlahisoa tse fokolang tsa thepa li etsa hore polyimide laminates e be phephetso ho hlahisa le ho bitsa chelete e ngata. Hangata li sebelisoa feela moo ho se nang likhetho tse ling tse sebetsang ka lebaka la litlhaloso tse thata.

Ho khetha thepa e nepahetseng ho kenyelletsa ho utloisisa lintlha tsena tse poteletseng le hore na li ama ts'ebetso le ts'epo ea nako e telele. Ho bohlokoa ho lekola melemo le li-tradeoffs ho fihlela boleng le ts'ebetso e ntle ka ho fetesisa bakeng sa litlhoko tsa hau tsa PCB.

Mekhoa e Molemo ka ho Fetisisa ea ho Khetha Lisebelisoa tse Nepahetseng tsa PCB

Ha u khetha lisebelisoa tsa PCB, ho bohlokoa ho utloisisa matla le mefokolo ea khetho ka 'ngoe ho etsa khetho e ntle ka ho fetisisa. Baqapi ba hloka ho leka-lekanya lintho tse tlang pele tse kang ts'ebetso ea motlakase, taolo ea mocheso, ho tšoarella ha mochini, ho ikamahanya le maemo tikolohong, nako ea bophelo, ho latela melao, le ho ts'epahala khahlano le lits'enyehelo, linako tse etellang pele, scalability le ho se sebetse ho ka bang teng. Mona ke tse ling tsa litataiso tse sebetsang ho thusa ts'ebetsong ena:

Utloisisa Maikutlo a Bohlokoa a Thepa

Lintho tse bonahalang tse kang dielectric constants, melting points, le resistivities li ka fapana haholo pakeng tsa li-resin tse fapaneng esita le ka har'a lelapa le le leng la thepa. U se ke ua itšetleha feela ka maqephe a data; ho e-na le hoo, sebelisa lipapiso tse qaqileng tsa k'homphieutha ho hlahloba lisebelisoa tlas'a maemo a feteletseng. Sena se thusa ho senola mathata afe kapa afe a ka 'nang a se ke a bonahala litekong tse tloaelehileng tsa tikoloho.

Etsa Tlhahlobo ea Phekolo ea Bophelo

Bapisa bophelo bo hakanyetsoang ba ts'ebetso ea lisebelisoa tse ka bang teng le maemo a lebelletsoeng le lipotoloho tse ncha bakeng sa kopo ea hau. Lintho tse ikhethang tsa motlakase li bohlokoa, empa haeba thepa e senyeha pele ho nako tlas'a khatello ea kelello, e ka baka ho hlōleha ho bitsa chelete e ngata. Netefatsa hore lisebelisoa li khona ho sebetsana le khatello ea mocheso le matla ntle le ho baka mathata ka nako.

Lekola Letoto la Liphepelo

Lekola bokhoni ba tlhahiso le botsitso ba phepelo ea bafani ba thepa. Sheba maano a bona a setoko sa buffer 'me u nahane ka likotsi tse kang ho itšetleha ka mohloli o le mong kapa litaba tsa lipolotiki tse ka sitisang phepelo. Liketsahalo tsa morao-rao, joalo ka khaello ea semiconductor, li totobalitse hore na ho bohlokoa hakae ho ba le liketane tsa phepelo tse tšepahalang ho qoba khaello le tieho.

Nahana ka Lintlha tsa Tumellano

Etsa qeto ea hore na morero oa hau o hloka litifikeiti tse khethehileng tsa taolo, joalo ka IPC-4101 bakeng sa lisebelisoa tsa boemo ba likoloi kapa UL-94 bakeng sa tieho ea mollo. Liindasteri tse ling li hloka tlhahlobo e matla le setifikeiti tse ka 'nang tsa se ke tsa hlokahala bakeng sa lits'ebetso tse laoloang hanyane. Ho utloisisa litlhoko tsena esale pele ho ka boloka nako le ho thibela mathata hamorao ts'ebetsong ea moralo.

Ka ho nka katamelo e felletseng le ho nahana ka likarolo tsohle tsa ts'ebetso ea thepa, potoloho ea bophelo, phepelo ea thepa, le ho latela melao, baenjiniere ba ka etsa liqeto tse nang le tsebo tse leka-lekaneng ts'ebetso, litšenyehelo, le ho fumaneha. Tlhahlobo e nepahetseng le moralo li thusa ho qoba liphoso tse theko e boima le ho netefatsa hore lisebelisoa tsa hau tsa PCB li kopana le litlhoko tsa hau tsa tekheniki le tsa tekanyetso.

Litlhaloso tse Tloaelehileng le Matlotlo a Lihlopha tsa Lintho tsa Bohlokoa tsa PCB

Ha ho etsoa li-PCB, ho khetha thepa e nepahetseng ho kenyelletsa ho utloisisa litlhaloso le thepa ea tsona ho pholletsa le mekhahlelo e fapaneng. Mona ke kakaretso ea litšobotsi tsa bohlokoa tse susumetsang khetho ea thepa:

Thepa ea Motlakase

Ts'ebetso ea motlakase ea lisebelisoa tsa PCB e bohlokoa bakeng sa ho netefatsa phetiso ea mats'oao e tšepahalang. Lintho tse ka sehloohong li kenyelletsa kamehla dielectric, tse amang impedance ea capacitive le taolo ea matšoao; tangent ea tahlehelo, e lekanyang ho monya matla le phello ea eona ho botšepehi ba lipontšo ka maqhubu a phahameng; le matla a dielectric, a bontšang sebaka se seholo sa motlakase seo thepa e ka se sebetsanang le pele e senya. Ho feta moo, ho hanyetsa molumo ho lekola khanyetso ea thepa ho tsoa ha motlakase ka bongata ba laminate.

Mechanical Properties

Lintho tsa mochini li etsa qeto ea hore na thepa e khona ho mamella likhatello tsa 'mele hantle hakae. The tensile modulus e lekanya ho satalla ha thepa le tšekamelo ea eona ea ho khopama tlas'a mefuta e otlolohileng. Matla a Flexural a bonts'a matla a holimo a ho kobeha ao thepa e ka e mamellang pele e robeha, ha matla a khatello a hlalosa bokhoni ba eona ba ho hanela buckling tlas'a meroalo ea khatello ea axial.

Thepa ea Thermal

Thermal thepa e bohlokoa bakeng sa ho laola mocheso ka har'a likopano tsa PCB. Coefficient of thermal expansion (CTE) e bonts'a hore na thepa e atoloha hakae ka liphetoho tsa mocheso. Thermal conductivity lekanya lebelo leo mocheso o phallang ka lona ka laminate. Mocheso oa mocheso oa khalase (Tg) o emela mocheso oo thepa e leng bonolo ho oona, 'me mocheso oa ho bola o bontša ntlha eo ka eona thepa e senyehang ka lik'hemik'hale, e lokolla mocheso.

Mefuta ea Lik'hemik'hale

Ho hanyetsa lik'hemik'hale ho bohlokoa bakeng sa ho tšoarella le ho sebetsa. Ho monyela ha metsi ho bolela kamano ea mongobo ea thepa, e ka amang ho kenya letsoho le ho lebisa ho ionic conduction. Solvent resistance e bontša kamoo thepa e mamellang lik'hemik'hale tse matla kateng. Flame retardance e hlalosa bokhoni ba thepa ea ho itima ha e pepesehetse malakabe, 'me ho fokotsa mocheso ho lekanya tšekamelo ea eona ea ho lokolla likhase tse qabeletsoeng, tse ka amang botšepehi le ts'ebetso.

Baetsi ba Leading Global Baetsi ba Lisebelisoa tsa PCB

Ha baqapi ba ntse ba tsoma lisebelisoa tsa PCB tsa maemo a holimo, ho fetohela ho baetapele ba indasteri ho ka etsa phapang eohle. Likhamphani tsena ke litsebi lefapheng la tsona, li lula li sutumelletsa enfelopo ka lisebelisoa tse ncha le theknoloji e tsoetseng pele. Hore na o hloka li-substrates tse matla, li-reinforcement tse tšepahalang, li-foil tse nepahetseng tsa koporo, kapa limaske tsa solder tse sebetsang hantle, baetsi bana ba fana ka likhetho tse ntle ho fihlela litlhoko le liphephetso tsa hau. Mona ke setšoantšo sa ba bang ba libapali tsa bohlokoa tse etsang maqhubu lefatšeng la lisebelisoa tsa PCB:

Baetsi ba Substrate Laminates

• Island: E tsebahala ka li-epoxy, polyimide, fluoropolymer, le li-laminate tse tlatsitsoeng ka ceramic, Isola e fana ka tharollo e fapaneng bakeng sa lits'ebetso tse fapaneng tsa PCB.
• laminate e khethehileng e nang le tahlehelo e tlase: E sebetsa ka ho khetheha ka metsoako ea hydrocarbon/ceramic le laminates conductive thermally, e fanang ka likhetho tse phahameng tsa ts'ebetso bakeng sa tikoloho e hlokang.
• Taconic: E fana ka li-composites tsa PTFE le li-laminate tse tlatsitsoeng ka ceramic, tse loketseng lits'ebetso tse hlokang tahlehelo e tlase le ts'ebetso e phahameng ea maqhubu.
• Panasonic: E fana ka Megtron hydrocarbons le ceramics, tse tsejoang ka ho tšoarella ha tsona le bokhoni ba tsona ba maqhubu a phahameng.
• Park Electrochemical: E tsepamisitse maikutlo ho lisebelisoa tse phahameng tsa maqhubu, ho fana ka puisano e khethehileng le litlhoko tsa elektronike.
• Shengyi: E fana ka li-laminate tse nang le koporo tse finyellang litlhoko tse ngata tsa tlhahiso.

Reinforcement Suppliers

• Own Corning: E fana ka mefuta e fapaneng ea masela a fiberglass, a tsejoang ka matla le ho tšepahala.
• Saertex: E fana ka masela a khalase le a quartz, a fanang ka ts'ebetso e ntlafalitsoeng le ho tšoarella.
• Valuetex / Technic: E tsebahala ka masela a quartz a bobebe, a bohlokoa bakeng sa lits'ebetso tse phahameng haholo.

Baetsi ba Copper Foil

• Oak-Mitsui: E hlahisa li-foil tsa koporo tse kentsoeng tse bohlokoa bakeng sa tlhahiso ea boleng bo holimo ea PCB.
• Likhamphani tsa Furukawa Electric Co: E sebetsa ka ho khetheha ka koporo ea electrodeposited e tlase haholo, e fanang ka ho nepahala le ho boreleli bakeng sa likarolo tse ntle tsa potoloho.

Li-mask tsa solder

• Taiyo Ink: E fana ka limaske tsa solder tse nang le lifoto, tse tsejoang ka ho nepahala le bonolo ho li sebelisa.
• Sehlopha sa Tamura Corp: E fana ka limaske tse hatisang skrineng sa botsitso bo phahameng ba mocheso, tse loketseng maemo a mocheso o phahameng.
• Peters Group: E fana ka limaske tsa solder tse phekolehang ka UV, tse sebetsang hantle le tse tšoarellang lits'ebetsong tse fapaneng.

Bonding Film Manufacturers

• laminate e khethehileng e nang le tahlehelo e tlase: E na le lifilimi tsa sekhomaretsi tsa thermoplastic fluoropolymer tse netefatsang litlamo tse matla, tse tšepahalang.
• Panasonic: E tsebahala ka li-prepregs tsa "low-flow epoxy prepregs", tse nolofatsang ts'ebetso e phahameng ea lamination.
• Ventec: E fana ka lifilimi tse tlatsitsoeng tse khomarelang, tse fanang ka matlafatso le botsitso bo eketsehileng.

Liphello tsa Khetho ea Boitsebiso ho PCB Design le Thepa

Ho nkela thepa ea jeneric sebakeng sa khaello ea phepelo ho ka lebisa mathateng a bohlokoa haeba liphapang tse poteletseng tsa litšobotsi tsa thepa li sa nkuoe ka hloko. Liphapang tsena li ka ama haholo lihlahisoa tsa tlhahiso le ts'epahalo ea ts'ebetso:

Ho Tsamaellana ha Ts'ebetso ea Tlhahiso - Esita le liphapang tse nyane tsa thepa tse kang tangent ea tahlehelo ea dielectric, boima ba limolek'hule, viscosity, kapa liprofaele tsa pheko li ka ama likarolo tsa bohlokoa tsa ts'ebetso ea tlhahiso, joalo ka ho tjheka habonolo, ho plateable hantle, le ho lokisoa hape. Sena se etsa hore ho fapanyetsana ha thepa kapele ho be thata ho feta kamoo ho ka bonahalang kateng.

Tshebetso ya Motlakase – Mefuta e fapaneng ya substrate le diforomo di ka ba le di-constant tsa dielectric tse fapaneng haholo. Ho fihlella impedance e lakatsehang ya tšobotsi ho hloka ho bapisa ka nepo boleng bona, e leng se ka nnang sa se tsamaellane le karolelano ya datasheet kamehla.

Katoloso ea Thermal Coefficient (CTE) – Ho se lumellane ha CTE pakeng tsa mekhahlelo ea thepa ho ka hatisa li-interface tse bonolo moo mekhahlelo e hokahaneng. Ho thibela mathata a kang ho arohana ha mocheso nakong ea potoloho ea mocheso, ho bohlokoa ho hokahanya thepa ea mocheso haufi-ufi.

Mehopolo ea Phetoho ea Khalase - Mocheso o phahameng ka ho fetisisa oo substrate e ka o mamellang nakong ea ho kopanya o amana ka ho toba le ntlha ea phetoho ea khalase ea resin. Ho utloisisa thepa ena ho bohlokoa bakeng sa ho lokisa ts'ebetso ea tlhahiso ho netefatsa hore e lumellana.

Taolo ea Thempereichara – Ho fetola thepa, joalo ka ho fetola fiberglass ho ea ho dielectric tsa ceramic kapa tsa tšepe, ho ama phetisetso ea mocheso. Sena se hloka ho ntlafatsa kabo ea sefofane sa motlakase ho laola ka katleho ho qhala ha mocheso le ho netefatsa ts'ebetso e tšepahalang.

fihlela qeto e

Sebakeng se ntseng se tsoela pele sa moralo le boqapi ba PCB, ho utloisisa tekatekano e rarahaneng lipakeng tsa thepa le litlhoko tsa ts'ebeliso ke ntho ea bohlokoahali. Joalo ka ha ho shebiloe tlhahlobisong ena e qaqileng, khetho ea li-substrates, dielectrics, le li-reinforcement li ama haholo ts'ebetso, ts'epahalo le katleho ea li-PCB tsa hau. Ka ho hlahloba ka hloko lintlha tse kang dielectric constants, thermal conductivity, le mechanical strength, o ka ntlafatsa meralo ea hau ho fihlela litlhoko tsa hajoale le tsoelopele ea nako e tlang.

Haeba u batla ho phahamisa merero ea hau ea PCB ka litharollo tsa thepa tse lokiselitsoeng tse rarollang mathata a itseng a tekheniki le tikoloho, ho hlahloba mefuta ea rona ea lisebelisoa tse sebetsang hantle haholo e ka ba mohato oa hau o latelang. Ikopanye le rona ho buisana ka hore na lihlahisoa tsa rona li ka fihlela litlhoko tsa hau tse ikhethang joang le ho u thusa ho fihlela sepheo sa hau sa moralo.