Tlhahiso ea PCB ea CLTE XT
CLTE-XT e tshwarwa mona e le bothata ba ho bokellana le taolo ya dimensional-dependent. Ha e kopantswe le thepa e meng ya PCB, kaho e lokollotsweng e tlameha ho ikarabella bakeng sa botenya ba dielectric, boitshwaro ba katoloso ya mocheso, ngodiso ya lera le tshepahalo ya masoba a poleiti ho pholletsa le boto e felletseng.
Setšoantšo sa 1. Tlhahiso ea Rogers CLTE-XT PCB
Tlhahiso ea CLTE XT PCB e molemo haholo ha moralo o hloka kaho ea motsoako o tlase oa CTE 'me mekhahlelo e ke ke ea nkoa e le liboto tse ikemetseng. Stackup e tlameha ho ikarabella bakeng sa ho kopanya thepa, ngoliso le katoloso ea mocheso pele tsela ea tlhahiso e lokisoa. Tlhahiso ea Rogers CLTE-XT PCB e sebelisoa ha boto ea RF e hloka katoloso e tlase ea mocheso, boitšoaro bo tiileng ba litekanyo, le kaho e tšepahalang ea stackup ea motsoako o kopantsoeng. Ho fapana le callout ea laminate ea boleng bo le bong, CLTE-XT e tlameha ho hlalosoa ka botenya bo nepahetseng le kaho ea koporo hobane Dr e sebetsang e itšetlehile ka kaho e khethiloeng. Highleap Electronics e hlahloba botenya ba thepa, koporo, phetoho ea motsoako o kopantsoeng, ho cheka, ho plating, ho qeta le ho pepesehela kopano pele ho tlhahiso.
Tafole ea likateng
Sekgahla sa thepa: Highleap Electronics e hlahisa le ho kopanya PCB e fedileng. Sehlopha sa Rogers se boletsweng leqepheng lena se hlwaya laminate e boletsweng; Highleap ha e hlahise kapa ho rekisa laminate tsa Rogers.
Ha CLTE-XT e le Thepa e Nepahetseng ea PCB
CLTE-XT e sebediswa ha boto ya RF e hloka katoloso e tlase ya mocheso, botsitso ba dibopeho, le boitshwaro bo tshepahalang ho di-stackup tse kopantsweng. Hangata e nkuwa bakeng sa di-antenna, di-electronic tsa sefofane, di-module tsa RF, le diboto tse tsheheditsweng ka tshepe kapa tse kopantsweng moo ho se tshwane ha katoloso ho ka amang ngodiso, masoba a phuthetsweng, le botshepehi ba nako e telele. Haeba TMM e nkuwa hape bakeng sa tshebediso, tlhahlobo ya botsitso ba mocheso bakeng sa diboto tsa TMM e fana ka tlhahlobo e arohaneng ya boitshwaro ba ho tjhesa ha Dk le masoba a phuthetsweng.
Thepa e lokela ho khethoa ho nahanoa ka ho bokellana ho felletseng. CLTE-XT e ka kopanngoa le FR-4, li-laminate tse ling tsa RF, li-prepreg, li-carrier tsa tšepe, kapa likarolo tsa taolo ea dijithale, kahoo ho lekana ha lamination, ho leka-lekana ha koporo, ka sebopeho, le ho pepesehela mocheso oa kopano ho hloka ho hlahlojoa hammoho.
CLTE-XT e Lokela ho Qotsoa e le Moqomo oa Tšepo ea Motsoako
Phoso e tloaelehileng ka CLTE-XT ke ho e nka e le lebitso le bonolo la thepa. Likahareng tsa 'nete, potso ea bohlokoa ke hore na lera la CLTE-XT le sebelisana joang le FR-4, li-laminate tse ling tsa RF, li-prepreg, li-carrier tsa tšepe, kapa likarolo tsa taolo ea dijithale. CTE e tlase e thusa botsitso ba litekanyo, empa liphetoho tsa lamination li ntse li ka hlahisa mathata a ngoliso, phallo ea resin, le khatello ea maikutlo haeba stackup e sa hlahlojoe esale pele.
Sehlooho se lokelang ho elwa hloko haholo ke botshepehi ba motsoako o kopaneng. Highleap e hlahloba ho se tshwane ha CTE, ho leka-lekana ha lera, ho leka-lekana ha koporo, ngodiso ya drill, sebopeho sa masoba a poleiti, ho pepesehela phallo e ntjha, le tlhoko efe kapa efe ya ho potoloha ha mocheso. Ho bokellana ha motsoako o kopaneng ho ka hloleha hobane thepa e amoheleha ka bonngoe empa e kopantswe hampe, haholoholo ha lera la RF, lera la taolo ya dijithale, le disebediswa tsa mechini kaofela di hula moralo ka ditsela tse fapaneng.
Haeba boto e tla kopanngoa, boemo ba solder le boima ba mocheso ba karolo li lokela ho hlahlojoa ka stackup ea boto e se nang letho ho e-na le ka mor'a tlhahiso. Lithebe tse boima tsa RF, lihokelo, lijari tsa tšepe, kapa li-heat spreader li ka fetola ho pepesehela mocheso ha masoba a poleiti le li-interface tsa laminate. Ka hona, RFQ e lokela ho hlalosa tikoloho ea kopano, eseng feela boto e se nang letho.
- Hlalosa stackup e felletseng ea hybrid, ho kenyeletsoa FR-4 kapa thepa e 'ngoe ea RF e sebelisitsoeng le CLTE-XT.
- Hlahloba ho se tshwane ha CTE, ho leka-lekana ha koporo, le ho tshepahala ha masoba a poleiti pele o sebedisa disebediswa.
- Kenya ho pepesehela mocheso oa kopano ha sehlahisoa sa ho qetela se e-na le lithebe, lijari, kapa lihokelo tse boima.
Thepa e Tlase ea CTE le ea Hybrid-Stackup e Amang Tlhahiso
| Item | Moelelo oa tlhahiso |
|---|---|
| Dr ka kaho | Botenya ba CLTE-XT le kaho ea koporo li lokela ho hlalosoa ka har'a stackup. |
| Boitšoaro bo tlase ba CTE | E thusa ho sireletsa ngoliso, masoba a poleiti, le geometry ea RF tlas'a potoloho ea mocheso. |
| Kaho ea motsoako | Hangata e sebelisoa le FR-4, thepa ea dijithale e potlakileng haholo, kapa liboka tsa RF tse tšehelitsoeng ke tšepe. |
| Kopano e se nang loto | Qetello, boemo ba ho kopanya, le boima ba mocheso oa likarolo li lokela ho hlahlojoa pele li lokolloa. |
Tlhahlobo ea DFM le Stackup Pele U Qotsa
Khoutu e tšepahalang e qala ka sete e felletseng ea Gerber, lifaele tsa ho phunya, lethathamo la netlist, kemiso ea boto, setšoantšo sa stackup, callout ea thepa, boima ba koporo, qetello ea bokaholimo , lintlha tsa maske ea solder, lipheo tsa impedance, le litlhoko life kapa life tsa kopano. Highleap e hlahloba hore na moralo o ka etsoa ka makhetlo a mangata pele lisebelisoa li qala.
| Ntho ea DFM | Seo u lokelang ho se hlahloba |
|---|---|
| Sehlahisoa sa thepa | Hlalosa botenya ba CLTE-XT, mofuta oa koporo, boima ba koporo, le khopolo efe kapa efe ea Drk e sebelisitsoeng ho ketsiso. |
| Phetoho ea lamination | Hlahloba phallo ea resin, ngoliso, ho se lumellane ha CTE, le ka ts'epo mehahong e kopantsoeng. |
| Lirekoto tsa ho tšepahala | Hlalosa ditlhoko tsa microsection, kgatello ya mocheso, bokgoni ba ho kopanya, le ditlhoko tsa ho latela bongata. |
Litaolo tsa Ts'ebetso ea Tlhahiso
Tsela ea ts'ebetso e lokela ho khethoa pele thepa e lokolloa tlhahisong. Litaolo tse tloaelehileng li kenyelletsa netefatso ea thepa, tlhahlobo ea lera la ka hare, tlhahlobo ea lamination, boleng ba drill, ho lokisa lebota la masoba, ho penta koporo, ngoliso ea maske ea solder, qetello ea bokaholimo, ho nepahala ha tsela, teko ea motlakase, le tlhahlobo ea ho qetela. Nakong ea tlhahlobo ea lamination, Highleap e hlahloba hore na thepa ea hybrid e kopantsoe joang, hore na botenya bo hahuoa joang ka har'a stack le moo kotsi ea ngoliso e kopaneng teng. Phapang ea bohlokoa ea tlhahiso ke geometry e felileng ea lera le lengata, eseng feela data ea laminate ka 'ngoe. Boleng ba thepa ea thepa bo nepahetseng bo lokela ho hlahlojoa khahlanong le litokomane tsa mofani oa hona joale bakeng sa kereiti e boletsoeng le kaho.
Tlhahiso e pheta-phetoang e lokela ho sebedisa ho kopanya thepa ho amohetsweng, kaho ya kgatiso, sebopeho sa phanele le taolo ya ngodiso e le motheo. Phetolo ya thepa kapa ho leka-lekanya botjha ha stackup ho ka fetola phallo ya resin, botenya bo fedileng le ngodiso ya lera leha thepa ka nngwe e bonahala e lekana pampiring.
Sephutheloana sa RFQ le Litlaleho tsa Tlhahiso
CLTE-XT e lumellana le li-antenna tse arotsoeng ka mekhahlelo, li-module tsa RF, lisebelisoa tsa elektroniki tsa sefofane, liboto tsa RF-digital tse kopantsoeng, lisebelisoa tsa puisano, le likopano moo potoloho ea mocheso e ka fetolang impedance kapa masoba a koahetsoeng ke khatello. Bakeng sa lenaneo la lifofane le boletsoeng ka TMM, litokomane tsa tikoloho bakeng sa liboto tsa RF tsa sefofane li lokela ho hlalosa boemo ba litšoaneleho le boholo ba ho latela ka thoko ho papiso ea thepa.
Romella lifaele tsa Gerber, data ea drill, setšoantšo sa stackup, botenya ba CLTE-XT, koporo cladding, lipheo tsa impedance, lintlha tsa thepa e kopantsoeng, profil ea kopano, litlhoko tsa tlhahlobo, bongata le litlhoko tsa ho tlisa.
Bakeng sa meaho e kopantsoeng ea CLTE-XT, bopaki bo thusang bo kenyelletsa lirekoto tsa ho bokella le tsa thepa, tlhahlobo ea boholo ba sengoloa sa pele, liteko tsa ho bokella/ngoliso le liphetho life kapa life tsa liteko tsa mocheso kapa tsa ts'epo tse hlokoang ke lenaneo. Litokomane li lokela ho bonts'a kaho ea 'nete ea lebasetere e neng e tšoaneleha. Bakeng sa RFQ, fana ka stackup e felletseng ea lebasetere, botenya bo felileng, koporo, litlhoko tsa ho hokahanya lera le maemo a ho tšoaneleha ha mocheso. Ka tlhahisoleseling eo, moetsi a ka beha theko ea mosebetsi oa 'nete oa ho bokella le ho ngolisa ho fapana le ts'ebetso e tloaelehileng ea mekhahlelo e mengata.
Posts kgothaletswa
Tlhahiso ea PCB ea Sefa ea TMM6
Lethathamo la dikahareHobaneng Baqapi ba Difiltara tsa Microwave ba Sebelisa...
Taconic RF 35 khahlanong le RO4350B PCB
Lethathamo la dikahareRF-35 vs RO4350B Theko le...
Tlhahiso ea PCB ea Sefa ea TMM4
Tlhahiso ea PCB ea sefe ea TMM4 e laoloa ke ...
Tlhahiso ea PCB ea TMM3 bakeng sa Li-module tsa RF
Tlhahiso ea TMM3 PCB e molemo haholo moo module ea RF...
Mokhoa oa ho fumana quote bakeng sa li-PCB
A re tsamaiseng tlhahlobo ea DFM/DFA bakeng sa hau 'me re khutlele ho uena ka tlaleho. U ka kenya lifaele tsa hau ka mokhoa o sireletsehileng ka webosaete ea rona. Re hloka tlhahisoleseling e latelang ho u fa khotheishene:
-
- Gerber, ODB++, kapa .pcb, spec.
- Lethathamo la BOM haeba o hloka kopano
- bongata
- Nako ea ho fetoha
Bakeng sa litšebeletso tsa PCBA, ka kopo fana ka BOM ea hau (Bill of Materials) le litaelo tse itseng tsa kopano. Re boetse re fana ka tlhahlobo ea DFM/DFA ho ntlafatsa meralo ea hau bakeng sa tlhahiso le kopano, ho netefatsa ts'ebetso ea tlhahiso e boreleli.