5G Communication PCB Manufacturing and Assembly Solutions

5G le Kameho ea Eona ho Litlhoko tsa PCB

Li-PCB tsa puisano tsa 5G li tlameha ho sebetsana le maqhubu ho tloha sub-6 GHz ho ea fihla ho lihlopha tsa millimeter-wave ka holimo ho 24 GHz.
Maemong ana, esita le ho kheloha ho honyenyane ho latella geometry kapa thepa ea thepa ho ka baka tahlehelo e kholo ea ho kenya, tahlehelo ea ho khutla, kapa ho sotha matshwao.
Bakeng sa bareki le baenjiniere, sena se fetolela litlhoko tse thata tsa tlhahiso ho pholletsa le boto.

Litlamorao tsa bohlokoa tsa 5G ho moralo le boqapi ba PCB li kenyelletsa:

• Taolo ea tahlehelo ea dielectric: Ke li-laminate tsa tahlehelo tse tlase haholo (Df <0.002) tse ka ts'ehetsang ts'ebetso ho maqhubu a mmWave.
• Ho nepahala ha Impedans: Tšireletso e laoloang ka hare ho ± 5%, 'me maemong a mangata ± 3%, e bohlokoa bakeng sa li-PCB tsa setsi le li-antenna.
• Lihokelo tse phahameng haholo: Li-vias tse foufetseng / tse patiloeng le li-microvia tse entsoeng ka laser li tlamehile ho li-stackups tsa morao-rao tsa 5G PCB.
• Ho tšepahala ha mocheso: Li-amplifiers tsa matla a phahameng le liketane tsa RF li hloka maano a tsoetseng pele a ho felisa mocheso ho netefatsa botsitso ba nako e telele.

Litlhaloso tsa Bohlokoa tsa Tlhahiso ho Highleap Electronics

Baenjiniere le lihlopha tsa ho reka thepa ba tlameha ho lekola hore na moetsi a ka lula a fana ka li-PCB tse itokiselitseng 5G.
Ho Highleap Electronics, re fana ka bokhoni bo hlakileng, bo netefalitsoeng ho pholletsa le maemo a bohlokoa ka ho fetisisa:

• Bophara ba mola le sebaka: Tlhahiso e tsitsitseng ho 3/3 mil, e nang le bokhoni bo tsoetseng pele ho fihla ho 2/2 mil bakeng sa meralo e boima.
• Li-microvias le li-stacked vias: Ho cheka ka laser ka ho tlatsoa ha koporo e tšepahalang, ho ts'ehetsa lifofu, ho patoa le ho patoa ka meaho.
• Layer counts: Likarolo tsa 8-20 li tloaelehile ho 5G PCBs, empa Highleap e ka etsa liboto tse rarahaneng tse nang le lihlopha tse fihlang ho 48+ ho sebelisa lamination e latellanang.
• Taolo ea impedance: Tokiso e nepahetseng ea impedance e nang le ± 5% ea mamello kapa e matla haholoanyane, e netefalitsoeng ke litlaleho tsa TDR tse fanoeng ka sehlopha se seng le se seng.
• Teko le ho latedisa: Sehlopha se seng le se seng se etsa tlhahlobo ea AOI, tlhahlobo ea motlakase, le netefatso ea ho se sebetse, ho netefatsa ts'epahalo e tsitsitseng ho tloha ho li-prototype ho ea ho lebelo la molumo.

Lisebelisoa tsa PCB tse tšehelitsoeng li kenyelletsa: FR-4 (likereiti tse phahameng tsa Tg), laminate e ikhethang e nang le tahlehelo e tlase (li-laminate tsa hydrocarbon-ceramic tse nang le tahlehelo e tlase, laminate e ikhethang e nang le tahlehelo e tlase, laminate e thehiloeng ho PTFE e nang le tahlehelo e tlase), metsoako ea PTFE, li-laminate tsa Isola tse nang le tahlehelo e tlase,
Panasonic Megtron letoto, Taconic high-frequency laminates, hydrocarbon ceramic blends, le ceramic substrates (Al₂O₃, AlN).
Li-stackup tsa Hybrid tse kopanyang lisebelisoa tsena li teng ho leka-lekanya ts'ebetso ea RF le litšenyehelo.

Lisebelisoa tse tsoetseng pele le li-hybrid Stackups bakeng sa li-PCB tsa 5G

Khetho ea thepa e etsa qeto ea hore na PCB e sebetsa hantle hakae ka maqhubu a phahameng.
Ho sebelisa li-laminate tsa tahlehelo e tlase feela ho tla bitsa chelete e ngata haholo, kahoo Highleap e thusa bareki ho leka-lekanya litšenyehelo le ts'ebetso ka li-stackups tse nyalisitsoeng:

• FR-4: e sebetsang hantle, e sebelisetsoang taolo le likarolo tsa dijithale.
• laminate/PTFE e khethehileng e nang le tahlehelo e tlase: tahlehelo e tlase ea dielectric, e loketseng likarolo tsa matšoao a RF.
• Li-substrates tsa Ceramic: conductivity e babatsehang ea mocheso bakeng sa li-amplifiers tsa matla.

Ka ho kopanya lisebelisoa tsena ho PCB e le 'ngoe, bareki ba fihlella ka bobeli ts'ebetso le taolo ea litšenyehelo.
Highleap e na le boiphihlelo bo batsi ba ho fumana le ho sebetsana le liboto tsa lintho tse tsoakiloeng bakeng sa lits'ebetso tsa 5G.

Kopano ea Antenna le Tšehetso ea RF Design

Ho fapana le li-PCB tsa setso, liboto tse ngata tsa puisano tsa 5G li kopanya li-antenna tse arohaneng ka kotloloho ho likarolo tsa PCB.
Ho hlahisa li-PCB tse joalo tsa antenna bakeng sa puisano ho hloka:

• Sebaka se nepahetseng le ho tsamaisana ha mekhahlelo pakeng tsa likarolo tsa antenna.
• Likarolo tse ka holimo le ho ts'oara ho ts'oana ho boloka mahlaseli a tsitsitseng.
• Mekhabiso e thibelang mongobo bakeng sa lits'ebetso tsa antenna tsa kantle.
• Maano a ho itšehla thajana a ho fokotsa ho hokahana ka mekhahlelo ea MIMO.

Highleap e ts'ehetsa li-PCB tsa module oa antenna ka li-HDI tse tsoetseng pele, ho cheka microvia, le ho kopanngoa le litšebeletso tsa kopano bakeng sa likarolo tsa antenna le li-module tsa RF tse ka pele.

Mekhoa ea Tsamaiso ea Mocheso ho Liboto tsa 5G

Li-PCB tsa maqhubu a phahameng liteisheneng tsa motheo le li-module tsa RF tse ka pele li hlahisa mocheso o mongata.
Highleap e sebelisa maano a 'maloa ho netefatsa ts'ebetso e tšepahalang ea mocheso:

1. Lifofane tse teteaneng tsa koporo: Mekhahlelo ea koporo ea 2-4 oz libakeng tsa kabo ea matla.
2. Litsela tsa mocheso: mefuta e mengata ea li-vias tse tlatsitsoeng ho tsamaisa mocheso ho litepisi kapa lipoleiti tse batang.
3. Metal-based substrates: IMS kapa liboto tsa ceramic bakeng sa lisebelisoa tsa motlakase tsa RF.
4. Maikutlo a moralo bakeng sa tlhahiso: litlhahlobo tsa ketsiso ea mocheso nakong ea DFM.

Mekhoa ena e boloka mocheso oa mateano ka har'a meeli e sireletsehileng ea ts'ebetso, e lelefatsa nako ea bophelo ba sistimi le ho fokotsa ho hloleha ha masimo.

Mathata a Tlhahiso le Litharollo tsa Highleap

Tlhahiso ea 5G PCB e sutumelletsa tlhahiso ho feta mekhoa e tloaelehileng.
Mathata a kenyelletsa ho ts'epahala ha microvia, lamination e latellanang, le ho nepahala ha ngoliso.
Highleap Electronics e sebetsana le tsena ka:

• Li-microvias tse entsoeng ka laser tse nang le plating e laoloang le ho tlatsa koporo.
• Ts'ebetso ea lifensetere bakeng sa lipotoloho tsa lamination, ho netefatsa ho pheta-pheta ho pholletsa le lihlopha.
• X-ray ngodiso licheke bakeng sa ho foufala le patoa vias.
• DFM e tlaleha e totobatsang likotsi tsa moralo pele ho etsoa.

Mokhoa ona o fokotsa kotsi ea tlhahiso mme o netefatsa chai e ngata, esita le bakeng sa liboto tse rarahaneng tsa puisano tsa multilayer.

Teko le netefatso bakeng sa Ts'ebetso e Tšepahalang ea 5G

5G PCB e 'ngoe le e' ngoe e tlameha ho netefatsoa ho paka ts'ebetso pele e romelloa.
Highleap e fana ka tlhahlobo e felletseng, ho kenyelletsa:

• Vector Network Analyzer (VNA) litekanyo tsa S-parameters.
• Time-Domain Reflectometry (TDR) bakeng sa taolo ea impedance.
• Teko ea tikoloho: ho palama baesekele e futhumatsang, mongobo, ho thothomela.
• Tlhahlobo ea optical e ikemetseng le X-ray bakeng sa liphoso tse patiloeng.

Ho sebetsa le moetsi ea tšoanelehang oa PCB ea puisano joalo ka Highleap ho netefatsa hore liboto li kopana le litekanyetso tsa moralo le ts'epahalo pele ho kopanyo ea sistimi.

Likopo tsa 5G Communication PCBs

Highleap e hlahisa 5G PCBs bakeng sa mefuta e mengata ea liindasteri le lisebelisoa:

• Liteishene tsa motheo tsa 5G le li-antenna tse kholo tsa MIMO
• Lisele tse nyane le libaka tsa phihlello tsa waelese ka tlung
• Li-module tsa RF tse ka pele le li-transceivers tsa mmWave
• Li-routers tsa lebelo le phahameng, li-switches, le liboto tsa khokahano ea setsi sa data
• Li-gateway tsa puisano tsa IoT le lisebelisoa tsa bohale
• Khokahano ea satellite le lihokelo tsa microwave
• Liboto tsa tlhahlobo, lisebelisoa tsa liteko, le lisebelisoa tsa ntlafatso

Ho tloha ho di-prototype ho isa tlhahisong e kgolo, Highleap e fana ka tlhahiso ya PCB e se nang letho le ditshebeletso tse felletseng tsa kopano ya PCB tse etseditsweng ditlhoko tsa bareki.