Moqapi oa 5G HDI PCB le Tataiso ea Boitsebiso | Highleap Electronics

Selelekela

Ho romelloa ha marang-rang a marang-rang a moloko oa bohlano ho fetotse litlhoko tsa moralo o hatisitsoeng oa boto ea potoloho. Ha litsamaiso tsa 5G li ntse li sebetsa ho pholletsa le li-frequency spectra tse ntseng li eketseha ho tloha ka tlase ho 6GHz ho ea ho lihlopha tsa millimeter-wave, tlhokahalo ea litharollo tse tsoetseng pele tsa ho hokahanya e eketsehile. Theknoloji ea 5G HDI PCB e sebetsana le liqholotso tsena ka ho kopanya batho ba bangata haholo, taolo e nepahetseng ea ho itšireletsa, le meralo e ntlafalitsoeng ea meaho eo liboto tse tloaelehileng tsa multilayer li ke keng tsa li fihlela.

Maboto a potoloho a hatisitsoeng a nang le sekgahla se hodimo a thusa ho etsa hore ho be bonolo ho ntlafatsa le ho ntlafatsa tshebetso ho be bohlokwa bakeng sa di-module tsa sejwalejwale tsa RF. Ka di-microvia, di-trace tse nyane, le di-stackup tse rarahaneng tsa lera, meralo ya 5G HDI PCB e tshehetsa dibopeho tse thata tsa motlakase tse hlokahalang bakeng sa phetiso ya data ya lebelo la gigabit ha e ntse e boloka botsitso ba letshwao ho pholletsa le di-domain tse ngata tsa maqhubu.

Hobaneng 5G RF Modules Hloka HDI PCB Technology

Mathata a Maqhubu a Maqhubu

Litsamaiso tsa mohala tsa moloko oa bohlano li sebetsa ho pholletsa le lihlopha tse fapaneng tsa maqhubu ho tloha ho sub-6GHz ho isa ho millimeter-wave ranges ho 28GHz le 39GHz. Sehlopha se seng le se seng sa frequency se fana ka litlhoko tse ikhethileng tsa motlakase tse amang ka kotloloho litekanyetso tsa moralo oa PCB. Matšoao a maqhubu a phahameng a bonts'a kutloelo-bohloko e feteletseng ea ho latela geometry, thepa ea dielectric, le meaho e hokahantsoeng, e leng ho etsang hore theknoloji e tloaelehileng ea PCB e seke ea lekana lits'ebetso tse tsoetseng pele tsa RF.

Meeli ea Tloaelo ea PCB

Liboto tse tloaelehileng tsa multilayer li kopana le litšitiso tse kholo tsa ts'ebetso libakeng tse nang le maqhubu a holimo. Ka tsela ea lesoba e hlahisa li-parasitic inductance le capacitance e sothang maqhubu a maqhubu le ho hlahisa li-discontinuities tsa impedance. Boima bo fokolang ba litsela bo thibela likhetho tsa ho beha likarolo, ho qobella litsela tse telele tsa matšoao tse eketsang tahlehelo ea ho kenya le ho kena-kenana le motlakase.

Melemo ea Theknoloji ea HDI

Meaho ea likhokahano tse matla haholo e hlola mefokolo ena ka li-microvia tse entsoeng ka laser tse fokotsang litlamorao tsa likokoana-hloko ha li ntse li nolofalletsa litsela tse khutšoane tsa matšoao. Moralo oa RF HDI o kenyelletsa meaho e tsoetseng pele e fihlelang litsamaiso tse sa khoneheng ka ho cheka ka mochini:

• Ho beoa ka pad - E felisa li-stub resonances mme e nolofalletsa karolo e otlolohileng holim'a likhokahano.
• Bokhoni ba line-line - Lekola bophara ho fihla ho li-microns tse 50-75 li ts'ehetsa taolo e nepahetseng ea impedance ka crosstalk e fokotsehileng.
• Lamination e latellanang - E nolofalletsa likhokahano tsa mofuta o fe kapa o fe ha o ntse o boloka botsitso ba lets'oao ho pholletsa le maqhubu ohle.

Khetho ea Boitsebiso bakeng sa Ts'ebetso ea 5G HDI PCB

Litlhoko tsa Ts'ebetso ea Dielectric

Khetho ea thepa e khetha ka kotloloho boleng ba matšoao lits'ebetsong tsa maqhubu a holimo. Litšobotsi tse tlase tsa dielectric (Dk) le maemo a tlase a dissipation factor (Df) li fokotsa ho fokotseha ha lets'oao le ho khopama ha mekhahlelo ho pholletsa le lihlopha tsa RF frequency. Thepa e tsitsitseng ea motlakase ho pholletsa le phapang ea mocheso e netefatsa ts'ebetso e tsitsitseng libakeng tse thata tsa ts'ebetso moo likopano tsa 5G HDI PCB li tlamehang ho boloka litlhaloso tse nepahetseng.

Likhetho tsa Laminate tsa High-Frequency

Lisebelisoa tse tsoetseng pele tsa RF li hloka thepa e khethehileng ea substrate e fetang FR-4 e tloaelehileng. laminate e khethehileng e nang le tahlehelo e tlase le laminate e ikhethang e nang le tahlehelo e tlase li fana ka boleng ba Dk pakeng tsa 3.38 le 3.48 ka litšobotsi tse fokolang tsa tahlehelo e tlase tse loketseng maqhubu a microwave. Panasonic Megtron 6 e fana ka tekano e sebetsang pakeng tsa ts'ebetso le tlhahiso bakeng sa lits'ebetso tsa sub-6GHz, ha thepa e thehiloeng ho PTFE joalo ka Taconic RF-35 e fana ka ts'ebetso e phahameng ea motlakase maqhubung a millimeter-wave.

Lithekiso tsa Ts'ebetso ea Material

Li-substrates tse tloaelehileng tsa FR-4 li bontša hore li na le litšenyehelo tse ngata empa li na le tahlehelo e kholo ea dielectric ka holimo ho 2GHz, e leng se etsang hore li se ke tsa tšoaneleha bakeng sa ho batla lits'ebetso tsa 5G. Li-laminate tsa maqhubu a phahameng li ntlafatsa haholo ts'ebetso ea motlakase ha li ntse li hlahisa lintlha tsa tlhahiso ho kenyelletsa le litšenyehelo tse phahameng tsa thepa le litlhoko tse khethehileng tsa ts'ebetso. Motsoako oa katoloso ea mocheso lipakeng tsa likarolo tse fapaneng tsa thepa e ba ea bohlokoa ho boloka ts'epahalo ho pholletsa le libaesekele tsa mocheso, haholo meahong ea HDI PCB ea lisebelisoa tse ngata.

5G HDI PCB Stackup Design bakeng sa Pontšo ea Letšoao

Mehaho ea Core Stackup

Ts'ebetso e sebetsang ea li-stackup bakeng sa 5G HDI PCB hangata e latela litlhophiso tsa 1+n+1 kapa 2+n+2, moo likarolo tse hokahaneng tse phahameng haholo holim'a bokantle ba kantle li hokahantsoeng le meaho e tloaelehileng ea mantlha. Meralo efe kapa efe ea HDI ea lera e etsa hore ho be le likhokahano tse tobileng lipakeng tsa likarolo tse seng haufi, ho fokotsa lipalo le ho fokotsa bolelele ba tsela ea matšoao. Mokhoa ona o ipaka e le oa bohlokoa haholo ho li-module tsa RF tse rarahaneng moo likarolo tse ngata tse laoloang ke impedance li tlamehang ho phela hammoho le marang-rang a kabo ea matla.

Reference Plane Configuration

Lifofane tsa litšupiso tse tiileng tse behiloeng haufi le likarolo tsa matšoao li fana ka tikoloho e laoloang ea impedance le ho fokotsa tšitiso ea motlakase. Matla a Symmetrical le ho beoa ha lera la fatše ho etsa li-stackups tse leka-lekaneng tse fokotsang warpage nakong ea ts'ebetso ea mocheso. Leano ka ho bea le hokahanya lifofane tsa litšupiso nako le nako, ho boloka litsela tsa ho khutlisa tse tlase-tlase tsa bohlokoa bakeng sa botšepehi ba matšoao a holimo.

Leano la ho Kenngwa ha Microvia

Theknoloji ea Via-in-pad e felisa bolelele ba li-stub tse bakang lipontšo, haholo-holo tse bohlokoa ka holimo ho 10GHz moo li-stubs tsa kotara-wavelength li hlahisang li-resonances. Li-microvias tse patiloeng le tse foufetseng li etsa hore likarolo tse teteaneng li behoe ha li ntse li boloka liteishene tsa litsela bakeng sa litsela tse laoloang tsa impedance. Meaho ena e hloka li-vias tse tlatsitsoeng le tse reriloeng ho netefatsa hore ho na le karolo e tšepahalang, e fanang ka melemo ea bohlokoa ea ts'ebetso bakeng sa meralo ea millimeter-wave.

Taolo ea Botenya ba Dielectric

Karohano ea lera-to-layer e etsa qeto ka kotloloho hore na ho na le tšitiso ea mofuta ofe bakeng sa lijeometri tsa microstrip le stripline. Taolo ea mamello e ntse e ba ea bohlokoa le ho feta maemong a holimo moo liphapang tse nyane li amang ts'ebetso ea motlakase haholo. Taolo e nepahetseng ea botenya ba mantlha le ba prepreg e netefatsa HDI PCB bakeng sa meralo ea 5G e fihlela lintlha tse shebiloeng tsa impedance sebakeng sohle sa boto.

RF HDI PCB Layout Design Menahano

Mehala ea Phetiso ea Maqhubu a Phahameng

Litlhophiso tsa Microstrip le stripline routing li theha motheo oa moralo oa RF HDI bakeng sa litsela tse laoloang tsa matšoao a impedance. Mesaletsa ea Microstrip ea likarolo tse kantle e fana ka phihlello e bonolo bakeng sa tokiso le ho metha empa e bonts'a mahlaseli a maholo a motlakase. Ho tsamaisa li-stripline lipakeng tsa lifofane tsa litšupiso ho fana ka karohano e phahameng le ho fokotsa mesi, e bohlokoa bakeng sa li-circuits tsa RF tse hlokang ho ts'oana hantle.

Mekhoa ea ho Ikhetha ka Letšoao

Via terata e theha litšitiso tsa motlakase tse thibelang ho kopana lipakeng tsa li-circuits tsa RF tse hlokolosi le likarolo tsa logic tsa dijithale. Litsela tse pota-potileng maqhubu a phahameng li koalehile masimo a motlakase 'me li fokotsa ho kopana pakeng tsa litsela tsa mats'oao a bapileng. Ho beoa ha likarolo tsa maano ho arola likarolo tsa phetisetso ea matla a phahameng ho li-circuitry tsa moamoheli, ho fokotsa tšitiso ka ts'ebetso e nepahetseng ea ho itšehla thajana.

Netefatso e Tsamaiswang ke Ketsiso

Li-solvents tsa masimo a motlakase li thusa ho netefatsa pele ho tlhophiso ea li-profiles tsa impedance, li-parameter tsa S, le mekhoa ea ho kopanya ka har'a meralo e rarahaneng ea litsamaiso. Tlhahlobo ea botšepehi ba matla e khetholla li-resonances le ho arohana ho sa lekaneng pele ho etsoa mohlala. Time-domain reflectometry simulation e senola ho se tsoele pele ha impedance ka liphetoho, likaroloana tsa likarolo, le lihokelo tsa sehokelo, ho bonts'a bohlokoa bakeng sa katleho ea pele ho meralo ea millimeter-wave 5G HDI PCB.

Tsamaiso ea Thermal le EMI

Li-amplifiers tsa RF tse nang le matla a phahameng li hlahisa mocheso o mongata o hlokang hore litšepe tsa mocheso li hokahaneng le lifofane tse ka hare tsa fatše kapa likarolo tse inehetseng tse hasang mocheso. Likarolo tsa tšireletso kapa li-gaskets tse tsamaisang li na le mesi ea motlakase e tsoang likarolong tsa transmitter ha li ntse li thibela tšitiso ea kantle ho senya kutlo ea moamoheli. Maano a nepahetseng a motheo le ts'ebetso ea thebe e ama ka kotloloho ho latela maemo a tsamaiso ea EMI le ts'ebetso ea ts'ebetso.

Mathata a ho Hlahisa Tlhahisong ea 5G HDI PCB

Ho tšepahala ha Microvia

Theknoloji ea ho cheka ka laser e theha masoba a bophara bo nyane a bohlokoa bakeng sa meaho e hokahantsoeng e phahameng, eo hangata e tlohang ho li-micron tse 75 ho isa ho tse 150. Ho lumellana ha koporo ka har'a li-microvia tsena ho ama ka kotloloho ts'ebetso ea motlakase le ts'epahalo ea mochini:

• Phekolo ea plasma desmear - E tlosa smear ea resin mme e kenye mabota a lesoba bakeng sa ho khomarela koporo e tšepahalang.
• Peo ea koporo e se nang motlakase - E fana ka lera le ts'oanang la conductive pele ho ts'ebetso ea plating.
• Taolo ea karo-karolelano - Sequential build-up e etsa hore ho be le plating e tšepahalang ka har'a meaho ea karo-karolelano e phahameng.

High-Frequency Material Processing

Li-laminates tse thehiloeng ho PTFE li hlahisa liphephetso tse ikhethang tsa tlhahiso ha li bapisoa le li-substrates tsa khale tsa epoxy-glass. Lithempereichara tse tlase tsa phetoho ea likhalase li thibela ho sebetsa lifensetereng tsa mocheso nakong ea li-cycle lamination. Ho lokisoa ha lintho tse bonahalang ho hloka phekolo e khethehileng ho finyella ho khomarela ka koporo e lekaneng, ha ho nepahala ha ho ngolisoa ha lera ho ntse ho hlokahala le ho feta ka li-stackups tse tsoakiloeng tsa dielectric tse kopanyang li-cores tsa FR-4 le likarolo tse phahameng tsa maqhubu a holimo.

Khetho ea Phekolo ea Bokaholimo

Khetho ea ho qeta bokaholimo e tlameha ho leka-lekanya litlhoko tsa ts'ebetso ea motlakase khahlano le ts'ebetso ea kopano. Electroless nickel mersion gold (ENIG) e fana ka libaka tse ka rekisoang empa e hlahisa litahlehelo tse nyane lits'ebetsong tsa maqhubu a holimo. Electroless nickel electroless palladium immersion gold (ENEPIG) e fana ka litšobotsi tse ntlafalitsoeng tsa khokahanyo ea mohala tse hlokahalang bakeng sa kopano ea module ea RF, ha silevera ea qoeliso e fana ka thepa e ntle ea motlakase e nang le phokotso e nyane ea matšoao bakeng sa lits'ebetso tsa 5G HDI PCB.

Likopo tse Tloaelehileng tsa 5G HDI PCB Technology

Lisebelisoa tsa Seteishene sa Base

Liteishene tse kholo tsa MIMO li kenyelletsa mefuta e mengata ea phetisetso le liketane tse amohelang, e 'ngoe le e 'ngoe e hlokang likamano tse nepahetseng tsa mekhahlelo e bolokiloeng ka tsela e laoloang ea impedance. Li-module tsa amplifier tsa matla li hloka meralo e khonang ho sebetsana le maemo a holimo ha joale e ntse e theola meroalo e mengata ea mocheso. Liboto tsa ts'ebetso ea Baseband li kopanya likhokahano tsa dijithale tse lebelo le holimo le li-circuits tsa RF tse ka pele, tse hlokang ho aroloa ka hloko ka har'a li-stackups tse kopaneng tsa 5G HDI PCB.

Antenna Integration Modules

Meralo ea Antenna-in-Package (AiP) e fihlella miniaturization e feteletseng ka ho kopanya likarolo tse phatsimang ka kotloloho le RF transceiver die mahlaleng a tsoetseng pele a substrate. Lihlopha tse bohlale tsa antenna bakeng sa lits'ebetso tsa ho etsa mahlaseli li hloka mamello e tiileng ea mechini ho boloka ho nepahala ha sebaka sa likarolo ho pholletsa le lihlopha tsa maqhubu a millimeter-wave. Meralo ena ea mmWave PCB e kenyelletsa marang-rang a rarahaneng a fepa a nang le lebelo la mekhahlelo le laoloang hantle le ho se leka-lekane ho fokolang ha amplitude.

Likopo tsa likoloi le tsa IoT

Sistimi ea radar ea makoloi e sebetsang ho 77-81GHz e hloka mekhoa e ts'oanang ea meralo ea maqhubu a holimo joalo ka meaho ea 5G ka har'a litlhoko tse thata tsa ho fumana thuto ea likoloi. Li-module tsa puisano tsa koloi ho ea nthong e 'ngoe le e 'ngoe li kopanya liprothokholo tse ngata tse se nang mohala holim'a compact form factor moo thekenoloji ea HDI e etsang hore ho be le sesupo se hlokahalang sa litsela. Liheke tsa IoT tsa indasteri li kopanya li-cellular, WiFi, le li-interfaces tse se nang mohala, tse ruang molemo ho 5G RF module PCB.

Mekhoa ea Bokamoso ho 5G HDI PCB Development

Advanced Interconnect Evolution

Meaho ea HDI efe kapa efe e nolofalletsa likhokahano tse tobileng lipakeng tsa lipara tsa lera tse sa reroang, e felisa meeli ea mehato ea lera ho isa lera ea lits'ebetso tse tloaelehileng tsa ho haha ​​​​ho latela tatellano. Theknoloji ea PCB e kang substrate e fokotsa boholo ba likarolo tse ka tlase ho bophara ba mela ea 25-micron, e atamela bokhoni ba ho aba hape ba lera la semiconductor. Meralo ena e tšehetsa kopanyo e rarahaneng ea RF front-end ha lipalo tsa kanale li ntse li eketseha lits'ebetsong tse tsoetseng pele tsa 5G.

Kopanyo ea Lintho tse Hybrid

Mehaho e tsoakiloeng ea dielectric e kopanya li-laminate tse phahameng-frequency likarolong tsa RF le lisebelisoa tse theko e tlaase tsa FR-4 libakeng tsa ts'ebetso ea digital. Mekhoa ea ho kopanya e fapaneng e kenyelletsang ho shoa ka kotloloho ho li-substrates tsa PCB, ho fokotsa likokoana-hloko tsa khokahano bakeng sa mesebetsi ea bohlokoa ea RF. Mekhoa e tsoetseng pele ea lamination e etsa hore ho be le maqhama a ka tšeptjoang pakeng tsa lisebelisoa tse sa tšoaneng ha ho ntse ho boloka ho nepahala ha ngoliso ho bohlokoa bakeng sa litlhaloso tsa ts'ebetso ea 5G HDI PCB.

Litlhoko tsa Moloko o Latelang

Phetoho e lebisang ho lipatlisiso tsa 5G-Advanced le tsa pele tsa 6G e shebane le maqhubu a fetang 100GHz, a hloka le likhakanyo tse matla tsa tahlehelo le boholo ba likarolo tse nyane. Lisebelisoa tsa tahlehelo e tlase haholo tse nang le lintlha tsa ho qhalana tse ka tlase ho 0.001 lia hlokahala ha li-bandwidth tsa matšoao li ntse li hola le lipalo tsa liteishene li eketseha. Lipalo tse phahameng tse nang le likarolo tse 20-plus tse kenyelletsang libaka tse ngata tsa HDI li tla ts'ehetsa matla a ho kopanya a hlokehang bakeng sa lisebelisoa tsa mohala tsa moloko o latelang.

fihlela qeto e

Theknoloji ea khokahanyo e phahameng haholo e fana ka motheo oa bohlokoa bakeng sa ts'ebetso ea mojule oa 5G le RF ka khetho e khethehileng ea thepa, meralo e ntlafalitsoeng ea li-stackup, le mekhoa e nepahetseng ea tlhahiso. Tsoelo-pele ho tloha ho liboto tse tloaelehileng tsa multilayer ho ea meahong e tsoetseng pele ea 5G HDI PCB e sebetsana le liqholotso tsa mantlha ho phatlalatsoeng ha mats'oao a maqhubu a phahameng, ho nolofalletsang matla a manyane le a kopanyang a batloang ke lits'ebetso tsa sejoale-joale tse se nang mohala tse sebetsang ho tloha sub-6GHz ho ea ho millimeter-wave frequency range.

Highleap Electronics e fana ka litharollo tse felletseng tsa HDI PCB tse etselitsoeng likopo tsa 5G le RF:

• Theko ea thepa e tsoetseng pele – laminate e khethehileng e nang le tahlehelo e tlase, Megtron, le PTFE e nang le thepa e netefalitsoeng ea dielectric bakeng sa ts'ebetso ea maqhubu a phahameng.
• Bokhoni ba ho etsa ka nepo - Li-microvias tse entsoeng ka laser ho tloha ho li-microns tse 75, litsela tse bonolo ho ea ho li-microns tse 50, le mamello e laoloang ea impedance ka hare ho ± 5%.
• Moralo oa tšehetso ea tlhahiso - Ntlafatso ea li-stackup, therisano ea botšepehi ba matšoao, le tlhahlobo ea pele ea tlhahiso ea DFM ho netefatsa katleho ea pele.
• Litšebeletso tse felletseng tsa kopano ea turnkey - Ho fumana likarolo, ho beoa ha SMT, tlhahlobo ea RF, le netefatso ea ts'ebetso bakeng sa tlhahiso e felletseng ea module.

Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka hore na boiphihlelo ba rona ba tlhahiso ea 5G HDI PCB bo ka ts'ehetsa nts'etsopele ea sehlahisoa sa hau se se nang mohala sa moloko o latelang.