Sequential Lamination: HDI PCB Build-Up Process Guide

Selelekela

Ho laminate ka tatellano ke ts'ebetso ea bohlokoa tlhahisong ea HDI PCB e nolofalletsang likhokahano tsa mekhahlelo e mengata ka ho laminate ka makhetlo a mangata le ka lipotoloho tsa sebopeho. Mokhoa ona o tsoetseng pele o lumella bahlahisi ho theha liboto tsa potoloho tse nang le bongata bo boholo tse nang le meralo e rarahaneng ea ho tsamaisa e ke keng ea finyelloa ka mekhoa e tloaelehileng ea tlhahiso ea ho tobetsa ka le leng.

Ha lisebelisoa tsa elektroniki li hloka ts'ebetso e kholo maemong a manyane, lamination e latellanang e fetohile ea bohlokoa bakeng sa ho hlahisa liboto tsa HDI tsa sejoale-joale tse nang le likarolo tse hlakileng le lipalo tse phahameng tsa I/O. Tshebetso ena e hloka taolo e nepahetseng mabapi le ho nepahala ha ngoliso, khetho ea thepa, le tsamaiso ea mocheso ho pholletsa le potoloho e 'ngoe le e' ngoe ea ho haha ​​​​ho netefatsa likhokahano tse tšepahalang le ho boloka botsitso bo boholo.

Sequential Lamination ho HDI PCB ke eng?

Sequential lamination ke mokhoa oa ho aha likarolo tse ling tsa potoloho holim'a substrate ea mantlha ka lipotoloho tse pheta-phetoang tsa dielectric lamination, laser drilling, le copper plating. Ho fapana le liboto tse tloaelehileng tsa multilayer tse hatelletsoeng ts'ebetsong e le 'ngoe, liboto tsa HDI li ntse li hahuoa butle-butle, li eketsoa ka mekhahlelo e laoloang ho etsa li-microvia tse pakiloeng kapa tse thekeselang tse nolofalletsang likhokahano tse otlolohileng tse otlolohileng.

Sequential Build-Up Architecture

Mehaho e hlahisoang hangata e hlalosoa e le 1+N+1, 2+N+2, kapa meralo efe kapa efe ea HDI, moo lipalo li emelang likarolo tsa ho haha ​​​​tse kentsoeng lehlakoreng le leng le le leng la mantlha. Sebopeho sa 1 + N + 1 se kenyelletsa potoloho e le 'ngoe ea lamination ka lehlakoreng le leng, ha 2+N+2 e kenyelletsa tse peli. Potoloho e 'ngoe le e 'ngoe e eketsang khokahanyo ea likhokahano le ho tenyetseha ha litsela empa e boetse e eketsa mathata a ts'ebetso le litlhoko tsa taolo ea ngoliso. Koko, hangata e nang le likarolo tse peli ho isa ho tse 'ne tsa matšoao, e sebetsa e le motheo oa mochini le motlakase bakeng sa ts'ebetso ea ho aha ka tatellano.

Phallo ea Ts'ebetso bakeng sa Cycle ka 'ngoe ea Lamination

• Tokiso ea Sefahleho - Ho hloekisoa ha mechine kapa lik'hemik'hale tsa bokaholimo ba koporo bo teng ho tiisa hore ho khomarela hantle bakeng sa lera le latelang la dielectric.
• Dielectric Lamination - Sesepa sa koporo se koahetsoeng ka resin (RCC) kapa filimi ea dielectric e nang le setšoantšo e lumellana le laminated tlas'a mocheso o laoloang le maemo a khatello.
• Ho cheka Laser - Li-microvia tse nang le bophara ba 75-150 µm li chekoa hantle hore li hokahane le mapheo a koporo a ka tlase.
• Desmear le Copper Deposition - Plasma kapa lik'hemik'hale tsa desmear li hloekisa ka marako, 'me li lateloa ke lisebelisoa tsa koporo tse se nang electroless ho theha conductivity.
• Ho khabisa ka mohlala le ho Etching - Koporo e eketsehileng e pentiloe ho etsa mesaletsa le ho tlatsa li-microvias, ebe e hlophisoa ho hlalosa likarolo tsa potoloho.
• Planarization ea Bokaholimo - Planarization ea lik'hemik'hale kapa ea mochini e etsa hore ho be le sebaka se boreleli bakeng sa lipotoloho tse latelang tsa lamination.
• Pheta-pheta - Ts'ebetso ea ho aha e pheta-pheta ho fihlela palo e hlokahalang ea lera e finyelloa, 'me potoloho e' ngoe le e 'ngoe e ntse e eketseha empa hape e hlahisa liphephetso tsa ngoliso le khatello ea mocheso.

Potoloho e 'ngoe le e' ngoe e latellanang ea lamination e eketsa boima ba lera empa hape e hlahisa liphephetso tsa ngoliso le khatello ea mocheso tse lokelang ho laoloa ka hloko.

Sequential Lamination Process Flow ho HDI Build-Up

Ts'ebetso ea tatellano ea lamination e qala ka tlhahiso ea mantlha, moo substrate e tloaelehileng ea multilayer e hlahisoang ka litšoantšo tse ka hare tsa lera, kalafo ea oxide, le lamination ea prepreg le foil ea koporo. Konokono, eo hangata e nang le likarolo tse peli ho isa ho tse 'ne tsa matšoao, e fana ka botsitso ba mochini mme e sebetsa e le motheo oa ts'ebetso ea ho haha.

Ka mor'a ho cheka, ho pola, le ho qeta holim'a metsi ho etsa likhokahano tsa likoti, lipehelo tsa ngoliso ea mahlo lia eketsoa ho netefatsa tlhophiso e nepahetseng nakong ea lipotoloho tse latelang tsa lamination.

Pele Lamination Cycle

Mohaho oa pele o fetola mantlha hore e be sebopeho sa 1+N+1 ka lisebelisoa tsa dielectric tsa laminating holim'a libaka tse peli tse ka ntle. Li-foil tsa koporo tse koahetsoeng ka resin kapa li-dielectric tsa filimi e omileng li hokahantsoe ka lisebelisoa tsa optical kapa X-ray tse supang matšoao a ngoliso a entsoeng motheong.

Lamination e etsoa tlas'a mocheso o laoloang le khatello ea ho etsa bonnete ba hore resin e phalla ka ho feletseng ntle le li-voids. Ka mor'a ho pholile, ho phunya ka laser ho etsa li-microvias tse hokahantsoeng le li-pads tsa bokantle ba mantlha, hangata ka ho nepahala ha ±25 µm.

• Litokisetso tsa holimo - Roughening e ntlafatsa ho khomarela pakeng tsa core le dielectric layers.
• Taolo ya ho tsamaisana - Sistimi ea Optical e boloka ho nepahala ha maemo ka har'a litlhaloso.
• Lamination tobetsa - Thempereichara e laoloang le khatello li netefatsa hore resin e phekoleha le ho tlamahanngoa.
• Ho cheka ka laser microvia - Vias of 75–150 µm e thehiloe ho fihlela liphaephe tse shebiloeng.
• Metallization ea koporo - Desmear, koporo e se nang electroless, le plating ea mohlala li theha litsela tse tsamaisang.

Lamination Cycles tse latelang

Lipotoloho tsa morao-rao li latela mokhoa o ts'oanang oa ts'ebetso empa li eketsa ho rarahana ha likarolo tse ncha tsa dielectric li entsoe ka laminated holim'a mohaho o fetileng. Ka tlhophiso ea 2+N+2, li-microvias li ka beoa ka kotloloho holim'a tsela ea boemo ba pele kapa tsa thekesela ho li-pads tse haufi.

Liphetoho tse fapaneng ho tloha ho futhumatsang khafetsa li hloka litokiso tse nepahetseng tsa boingoliso ho boloka ho nepahala ha layer-to-lay. Potoloho e 'ngoe le e' ngoe e kenyelletsa ho cheka ka laser, ho pola ka koporo, ho etsa planarization, le ho lokisa bokaholimo ho boloka ho khomarela le ho ts'epahala.

Potoloho ea ho qetela e feta litšoantšong tsa lera le ka ntle, ho fata, ho sebelisa maske ea solder, le ho qeta bokaholimo. Ho boloka ho lekana mekhahlelong eohle ea lamination ho bohlokoa ho netefatsa botsitso ba boholo le botšepehi ba khokahano mehahong e rarahaneng ea HDI.

Mathata a Boenjiniere ho Lamination ea Sequential

Ho rarahana ha tekheniki ha ho lamination ka tatellano ho hlahisa diphephetso tse mmalwa tsa bohlokwa tseo bahlahisi ba lokelang ho di rarolla ka taolo e nepahetseng ya tshebetso le kgetho ya thepa . Diphephetso tsena di kopana le potoloho e nngwe le e nngwe e eketsehileng ya ho bokellana mme di hloka mekgwa e hlophisehileng ya boenjiniere ho boloka chai le botshepehi.

Ngodiso le Taolo ya Dimensional

Ho nepahala ha ngoliso ho hlalosa meeli ea bokhoni ba lamination e latellanang. Potoloho e 'ngoe le e' ngoe ea mocheso e hlahisa liphetoho tse fapaneng ho tloha ho atoloso ea koporo le dielectric, phallo ea resin, le mamello e bokelletsoeng ea lisebelisoa.

Sistimi ea ngoliso ea mahlo e hokahanya mohato o mong le o mong oa lamination le oa ho cheka ho sebelisa lipheo tsa fiducial ho tsoa ho mekhahlelo e fetileng, ha litsamaiso tsa X-ray li sebetsana le lisebelisoa tse opaque. Baetsi ba tsoetseng pele ba sebelisa taolo ea ts'ebetso ea lipalo-palo ho bolela esale pele le ho lokisa liphetoho tse hlophisitsoeng.

• Liphello tsa potoloho ea mocheso - Katoloso le ho honyela ho tsoa ho futhumatsang khafetsa ho hloka matšeliso lipotolohong tse latelang.
• Ho tsitsa ha lintho - Li-dielectric tsa CTE tse tlase le li-foil tsa koporo tse tsamaellanang li fokotsa ho hoholeha ha ngoliso.
• Ho nepahala ha lisebelisoa - Litsamaiso tse nepahetseng tsa ho tsamaisana li boloka maemo a marang-rang ka har'a mamello e thata.
• Fetola maikutlo - Ho shebella ka nako ea 'nete ho thusa ho lokisoa ka matla ha liphoso tsa tumellano.

Ho mamellana ka kakaretso hangata ho fokotsa tatellano ea lamination ho lipotoloho tse tharo kapa tse fokolang tsa ho haha ​​​​lehlakoreng ka leng pele ho nepahala ha maemo ho nyenyefatsa bakeng sa meralo e hlakileng ea HDI.

Ho lumellana ha lintho le ho khomarela

Tšebelisano ea lintho tse bonahalang ke ea bohlokoa bakeng sa lamination e ka tšeptjoang ea tatellano. CTE ea mantlha, dielectric, le koporo e tlameha ho bapaloa haufi-ufi ho fokotsa khatello ea maikutlo nakong ea libaesekele tse futhumetseng.

Ho lokisoa ha bokaholimo ho tiisa ho khomarela ka nepo, ka mahlahahlaha a laoloang a khothalletsang ho kena-kenana ntle le ho senya ts'ebetso ea impedance. Sistimi ea resin e tlameha ho hanela tšenyo ea ho cheka ka laser, e lule e lumellana le lik'hemik'hale le lits'ebetso tsa plating, 'me e boloke botsitso ka lipotoloho tse ngata tsa phallo.

Mehopolo ea Moralo bakeng sa Sequential Lamination

Lamination e latellanang e beha lithibelo tse itseng ho HDI stack-up le moralo oa moralo. Ho nahanoa esale pele ka meeli ea ts'ebetso ho thusa ho netefatsa tlhahiso, tlhahiso, le ts'epahalo ea nako e telele. Mohaho o khethiloeng oa ho haha ​​o susumetsa ka kotloloho litšenyehelo, nako ea ho etella pele, le ts'ebetso.

Khetho ea Sebopeho sa Stack-Up

Baqapi ba lokela ho sebelisa mokhoa o bonolo ka ho fetisisa oa ho haha ​​o finyellang lipakane tsa potoloho ea potoloho. Sebopeho sa 1+N+1 se fana ka motsoako o leka-lekaneng oa sets'oants'o, litšenyehelo, le kotulo, ha 2+N+2 kapa meralo ea lera leha e le efe e etsa hore ho be le letsoalo le phahameng ka litšenyehelo tsa taolo e matla ea ts'ebetso le lipotoloho tse telele tsa mahlale.

Botenya ba mantlha bo lokela ho fokotsoa ho ntlafatsa ho nepahala ha ngoliso ha o ntse o boloka botsitso ba mochini. Botenya ba dielectric bo tlameha ho leka-lekanya taolo ea impedance, meeli ea ho phunya laser, le ka likarolo tsa likarolo. Khetho ea thepa e lokela ho etelletsa pele botsitso ba mocheso, CTE e ts'oanang, le ho lumellana ho pholletsa le lipotoloho tsa lamination.

Ka Leano le ho Bea

Tlhophiso ea Microvia e ama ka matla ho ts'epahala le ho etsoa. Litsela tse thekeselang li aba khatello ea maikutlo le ho fokotsa kotsi ea ho ata ha crack empa li hloka sebaka se eketsehileng sa ho tsamaisa. Li-vias tse pakiloeng li lokela ho lekanyetsoa ho mekhahlelo e 'meli, e nang le sebaka se lekaneng sa pad ho amohela mamello ea ngoliso.

• Ntlafatsa ka sebopeho - Khetha meaho e thekeselang bakeng sa ts'epo e ntlafalitsoeng ea mochini.
• Boloka litokomane - Lumella ho aha mamello ho tsoa ho lipotoloho tse ngata tsa lamination.
• Fokotsa likarolo tsa ho haha - Lipotoloho tse fokolang li ntlafatsa chai le ho fokotsa litšenyehelo.
• Akhaonto ea ho tlatsa - Via-in-pad e hloka li-microvias tse tlatsitsoeng le tse hlophisitsoeng.
• Laola impedance - Boloka seaparo sa botenya ba dielectric ho pholletsa le mekhahlelo.

Khokahano le Tlhahiso

Tšebelisano ea pele le moetsi oa PCB e bohlokoa. Melao e ikhethileng ea moralo bakeng sa boholo, boholo, litekanyo tsa pad, ho nepahala ha ngoliso, le meeli ea lamination e lokela ho tataisa liqeto tsa moralo.

Khetho ea thepa e tlameha ho ikamahanya le sete ea thepa e tšoanelehang ea moetsi le bokhoni ba lisebelisoa. Maikutlo a moralo bakeng sa tlhahiso a thusa ho tseba likotsi tsa tlhahiso, joalo ka ho ingolisa, ho latela likarolo tsa karo-karolelano, kapa ho bokellana ha thepa.

Bahlahisi ba nang le boiphihlelo joalo ka Highleap Electronics ba ka thusa ho ntlafatsa litlhophiso tsa stack-up le liparamente tsa lamination ho fihlela lihaho tse tšepahalang tsa HDI ka phetoho ea ts'ebetso e laoloang.

Tšepahala le Teko ka Sequential Lamination

Sequential lamination e hlahisa mathata a ikhethang a ho tšepahala ha a bapisoa le li-PCB tse tloaelehileng tsa multilayer. Lipotoloho tse ngata tsa mocheso le likhokahano tsa thepa li ka theha lintlha tse ka bang teng tsa ho hloleha tse tlamehang ho netefatsoa ka tlhahlobo e nepahetseng.

Mekhoa e Tloaelehileng ea ho hloleha

Microvia cracking ke eona ntho e ka sehloohong eo ho amehang ka eona, haholo-holo ka har'a meralo. Ho palama libaesekele nakong ea kopano kapa ts'ebetso ho baka ho se lumellane ho hokahaneng ho sehokelo sa via-to-pad, se lebisang ho thehoeng ha crack le li-circuits tse bulehileng tse ka bang teng. Interlayer delamination e ka bakoa ke ho khomarela ho fokolang, tšilafalo ea holim'a metsi, kapa lisebelisoa tse sa lumellaneng, ha kholo ea Conductive Anodic Filament (CAF) e ka etsahala libakeng tse mongobo tlas'a leeme la motlakase haeba tšilafalo ea ionic e le teng lipakeng tsa mekhahlelo.

Netefatso le Taolo ea Boleng

Tlhahlobo ea Microsection e lumella tlhahlobo e tobileng ea ka botšepehi, ho tlatsa resin, le ho kopanya li-interlayer. E tiisa hore potoloho e 'ngoe le e' ngoe ea lamination e fihletse khokahano e nepahetseng ea lera ntle le li-voids kapa ho se lumellane.

Mekhoa ea bohlokoa ea tlhahlobo ea ho tšepahala e kenyelletsa:

• Thermal cycling - E etsisa khatello ea maikutlo le khatello ea ts'ebetso ho bona ka mokhathala kapa ho phatloha.
• Interconnect Stress Testing (IST) - E potlakisa mekhoa ea ho hloleha tlas'a khatello ea mocheso le motlakase.
• Tlhahlobo ea likarolo tse fapaneng - E netefatsa plating ea koporo, boleng ba ho tlatsa, le ho tsitsa ha likhoele.
• Tlhokomelo ea ho hanyetsa - E lemoha ho senyeha butle butle pele ho hloleha.

Baetsi ba etsa liteko tsena nakong ea thuto le tlhahiso ho boloka botsitso le ts'epahalo ea ts'ebetso. Khatello ea lamination e laoloang, ngoliso e nepahetseng, le khetho e nepahetseng ea thepa e bohlokoa bakeng sa ho netefatsa ts'ebetso ea nako e telele ea li-PCB tsa HDI tse latellanang.

fihlela qeto e

Lamination e latellanang e thusa meralo ea HDI e ts'ehetsang sekhahla se phahameng sa potoloho le likarolo tsa molumo o motle ka li-cycle tse laoloang tsa lamination, laser drilling, le copper plating. Le ha e fana ka bokhoni bo phahameng ba ho hokahanya, e boetse e hlahisa ho rarahana ha ts'ebetso e hlokang ho ngolisoa ka nepo, ho lumellana ha thepa le taolo ea mocheso. Moralo o ntlafalitsoeng oa li-stack-up le lisebelisoa tse netefalitsoeng ke senotlolo sa ho boloka chai le ho ts'epahala ha nako e telele.

Highleap Electronics Sequential Lamination bokhoni

Highleap Electronics e fana ka litharollo tsa lamination tse latellanang ho tloha qetellong ho isa qetellong bakeng sa li-PCB tsa HDI ka:

• Taolo ea ts'ebetso e tsoetseng pele - Ngoliso e nepahetseng le lifaele tsa khatiso tse ntlafalitsoeng bakeng sa meaho ea li-cycle tse ngata.
• Tsebo ea lintho tse bonahalang - Lisebelisoa tse tšoanelehang tse nang le CTE e ts'oanang le ts'ebetso e netefalitsoeng ea lamination.
• Tšehetso ea moralo - Litlhahlobo tsa DFM le ntlafatso ea li-stack-up bakeng sa tlhahiso le katleho ea litšenyehelo.
• Netefaletso ea boleng - Teko ea ts'epo e kenyelletsang likarolo tse fapaneng, ho palama libaesekele tse futhumetseng le IST.
• Lisebelisoa tse tenyetsehang - Ts'ehetso ea 1+N+1, 2+N+2, le meaho efe kapa efe ea lera la HDI.

Sehlopha sa boenjiniere sa Highleap se sebelisana 'moho le bareki ho fana ka litharollo tse tšepahalang, tse nang le bongata bo phahameng ba PCB tse ntlafalitsoeng bakeng sa ts'ebetso le tlhahiso. Ikopanye le sehlopha sa rona sa botekgeniki ho buisana ka projeke ea hau e latelang ea HDI.