HDI PCB Manufacturing Services in China | Litšenyehelo-Optimized

Sebakeng sa lisebelisoa tsa elektroniki tse sebetsang hantle, li-PCB tsa High-Density Interconnect (HDI) li bohlokoa haholo bakeng sa ho nolofalletsa meralo e sebetsang hantle, e sebetsang hantle le e tšepahalang. Ho Highleap Electronic, moetsi ea tšepahalang oa HDI PCB, re ikhethile ka ho hlahisa le ho kopanya HDI PCB, ho kenyeletsoa le litharollo tse tsoetseng pele tsa Rigid-Flex HDI PCB. Bokhoni ba rona ba sejoale-joale bo etselitsoe ho fihlela litlhoko tse thata tsa liindasteri ho tloha ho lisebelisoa tsa elektroniki tsa bareki ho ea ho lifofane. moralo oa kopano bakeng sa liboto tsa potoloho tsa HDI, tlhahiso ea likarolo tse ntle e lokela ho hokahanngoa le tsela ea ho baleha ha likarolo, masoba a stencil le leano la tlhahlobo.

Sengoliloeng sena se shebisisa likarolo tse rarahaneng tsa HDI PCB Manufacturing, se totobatsang bokhoni ba rona bo tsoetseng pele, boitseanape ba lintho tse bonahalang, le lits'ebetso tse thata tsa netefatso ea boleng tse re tiisang re le balekane ba tšepahalang bakeng sa tharollo ea ts'ebetso e phahameng ea PCB.

E tsoetseng pele ea HDI PCB Matla a Tlhahiso

Highleap Electronic e na le mahlale a morao-rao le boiphihlelo ba ho fana ka li-PCB tsa HDI tse fihlelang maemo a holimo a indasteri. Bokhoni ba rona bo felletseng bo kenyelletsa:

Feature	Bokhoni
Max Layer	Likarolo tse 60
Inner Layer Min Trace/Space	2 limilione / 2 limilione
Out Layer Min Trace/Space	2 limilione / 2 limilione
Lera le ka Hare Max Koporo	10 oz
Out Layer Max Copper	10 oz
Min Mechanical Drilling/Annular Ring	0.15 limilimithara / 0.127 limilimithara
Min Laser Drilling/Annular Ring	0.075 limilimithara / 0.075 limilimithara
Aspect Ratio (Ho cheka Mechini)	20:1
Aspect Ratio (Ho Drilling Laser)	1:1
Tobetsa Fit Hole Tolerance	± 0.05 mm
Mamello ea PTH	± 0.075 mm
NPTH Mamello	± 0.05 mm
Mamello ea Countersink	± 0.15 mm
Botenya ba Boto	0.4 limilimithara - 8 limilimithara
Mamello ea Botenya ba Boto	<1.0 mm: ±0.1 mm >=1.0 mm: ±10%
Mamello ea Impedance	Ea Nako e le 'Ngoe: ±5Ω (≤50Ω), ±7% (>50Ω) Phapano: ±5Ω (≤50Ω), ±7% (>50Ω)
Mini Board Size	10 mm x 10 mm
Boholo ba Boto	Lisenthimithara tse 22.5 x lisenthimithara tse 30
Mamello ea Contour	± 0.1 mm
Min BGA	7 tse sekete
Min SMT	7 x 10 mil
Phekolo ea bokaholimo	ENIG, Monoana oa Khauta, Silivera ea ho qoelisoa, Tin ea ho qoelisoa, HASL, OSP, ENEPIG, Flash Gold, Hard Gold Plating
Mask ea solder	Botala, Botsho, Boputsoa, ​​Bofubedu, Matt Green
Min Solder Mask Clearance	1.5 tse sekete
Letamo la Mask la Min Solder	3 tse sekete
Litaba	Bosoeu, Botsho, Bofubedu, Bosehla
Min Legend Bophara/Botelele	4 limilione / 23 limilione
Senya Bophara ba Fillet	/
Bow & Sotha	0.3%

Matla a pharalletseng a HDI PCB

Highleap Electronic e khona ho etsa li-PCB tsa HDI ka lintlha tse latelang:

• Litlhophiso tsa Layer: Likarolo tse 4 ho isa ho tse 60, tse ts'ehetsang tse rarahaneng ka meaho e joalo ka 1+N+1, 2+N+2, le 3+N+3 meralo e nang le li-vias tse foufetseng, tse patiloeng le tse pakiloeng.
• Material Flexibility: E tšehetsa mefuta e fapaneng ea substrates ho kenyelletsa FR4 (Tg e tloaelehileng le e phahameng), laminate e ikhethang e nang le tahlehelo e tlase, Arlon, le laminate e thehiloeng ho polyimide bakeng sa lits'ebetso tse thata tse tenyetsehang.
• Dimension le Botenya bo fapaneng: E khona ho etsa liboto tsa tlhahiso ho tloha ho 10 mm x 10 mm ho isa ho 22.5 inches x 30 inches, ka botenya ho tloha ho 0.4 mm ho isa ho 8 mm.
• Boima ba koporo: E fana ka likhetho tsa botenya ba koporo ho tloha ho 0.5 oz ho isa ho 10 oz (e felile), e loketseng lits'ebetso tsa morao-rao le taolo ea mocheso.
• Lintlafatso: E kenyelletsa lits'ebetso tsa PCB tsa cavity, ka-in-pad e nang le li-conductive kapa li-non-conductive fills, li-capacitor tse patiloeng bakeng sa li-PCB tsa mohlala, le metsoako e thata-thata bakeng sa litlhoko tse fapaneng tsa moralo.
• Kalafo ea Bokaholimo: ENIG, Monoana oa Khauta, Silivera ea ho qoelisoa, Tin ea ho qoelisoa, HASL, TSO, ENEPIG, Khauta e Khanyang, Ho Plating Khauta e Thata.
• Litlhokahalo tse fokolang:
  • Min BGA: 7 mil
  • Min SMT: 7 x 10 mil
  • Min Solder Mask Clearance: 1.5 mil
  • Letamo la Mask la Min Solder: 3 mil
  • Min Legend Width / Height: 4 mil / 23 mil
• Matla a Eketsehileng:
  • Tobetsa Fit Hole Tolerance: ± 0.05 mm
  • Mamello ea Countersink: ± 0.15 mm
  • Sefa Bophara ba Fillet: /
  • Bow & Twist: 0.3%

Hobaneng U Khetha Highleap Electronic joalo ka Moetsi oa hau oa HDI PCB?

Ho Highleap Electronic, re motlotlo ka ho se be moetsi feela-re ba moetsi oa hau ea tšeptjoang oa HDI PCB le molekane oa leano ho moralo le tlhahiso ea PCB e phahameng haholo. Mona ke ka lebaka leo lik'hamphani tse etellang pele li re tšepang bakeng sa litlhoko tsa tsona tse phahameng tsa PCB:

1. Bokhoni bo sa Bapisitsoeng ba Tlhahiso

Re sutumelletsa meeli ea theknoloji ea HDI PCB ka bokhoni bo latelang:

• Max Layer Count: Ho fihla ho 60 layers bakeng sa meralo e rarahaneng haholo.
• Min Trace/Sebaka: Ka tlase ho 2/2 milli bakeng sa likarolo tse ka hare le tsa ka ntle.
• Boima ba koporo: Ho fihla ho 10 oz bakeng sa matla a holimo a mocheso le a hona joale.
• Drilling Precision: Ho cheka ka mechine ka boholo ba bonyane ba 0.15 mm le laser e cheka ho ea ho 0.075 mm.
• Aspect Ratiations: 20:1 bakeng sa ho phunya mechine le 1:1 bakeng sa ho phunya laser.
• Botenya ba Boto: Ho tloha ho 0.4 mm ho isa ho 8 mm, ka mamello ea botenya ea ± 0.1 mm bakeng sa mapolanka a ka tlase ho 1.0 mm le ± 10% bakeng sa liboto tse teteaneng.
• Taolo ea Impedans: E laoloang ka mokhoa o nepahetseng e le 'ngoe le mamello e fapaneng ea impedance ea ± 5Ω (≤50Ω) le ± 7% (> 50Ω).
• Surface Finishes: ENIG, ENEPIG, Silivera ea ho qoelisoa, Tin ea ho qoelisoa, HASL, OSP, le tse ling.

Bokhoni bona bo tsoetseng pele bo beha Highleap Electronic e le moetsi oa maemo a holimo oa HDI PCB bakeng sa lits'ebetso tse rarahaneng, tse tšepahalang haholo.

2. Litharollo tse Tailored bakeng sa Litlhoko tse Ikhethang

Haeba o thatafalloa ke ho fumana moetsi oa HDI PCB ea fihlelang litlhoko tsa hau tse nepahetseng, sehlopha sa litsebi tsa lits'ebetso sa Highleap Electronic se ikemiselitse ho thusa. Re sebetsa haufi-ufi le uena ho theha litharollo tsa HDI tse etselitsoeng uena tse netefatsang hore lia etsoa, ​​​​li ka tšeptjoa ebile lia sebetsa. Ebang ke pokello ea thepa e etselitsoeng uena haholo kapa e rarahaneng ka litlhophiso, re etsa hore mehopolo ea hau e be ea 'nete.

3. Taolo ea Boleng e Felletseng

Re kenya tšebetsong liteko tse matla mohatong o mong le o mong oa ts'ebetso ea tlhahiso, ho kenyelletsa:

• Tlhahlobo e Ikemetseng ea Optical (AOI): E supa esita le liphoso tse nyane haholo ho mesaletsa, limaske tsa solder, le vias.
• Tlhahlobo ea X-ray: E netefatsa sebopeho sa sebopeho sa li-vias tse sa boneng le tse patiloeng le manonyeletso a rarahaneng a solder.
• Teko ea Motlakase: E netefatsa impedance, tsoelo-pele, le botšepehi ba pontšo bakeng sa ts'ebetso e tšepahalang.
• Tshebetso Testing: E etsisa maemo a sebele a lefats'e ho netefatsa ts'ebetso pele e romelloa.

4. Linako Tsa Phetoho e Potlakileng

Ka mesebetsi e tsoetseng pele ea tlhahiso le sehlopha se sebetsang hantle, re fana ka linako tse potlakileng tsa phetoho, esita le bakeng sa meralo e rarahaneng. Hore na o hloka prototype kapa tlhahiso e felletseng ea tlhahiso, re fana ka nako ntle le ho beha boleng.

Joaloka moetsi oa HDI PCB ea khale, Highleap Electronic e kopanya boenjiniere bo nepahetseng, tlhahiso e feto-fetohang, le tiisetso ea boleng ba maemo a lefats'e ho tšehetsa merero ea hau e boima ka ho fetisisa.

Lintlha tsa HDI PCB Design bakeng sa Tlhahiso e Seamless

Ho fihlella diphetho tse ntle tlhahisong ya HDI PCB , ho sebelisana le moetsi ya nang le boiphihlelo wa HDI PCB ya utlwisisang mekgwa e metle ya moralo ho bohlokwa.

Ho ts'oara litšitiso ke ntlha ea bohlokoa ho netefatsa botšepehi ba matšoao, haholo-holo bakeng sa lits'ebetso tsa lebelo le holimo le tsa RF. Taolo e nepahetseng ea impedance e fokotsa tahlehelo ea matšoao mme e ntlafatsa ts'ebetso. Tsamaiso ea mocheso ke ntlha e 'ngoe ea bohlokoa; ho kenyelletsa li-vias tsa mocheso le ho khetha lisebelisoa tse nang le thepa e sebetsang hantle ea ho senya mocheso hoa hlokahala ho thibela ho futhumala ha lipotoloho tse phahameng.

Moralo o sebetsang oa microvia o bohlokoa tlhahisong ea HDI PCB. Ho khetha moetsi ea nepahetseng oa HDI PCB ho netefatsa ts'ebetsong e nepahetseng ea tlhophiso ea via-in-pad le li-microvias tse thekeselang kapa tse pakiloeng, tse lumellang ho hokahana ha lera, bongata bo phahameng, le tšitiso e nyane ea matšoao. Mekhoa ena e etsa hore ts'ebetso e ts'eptjoang le e sebetsang hantle ka har'a meralo e kopaneng e batloang ke lisebelisoa tsa elektroniki tsa sejoale-joale.

Khetho ea thepa e bapala karolo ea bohlokoa ho ntlafatseng ts'ebetso le ho khoneha ha li-PCB tsa HDI. Lisebelisoa tse tsoetseng pele tse kang laminate e khethehileng e nang le tahlehelo e tlase, Arlon, kapa high-Tg FR4 li fana ka botsitso bo hlokahalang ba motlakase le ho tšoarella ha mocheso bakeng sa meralo e rarahaneng.

Ho Highleap Electronic, moetsi ea ka sehloohong oa HDI PCB, sehlopha sa rona sa litsebi tsa boenjiniere se sebetsa haufi-ufi le bareki ho ntlafatsa meralo le ho e hokahanya le mekhoa e metle ea tlhahiso. Sena se tiisa tlhahiso e se nang moeli le liphetho tsa boleng bo holimo ho projeke e 'ngoe le e 'ngoe ea HDI PCB.

Kamoo re Thusang ho Fokotsa Litšenyehelo ho HDI PCB Manufacturing ea Hao

Ho Highleap Electronic, re tsepamisitse maikutlo ho faneng ka litharollo tse baballang litšenyehelo ho HDI PCB Manufacturing ntle le ho sekisetsa boleng kapa ts'ebetso. Ka ho ntlafatsa moralo, mekhoa e tsoetseng pele ea tlhahiso, le tšebeliso e nepahetseng ea thepa, re thusa bareki ba rona ho fumana chelete e ngata ea ho boloka litšenyehelo ha ba ntse ba boloka maemo a holimo.

1. Ntlafatso ea Moqapi bakeng sa Katleho ea Litšenyehelo

Sehlopha sa rona sa litsebi tsa boenjiniere se sebelisana 'moho le uena ho ntlafatsa moralo oa hau oa HDI PCB molemong oa ho etsoa. Ka ho fokotsa ho rarahana ho sa hlokahaleng, joalo ka li-stack-ups tse teteaneng kapa tse sa hlokeng letho ka litlhophiso, re tsamaisa mekhoa ea tlhahiso.

Ho sebelisa li-microvia tse tsitsitseng kapa tse pakiloeng ka leano ho ka ntlafatsa khokahanyo ea lera ha ho ntse ho fokotsa litšenyehelo tsa tlhahiso. Re boetse re tsepamisitse maikutlo ho ntlafatseng lipeakanyo tsa mohlala ho fokotsa ts'ebeliso ea koporo le lisebelisoa tse ling, ho netefatsa hore moralo oa hau o lula o sebetsa ebile o boloka chelete e ngata.

2. Optimised Panelization to Maximize Material Utilization

E 'ngoe ea litsela tse sebetsang ka ho fetisisa tsa ho fokotsa litšenyehelo ho HDI PCB Manufacturing ke ka ho ntlafatsa phanele. Sehlopha sa rona sa boenjiniere se sebelisa lisebelisoa tse tsoetseng pele tsa software ho rala meralo e sebetsang ka ho fetesisa ea liphanele, ho netefatsa tšebeliso e phahameng ka ho fetesisa ea thepa. Ka ho hlophisa meralo ea PCB ka leano, re fokotsa litšila tsa thepa le ho eketsa chai ea tlhahiso. Sena ha se fokotse litšenyehelo tsa thepa feela empa hape se fokotsa nako eohle ea tlhahiso.

Ho feta moo, ka ho kopanya meralo e fapaneng (mekhabiso e mengata ea merero) kapa ho hlophisa liboto tse nang le tumello e fokolang, re ka eketsa ts'ebeliso ea lisebelisoa. Mokhoa ona o molemo haholo bakeng sa li-batch tse nyane kapa li-prototype, moo ho sebetsa hantle ha litšenyehelo hangata ho leng thata.

3. Khetho le Tšebeliso ea Leano la Lintho

Khetho ea thepa ke ntlha ea bohlokoa ho leka-lekaneng ts'ebetso le litšenyehelo. Re u tataisa ho khetheng thepa ea boleng bo holimo empa e le e theko e tlaase, joalo ka li-laminate tse kopantsoeng tse kopanyang FR4 le thepa e tsoetseng pele joalo ka laminate e khethehileng e nang le tahlehelo e tlase bakeng sa lits'ebetso tse hlokang thepa e itseng ea motlakase. Ka ho khetha thepa e etselitsoeng litlhoko tsa sehlahisoa sa hau, re fokotsa litšenyehelo tse sa hlokahaleng ha re ntse re netefatsa ts'ebetso e ntle.

Tšebeliso e nepahetseng ea lisebelisoa, joalo ka ho roala koporo e nyane haholo moo ho khonahalang kapa ho khetha Tg e phahameng ea FR4 bakeng sa lits'ebetso tse sa hlokeng ts'ebetso e phahameng haholo, e thusa ho boloka litšenyehelo. Sehlopha sa rona se boetse se tiisa litšila tse fokolang nakong ea ts'ebetso ea tlhahiso, ho eketsa chai ho tsoa ho letlapa le leng le le leng la laminate.

4. Mekhoa e Tsoetseng Pele ea Tlhahiso ea ho Ntlafatsa Tšebeliso e Ntle

Highleap Electronic e sebelisa mahlale a morao-rao a ho etsa thepa ho fokotsa litšenyehelo tsa tlhahiso. Mokhoa o phahameng oa ho phunya laser le mekhoa e ikemetseng e netefatsa chai e ngata e nang le mefokolo e fokolang. Ts'ebetso ena ka kotloloho e fetolela ho fokotsoa ho sebetsa hape le litšila, ho thusa ho boloka litšenyehelo li le tlase.

Ka mohlala:

• Fine Trace Optimization: Bokhoni ba rona ba ho hlahisa mesaletsa hantle joalo ka 2 mil ho netefatsa hore lipotoloho tse ngata li ka beoa ka har'a sebaka se senyenyane, ho fokotsa palo ea li-layers tse hlokahalang.
• Sephetho se Sebetsang sa Bokaholimo: Ho fana ka liphekolo tse holimo tse kang ENIG, OSP, le HASL hammoho le litlhoko tsa moralo oa hau ho thusa ho fokotsa litšenyehelo tse sa hlokahaleng ha o ntse o netefatsa ts'epo.

5. Ho Beha Phano ea Phepelo le Tlhahiso

Mesebetsi ea rona ea tlhahiso e nolofalitsoeng le likamano tse matla tsa bafepedi li re nolofalletsa ho fumana thepa ka mokhoa o theko e tlase le ho fihlela linako tsa ho qetela ka katleho. Ho kopanya sena le bokhoni ba ka hare, joalo ka ho kopanya PCB le ho etsa li-prototyping, ho fokotsa linako tsa ho etella pele le litšenyehelo tse ling tse amanang le ho fana ka mesebetsi kantle ho naha.

Maano a Fokotsang Litšenyehelo

Ho Highleap Electronic, re hlophisa morero o mong le o mong ho leka-lekanya litšenyehelo le boleng. Ebang ke ka ntlafatso ea moralo, khetho ea thepa, phanele e ntlafalitsoeng, kapa mekhoa e tsoetseng pele ea tlhahiso, sehlopha sa rona se ikemiselitse ho u thusa ho holisa boleng ba matsete a hau.

Ikopanye le rona kajeno ho buisana ka hore na re ka fokotsa litšenyehelo tsa tlhahiso ea hau ea HDI PCB joang ha re ntse re fana ka lihlahisoa tse tšepahalang le tse sebetsang hantle. Ka Highleap Electronic, ho boloka litšenyehelo le bokhabane lia tsamaisana.

fihlela qeto e

High-Density Interconnect (HDI) PCB Manufacturing ke sesebelisoa sa bohlokoahali sa boqapi ba sejoale-joale sa elektroniki, se fanang ka sekhahla sa potoloho se ke keng sa lekanngoa, ts'ebetso e matlafalitsoeng ea motlakase, le ho feto-fetoha ha moralo.

Ho Highleap Electronic, bokgoni ba rona bo tswetseng pele ba tlhahiso , boiphihlelo bo felletseng ba thepa ya HDI PCB , le mekgwa e tiileng ya netefatso ya boleng di re beha boemong ba ho ba moetsi ya etellang pele wa HDI PCB mmarakeng. Ka ho sebetsa mmoho le rona, dikgwebo di ka sebedisa bokgoni bohle ba theknoloji ya HDI ho ntshetsa pele dihlahiswa tsa elektroniki tse nang le maemo a hodimo tse fihlelang maemo a hodimo a tshebetso le botshepehi.

Amohela bokamoso ba lisebelisoa tsa elektroniki ka tlhahiso, kopano le lits'ebeletso tse felletseng tsa HDI PCB ea Highleap Electronic. Ikopanye le rona kajeno ho buisana ka hore na boitseanape ba rona joalo ka moetsi ea nang le boiphihlelo oa HDI PCB bo ka phahamisa projeke ea hau e latelang joang, ho netefatsa hore lihlahisoa tsa hau li sebetsa hantle maemong a tlholisano le a fetohang ka potlako a elektroniki.

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Ikopanye le Highleap Electronic Kajeno
Haeba ha u so fumane moetsi oa HDI PCB ea ka fihlelang litlhoko tsa hau tse ikhethileng, rea u amohela ho ikopanya le Highleap Electronic. Sehlopha sa rona se hlahelletseng sa baenjiniere ba ts'ebetso se ka fana ka tharollo e phethahetseng ea tlhahiso e lumellanang le sehlahisoa sa hau, ho netefatsa tlhahiso le ts'ebetso e nepahetseng.

Lipotso Tse Atisang ho Botsoa (FAQ)

1. Phapang ea Sehloho ke Efe Pakeng Tsa Bofofu le Tsela ea ho Patoa?

Blind vias amahanya le magato a ka ntle ho le 'ngoe kapa ho feta le dikarolo ka hare ntle le phunyeletse PCB kaofela, ho etsa hore ba bonahale ho tloha lehlakoreng le leng. vias patoa ka ho feletseng ka hare, ho hokahanya le magato a ka hare feela le lula a patiloe ho tloha mahlakoreng a mabeli a PCB.

2. Lifofu le tse patoang ka tsela efe li ama PCB Manufacturing Costs?

Li-vias tse foufetseng le tse patiloeng ka kakaretso li eketsa litšenyehelo tsa tlhahiso ka lebaka la mehato e eketsehileng ea ts'ebetso, joalo ka lipotoloho tse ngata tsa lamination le ho cheka ka nepo. Leha ho le joalo, melemo ea ntlafatso ea sebaka le ts'ebetso hangata e lokafatsa litšenyehelo tse phahameng bakeng sa li-PCB tse rarahaneng le tse nang le bongata bo phahameng.

3. Ke Mathata afe a Amanang le Mekhoa ea ho Etsa Lifofu le Tse Patoang?

Liphephetso li kenyelletsa ho boloka tolamiso e nepahetseng nakong ea ho cheka le ho lamination, ho laola botenya ba koporo ka nepo, le ho laola li-vias tse tletseng resin ho thibela liphoso. Lisebelisoa tse tsoetseng pele le ho latela ka tieo lintlha tsa CAM li bohlokoa ho hlola mathata ana.

4. Joang ho Foufala le Patoa Vias Ntlafatsa PCB tšepahala?

Ka ho fokotsa bolelele ba likhokahano tsa motlakase le ho fokotsa palo ea likoti, tse foufetseng le tse patoang ka tsela e fokolang ea motlakase le ho ntlafatsa botšepehi ba pontšo. Sena se lebisa ts'ebetsong e ts'eptjoang haholoanyane, haholo-holo lits'ebetsong tse potlakileng le tse phahameng haholo.

5. Ke liindasteri life tse ruang molemo haholo ho tsoa ho lifofu le ho patoa ka li-PCB?

Liindasteri tse kang likhokahano tsa mehala, lisebelisoa tsa elektroniki tsa bareki, sebaka sa sefofane, likoloi le lisebelisoa tsa bongaka li rua molemo haholo. Makala ana a hloka li-PCB tse phahameng haholo, tse kopaneng, le tse tšepahalang ho ts'ehetsa ts'ebetso e tsoetseng pele le maemo a thata a ts'ebetso.