Tlhahiso e Hatetseng Pele ea PCB bakeng sa Litharollo tsa HDI (Mohokahanyi o Phahameng oa Density)

Lisebelisoa tsa elektroniki li ntse li eketseha matla ha boholo ba tsona bo ntse bo fokotseha, e leng se etsang hore moralo oa liboto tsa tsona tsa potoloho e be thata le ho feta. Li-PCB tse tloaelehileng li ke ke tsa fihlela litlhoko tsa litsamaiso tsa sejoale-joale tse hlokang terata e teteaneng, thepa e khethehileng, le tlhahiso e nepahetseng haholo. Ebang ke bakeng sa lisebelisoa tsa mehala ea thekeng, litsamaiso tsa lifofane , likoloi tse itsamaelang, kapa lisebelisoa tse tsoetseng pele tsa bongaka , u hloka li-PCB tse laolang matšoao ka katleho, mocheso le khatello tlas'a maemo a thata.

Ho Highleap Electronic, re sebetsa ka thata ho hlahisa li-PCB tse tsoetseng pele tsa HDI tse fetang matla a mahlale a boto ea setso. Liboto tsa rona li sebelisa lisebelisoa tse sebetsang hantle tse kang li-ceramic substrates, liboto tse thehiloeng ka tšepe le likhalase-ho netefatsa hore projeke ea hau e fumana ho nepahala le ho tšoarella ha eona. Re fana ka litharollo tse matla, tse lokiselitsoeng tlhahiso tse sebetsanang le litlhoko tse ikhethang tsa lisebelisoa tse rarahaneng tsa elektroniki.

Bokgoni ba rona ba tlhahiso ya HDI PCB bo kenyeletsa ho sebetsana le dipotoloho tse ngata tsa lamination, ho theha mesaletsa e menyenyane haholo, le ho netefatsa taolo e nepahetseng ya impedance. Ka disebediswa tsa sejoale-joale le tsebo e pharaletseng ya boenjiniere, re hlomelletswe ho sebetsana le diporojeke tse thata ka ho fetisisa. Ditharollo tsa rona tse felletseng tsa HDI di netefatsa maemo a hodimo a tshebetso le botshepehi, ho thusa ditsamaiso tsa moloko wa hao o latelang ho atleha.

Litharollo tse tsoetseng pele tsa HDI PCB bakeng sa Tlhahiso e rarahaneng le e Khethehileng

Haeba o batla moetsi ya kgonang ho fana ka ditharollo tse rarahaneng tsa tlhahiso ya PCB , kapa haeba o hloka ho etsa diprototype tse nepahetseng tsa PCB, tlhahiso ya sehlopha, le kopano, Highleap Electronic ke molekane wa hao ya loketseng. Re ikgethile ka ho fana ka ditharollo tsa PCB tse ikgethileng tse fihlelang ditlhoko tse matla tsa baenjiniere, ditsebi tsa R&D, le balaodi ba theko indastering ya dielektroniki. Ditshebeletso tsa rona di kenyeletsa:

• • Li-substrates tse sa tloaelehang le Mehaho e Kopanetsoeng: Re fana ka litharollo tsa PCB tse etselitsoeng maemo a feteletseng, joalo ka li-PCB tsa ceramic bakeng sa phetisetso ea mats'oao a RF e tsitsitseng, meralo ea tšepe ea mantlha bakeng sa ho qhala mocheso o phahameng, le likaroloana tsa likhalase bakeng sa likhokahano tsa maqhubu a phahameng haholo le a optical. Litlhophiso tsena tse tsoetseng pele ke karolo ea tharollo ea rona e pharalletseng ea HDI bakeng sa tikoloho e feteletseng le lits'ebetso tsa mofuta o latelang.
  • Lintlha tse phahameng tsa Layer Counts le Tolerances tse Tight: Re ka etsa li-PCB tse tsoetseng pele tsa HDI tse nang le likarolo tse fihlang ho 60, tse nang le trace/sebaka ho fihla ho 2/2 mil, tse nolofalletsang miniaturization, botšepehi bo matlafalitsoeng ba matšoao, le boima bo ikhethang ba ts'ebetso.
  • E Nepahetse ka Boqhetseke ka ho Cheka le ho Rala: Li-microvias tsa rona tse entsoeng ka laser, taolo e tiileng ea selikalikoe, le litekanyo tse ntlafalitsoeng tsa likarolo li netefatsa likhokahano tse matla le impedance e tsitsitseng ho meralo eohle.
  • Impedance e Laolang ho pholletsa le Complex Stack-Ups: Re ipabola ka har'a meralo ea li-stack-up tse ngata, re kopanya lisebelisoa tse fapaneng tsa dielectric ha re ntse re boloka mamello e thata ea ho se sebetse, ho netefatsa ts'ebetso ea mats'oao a sa lebelloang le ho ts'epahala.

Hore na o sebetsa ka li-prototypes, tlhahiso ea li-batch tse nyane, kapa tlhahiso le kopano e kholo, Highleap Electronic e fana ka ts'ehetso e felletseng ho tloha ho moralo ho isa sehlahisoa sa ho qetela, e o thusang ho fihlela bokhabane ba theknoloji ka li-PCB tsa HDI tse tsoetseng pele tse fihlelang litekanyetso tse phahameng ka ho fetisisa tlhahisong le ts'ebetsong.

Lisebelisoa tsa PCB tse tsoetseng pele le phello ea tsona ts'ebetsong

Ha lisebelisoa tsa elektroniki li ntse li tsoela pele ho fetoha, le lisebelisoa tse sebelisoang ho aha li-PCB. Ho Highleap Electronic, re ipabola ka ho etsa liboto tse atolohang ho feta maemo a FR4 le li-laminate tse phahameng tsa Tg, re sebelisa lisebelisoa tse tsoetseng pele ho fihlela litlhoko tse thata:

• • Li-PCB tsa Metal Core (Aluminium, Koporo):
    E loketse li-LED tse matla a holimo, li-drive tsa likoloi, le li-converter tsa indasteri. Metal core boards e tlosa mocheso hantle, e boloka botsitso ba sebopeho, 'me e tšehetsa koporo e boima (ho fihla ho 10oz) bakeng sa lits'ebetso tse phahameng tsa hajoale.
  • Li-PCB tsa Ceramic Substrate (Alumina, Aluminium Nitride):
    E nepahetse bakeng sa li-aerospace, li-module tsa microwave, le mekhoa ea puisano ea RF. Li-substrates tsa Ceramic li fana ka conductivity e ntle ea mocheso, botsitso ba sebopeho, le tahlehelo e tlase ea dielectric, ho netefatsa ts'ebetso e tsitsitseng tlasa maemo a boima.
  • Li-PCB tsa khalase:
    Botsitso bo haufi-ufi bo phethahetseng le thepa ea motlakase e ikhethang e etsa hore li-substrates tse thehiloeng ka khalase li tšoanelehe bakeng sa li-circuits tsa digital tse phahameng haholo, li-photonics, li-optical interconnects, le mekhoa ea puisano ea moloko o latelang.
  • Li-Laminate tse Thehiloeng ho PTFE le tse Tlase tsa Dk (mohlala, laminate e khethehileng e nang le tahlehelo e tlase, Taconic):
    Bakeng sa lisebelisoa tse phahameng tsa digital le RF, PTFE le li-laminates tse khethehileng tse tlaase tsa Dk li fokotsa ho fokotsa matšoao le ho etsa bonnete ba hore ho na le impedance e tsitsitseng, e nolofalletsang lisebelisoa tse phahameng le ho fetisa data ka potlako. Lisebelisoa tsena li bohlokoa ho HDI tharollo e lebisitsoeng ho meralo ea maqhubu a holimo, a tahlehelo e tlase.
  • Polyimide, Flexible, le Rigid-Flex Boards:
    Li-circuits tse feto-fetohang tse thehiloeng ho polyimide le metsoako e thata-thata li fana ka ts'ebetso e matlafalitsoeng, lipalo tse fokotsehileng tsa sehokelo, le matla a ho kobeha a matla, a bohlokoa bakeng sa sepakapaka, lintho tse aparoang, le lisebelisoa tsa elektroniki tse nyane tsa bareki.
  • Li-Mixed-Dielectric Stack-Ups (Li-PCB tsa Hybrid):
    Ho kopanya lisebelisoa tse fapaneng ka har'a boto e le 'ngoe ho lumella baenjiniere ho ntlafatsa thepa ea dielectric, matla a mochini le boits'oaro ba mocheso. Mokhoa ona o loketse ho leka-lekanya litlhoko tse ngata tsa ts'ebetso ka moralo o le mong. Mokhoa ona o sebelisoa khafetsa ho li-PCB tsa HDI tse tsoetseng pele, moo litlhoko tsa ts'ebetso li fapanang libakeng tse fapaneng tsa potoloho e le 'ngoe.

Highleap e fana ka tlhahiso le kopano ea PCB ka litharollo tse tsoetseng pele tsa HDI PCB, taolo ea impedance , le thepa ea sejoale-joale bakeng sa mafapha a lifofane, a puisano le a bongaka. Ho tloha ho li-PCB tse tsoetseng pele tsa HDI tse sebelisang li-stack-up tse tsoakiloeng tsa dielectric ho ea ho litharollo tsa HDI tse hlokang impedance e tsitsitseng litsamaisong tsa maqhubu a phahameng, sehlopha sa rona se netefatsa hore moralo o mong le o mong o ntlafalitsoe bakeng sa ts'ebetso, ts'epo le tlhahiso.

Mohokahanyi oa Matla a Phahameng ka ho Fetisisa (HDI) le Litsebi tsa Multi-Lamination

Ho theha diboto tse hatellang meedi ya tekheniki ho hloka ditharollo tse hlokolosi tsa HDI le dipotoloho tse ngata tsa lamination. Ho Highleap Electronic, re etsa di-PCB tse tswetseng pele tsa HDI tse fihlang ho di-layer tse 60 , re fihlella motsamao/sebaka sa kahare le kantle sa lera le lenyenyane jwalo ka 2/2 mil , re netefatsa bongata bo ikgethang ba routing le dintlha tse nyane tsa sebopeho. Re boetse re tshehetsa ho tjheka ka mechine le ho tjheka ka laser ka ditlhaloso tse latelang:

• Mocheso o fokolang oa ho cheka / Ring ea Annular: 0.15mm / 0.127mm, e nolofalletsang ho tsitsisa ho pota-potiloe ka likoti tse nang le kabo e ntle ea koporo ea koporo le likhokahano tse tšepahalang.
• Bonyane ba Laser Drilling / Annular Ring: 0.075mm/0.075mm, e tšehetsang meaho ea microvia e phuthetsoeng, e thekeselang le e tlatsitsoeng e bohlokoa meralong e tsoetseng pele ea HDI.

Likarolelano tsa likarolo ke tekanyo ea bohlokoa ea botebo ba ho phunya khahlanong le bophara ba masoba. Highleap Electronic e boloka karolelano ea likarolo tse fihlang ho 20:1 bakeng sa ho phunya ka mechine le 1:1 bakeng sa ho phunya ka laser, e netefatsa hore e tiile ka ho tšepahala esita le meahong e teteaneng, e nang le mekhahlelo e mengata.

Hangata liboto tse rarahaneng tsa HDI li hloka li-lamination tse ngata tse latellanang. Ho pholletsa le ts'ebetso ena, re laola botenya ba boto ho tloha ho 0.4mm ho isa ho 8mm , re khomarela mamello ea botenya ba boto ea ±0.1mm bakeng sa botenya ba <1.0mm le ±10% bakeng sa botenya ba ≥1.0mm, re netefatsa litekanyo tse tsitsitseng tsa bohlokoa bakeng sa impedance e ka boleloang esale pele le botsitso ba mechini - lintlha tsa bohlokoa ho faneng ka litharollo tse tšepahalang tsa HDI bakeng sa lits'ebetso tse hlokang tlhokomelo.

Botsitso ba Dimensional, Impedans Control, le Likhetho tsa ho Qetella

Ha maqhubu a mats'oao a nyoloha 'me mats'oafo a fokotseha, ho laola phapano ea impedance ho bohlokoa ho fana ka tharollo e tšepahalang ea HDI. Matla a mamello a Highleap Electronic a bohlokoa haholo ts'ebetsong ea li-PCB tse tsoetseng pele tsa HDI, tse nang le:

• E le ngoe±5Ω (≤50Ω), ±7% (>50Ω)
• Phapang±5Ω (≤50Ω), ±7% (>50Ω)

Ho nepahala ha rona ha tlhahiso ho atoloha ho lintlha tsohle:

• Mini Board Size: 10 * 10mm bakeng sa lisebelisoa tsa ultra-compact
• Boholo ba Boto: 22.5 * 30inch bakeng sa litsamaiso tse kholo
• Mamello ea Contour: ± 0.1mm bakeng sa phanele e nepahetseng e phahameng le lintlha tse rarahaneng tsa boto

Bakeng sa ho paka likarolo tse tsoetseng pele, re amohela li-patch tsa BGA ho fihla ho 7mil le li-SMT pads ho 7*10mil, tse tšehetsang likarolo tsa morao-rao tse phahameng, tse hlakileng ho li-PCB tse tsoetseng pele tsa HDI.

Dikgetho tsa kalafo ya bokahodimo di fapane ka ho lekana. Re fana ka ENIG , silevera ya ho qoelisa, thini ya ho qoelisa, HASL , OSP , ENEPIG , kgauta e benyang, plating ya kgauta e thata, le diphetho tsa kgauta tse kgethehileng tsa menoana. Mebala e mengata ya maske ya ho qoelisa (e tala, e ntsho, e putswa, e kgubedu, e tala e sa hlakang) le dikgetho tsa legend (e tshweu, e ntsho, e kgubedu, e tshehla) e dumella phapang ya sehlahiswa le ho tshwaya tshebetso. Sebaka se fokolang sa maske ya ho qoelisa ke 1.5mil mme letamo la maske ya ho qoelisa ke 3mil, ho netefatsa ho kwahelwa ka nepo le ho fokotsa ho qhalana ha solder.

Tiisetso ea Boleng le Tšepahala

Ho li-PCB tse tsoetseng pele tsa HDI, ho boloka mamello e tiileng le meaho e rarahaneng ha ho na taba haeba ho ts'epahala ho ka senyeha. Ho netefatsa ts'epo e tsitsitseng ho litharollo tsa rona tsa HDI, Highleap Electronic e kopanya taolo e matla ea boleng boemong bo bong le bo bong:

• • Mamello ea PTH/NPTH: ± 0.075mm bakeng sa ho kenngoa ka har'a masoba le ± 0.05mm bakeng sa likoti tse sa phunngoeng, tse tšehetsang ho kenngoa ha karolo e tsitsitseng le botšepehi ba pontšo.
  • Tobetsa Fit Hole Tolerance: ± 0.05mm e netefatsa kopano e ka tšeptjoang ea mochine oa mochine oa khatiso.
  • Mamello ea Countersink: ± 0.15mm e fana ka li-interfaces tse tsitsitseng tsa mechine le litulo tse sireletsehileng tsa likarolo.
  • Bow & Sotha: ≤0.3% e etsa bonnete ba hore mapolanka a lula a bataletse ebile a tsitsitse, e leng ntlha ea bohlokoa ho kopano e ikemetseng le ho tšepahala ha nako e telele.

Ka ho sebelisa Tlhahlobo ea Optical e Iketsang ( AOI ), litšoantšo tsa X-ray bakeng sa botšepehi ba via le plating, le liteko tse fapaneng tsa khatello ea motlakase le tikoloho, re netefatsa hore boto ka 'ngoe—ho kenyeletsoa le li-PCB tsa HDI tse tsoetseng pele tse batloang haholo—e fihlela kapa e feta maemo a indasteri le litlhoko tsa projeke ea hau.

Tšehetso ea DFM le Litharollo tsa Qetello-ho-Qetellong tse nang le Litsebi tse Tsoetseng Pele tsa HDI

Ha ba rala ditharollo tsa HDI tse sejoale-joale, baenjiniere ba tobana le diphephetso tse ikgethang ka lebaka la ditlhoko tse rarahaneng tsa thepa, ho bokellana ha di-stack-up tsa mekhahlelo e mengata, le taolo e nepahetseng ya impedance. Ho Highleap Electronic, re ikgethile ho o tataisa tshebetsong yohle ka tshehetso ya rona e felletseng ya moralo bakeng sa tlhahiso ( DFM ). Ho tloha qalong ya projeke ya hao, sehlopha sa rona se thusa ho hlwaya metswako e metle ya thepa, ditlhophiso tse tswetseng pele tsa ho bokellana, le mawa a nepahetseng a ho tjheka a etseditsweng ditlhoko tsa hao tse tswetseng pele tsa HDI PCB, ho netefatsa tlhahiso e nolofaditsweng le diphetho tsa boleng bo hodimo.

Tataiso ea rona ea DFM e fokotsa kotsi ea ho qapa bocha ho turang 'me e potlakisa nako ea hau ea ho ea 'marakeng ka ho sebetsana le liphephetso tse ka bang teng ka mafolofolo. Ebang u sebetsa ho liboto tsa HDI tse nang le mekhahlelo e mengata , ho tsamaisa mela e menyenyane, kapa li-substrate tse ikhethileng, re netefatsa hore ntlha e 'ngoe le e 'ngoe e ntlafalitsoe bakeng sa tlhahiso le ts'ebetso.

Ntle le tlhahiso ea PCB , re fana ka lits'ebeletso tse felletseng, ho kenyeletsoa kopano ea PCB le liteko tse felletseng. Mokhoa oa rona o kopaneng o akaretsa karolo e 'ngoe le e 'ngoe ea projeke - ho tloha ho fumaneng likarolo tsa boleng bo holimo ho isa ho netefatsong e sebetsang ea litharollo tsa hau tsa HDI - ho netefatsa hore sehlahisoa sa ho qetela se fihlela litlhaloso tsa hau tse nepahetseng le maemo a boleng. Ka Highleap Electronic joalo ka molekane oa hau, u rua molemo ho tsebo ea moralo le tlhahiso ea PCB ea HDI e tsoetseng pele, ha u ntse u boloka taolo holim'a litšenyehelo le kemiso.

Ho sebelisana le Highleap Electronic bakeng sa Katleho ea Hao e Tlang

Ha meralo ea hau e hloka bokhoni bo ikhethang—60-layer stack-ups, 2/2 mil trace/space, 10oz copper ka mahlakoreng a mabeli a ka hare le kantle, kapa likaroloana tse khethehileng tse kang tšepe, ceramic le khalase—Highleap Electronic e se e loketse ho tsamaisoa. Mokhoa oa rona o feto-fetohang o ts'ehetsa ntho e 'ngoe le e' ngoe ho tloha ho li-prototypes tse fetohang ka potlako ho isa ho tlhahiso e felletseng, e ikamahanyang le litlhoko tse tsoelang pele tsa projeke ea hau.

Baenjineri, baqapi, le litsebi tsa ho hira tse hlokang Precision Electronics PCB Manufacturing ba tla fumana molekane oa leano ho Highleap Electronic. Re utloisisa hore meralo e rarahaneng, lisebelisoa tse fetelletseng, le mamello e boima ha se liphephetso tsa tekheniki feela - ke menyetla ea ho fihlela ts'ebetso le ts'epahalo e sa lebelloang.

Ikopanye le Highleap Electronic Kajeno

Haeba o se o loketse ho fetela ka nqane ho di-PCB tse tloaelehileng le ho hlahloba bokgoni boo ditharollo tsa HDI tsa sejoale-joale, multi-lamination, le thepa e sa tlwaelehang di ka fanang ka bona, ikopanye le Highleap Electronic . Sehlopha sa rona sa ditsebi se itokiseditse ho o tataisa ka kgetho ya thepa, ntlafatso ya ho bokellana, le ntlha e nngwe le e nngwe e hlokolosi ya tlhahiso ho phethahatsa pono ya hao.

Lefatšeng leo meeli ea tekheniki e lulang e hatelloa, e re re u thuse ho tlola meeli le ho theha li-PCB tse hlalosang sephetho sa boqapi ba elektroniki.