Tataiso ea Highleap Electronic ea ho Foufala le ho Epeloa ka Li-PCB

Sebakeng se ntseng se fetoha sa di-elektroniki, diboto tsa potoloho tse hatisitsweng (di-PCB) di sebetsa e le motheo wa hoo e ka bang disebediswa tsohle tsa elektroniki. Ha theknoloji e ntse e tswela pele, tlhoko ya di-PCB tse nyane, tse sebetsang hantle le tse tshepahalang e eketsehile. Ntho ya bohlokwa ho fihlelleng ditlhoko tsena ke meaho e ikgethang e tsejwang e le di-via tse foufetseng le tse patilweng. Tataiso ena e felletseng e teba ka hara mathata a di-via tse foufetseng le tse patilweng, e kopanya dintlha tse qaqileng tsa tshebetso ya boenjiniere ba CAM ho fana ka kutlwisiso e phethahetseng bakeng sa baenjiniere, baqapi le ditsebi tsa indasteri. Jwalo ka k'hamphani e etellang pele ya tlhahiso le kopano ya PCB , Highleap Electronic e ikgethile ka ho hlahisa di-PCB tsa Blind and Buried Vias tsa boleng bo hodimo le diboto tsa potoloho tsa Blind and Buried Via, ho netefatsa ho nepahala le ho tshepahala morerong o mong le o mong.

Litsela tsa lifofu le tse patoang ke life?

Lifofu ka Vias

Li-vias tse foufetseng ke likhokahano tse khethehileng tse hokahanyang likarolo tse le 'ngoe kapa ho feta tse ka ntle tsa PCB ho lihlopha tse khethiloeng ka hare ntle le ho phunyeletsa boto eohle. Ho fapana le ka-sekoti vias, e leng ho pholletsa le le dikarolo tsohle, vias foufetseng ba "foufetseng" hobane ha ba atolose ho lehlakoreng le fapaneng la PCB. Khokahano ena e khethang e lumella moralo o kopaneng haholoanyane ka ho lokolla sebaka holim'a likarolo tse ka ntle bakeng sa ho beha likarolo le ho tsamaisa litsela.

E patoang ka Vias

vias patoa, ka lehlakoreng le leng, teng ka ho feletseng ka hare ho magato a ka hare ea PCB, hokela dikarolo tsena ntle le ho fihla bokaholimo ka ntle. vias tsena li patiloe ka ho feletseng ho tloha mahlakoreng ka bobeli holimo le tlase boto, ho fana ka dikgokelo ka hare hore ntlafatsa routing feto-fetoha le ho boloka e hloekileng lera kantle bakeng sa ho beha karolo.

Lihlopha tsa Lifofu le Tse Patoang ka Litsela

Li-vias tse foufetseng le tse patiloeng li ka aroloa ho latela mekhoa ea bona ea tlhahiso le litlhophiso tsa meralo:

1. Sefofu sa Mechini ka Vias: E chekiloe ho sebelisoa mechini e tloaelehileng ea mochini, li-vias tsena hangata li hokahanya lera le le leng kapa ho feta tse haufi tse ka hare.
2. Laser Blind Vias: E entsoe ka ho cheka ka mokhoa o nepahetseng oa laser, e lumellang ho ntlafala ka ho beoa le ho teteana ho holimo.
3. E patoang ka Vias: E fumaneha ka ho feletseng ka har'a lihlopha tse ka hare, e kopanya lihlopha tse ngata tse ka hare ntle le ho phunyeletsa likarolo tse ka ntle.
4. Ka Vias: Letoto la li-vias tse tsamaellanang ka mokhoa o otlolohileng ka mekhahlelo e mengata, e matlafatsang khokahanyo ntle le ho eketsa botenya ba PCB.

Sefofu le ho Patoa ka Litlhaloso tsa Ts'ebetso ea Boenjiniere ba CAM

Ho netefatsa ho nepahala le ho ts'epahala ha tlhahiso ea PCB, litlhaloso tsa ts'ebetso ea boenjiniere ba CAM li fana ka lintlha tse qaqileng tsa phallo ea mosebetsi le litlhoko tsa ho hlahisa li-vias tse sa boneng le tse patiloeng. Litaelo tsena li bohlokoa bakeng sa ho fihlela ts'ebetso e tsitsitseng le boleng. Ka tlase ke kopanyo ea lintlha tsa boenjiniere tsa CAM tsa bohlokoa bakeng sa ho etsa li-PCB tse Foufetseng le tse patoang ho Highleap Electronic.

1. Moralo oa Ts'ebetso

1.1 Multilayer Boards (N Inner Layers)

Bakeng sa liboto tsa multilayer, ts'ebetso e kenyelletsa letoto la mehato e hlokolosi ea ho lokisa likarolo tse ka hare tsa popo:

• Ho Seha Lintho: Thepa ea motheo e kang FR4, 370HR, laminate e khethehileng e nang le tahlehelo e tlase, le Megtron li sehiloe ka nepo ka litekanyo tse laolehang.
• Ho omisa ka mor'a ho itšeha: Lisebelisoa tse sehiloeng li omisitsoe ho tlosa mongobo, ho netefatsa maemo a nepahetseng bakeng sa ts'ebetso e latelang.
• Inner Layer Dry Film Kopo: Filimi e tšesaane e omeletseng e sebelisoa likarolong tse ka hare, e sebetsa e le mask bakeng sa etching.
• Inner Layer Etching: Koporo e sa batleheng e tlosoa ho theha mekhoa ea potoloho e lakatsehang.
• Automatic Optical Inspection (AOI): Karolo e 'ngoe le e 'ngoe e hlahlojoa ho bona liphoso ho netefatsa ho nepahala ha paterone.
• Browning: Phekolo ea holim'a metsi e sebelisoa ho matlafatsa ho khomarela nakong ea lamination.
• Khalemelo: Likarolo tse ngata li phuthetsoe 'me li entsoe ka laminated hammoho tlas'a khatello e phahameng le mocheso. Bakeng sa li-vias tse foufetseng, sena se ka hloka lipotoloho tse ngata tsa lamination.
• Omisa le Edge Milling: Boto ea laminated e omisitsoe hape, e lateloa ke ho sila ka bohale ho etsa bonnete ba hore litekanyo tse nepahetseng le metse e boreleli.
• Ho Tlosa Sekhomaretsi: Likhomaretsi tse sebelisoang nakong ea lamination li tlosoa ka hloko ho thibela tšilafalo.
• Copper Thinning: Koporo e ka holimo e fokotsehile ka botenya ka mekhoa e mengata ea ho fokotsa:
  • Thinning ea Pele: Botenya ba koporo bo fokotsehile ho 7-9 µm.
  • Thinning ea Bobeli: Phokotso e eketsehileng ho 9-12 µm.
  • Thinning ea Boraro (4-time Compression process): Phokotso ea ho qetela ho 9-12 µm bakeng sa likarolo tse ka ntle, ho latela litlhoko tse khethehileng tsa ho sesa.
• cheka: Ho cheka ka mokhoa o nepahetseng ho etsoa ho sebelisoa mechine kapa laser drill, ho itšetlehile ka mofuta oa mofuta.
• Deburring: Li-burrs life kapa life tse mahoashe li tlosoa ka hloko ho etsa bonnete ba hore li-vias li hloekile.
• Ho qoelisoa ka Koporo: Karolo ea pele ea koporo e kenngoa holim'a li-vias tse chekiloeng ho etsa litsela tse tsamaisang.
• Negative Plating: Electroplating e etsoa ho latela litaelo tse tobileng tsa ERP.
• Plating Ho sila: Koporo e feteletseng e siloa ho fihlela seaparo se tšoanang.
• Negative Dry Film Kopo: Filimi e sireletsang e sebelisoa ho sireletsa li-vias tse pentiloeng.
• Ho hlahloba le ho Etching: Litlhahlobo tse matla li etsoa ho netefatsa boleng, ho lateloa ke etching ho tlosa koporo e sa batleheng.
• Kamora ho sebetsa: PCB e nka mehato ea ho qetela ea ho qetela, ho kenyelletsa ts'ebeliso ea mask ea solder, tlhahlobo ea silika, le lits'ebetso tsa ho qetela.

1.2 Maboto a Mela e 'meli

Bakeng sa liboto tse nang le mekhahlelo e 'meli, ts'ebetso e lokisoa empa e boloka mehato eohle ea bohlokoa ho netefatsa botšepehi ba motlakase le mochini:

• Ho Seha le ho Omisa Boitsebiso: E tšoana le mapolanka a mangata.
• Ho Sesa Koporo le ho Epa: Koporo e holim'a metsi e tšesaane pele ho cheka li-vias.
• Deburring le Plating: Vias ba cheka le deburred, lateloa ke qoelisoa koporo le electroplating.
• Etching ea ho qetela le Post-Processing: Koporo e sa batleheng e tlosoa, 'me PCB e qeta ho qetela.

2. Mekhoa ea Kalafo ea Bokaholimo (N Likarolo tsa Kantle)

2.1 Kalafo ea Bokaholimo ba Khauta

• Lamination le ho omisa: Likarolo li entsoe ka laminated 'me li omisitsoe ho itokisetsa phekolo ea holim'a metsi.
• Edge Milling le Ho Tlosa Sekhomaretsi: E netefatsa litekanyo tse nepahetseng hantle le libaka tse hloekileng.
• Ho Sesa Koporo le Ho Sila: Koporo e holim'a metsi e tšesaane ho latela litlhaloso tse hlokahalang.
• cheka: Li-Vias li chekoa ka mor'a ho fokotsa koporo.
• Kamora ho sebetsa: Mehato ea ho qetela e kenyelletsa ho qeta holim'a metsi le liphahlo tse sireletsang.

2.2 Liphekolo Tse Ling tsa Bokaholimo

• Mehato e Tšoanang: Latela ts'ebetso e ts'oanang le kalafo ea bokaholimo ba khauta empa e etselitsoe liphetho tse khethehileng tse hlokoang ke moreki.

3. Matšeliso a Boenjiniere le Litlhoko tsa ho Thinning Koporo

Highleap Electronic e sebelisa maano a mats'eliso a boenjiniere a nepahetseng ho boloka botenya le sebaka se lekaneng sa koporo, ho netefatsa ts'epo ea motlakase le ts'ebetso ea tlhahiso.

3.1 Mekhahlelo e ka Hare

• Tlhokahalo ea Botenya ba Koporo: 35 µm (1 oz).
• puseletso: E sebelisoa ka mokhoa o ts'oanang ho 1 mil, ho netefatsa sebaka sa bonyane sa 3 mls. Ha sebaka se sa lekana, matšeliso a ka fokotsoa hanyenyane, a boloka bonyane ba 0.8 mls.
• Copper Thinning:
  • Thinning ea Pele: E fokotsa koporo ho 7-9 µm.
  • Thinning ea Bobeli: Ho fokotsa ho feta ho 9-12 µm.
  • Thinning ea Boraro (4-time Compression): E boloka koporo ho 9-12 µm bakeng sa likarolo tse ka ntle, ho latela litlhoko tse itseng.

3.2 Mekhahlelo e Ntle

• Litlhoko tsa Botenya ba Koporo:
  • ≤46 µm: E lefshoa ka mokhoa o ts'oanang ho 1.5 mils, ho netefatsa sebaka sa bonyane sa 3 mls.
  • 46.1-55 µm: Koporo e fokotsehile ho 15-20 µm.
  • 55.1-70 µm: E lefshoa ka koporo ea motheo ea 1 oz 'me ea fokotsoa ho 20-30 µm.
• Matšeliso Liphetoho: E entsoe ho ipapisitsoe le lipalo tsa lera le ho rarahana ha moralo ho boloka ts'epahalo ea motlakase le ho etsoa.

3.3 Resin e Tlatsing ka Ts'ebetso ea Copper Thinning

Bakeng sa li-vias tse tlatsitsoeng ka resin, mehato e meng e netefatsa bots'epehi ba sebopeho le thibelo ea bofokoli:

1. Tatellano ea ho cheka le ho fokotsa:
   • Ho fokotseha ha koporo ho etsahala ka mor'a ho sila ka ceramic le pele ho cheka, ntle le mehaho ea N+N e hlokang ho phunngoa ka laser.
2. Ho Sila ka mor'a ho Thinning:
   • Ho sila ho eketsehileng ho etsoa ho tlosa li-protrusions tsa resin, ho netefatsa libaka tse boreleli le ho thibela mefokolo nakong ea lamination.
   • Hlokomela: Li-protrusions tsa resin li ka baka lamination e mpe le ho pepesa vias ntle le koporo, ho hloka hore ho sila ka ho feletseng ho batalatsa resin.

4. Litaelo tsa ERP tsa Electroplating bakeng sa Vias

Electroplating e sebetsang e bohlokoa bakeng sa ho netefatsa botšepehi ba motlakase oa vias. Highleap Electronic e latela litaelo tse latelang tsa ERP (Enterprise Resource Planning):

• A. Botenya bo fokolang ba Lebota la Lebota: 18 µm.
• B. Karolelano ea Lebota la Lebota la Koporo: 20 µm.
• C. Botenya ba Koporo bo Phethang Bokaholimo: 25-35 µm.
• D. Hole Area: E tobileng litlhoko tsa moralo.
• E. Boima ba Hona Joale: 16 ASF (Amperes ka Square Foot).
• F. Nako ea Electroplating: Metsotso e 60.

Mekhahlelo ena e netefatsa hore li-vias tse pentiloeng li kopana le litekanyetso tse hlokahalang tsa motlakase le tsa mochini bakeng sa ts'ebetso e tšepahalang.

Melemo ea ho Foufala le ho Epeloa ka Litsela

Ho kenya tshebetsong di-vias tse foufetseng le tse patilweng meralong ya PCB ho fana ka melemo e mengata:

1. Ntlafatso ea Sebaka: Lokolla sebaka sa bohlokoa holim'a mealo e ka ntle, e lumellang hore ho be le sekhahla se phahameng sa likarolo le meralo e kopaneng.
2. Ts'ebetso e Ntlafetseng ea Motlakase: Nako e khuts'oane ka bolelele e fella ka khanyetso e tlase ea motlakase le botsitso bo matlafalitsoeng ba lets'oao, ho bohlokoa bakeng sa lits'ebetso tsa lebelo le holimo.
3. Tekano e Phahameng ea Tsela: Tšehetsa meralo ea HDI e nang le matšoao a rarahaneng le a lebelo le phahameng, a nolofalletsang potoloho e rarahaneng ka har'a sebaka se le seng sa boto.
4. Palo e Fokotsoeng ea Lera: Tsela e sebetsang ea ka hare e lumella hore ho be le mekhahlelo e fokolang, ho nolofatsa moralo le tlhahiso ha ho ntse ho boloka ts'ebetso.
5. Taolo e Ntlafetseng ea Thermal: Lisebelisoa tse betere tsa tšebeliso ea sebaka ka ho felloa ke matla ha mocheso, ho ntlafatsa ts'epo le bophelo bo bolelele ba lisebelisoa tsa elektroniki.

Likopo tsa Lifofu le Li patoa ka Litsela

Li-vias tse foufetseng le tse patiloeng li bohlokoa haholo lits'ebetsong tse fapaneng tse tsoetseng pele tsa PCB:

• Maboto a Khokahanyo e Phahameng ea Boipheliso (HDI).: E bohlokoa bakeng sa lisebelisoa tsa elektroniki tsa sejoale-joale joalo ka li-smartphone, matlapa le lisebelisoa tse ka roaloang, moo sebaka se leng teng ka theko e phahameng.
• Maboto a Potoloho a Lebelo le Phahameng: E bohlokoa bakeng sa lits'ebetso tse hlokang phetiso ea mats'oao ka potlako, joalo ka likhokahano tsa mehala, lisebelisoa tsa ts'ebetso ea data, le komporo e sebetsang hantle haholo.
• Li-PCB tse ngata: Ts'ehetsa lits'ebetso tse rarahaneng tse nang le mekhahlelo e mengata, e tsamaisang tsela e nepahetseng le khokahanyo ho liindasteri, likoloi le lisebelisoa tsa elektroniki tsa sefofane.
• Lisebelisoa tsa elektroniki tse nang le mesebetsi e rarahaneng: E loketse lisebelisoa tse rarahaneng tse hlokang meralo e tšepahalang le e kopaneng ea PCB, ho kenyeletsoa lisebelisoa tsa bongaka, lisebelisoa tsa papali, le lisebelisoa tsa elektroniki tsa bareki.

Setsebi sa Highleap Electronics ho Lifofu le ho Patoa ka PCB Manufacturing

Jwalo ka khamphani e etellang pele ya tlhahiso le kopano ya PCB, Highleap Electronic e ikgethile ka tlhahiso ya di-PCB tsa Blind and Buried Vias le diboto tsa potoloho tsa Blind and Buried Via. Boitlamo ba rona ba boleng le ho nepahala bo bonahatswa ke ho kgomarela ha rona ditlhaloso tse thata tsa tshebetso ya boenjiniere ba CAM le mekgwa e tswetseng pele ya tlhahiso. Ha di-vias tse foufetseng le tse patilweng di kopantswe le di-vias tse tlatsitsweng, diphetho tse kgethilweng kapa dikarolo tse laolwang ka botebo, tlhahiso ya boto ya potoloho e rarahaneng haholo e hloka tsela e hokahantsweng ya tshebetso ho ena le ditlhahlobo tse arohaneng tsa karolo ka nngwe.

Melao le Mekhoa ea Bohlokoa

• Tsamaiso ea Sebopeho sa Lera: Re laola ka hloko meaho ea layer ho netefatsa likhokahano tse se nang moeli le ho thibela ho sekisetsa botšepehi.
• Ho Cheka ka nepo: Ka ho sebelisa mekhoa ea ho cheka ka mochine le ka laser, re finyella ho nepahala ho phahameng ho hlokahalang bakeng sa ho rarahana ka litlhophiso.
• Taolo ea Botenya ba Koporo: Ts'ebetso ea rona ea mats'eliso e tsoetseng pele le ts'ebetso ea ho fokotsa boima ba 'mele e boloka botenya ba koporo bo sa fetoheng ho pholletsa le likarolo tsohle, ho latela litekanyetso tse thata tsa boleng.
• Mekhoa e tsoetseng pele ea ho Plating: Ka li-parameter tsa electroplating tse laoloang, re tiisa ts'ebetso e tšepahalang ea motlakase le ho tšoarella ha vias.
• boleng tiisetsa: Ka litlhahlobo tse felletseng le liteko mohatong o mong le o mong, re etsa bonnete ba hore PCB ka 'ngoe e kopana le litekanyetso tse phahameng ka ho fetisisa tsa indasteri.

Kopano ea Boenjiniere ea CAM

Ho kenyelletsa lintlha tse fanoeng tsa ts'ebetso ea boenjiniere ba CAM, Highleap Electronic e netefatsa hore mohato o mong le o mong oa ts'ebetso ea tlhahiso o lateloa ka hloko:

• Phallo ea Ts'ebetso bakeng sa Li-Layers tsa N ka hare: Ho tloha ho seha thepa ho ea ho post-processing, mohato ka mong o ntlafatsoa bakeng sa ho nepahala le boleng.
• Matšeliso le ho Thibela Koporo: Ho ikamahanya le maqheka a khethehileng a matšeliso le litlhoko tsa ho fokotsa koporo ho netefatsa ho tšepahala le ho etsoa ha motlakase.
• Resin-Filled Vias Handling: Ho na le mekhoa e khethehileng ea ho laola li-vias tse tletseng resin, ho thibela likoli le ho etsa bonnete ba hore libaka tse boreleli, tse bataletseng.
• Electroplating ERP Compliance: Ho khomarela ka thata ho litekanyetso tsa electroplating ho tiisa botšepehi le ts'ebetso ea e 'ngoe le e' ngoe ka tsela.

fihlela qeto e

Ho utloisisa karolo ea li-vias tse foufetseng le tse patiloeng ho bohlokoa bakeng sa ho rala le ho etsa li-PCB tse sebetsang hantle le tse nang le bongata bo phahameng. Ka ho sebelisa mekhoa e tsoetseng pele ea tlhahiso le ho khomarela litlhaloso tse thata tsa ts'ebetso ea boenjiniere ba CAM , Highleap Electronic e netefatsa tlhahiso ea li-PCB tse tšepahalang le tse sebetsang hantle tsa Blind and Buried Vias le liboto tsa potoloho tsa Blind and Buried Via tse etselitsoeng litlhoko tse boima tsa lisebelisoa tsa elektroniki tsa sejoale-joale. Ebang u ntse u nts'etsapele lisebelisoa tse nyane tsa bareki kapa litsamaiso tse rarahaneng tsa indasteri, ho kenyelletsa li-vias tse foufetseng le tse patiloeng ho ka ntlafatsa haholo ts'ebetso le ts'ebetso ea PCB ea hau.

Bakeng sa tlhaiso-leseling e batsi ka bokhoni ba rona ba ho etsa lifofu le tse patoang ka PCB, ikopanye le Highleap Electronic-molekane oa hau eo u mo tšepang mosebetsing oa ho etsa le ho kopanya PCB ea boleng bo holimo.

Lipotso Tse Atisang ho Botsoa (FAQ)

1. Phapang ea Sehloho ke Efe Pakeng Tsa Bofofu le Tsela ea ho Patoa?

Blind vias amahanya le magato a ka ntle ho le 'ngoe kapa ho feta le dikarolo ka hare ntle le phunyeletse PCB kaofela, ho etsa hore ba bonahale ho tloha lehlakoreng le leng. vias patoa ka ho feletseng ka hare, ho hokahanya le magato a ka hare feela le lula a patiloe ho tloha mahlakoreng a mabeli a PCB.

2. Lifofu le tse patoang ka tsela efe li ama PCB Manufacturing Costs?

Li-vias tse foufetseng le tse patiloeng ka kakaretso li eketsa litšenyehelo tsa tlhahiso ka lebaka la mehato e eketsehileng ea ts'ebetso, joalo ka lipotoloho tse ngata tsa lamination le ho cheka ho nepahetseng. Leha ho le joalo, melemo ea ho ntlafatsa sebaka le ts'ebetso hangata e lokafatsa litšenyehelo tse phahameng bakeng sa li-PCB tse rarahaneng le tse phahameng haholo.

3. Ke Mathata afe a Amanang le Mekhoa ea ho Etsa Lifofu le Tse Patoang?

Liphephetso li kenyelletsa ho boloka tolamiso e nepahetseng nakong ea ho cheka le ho lamination, ho laola botenya ba koporo ka nepo, le ho laola li-vias tse tletseng resin ho thibela liphoso. Lisebelisoa tse tsoetseng pele le ho latela ka tieo lintlha tsa CAM li bohlokoa ho hlola mathata ana.

4. Joang ho Foufala le Patoa Vias Ntlafatsa PCB tšepahala?

Ka ho fokotsa bolelele ba likhokahano tsa motlakase le ho fokotsa palo ea likoti, tse foufetseng le tse patoang ka tsela e fokolang ea motlakase le ho ntlafatsa botšepehi ba pontšo. Sena se lebisa ts'ebetsong e ts'eptjoang haholoanyane, haholo-holo lits'ebetsong tse potlakileng le tse phahameng haholo.

5. Ke liindasteri life tse ruang molemo haholo ho tsoa ho lifofu le ho patoa ka li-PCB?

Liindasteri tse kang likhokahano tsa mehala, lisebelisoa tsa elektroniki tsa bareki, sebaka sa sefofane, likoloi le lisebelisoa tsa bongaka li rua molemo haholo. Makala ana a hloka li-PCB tse phahameng haholo, tse kopaneng, le tse tšepahalang ho ts'ehetsa ts'ebetso e tsoetseng pele le maemo a thata a ts'ebetso.