Likoloi tsa HDI PCB bakeng sa ADAS, Radar & Power Control Systems

Selelekela

Sebaka sa elektroniki sa likoloi se fetohile haholo ka tsoelo-pele e potlakileng ea Mekhoa ea Thuso ea Bakhanni e Tsoetseng Pele (ADAS), mahlale a ho khanna a ikemetseng, litsamaiso tsa radar tsa likoloi, le li-module tsa taolo ea motlakase oa motlakase. Litsamaiso tsena tse rarahaneng li hloka bongata bo ikhethang ba matšoao, ts'epo e sa sekisetseng, taolo e sebetsang ea mocheso, le ts'ebeliso e ntle ea sebaka ka har'a meralo ea likoloi e ntseng e eketseha e nyane.

Likoloi tsa HDI PCB li fana ka tharollo ea khokahanyo e phahameng haholo bakeng sa moloko o latelang oa ADAS le litsamaiso tsa radar, ho sebetsana le mathata ana a bohlokoa a moralo. Phetoho ho tloha ho liboto tse tloaelehileng tsa potoloho e hatisitsoeng ho ea thekenoloji ea khokahanyo e phahameng haholo e emela phetoho ea bohlokoa mabapi le kamoo lisebelisoa tsa elektronike tsa likoloi li finyellang litekanyetso tsa ts'ebetso le ho tšepahala tse hlokehang bakeng sa polokeho le ts'ebetso ea likoloi tsa morao-rao.

Hobaneng ha Likoloi tsa HDI PCB Technology li le Bohlokoa

Litlhoko tsa Phetiso ea data ka lebelo le phahameng

Sistimi ea radar ea millimeter-wave e sebetsang ho 77 GHz le 79 GHz, li-array tsa lik'hamera tse ngata, le li-sensor tsa LiDAR li hlahisa melapo e mengata ea data e hlokang ho tsamaisoa ka mats'oao a hlakileng ka tahlehelo e nyane. Theknoloji ea koloi ea HDI PCB e nolofalletsa phetisetso ena ka li-microvias tse entsoeng ka laser tse hlahisang litsela tse khuts'oane tsa lipontšo, ho fokotsa ho khaotsa ho thibela ho thibela le ho boloka botšepehi ba matšoao. Meaho ea microvia e pakiloeng e fokotsa bolelele ba li-stub mme e fana ka litsela tse laoloang tsa impedance tsa bohlokoa bakeng sa likarolo tsa ts'ebetso ea lik'hamera tsa radar le tse phahameng haholo.

Ntlafatso ea Sebaka ho Li-Module tsa Koloi

Diyuniti tsa taolo ya elektroniki tsa dikoloi tsa sejwalejwale (ECUs) le di-sensor modules di tlameha ho fana ka tshebetso e ntseng e hola ka hara mehato e fokotsehang ya mmele. Theknoloji ya HDI PCB e fihlella keketseho ya bongata ba dikarolo ka ho lamination e latellanang, ho foufala le ho patwa ka meaho, le bokgoni ba ho tsamaisa mela e menyenyane ho fihlela ho di-micrometer tse 75. Miniaturization ena e dumella baqapi ba dikoloi ho kopanya matla a mangata a ho sebetsana, memori le di-sensor ka hara di-housing tsa seipone, di-module tsa pilara le di-deshboard.

Ho tšepahala Libakeng tse thata tsa Likoloi

Lisebelisoa tsa elektroniki tsa likoloi li mamella ho palama baesekele ho tloha -40 ° C ho isa +125 ° C, ho thothomela ho tsoelang pele, ho pepeseha ha mongobo, le tšitiso ea motlakase e fetang hole litekanyetso tsa lisebelisoa tsa elektroniki tsa bareki. Meralo ea likoloi tsa HDI PCB e kenyelletsa lisebelisoa tse tsoetseng pele tsa dielectric tse nang le botsitso bo phahameng ba mocheso, li-coefficient tse lekanang tsa thepa ea katoloso ea mocheso, le li-microvias tse entsoeng ka laser tse nang le plating e ntlafalitsoeng ea koporo e mamellang linako tse likete tsa mocheso.

Maikutlo a Moqapi oa Likoloi oa HDI PCB

Khetho ea Lintho bakeng sa Maemo a Feteletseng

Lisebelisoa tsa substrate tse sebelisoang ha ho etsoa likoloi tsa HDI PCB li tlameha ho finyella litekanyetso tse thata tsa ho fumana likoloi ha li ntse li boloka ts'ebetso ea motlakase maemong a feteletseng a ts'ebetso. Litlhoko tsa thepa li kenyelletsa:

• Mocheso o phahameng oa phetoho ea khalase - Litekanyetso tsa Tg tse ka holimo ho 170 ° C li netefatsa botsitso ba tekanyo nakong ea kopano le ts'ebetso.
• Ho monya mongobo o tlase - E fokotsa ho fetoha ha dielectric khafetsa le likotsi tsa delamination libakeng tse mongobo.
• Thermal botsitso – Lisebelisoa tse kang FR-4 e sebetsang hantle, li-laminate tse khethehileng tsa laminate tse nang le tahlehelo e tlase, le letoto la MEGTRON li boloka thepa ho pholletsa le maemo a mocheso oa likoloi.

Lisebelisoa tsena li ts'ehetsa ho ikamahanya le maemo a ts'eptjoang a AEC-Q200 le litlhoko tsa boleng tsa IATF16949 tsa bohlokoa bakeng sa ho kopanya ketane ea phepelo ea likoloi.

Microvia Architecture le Tšepahala

Sebopeho sa microvia se hlalosa siling e ts'epahalang bakeng sa likopano tsa likoloi tsa HDI PCB. Khetho ea sebopeho lipakeng tsa 1+n+1 le 2+n+2 e ipapisitse le ho tenyetseha ha litsela le litlhoko tsa ho tšepahala. Li-microvias tse tletseng koporo tse nang le mahlakore a motlakase a motlakase li fana ka matla a phahameng a mochine ha a bapisoa le mekhoa e meng e tletseng resin, haholo-holo bakeng sa marang-rang a kabo ea matla ho balaoli ba likoloi tsa motlakase.

Ho fihlella botenya bo lekanang ba koporo le coefficient e tsamaellanang ea katoloso ea mocheso lipakeng tsa mekhahlelo ho hloka taolo e nepahetseng ea ts'ebetso nakong ea lipotoloho tse latellanang tsa lamination . Litekanyetso tsa ho phunya le k'hemistri ea desmear li susumetsa ka kotloloho nako e telele ka ts'epo tlas'a maemo a potoloho ea mocheso.

Mekhoa ea Tsamaiso ea Mocheso

Litaolo tsa motlakase tsa motlakase le lits'ebetso tsa taolo ea betri li tlameha ho theola mocheso o moholo ha li ntse li boloka phepelo ea motlakase e tsitsitseng. Kabo ea boima ba koporo ho pholletsa le matla le matla a fatše, e kopantsoeng le mocheso ka lihlopha tse ka tlas'a li-semiconductors tse matla a phahameng, li theha litsela tse sebetsang hantle tsa ho fetisa mocheso. Mefuta e fapaneng ea Metal-core HDI PCB e kopanya likaroloana tsa aluminium tse nang le likarolo tsa HDI bakeng sa lits'ebetso tse hlokang sehokelo sa mocheso o tobileng o nang le lisebelisoa tsa ho pholisa.

Pontšo ea Letšoao le Taolo ea EMI

Lipara tse fapaneng tsa lebelo le phahameng tse jereng data ea SerDes, Ethernet ea likoloi, kapa matšoao a radar li hloka tlhokomelo e hlokolosi ea ho ts'oara geometry le tsoelo-pele ea sefofane. Likarolo tsa lifofane tse ka tlase tse lutseng haufi le likarolo tsa matšoao li fana ka tšireletso ea motlakase e fokotsang phapano lipakeng tsa likepe tsa sensor ea analog le li-circuits tse lerata tsa ts'ebetso ea dijithale. Lisebelisoa tse tlase tsa dielectric li fokotsa tieho ea phatlalatso ea matšoao le ho boloka mamello e tiileng ea ho thibela phetiso ea data ea li-gigabit tse ngata.

Likopo tsa likoloi tsa HDI PCB

ADAS le Autonomous Driving Systems

Liboto tsa taolo ea likhamera tse shebileng ka pele le likarolo tsa ts'ebetso ea mats'oao a radar li emela lits'ebetso tse batloang haholo tsa likoloi tsa HDI PCB. Li-module tsena li kopanya li-sensor tsa setšoantšo, li-processor tsa FPGA kapa ASIC, tsamaiso ea matla, le mekhoa e mengata ea puisano ho li-substrates tsa compact HDI. Bofofu ka theknoloji e thusa ho beoa ha likarolo mahlakoreng ka bobeli ha ho ntse ho bolokoa ponts'o ea matšoao, ho ts'ehetsa miniaturization e hlokahalang bakeng sa ho kopanngoa le matlo a liipone, likopano tsa grille le li-sensor pods tse marulelong.

Koetliso ea Motlakase le Tsamaiso ea Battery

Li-inverter tsa likoloi tsa motlakase, balaoli ba lienjene, le litsamaiso tsa taolo ea libeteri li sebelisa meralo ea li-PCB tsa HDI tsa likoloi ho sebetsana le kabo e phahameng ea matla a motlakase hammoho le lipotoloho tse hlokolosi tsa motlakase le tsa mocheso. Kaho ea HDI ea mekhahlelo e mengata e lumella karohano ea lipotoloho tsa ho fetola matla a phahameng ho tloha liteisheneng tsa tekanyo ea analog ea lerata le tlase ka kabelo ea lera la maano. Balaoli ba taolo ea libeteri ba rua molemo haholo ho tsoa ho bongata ba routing ea HDI, e nolofalletsang likhokahano tse tobileng ho makholo a libaka tsa tlhokomelo ea lisele ha ba ntse ba boloka karohano e hlokahalang.

Khokahano le Infotainment Modules

Balaoli ba ponts'o e bohareng, li-module tsa telematics, le li-hubs tsa khokahanyo tse se nang mohala li hloka theknoloji ea koloi ea HDI PCB ho ts'ehetsa li-interface tsa video tse nang le liqeto tse phahameng le lihlopha tse ngata tsa maqhubu a seea-le-moea ka har'a libaka tse kentsoeng ka dashboard. Lisebelisoa tsena li eketsa bokhoni ba ho phahamisa likarolo tse matla tse nolofalitsoeng ke li-microvias, tse lumellang likhokahano tse tobileng ho li-processor tse tsoetseng pele tse nang le liphutheloana tsa bolo-grid-array ho 0.4mm pitch kapa ho feta.

Maemo a Tlhahiso le Boleng ba Likoloi tsa HDI PCB

Mathata a Tlhahiso

Tlhahiso ea likopano tsa likoloi tsa HDI PCB e hloka bokhoni bo khethehileng ho feta mokhoa o tloaelehileng oa masela a mangata. Mekhahlelo e mengata ea khatiso e nang le ngoliso e tsamaellanang, laser e laoloang ka botebo ka sebopeho, le ho beha koporo e ts'oanang ho pholletsa le mefuta e fapaneng ea liphephetso tsa tlhahiso ea maemo. Litlhoko tsa bohlokoa tsa tlhahiso li kenyelletsa:

• Sequential lamination ho nepahala - Lipotoloho tse ngata tsa lamination tse nang le mamello ea ngoliso e ka tlase ho li-micrometer tse 75 li boloka ka ho tsamaisana.
• Laser ho cheka taolo - Taolo e tebileng ka har'a ± 10 micrometer e netefatsa sebopeho se tsitsitseng sa microvia ntle le tšenyo ea substrate.
• Copper plating ho ts'oana - Ho fumana botenya bo ts'oanang ho pholletsa le sekhahla se phahameng ka masimo ho thibela ho hloleha ho ts'epahala.

Netefatso ea Boleng le Teko

Litlhaloso tsa likoloi li hloka liprothokholo tse felletseng tsa tlhahlobo ho netefatsa boleng ba tlhahiso le ho bolela esale pele ho ts'epahala ha nako e telele. Automated Optical Inspection (AOI) e netefatsa boleng ba sebopeho sa microvia mme e hapa lintlha tsa boholo bakeng sa taolo ea ts'ebetso. Teko ea li-flying probe e netefatsa ho tsoela pele ha motlakase ho pholletsa le litsela tse rarahaneng ntle le liteko tse inehetseng. Tlhahlobo ea X-ray e hlahloba ka hare ka sebopeho le boleng ba ho tlatsa koporo bo sa bonahaleng ka ho hlahloba holimo.

Ho potlakisa ho netefatsoa ha libaesekele tse futhumatsang ho tsamaisa likopano tsa HDI PCB ho mocheso o feteletseng o fetang litlhoko tsa ts'ebetso, hangata lipotoloho tse 1000 ho tloha -40 ° C ho ea + 125 ° C, ho bolela ho tšepahala ha nako e telele. Sistimi ea taolo ea boleng e netefalitsoeng ho IATF16949 e fana ka moralo oa ts'ebetso ea tlhahiso le taolo ea ts'ebetso e hlokoang ke li-OEM tsa makoloi le barekisi ba sehlopha se le seng.

fihlela qeto e

Theknoloji ea likoloi tsa HDI PCB e se e le ea bohlokoa haholo bakeng sa ho kopana le maemo, ts'epahalo le litlhoko tsa ts'ebetso ea lisebelisoa tsa elektroniki tsa likoloi tsa sejoale-joale. Motsoako oa litsela tse ntle, meaho ea microvia e pakiloeng, le lisebelisoa tse tsoetseng pele tsa substrate li thusa baqapi ba likoloi ho fihlela maemo a ts'ebetso a sa khoneheng ka theknoloji e tloaelehileng ea PCB ha ba ntse ba boloka matla a hlokahalang bakeng sa ts'ebetso ea mashome a lilemo tlasa maemo a thata a tikoloho.

Highleap Electronics e fana ka litharollo tse felletseng tsa likoloi tsa HDI PCB tse nang le bokhoni bo netefalitsoeng:

• Tlhahiso e netefalitsoeng ea IATF16949 - Ho lumellana ka botlalo le litsamaiso tsa tsamaiso ea boleng ba likoloi le litlhoko tsa ho latelloa.
• Theknoloji e tsoetseng pele ea HDI - Bokhoni ba tatellano ea lamination bo tšehetsang 1+n+1 le 2+n+2 meaho ea microvia ka mokhoa o nepahetseng oa ho phunya laser.
• Netefatso ea botšepehi - Teko ea libaesekele tse futhumatsang, tlhahlobo ea microsection, le tlhahlobo e potlakileng ea bophelo ho litekanyetso tsa likoloi.
• Tšehetso ea moralo - Tšebelisano ea boenjiniere ho ntlafatsa Li-stack-ups tsa HDI bakeng sa tlhahiso ha e ntse e kopana le litlhoko tse thata tsa ts'ebetso ea likoloi.

Sebelisana le Highleap Electronics bakeng sa merero ea hau ea likoloi tsa HDI PCB 'me u rue molemo ho tsebo ea rona ho ADAS, litsamaiso tsa radar, li-module tsa taolo ea matla le lits'ebetso tsa taolo ea betri. Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka litlhoko tsa hau tsa likoloi tsa PCB le ho netefatsa katleho ea pele karolong ena e boima ea 'maraka.