Ceramic Circuit Board Manufacturing: Tataiso e Feletseng

Tlhahiso ea boto ea potoloho ea letsopa ke ts'ebetso ea bohlokoa lefapheng la lisebelisoa tsa elektroniki tsa sejoale-joale, e nolofalletsang ho thehoa ha liboto tsa potoloho tse hatisitsoeng (li-PCB) tse ipabolang ts'ebetsong ea mocheso, ho thibela motlakase le ho tšoarella tikolohong. Li-PCB tsa letsopa li ntse li hlokahala haholo liindastering tse fapaneng, ho kenyeletsoa lifofane, lisebelisoa tsa bongaka , mabone a LED le matla a tsosolositsoeng, ka lebaka la thepa ea tsona e ikhethang. Tataiso ena e hlahloba mathata a tlhahiso ea boto ea potoloho ea letsopa, ho hlahloba thepa, lits'ebetso tsa tlhahiso, mefuta, lits'ebetso le bokhoni bo tsoetseng pele bo fanoang ke bahlahisi ba etellang pele joalo ka Highleap Electronic.

Ceramic Circuit Board ke eng?

Boto ea potoloho ea ceramic ke mofuta oa PCB e hahiloeng ka thepa e thehiloeng ka ceramic e kang alumina (Al₂O₃), aluminium nitride (AlN), silicon carbide (SiC), silicon nitride (Si₃N₄), kapa beryllium oxide (BeO). Ho fapana le li-PCB tsa setso tse sebelisang li-substrates tse thehiloeng ho polymer joalo ka FR4, li-PCB tsa ceramic li phahamisa boleng bo holimo ba mocheso le thepa ea ho kenya motlakase ea lirafshoa. Sena se li etsa hore li tšoanelehe bakeng sa lits'ebetso tsa matla a holimo le libaka tse hlokang ts'ebetso e matla le ho ts'epahala.

Li-PCB tsa Ceramic li tsebahala ka coefficient ea tsona e tlase ea ho atolosa mocheso (CTE), e leng se tiisang hore mapolanka a boloka botšepehi ba bona ba sebopeho le tlas'a liphetoho tse kholo tsa mocheso. Botsitso bona bo bohlokoa bakeng sa lits'ebetso tse hlokang ho ts'epahala ha nako e telele le ho hanyetsa khatello ea mocheso.

Lintlha tsa Bohlokoa tsa Maboto a Potoloho ea Ceramic

1. Superior Thermal Conductivity

Lisebelisoa tsa ceramic tse kang aluminium nitride le alumina li fana ka conductivity e ikhethang ea mocheso, e leng ho nolofalletsang ho ntša mocheso o sebetsang hantle ho tsoa likarolong tsa elektroniki. Thepa ena e bohlokoa bakeng sa lits'ebetso tsa matla a phahameng joalo ka mabone a LED, lisebelisoa tsa elektroniki tsa motlakase le lisebelisoa tsa indasteri, moo taolo e sebetsang ea mocheso e thibelang ho futhumala ho feteletseng le ho ntlafatsa bophelo bo bolelele ba karolo.

2. Motlakase o Molemohali oa Insulation

Li-PCB tsa Ceramic li fana ka insulation e ikhethang ea motlakase, e netefatsang karohano e tšepahalang lipakeng tsa mesaletsa ea conductive le likarolo. Sena se bohlokoa bakeng sa ho boloka botšepehi ba matšoao lipotolohong tse phahameng haholo le ho thibela lipotoloho tse khutšoane lits'ebetsong tse nang le matla a phahameng, ho etsa li-PCB tsa ceramic tse loketseng lits'ebetso tsa radar, litora tsa matšoao le puisano ea sebaka.

3. Ho hanyetsa Litikoloho tse thata

Liboto tsa potoloho ea Ceramic li hanyetsana haholo le mongobo, lik'hemik'hale le mocheso o feteletseng, e leng se etsang hore e be tse loketseng ho sebelisoa litsing tsa sefofane, lisebelisoa tsa ka ntle le indasteri ea ho lokisa lik'hemik'hale. Ho tšoarella ha bona ho netefatsa ts'ebetso e tšepahalang maemong a phephetsang moo li-PCB tsa setso li ka theolang kapa tsa hloleha.

4. Botsitso ba Mechini

CTE e tlaase ea li-PCB tsa ceramic e tiisa hore li boloka thepa ea tsona ea mechine le ea motlakase esita le tlas'a liphetoho tse feteletseng tsa mocheso. Sena se etsa hore li tšoanelehe bakeng sa lits'ebetso moo li-PCB tsa setso li ka khopameng kapa tsa lahleheloa ke bots'epehi, joalo ka lisebelisoa tsa motlakase tsa motlakase le lisebelisoa tsa likoloi.

Mokhoa oa Tlhahiso ea Boto ea Potoloho ea Ceramic

Ho etsoa ha li-PCB tsa ceramic ho kenyelletsa mehato e 'maloa e ikhethileng ea ho phahamisa thepa e ikhethang ea thepa ea ceramic. Mona ke tlhahlobo e tebileng ea ts'ebetso:

Mohato oa 1: Ho lokisoa ha Ceramic Substrate

Tlhahiso ea Ceramic PCB e qala ka ho lokisoa ha substrate ea ceramic. Lisebelisoa tse tloaelehileng tsa ceramic tse sebelisoang li kenyelletsa alumina (Al₂O₃), aluminium nitride (AlN), silicon carbide (SiC), silicon nitride (Si₃N₄), le beryllium oxide (BeO). Lisebelisoa tsena li siloa hore e be phofo e ntle 'me e kopantsoe le li-binders le li-additives tse ling ho etsa slurry. The slurry e ntan'o bōptjoa hore e be sebopeho se lakatsehang 'me se tšeloa ka mocheso o phahameng ho etsa sebaka se tiileng, se teteaneng sa ceramic substrate.

Mohato oa 2: Ho Sebelisa Mekhahlelo ea Koporo

Hang ha substrate ea ceramic e se e lokisitsoe, likarolo tsa koporo li sebelisoa ho ea holimo le ka tlaase. Sena se ka finyelloa ka mekhoa e fapaneng e kang sputtering, plating, sintering kapa brazing. Khetho ea mokhoa o itšetlehile ka litlhoko tse khethehileng tsa PCB, ho kenyelletsa le conductivity ea mocheso le ts'ebetso ea motlakase.

• Koporo e Otlolohileng ea Plating (DPC): Mokhoa ona o tsoetseng pele o kenyelletsa ho hloekisa substrate ea ceramic, ho fafatsa filimi e tšesaane ea koporo, ebe ka electroplating ho eketsa botenya ba koporo. Ts'ebetso e netefatsa tlamahano e matla le ts'epo e phahameng ntle le ho sekisetsa thepa ea ceramic.

Mohato oa 3: PCB Fabrication

Ha likarolo tsa koporo li le teng, mekhoa e tloaelehileng ea ho etsa PCB e lateloa:

• Ho cheka: Mechini e nepahetseng ea CNC e phunya li-vias le masoba bakeng sa ho beha likarolo.
• Paterone: Ho sebelisoa lesela la photoresist, le pepeselitsoe leseli la UV ka photomask, 'me le ntlafatsoa ho theha mokhoa oa potoloho.
• Etching: Koporo e feteletseng e koetsoe, e siea mesaletsa e entsoeng.
• Ho kopanya: Mehaho e meng ea tšepe e ka behoa bakeng sa ho ntlafatsa conductivity le ho tšoarella.
• Lamination: Ho ipapisitse le ts'ebetso e ikhethileng ea tlhahiso, li-substrates li ka beoa laminated ka mekhoa e tloaelehileng kapa ea sintering.

Mohato oa 4: Taolo ea Boleng le Teko

PCB ea ho qetela ea ceramic e ba le taolo e matla ea boleng ho netefatsa hore e kopana le litekanyetso tsohle tsa ts'ebetso le ts'epahalo. Sena se kenyelletsa tlhahlobo ea conductivity ea mocheso, ho kenya motlakase, botsitso ba mochini, le ho hanyetsa maemo a tikoloho.

Mefuta ea Mapolanka a Potoloho ea Ceramic

Li-PCB tsa Ceramic li ka aroloa ho latela sebopeho sa tsona sa thepa le lits'ebetso tsa tlhahiso. Ho utloisisa mefuta ena ho thusa ho khetha PCB e loketseng bakeng sa lits'ebetso tse itseng.

1. E Thehiloe ho Sebopeho sa Lintho

• Alumina Ceramic PCBs (Al₂O₃ PCBs): E theko e tlaase ebile e sebelisoa haholo bakeng sa lits'ebetso tse akaretsang tse nang le thepa e ntle ea mocheso le motlakase.
• Aluminium Nitride PCBs (AlN): E fana ka conductivity e phahameng ea mocheso, e loketseng lisebelisoa tse matla le tse sebetsang hantle.
• Li-PCB tsa Silicon Carbide (SiC): Fana ka matla a matla a mochini le ho hanyetsa mocheso oa mocheso, o loketseng maemo a feteletseng.
• Silicon Nitride PCBs (Si₃N₄): E tsebahala ka matla a phahameng a mochine le botsitso ba mocheso.
• Beryllium Oxide PCBs (BeO): Ts'ebetso e ikhethang ea mocheso empa e sa tloaelehe ka lebaka la matšoenyeho a chefo.
• Li-PCB tsa Hybrid Ceramic: Kopanya lisebelisoa tse fapaneng tsa ceramic ho fihlela ts'ebetso e ntlafalitsoeng bakeng sa lits'ebetso tse ikhethang.

2. E Thehiloe ho Mekhoa ea Tlhahiso

• Li-PCB tsa Ceramic tsa Thick-Film: Sebelisa theknoloji e matla ea ho hanyetsa lifilimi, e lumellang li-resistors tse kentsoeng le li-capacitor. E loketse lits'ebetso tsa matla a phahameng le meralo ea compact circuit.
• Thin-Film Ceramic PCBs: Sebelisa mekhoa ea ho kenya vacuum ho sebelisa likarolo tse tšesaane tsa tšepe, ho fana ka ho nepahala ho phahameng bakeng sa lits'ebetso tse tsoetseng pele.
• Li-PCB tsa Direct Plating Copper (DPC): E fana ka koporo e kentsoeng ka kotloloho holim'a li-substrates tsa ceramic, e fanang ka ts'ebetso e potlakileng le ts'epo e phahameng ntle le mefuta ea ceramic kapa meeli ea botenya.
• Li-PCB tsa Ceramic Co-Fired (LTCC) tsa Low-Temperature Co-Fired: E entsoe ka mocheso o ka tlase ho 900 ° C, e lumellang hore ho be le meralo e mengata ea lihlopha le ho kopanngoa ha likaroloana tse sa sebetseng.
• Li-PCB tsa High-Temperature Co-Fired Ceramic (HTCC): Li chesoa ka mocheso o ka holimo ho 1600 ° C bakeng sa thepa e matlafalitsoeng ea mocheso le mechine, e loketseng lisebelisoa tsa indasteri le tsa sefofane.
• Li-PCB tsa Direct Copper-Bonded Ceramic (DCB): Kenyelletsa koporo ea tlamahano ka kotloloho ho substrate ea ceramic e nang le mamati a matla le conductivity e phahameng ea mocheso.
• Li-PCB tsa Laser Activation Metallization (LAM): Sebelisa theknoloji ea laser ho etsa tšepe ea li-ceramic substrates, ho fana ka mekhoa ea potoloho e nepahetseng le e tšepahalang.

Mekhoa e tsoetseng pele ea tlhahiso

Tloaelehileng Lamination vs. Sintering Lamination

Lisebelisoa tsa Ceramic PCB li sebelisa mekhoa e 'meli ea mantlha ea lamination, e' ngoe le e 'ngoe e na le melemo le lits'ebetso tse ikhethang:

• Ho qhibilihisa ka mokhoa o tloaelehileng: Ho kenyelletsa ho qhibilihisa ka mokhoa o kopanyang mekhahlelo e 'meli ea ceramic substrate ho sebelisoa lera la dielectric (hangata e leng phenolic, epoxy resin, kapa thepa e khethehileng ea ho qhibilihisa ka mokhoa o futhumatsang) tlas'a maemo a mocheso o phahameng le a khatello e phahameng. Mokhoa ona o theko e tlase empa o fokotsa ho qhibilihisa ka mokhoa o akaretsang oa mocheso le matla a ho qhibilihisa ka mokhoa o kopanyang ha o bapisoa le ho qhibilihisa ka mokhoa o qhibilihisang.

• Sintering Lamination: E kenyelletsa ho futhumatsa le ho hatella dikarolo tsa ceramic mochesong o phahameng, e leng se bakang ho falla ha limolek'hule le ho theha li-ceramic tse teteaneng tsa polycrystalline tse nang le bongata bo fetang 98%. Mokhoa ona o ntlafatsa haholo conductivity ea mocheso le matla a ho kopanya, o etsa hore e be e loketseng lits'ebetso tse phahameng moo ho tšepahala le katleho li leng tsa bohlokoa.

Koporo e otlolohileng ea Plating (DPC) bakeng sa Tlhahiso ea Ceramic PCB

DPC ke thekenoloji e tsoetseng pele ea ts'ebetso ea potoloho ea ceramic e hlahang tlhahisong ea PCB ea lifilimi tse tšesaane. Ts'ebetso ea DPC e kenyelletsa:

1. Kalafo ea Pele: Ho hloekisa substrate ea ceramic ho tlosa litšila.
2. Sputtering: Vacuum ea ho roala ho tlama karolo ea koporo ho karoloana ea ceramic.
3. Sesebelisoa sa Photoresist: Ho roala ka photoresist le ho pepesehela leseli le mosehla bakeng sa ho etsa mohlala.
4. Etching le Ntlafatso: Ho tlosa koporo e feteletseng ho theha moralo oa potoloho.
5. Electroplating: Ho eketsa botenya ba koporo ka electroplating kapa electroless plating.
6. Qetello: Ho tlosa photoresist ho tlatsa potoloho ea metalized.

Ha ho bapisoa le lits'ebetso tsa lifilimi tse teteaneng le tse tšesaane, DPC e fana ka linako tsa ts'ebetso e potlakileng, ho nepahala ha boemo ba micron, 'me ha ho na meeli ea mofuta oa ceramic kapa botenya, e etsa hore e be e loketseng bakeng sa lits'ebetso tsa PCB tse phahameng haholo le tse nepahetseng haholo.

Ceramic PCB Depaneling

Depaneling ke mokhoa oa ho arola li-PCB tsa ceramic ka bomong ho phanele e kholo. Highleap Electronic e sebelisa mekhoa e 'meli ea mantlha ea ho hlophisa:

• Ho hloekisa laser: E sebelisa laser e nang le matla a holimo ho khaola PCB ntle le ho hlahisa mocheso o feteletseng, ho sireletsa potoloho ho senya mocheso. Nitrogen e sebelisoa ho theola mocheso oa PCB le ho tlosa masala a khabone.
• Diamond Depaneling: E ts'oanang le mekhoa ea V-cut empa e sebelisa lisebelisoa tse koahetsoeng ka taemane ho etsa bonnete ba hore likotoana tse nepahetseng, tse otlolohileng ntle le ho hlahisa mocheso. Mokhoa ona o boloka botšepehi ba thepa ea ceramic mme o qoba carbonization, e lumellang hore ho be le phanele ea li-PCB phanele ea tlhahiso.

Highleap e khothaletsa ho rala li-PCB tsa ceramic ka libopeho tse khutlonnetsepa kapa lisekoere ho etsa hore ho be bonolo ho arola, leha meralo e chitja e boetse e amoheloa ka tšehetso ea boenjiniere ea litsebi ho thibela carbonization.

Ceramic PCB Matla a ho Etsa

Highleap Electronic e fana ka mefuta e fapaneng ea lits'ebeletso tsa tlhahiso ea ceramic PCB, e sebetsanang le litlhoko tse fapaneng tsa projeke:

• Bongata ba Lera la PCB: Li-PCB tse nang le lehlakore le le leng le mahlakore a mabeli.
• Nako ea ho Aha: Ho tloha ho letsatsi le le leng ho isa ho libeke tse 1, ho itšetlehile ka ho rarahana le molumo.
• Lisebelisoa tsa Ceramic PCB Substrate: Alumina (Al₂O₃), Aluminium Nitride (AlN), Silicon Carbide (SiC), Beryllium Oxide (BeO), Silicon Nitride (Si₃N₄), le lisebelisoa tsa lebasetere tsa ceramic.
• Mekhoa ea Tlhahiso: E kenyelletsa DPC, DBC, HTCC, LTCC, filimi e teteaneng, filimi e tšesaane, le li-PCB tsa AMB.
• Boholo ba PCB: 138mm x 190mm.
• Botenya ba Ceramic PCB: E fumaneha ka 0.25mm, 0.38mm, 0.5mm, 0.76mm, 0.8mm, 1mm, 1.5mm, le 2mm.
• Mamello size: ≤±50µm.
• Trace Width/Space: 5-10µm bakeng sa mela e metle, e loketseng lipotoloho tse phahameng haholo.
• Botenya ba Koporo: E tloha ho 2µm ho isa ho 105µm bakeng sa DPC le 150µm ho isa ho 300µm bakeng sa DBC, e amohelang litlhoko tse fapaneng tsa motlakase.
• Ho cheka Laser: Bonyane bophara ba 75µm, bo nolofalletsang ho nepahala ka popo.
• Matla a Lekhapetla la Koporo: Ho feta 2N/mm, ho latela litekanyetso tsa IPC-TM-650 2.4.8.
• Solderability: Ho feta 95% ho latela litekanyetso tsa IPC-TM-650 2.4.14, ho netefatsa hore ho na le li-solder tse tšepahalang.
• Khanyetso ea Thermal: E mamella 350±10°C metsotso e 15 ntle le ho ebola kapa litlamorao tsa popcorn, joalo ka IPC-TM-650 2.4.7.
• Qetellong ea holimo: Likhetho li kenyelletsa OSP, silevera e qoelisoang, khauta e qoelisoang, le nickel-palladium-gold, e fanang ka litlhoko tse fapaneng tsa ho kopanya le ho pola.
• Laser Cut: Botebo ba ho ngola ka laser ≤0.7mm le botenya ba PCB ≤3.0mm bakeng sa ho khaola ho nepahetseng le ho hloekileng.
• Hole Diameter Tolerance: ±0.075mm bakeng sa PTH le ±0.05mm bakeng sa NPTH, ho netefatsa hore e nepahetse ka boholo.
• Bonyane Bophara ba Laser Drill: 75µm, e nolofalletsang meralo ea PCB e hlakileng.

Likopo tsa Ceramic Circuit Boards

Li-PCB tsa Ceramic li sebetsa ka mokhoa o fapaneng 'me li sebelisoa ho pholletsa le liindasteri tse fapaneng tse sebetsang hantle ka lebaka la thepa ea tsona e ikhethang:

• Li-module tsa memori (RAM): Tsamaiso e ntlafalitsoeng ea mocheso e tiisa botsitso le bophelo bo bolelele.
• Liphanele tsa Photovoltaic (PV): Phallo e sebetsang hantle ea mocheso e ts'ehetsa litsamaiso tse matla tsa matla a letsatsi.
• Leseli la LED: Ts'ebetso e sebetsang ea mocheso e eketsa nako ea bophelo le ts'ebetso ea mabone a LED.
• Sepakapaka: Ts'ebetso e tšepahalang lits'ebetsong tsa radar, likhokahano tsa sathelaete, le lisebelisoa tsa elektroniki tsa sefofane.
• Lisebelisoa tsa Bongaka: Li-bio-ceramics li sebelisoa lisebelisoa tsa bongaka tse tsoetseng pele tse hlokang ho nepahala le ho tšoarella nako e telele.
• Metal Industries: Ts'ebetso e matla maemong a mocheso o phahameng le a senyang.
• Puisano: Botšepehi ba mats'oao a maqhubu a holimo bakeng sa litora tsa mats'oao le lits'ebetso tsa puisano tse se nang mohala.

Hobaneng o Khetha Highleap Electronic bakeng sa Tlhahiso ea Boto ea Potoloho ea Ceramic?

1. Phihlelo e Pharalletseng

Ka lilemo tse fetang 16 indastering, Highleap Electronic e tlotlisitse tsebo ea eona ea ho etsa ceramic PCB. Kutloisiso ea rona e tebileng ea lisebelisoa tsa ceramic le mekhoa e tsoetseng pele ea tlhahiso e netefatsa hore re fana ka liboto tsa potoloho tsa boleng bo holimo, tse tšepahalang tse etselitsoeng litlhoko tse fapaneng tsa ts'ebeliso.

2. Maemo a Tsoetseng Pele a Tlhahiso

Re khomarela litekanyetso tse phahameng ka ho fetisisa tsa indasteri, re sebelisa lisebelisoa tsa morao-rao le ho boloka mehato e tiileng ea ho laola boleng. Bokhoni ba rona bo kenyelletsa DPC, DBC, LTCC, HTCC, filimi e teteaneng, filimi e tšesaane, le tlhahiso ea AMB PCB, e re lumellang ho fihlela litlhoko tse thata ka ho fetisisa tsa ts'ebetso le ts'epo.

3. Bokhoni bo Fetohang ba Tlhahiso

Highleap Electronic e ts'ehetsa li-odara tse nyane le tse mahareng, e fana ka tharollo ea tlhahiso e ikhethileng ntle le palo e tlase ea odara (MOQ). Ho feto-fetoha ha maemo hona ho re fa monyetla oa ho hlokomela bareki ba bangata, ho tloha ho batho ba qalang le ba ratang ho itlosa bolutu ho ea ho baetsi ba liindasteri tse kholo.

4. Litheko tsa tlhōlisano

Re fana ka tlhahiso e theko e tlaase ea ceramic PCB ntle le ho sekisetsa boleng. Ka ho ntlafatsa ts'ebeliso ea thepa le ho nolofatsa mekhoa ea tlhahiso, re fana ka litheko tsa tlholisano tse netefatsang boleng ba chelete bakeng sa bareki ba rona.

5. Phepelo e Tšepahalang

Phano e nakong ke motheo oa litšebeletso tsa rona. Re etsa bonnete ba hore li-PCB tsa hau tsa ceramic lia etsoa le ho tlisoa ka nako eo ho lumellanoeng ka eona, e u nolofalletsang ho boloka linako tsa projeke le ho fihlela linako tse behiloeng ntle le tieho.

6. Bokhoni bo Felletseng ba Tlhahiso

Bokhoni ba rona ba tlhahiso bo kenyelletsa mefuta e mengata e fapaneng ea litlhaloso:

• Bongata ba Lera: Li-PCB tse nang le mahlakore a mabeli.
• Nako ea ho Aha: Ho tloha matsatsing a 1 ho isa ho libeke tse 4.
• Lisebelisoa tsa Substrate: AlN, Al₂O₃, SiC, BeO, Si₃N₄, le lirafshoa tse nyalisitsoeng.
• Mekhoa ea Tlhahiso: Ho kenyeletsoa DPC, DBC, HTCC, LTCC, filimi e tenya, filimi e tšesaane, le AMB.
• Boholo le Botenya ba PCB: Ho fihla ho 138mm x 190mm le likhetho tse fapaneng tsa botenya.
• Ho nepahala: Mamello e thata le bophara bo botle ba ho latela mohlala bakeng sa lipotoloho tse phahameng haholo le tse sebetsang hantle.
• Surface Finishes: Likhetho tse ngata ho lumellana le litlhoko tse fapaneng tsa soldering le plating.
• Mekhoa ea ho Hlahisa: Laser le taemane ho itšeha ho netefatsa karohano e hloekileng le e nepahetseng ea PCB.

fihlela qeto e

Ho Highleap Electronic, re ipabola ka ho etsa ceramic PCB, re fana ka mekhoa e tsoetseng pele ea masela, lisebelisoa tsa boleng bo holimo, le bokhoni bo feto-fetohang ba tlhahiso ho fihlela litlhoko tse fapaneng tsa bareki ba rona. Boitlamo ba rona ba bokhabane bo tiisa hore PCB e 'ngoe le e 'ngoe ea ceramic eo re e hlahisang e finyella litekanyetso tse phahameng ka ho fetisisa tsa ts'ebetso le botšepehi.

Hore na o ntshetsa pele di-elektroniki tse matla haholo, disebediswa tse nepahetseng tsa bongaka, kapa ditsamaiso tse matla tsa difofane, Highleap Electronic ke molekane wa hao ya tshepahalang tlhahisong ya boto ya potoloho ya letsopa. Ikopanye le rona kajeno ho fumana hore na boiphihlelo ba rona le dibaka tsa tlhahiso tsa sejoale-joale di ka tshehetsa projeke ya hao e latelang jwang le ho o thusa ho fihlella diphetho tse ikgethang.