Mathata a Kopano ea Ceramic PCB: Ho roka le ho Mounting

Selelekela ho Ceramic PCB Kopano Complexity

Mathata a kopano ea Ceramic PCB a fapana haholo le tlhahiso e tloaelehileng ea boto ea FR4. Li-Ceramic substrates li fana ka conductivity ea mocheso ho fihla ho 230 W/mK ha e bapisoa le FR4's 0.3 W/mK, li-coefficients tsa katoloso ea mocheso o tlase haholo, le ts'epo e ikhethang tlas'a maemo a thata. Mehaho ena e etsa hore liboto tsa ceramic li be bohlokoa ho lisebelisoa tsa elektronike tse matla, lisebelisoa tse khanyang tsa LED, le lisebelisoa tsa sefofane.

Thepa e tšoanang ea thepa e fanang ka melemo ea ts'ebetso e etsa hore ho be le mefuta e fapaneng ea kopano. Ceramic's brittleness, thermal shock sensitivity, le ho se lumellane ha CTE le likarolo tsa tšepe li hloka liprothokholo tse khethehileng tsa ho sebetsana. Ho sebetsana le liphephetso tsa kopano ea ceramic PCB ka nepo ho etsa qeto ea boleng ba sehlahisoa le ts'epahalo ea masimo maemong a boima.

Mathata a Kopano ea Core Ceramic PCB

1. Mathata a Soldering ho Ceramic PCB Manufacturing

Thermal Shock Sensitivity

Lisebelisoa tsa letsopa li bontša kutloelo-bohloko e feteletseng liphetohong tse potlakileng tsa mocheso nakong ea ho kopanya hape. Tšabo ea mocheso e ka baka ho petsoha ha maemo a mocheso a feta meeli ea sebopeho sa substrate. Liphephetso tsena tsa kopano ea PCB ea letsopa li hloka liprofaele tsa mocheso tse laoloang ka sekhahla sa ho phahama butle-butle, hangata li lieha ka 30-50% ho feta lits'ebetso tse tloaelehileng tsa FR4.

Khetho ea Lintho tsa Solder

Ho se lumellane ha CTE lipakeng tsa li-ceramic substrates (5-7 ppm/°C) le likaroloana tsa tšepe ho baka khatello e matla nakong ea lipotoloho. Sena se emela e 'ngoe ea liqholotso tsa bohlokoahali tsa kopano ea PCB ea ceramic mabapi le tšebelisano ea thepa:

• Li-alloys tsa solder tse tlase - Liqapi tse nang le ductility tse ntlafetseng li amohela ho se lumellane ha CTE le ho fokotsa mokhathala o kopanetsoeng tlas'a libaesekele tse futhumetseng.
• Khemistri e khethehileng ea flux - Sistimi e sebetsang ea flux e etselitsoeng metallization ea ceramic e netefatsa ho koloba ka nepo ntle le masala a mabifi a ka hlaselang substrate.
• Litlhahiso tse sa hlokeng letho - SAC305 le li-alloys tse tšoanang li hloka mocheso o phahameng oa 240-260 ° C, ho eketsa likotsi tsa khatello ea mocheso ha li bapisoa le li-solders tsa lefa tsa SnPb.

Reflow Profile Optimization

Tlhōrō ea mocheso oa mocheso le ho leka-lekana ha nako ea bolulo li khetholla boleng ba motsoako oa solder ntle le tšenyo ea substrate. Lithapo tse futhumatsang tsa 1.5-2 ° C motsotsoana li fokotsa ho phatloha ho bakoang ke mocheso oa mocheso, ha ho bapisoa le 3-4 ° C / s e tloaelehileng kopanong ea FR4. Mekhahlelo ea ho pholile e hloka tlhokomelo e lekanang, kaha ho theoha ha mocheso ka potlako ho hlahisa khatello e phahameng ka ho fetisisa ea mochine lits'ebetsong tsa kopano ea ceramic PCB.

2. Mathata a ho Holisa Karolo

Taolo ea Khatello ea Mechini

Ceramic substrate brittleness e etsa hore taolo ea khatello ea kelello e be ea bohlokoa ts'ebetsong ea kopano. Khatello e feteletseng e ntseng e phahama nakong ea ho kenya likaroloana e baka ho robeha hang-hang kapa ho baka mathata a patehileng a bonahalang nakong ea ho palama baesekele. Liphephetso tsena tsa kopano ea ceramic PCB li hloka ho lekanyetsoa ha lisebelisoa tsa ho khetha le ho beha sebaka ka khatello e fokotsehileng ea nozzle, hangata ka 30-50% e tlase ho feta litlhophiso tsa FR4.

Maano a theknoloji ea ho kenya holim'a metsi a hloka khetho e khethehileng ea ntlha ea vacuum le litsamaiso tsa karabelo ea matla. Matla a tloaelehileng a ho beha a loketseng liboto tse tenyetsehang tsa FR4 a senya habonolo thepa e thata ea letsopa. Litaolo tsa khatello tse ikamahanyang le maemo le li-interface tsa ho kenya tse lumellanang li aba matla ka ho lekana ho pholletsa le 'mele ea likarolo, li thibela lintlha tsa khatello tse qalang mapetso.

Mehopolo ea Sebopeho sa Mehato e Phahameng

Sekhahla sa ho beoa ha likarolo ka kotloloho se ama kabo ea gradient ea mocheso le khatello ea maikutlo likopanong tsa ceramic. Liboto tse nang le baahi ba bangata li na le moea o futhumatsang oa lehae o bakang khatello ea maikutlo. Karohano ea leano lipakeng tsa lisebelisoa tsa motlakase le likarolo tse bonolo tsa mocheso li thusa ho fokotsa liphephetso tsena tsa kopano ea PCB ha u ntse u boloka lintlha tse kopaneng.

Meralo ea multilayer ceramic e hlahisa ho rarahana ho eketsehileng ka meaho le litselana tse patiloeng tsa mocheso. Mocheso o nepahetseng ka ho beoa le kabo ea boima ba koporo e ba bohlokoa bakeng sa ho laola phallo ea mocheso. Moralo o sa lekaneng oa mocheso o qobella mocheso ka litsela tse moqotetsane, ho baka khatello ea maikutlo e senyang ts'epo ea nako e telele.

Ho Kopanya Karolo ea Matla

Lisebelisoa tse nang le matla a phahameng li hlahisa likhahla tse feteletseng tsa mocheso oa lehae leha ho na le mocheso o motle oa mocheso oa ceramic. Motsoako oa mocheso o tebileng le ho se lumellane ha CTE ho potlakisa mokhathala o kopaneng oa solder likhokahanong tsena tsa bohlokoa:

• Thermal interface optimization - Khetho e nepahetseng ea TIM le taolo ea botenya ba bondline e netefatsa phetisetso e nepahetseng ea mocheso ho tloha karolong ho ea ho substrate.
• Matlafatso ea mechine - Lisebelisuoa tsa underfill le bonding ba sekhutlo li aba khatello ea maikutlo le ho thibela mokhathala oa libaesekele tsa solder.
• Moqapi oa ho jala mocheso - Lipoleiti tse tšehelitsoeng tsa koporo le lisebelisoa tse futhumatsang li jala mocheso ka thoko, li fokotsa mocheso o phahameng haholo le likhahla tsa mocheso.

Likopo le Phethahatso e Sebetsang

1. LED Manufacturing

Lisebelisoa tsa LED li tobana le potoloho e matla ea mocheso ha mabone a buleha le ho tima khafetsa bophelong bohle ba 'ona ba ts'ebetso. Lipotoloho tsena li baka liphephetso tse matla tsa kopano ea PCB ea ceramic ka katoloso le ho honyela khafetsa ha mocheso. Li-module tsa LED tse matla a mahareng le tse matla a phahameng hangata li sebelisa li-substrate tsa aluminium oxide kapa aluminium nitride ceramic tse nang le tšepe e teteaneng ea koporo bakeng sa ho hasana ha mocheso ho ntlafetseng, empa lera lena la koporo le mpefatsa matšoenyeho a ho se tšoane ha CTE a hlokang moralo o hlokolosi oa manonyeletso a solder.

2. Li-Module tsa Elektronike tsa Matla

Sistimi ea phetolo ea motlakase likoloing tsa motlakase le lits'ebetso tsa matla a tsosolositsoeng li sutumelletsa likopano tsa ceramic ho feteletseng le ho feteletseng. Lisebelisoa tsena li hloka li-substrates tsa ceramic bakeng sa khanyetso e tlase ea mocheso empa li hloka lits'ebetso tse netefalitsoeng tsa kopano ho thibela ho hloleha ha masimo. Litekanyetso tsa thuto ea likoloi li beha litlhoko tsa libaesekele tse futhumetseng ho tloha ho -40 ° C ho ea + 150 ° C bakeng sa lipotoloho tse 1000+, ho etsa hore ho sebetsanoa ka nepo ha liphephetso tsa kopano ea ceramic PCB e be tsa bohlokoa bakeng sa ho fihlela lintlha tsa ts'epo.

3. Sefofane le Mekhoa ea Tšireletso

Lisebelisoa tsa Aerospace li phahamisa li-substrates tsa ceramic bakeng sa botsitso ba maemo ho pholletsa le mefuta e mengata ea mocheso le ts'ebetso libakeng tse feteletseng. Maemo a boleng makaleng ana a hloka litekanyetso tsa bofokoli tse ka tlase ho 100 PPM, e leng se etsang hore ntlafatso le netefatso e se ke ea buisanoa. Mekhoa e tsoetseng pele ea tlhahlobo e kenyelletsang X-ray tomography le scanning acoustic microscopy e lemoha mefokolo e poteletseng ea kopano pele e kopanngoa le lits'ebetso tsa bohlokoa.

Qetello: Ho tseba Seboka sa Ceramic PCB

Kopano e atlehileng ea PCB ea ceramic e hloka kutloisiso e felletseng ea taolo ea mocheso oa mocheso, phokotso e fosahetseng ea CTE, le taolo ea khatello ea maikutlo. Liphephetso tsa mantlha li mabapi le ho fihlela li-solder tse ka tšeptjoang tlas'a likhakanyo tse fokolang tsa mocheso ha li ntse li thibela tšenyo ea substrate nakong ea ho beoa ha likarolo. Ntlafatso ea ts'ebetso e fana ka lihlahisoa tse ntlafalitsoeng le ts'epahalo ea masimo lits'ebetsong moo liboto tse tloaelehileng tsa FR4 li sa khoneng ho fihlela litlhoko tsa ts'ebetso.

Ho tsetela disebedisweng tse ikgethang, diresepe tsa tshebetso tse netefaditsweng, le ditsamaiso tse thata tsa taolo ya boleng di arola mesebetsi e atlehileng ya kopano ya letsopa ho ba nang le sekgahla se hodimo sa diphoso. Ha ditshebediso di ntse di tswela pele ho hloka matla a mangata le tshebetso e feteletseng ya tikoloho, ho tseba diphephetso tsa kopano ya PCB ya letsopa ho ba bohlokwa haholo bakeng sa monyetla wa tlholisano tlhahisong e tswetseng pele ya elektroniki.

Matla a Kopano ea Highleap Electronics Ceramic PCB

Highleap Electronics e fana ka litharollo tse netefalitsoeng tsa kopano ea PCB ea ceramic e ntlafalitsoeng bakeng sa lits'ebetso tse ts'epahalang haholo ho pholletsa le LED, lisebelisoa tsa elektroniki tsa motlakase le likarolo tsa sefofane:

• Tsebo ea ts'ebetso - Lintlha tse netefalitsoeng tsa reflow le liparamente tsa ho beoa tse etselitsoeng aluminium oxide le aluminium nitride ceramic substrates.
• Lisebelisoa tse tsoetseng pele - Sistimi e laoloang ka matla ea ho khetha le ho beha sebaka, profiling e nepahetseng ea mocheso, le tlhahlobo ea othomathike ea mahlo e lekantsoeng bakeng sa litlhoko tsa kopano ea ceramic.
• Netefaletso ea boleng - Tlhahlobo ea X-ray, tlhahlobo ea likarolo tse fapaneng, le netefatso ea libaesekele tse futhumatsang li etsa bonnete ba hore liphephetso tsa kopano ea ceramic PCB li rarolloa hantle pele ho tlisoa.

Ikopanye le Highleap Electronics ho buisana ka hore na bokhoni ba rona ba ho kopanya PCB ba ceramic bo ka tšehetsang litlhoko tsa projeke ea hau e latelang ea mocheso le ts'epo.