Ts'ebetso ea Tlhahiso ea PCB ea Copper Coin: Ho Tloha ho cheka ho ea ho Chelete ea Chelete

Selelekela: Ke Hobane'ng ha Copper Coin PCB Manufacturing e Hloka Ho nepahala

Dimojule tsa semiconductor tse matla a hodimo di hloka ditsela tse sebetsang hantle tsa ho qhala ha mocheso ho boloka botsitso ba tshebetso le ho thibela ho hloleha ha sesebediswa. Tlhahiso ya PCB ya tjhelete ya koporo e sebetsana le tlhoko ena ka ho kopanya di-insert tse teteaneng tsa koporo ka ho toba ka hara substrate, ho theha ditsela tse kgolo tsa mocheso tse sebetsang sebakeng seo tse fetang di-via tsa mocheso tsa setso. Theknoloji ena e fihlella dintlafatso tsa ho tsamaisa mocheso tse fetang 390 W/mK ha di bapiswa le thepa e tloaelehileng ya PCB, ka boleng bo tlwaelehileng ba ho hanyetsa mocheso bo ka tlase ho 0.5°C/W bakeng sa ditshebediso tsa semiconductor ya motlakase.

Ts'ebetso ea tlhahiso e hloka ho nepahala ho ikhethang mohatong o mong le o mong, ho tloha ho sebopeho sa pele sa mokoti ho isa ho ho kengoa ha ho qetela. Mohato o mong le o mong o ama ka ho toba ts'ebetso ea mocheso le ho tšepahala ha nako e telele. Sengoliloeng sena se hlahloba mekhahlelo ea bohlokoa ea tlhahiso e fetolang li-substrates tse tloaelehileng hore e be litharollo tse sebetsang hantle tsa taolo ea mocheso.

Tlhaloso ea Ts'ebetso: Tšebeliso ea Phallo ea Mosebetsi oa Copper Coin PCB Manufacturing Workflow

Ts'ebetso ea ts'ebetso ea koporo ea PCB e latela mehato e ts'eletseng e kopaneng e khethollang ts'ebetso ea ho qetela ea mocheso:

1. Cavity moralo le ho phunya - Ho sebetsa ka mokhoa o nepahetseng ho theha jiometry ea motheo e nang le mamello e lekaneng ka hare ho ± 20 μm bakeng sa ho lekana hantle ha chelete ea tšepe.
2. Ho sebetsa ka tšepe ea koporo le ho lokisa holim'a metsi - Ho itokisa lintho tse bonahalang ho tiisa hore ho na le kamano e ntle ea mocheso le mekhoa ea ho khomarela mechine libakeng tse mahlonoko.
3. Ho kopanya le ho hokahanya - Sebaka se nepahetseng se boloka botšepehi ba tsela ea mocheso le ho thibela ho falla ha lateral nakong ea ts'ebetso e latelang.
4. Ho tlatsa resin le lamination - Tlamahano e laoloang e laola ho se lumellane ha katoloso ea mocheso ha e ntse e tlosa li-voids tse behang kotsing ea ho tsamaisa mocheso.
5. Ho pharalla ha bokaholimo le ho etsa moralo - Topology e ts'oanang e etsa hore ho be le sebopeho se tsitsitseng sa potoloho libakeng tsohle tsa lichelete tsa tšepe.
6. Ho tšepahala ha mocheso le ho hlahloba - Teko e felletseng e netefatsa liparamente tsa ts'ebetso le bots'epehi ba sebopeho pele e romelloa.

Taolo ea tšebetso methating ena e etsa qeto ea hore na sehlahisoa se felileng se kopana le lintlha tse hlokahalang tsa mocheso le mochini bakeng sa lisebelisoa tsa motlakase tsa motlakase.

Ho phunya Cavity ka Copper Coin PCB Manufacturing

Mekhoa e nepahetseng ea ho sebetsa

Ho thehoa ha Cavity ho theha motheo oa geometri bakeng sa ts'ebetso ea mocheso ho etsoa ha PCB ea tšepe ea koporo. CNC routing le laser machining li finyella mamello ka hare ho ± 20 μm, ho netefatsa hore ho na le ho lekana hantle pakeng tsa cavity le koporo. Ho kheloha ha tekanyo ho feta moeli ona ho baka likheo tse sitisang ho kopana ha mocheso le ho hlahisa li-resin voids nakong ea ho lamination.

Laser ablation e fana ka tlhaloso e phahameng ka ho fetesisa bakeng sa lijeometri tse rarahaneng empa e hloka ts'ebetso e hlokolosi ea paramente ho thibela ho charisoa ha substrate. Mechanical routing e fana ka phallo e potlakileng bakeng sa libopeho tse bonolo tsa cavity ha e ntse e boloka ho nepahala ho lekaneng bakeng sa lits'ebetso tse ngata tsa semiconductor ea matla.

Taolo ea Boleng ba Bokaholimo

Bokhopo ba lerako la cavity bo ama ka ho toba conductivity ea mocheso le ho khomarela mochine ho sebopeho sa koporo-substrate. Sepheo sa litekanyetso tsa ho ba boima ho tloha ho 1.6 ho ea ho 3.2 μm Ra ho leka-lekanya ho kopana ha mocheso le ho khomarela resin. Boreleli bo feteletseng bo fokotsa ho hokahana ha mochini lipakeng tsa resin le marako a cavity, ho eketsa kotsi ea delamination nakong ea libaesekele tse futhumetseng.

Ho se tsitse ho laolwang ho kgothaletsa ho kolobisa resin ha ka nako e ts'oanang ho boloka ditsela tse tswelang pele tsa mocheso . Ho hlwekisa ka mora mochini ho tlosa dikarolwana tse ka bakang dikgeo nakong ya tshebetso e latelang ya ho kenya tjhelete ya koporo.

Ts'ebetso ea ho Embeha ha Chelete ea Koporo: Mohato oa Bohlokoa oa Kopano

Dimensional Matching le Fit Control

Ts'ebetso ea ho kenya chelete ea tšepe ea koporo e hloka ho bapisa ka mokhoa o nepahetseng pakeng tsa bophara ba chelete ea tšepe le ho buloa ha mokoti. Tšitiso e lekana ho tloha ho 10 ho isa ho 30 μm e fana ka ho boloka mochine o sireletsehileng ha o ntse o qoba ho phunyeha ha substrate nakong ea ho kenngoa. Mekhoa ea ho qoelisa e sebelisa matla a laoloang ho boloka lichelete tsa tšepe li phalla fatše le mokatong ntle le ho baka khatello ea mali.

Litsamaiso tsa pono tse ikemetseng li netefatsa ho tsamaisana le ± 25 μm pele ho lamination, ho thibela ho falla ha lateral nakong ea phallo ea resin. Ho se lumellane ho etsa hore ho be le litsela tsa mocheso oa asymmetric tse senyang ho hanyetsa mocheso ka kakaretso le ho hlahisa libaka tse chesang sebakeng sa heno kopanong ea ho qetela.

Lamination Parameters ka Copper Coin PCB Manufacturing

Katleho koporo tšepe PCB tlhahiso itšetlehile ka lamination lamination maemo a tlama kopano ntle warping:

• Taolo ea boemo ba mocheso - Sekhahla sa maqhubu a 2-3 ° C ka motsotso se tsamaisana le li-coefficients tsa katoloso ea mocheso lipakeng tsa koporo, resin le lisebelisoa tsa substrate tse nang le mocheso o phahameng ho tloha ho 170 ° C ho isa ho 200 ° C.
• Ntlafatso ea khatello e sebelisitsoeng - Matla a pakeng tsa 15 le 25 bar e tiisa hore resin e phalla ka ho feletseng ho pota-potiloe ke chelete ea tšepe ha e ntse e thibela ho phalla ha chelete ea tšepe ka holim'a karolo e ka tlaase.
• Ho sebetsa ka thuso ea vacuum - E tlosa moea o koaletsoeng o ka bakang mekoallo ea ho hanyetsa mocheso libakeng tsa bohlokoa tsa koporo-substrate.

Surface Planarization ka Copper Coin PCB Manufacturing

Ho Tlatsa Resin le Tsamaiso ea Phallo

Ho tlatsa khetho ea thepa ho leka-lekanya conductivity ea mocheso le litšobotsi tsa ts'ebetso nakong ea ts'ebetso ea ho kenya chelete ea tšepe ea koporo. Li-epoxies tse tsamaisang mocheso tse nang le li-ceramic fillers li fihlella 3-5 W / mK ha li ntse li boloka phallo e lekaneng nakong ea lamination. Lisebelisoa tsa pele ho pelehi li fana ka matlafatso ea moralo empa li hloka taolo e hlokolosi ea li-resin ho thibela tlala ho pota-potile chelete ea tšepe.

Kabo ea resin e ts'oanang e felisa likheo tse senyang ts'ebetso ea mocheso le dielectric. Khatello ea lamination e laoloang e tiisa botenya bo tsitsitseng ba resin pakeng tsa bokaholimo ba chelete ea tšepe le likarolo tse haufi tsa substrate bakeng sa phetisetso e nepahetseng ea mocheso.

Mekhoa ea Katleho ea Planarity

Ho sila ka mor'a lamination ho tlosa koporo e feteletseng le resin ho finyella ho bata ha holim'a ± 15 μm ho pholletsa le phanele. Mabili a abrasive a daemane butle-butle a fokotsa thepa ha a ntse a shebella botenya ka laser profilometry. Phokotso e tsoelang pele ea grit ho tloha ho 400 ho isa ho 1200 mesh e theha topology e ts'oanang ea topology e loketseng photolithography.

Ho belisoa ha lik'hemik'hale ho fana ka tokisetso ea ho qetela ea holim'a metsi, ho tlosa tšenyo e ka tlas'a lefatše ho tloha ho sila ka mechine. Netefatso ea Planarity pele litšoantšo tsa potoloho li thibela liphoso tsa ngoliso 'me li netefatsa sebopeho se tsitsitseng sa trace ho pholletsa le libaka tse nang le lichelete tsa tšepe tsa koporo tse kentsoeng.

Teko ea ho Tšepahala ho Tlhahiso ea Copper Coin PCB Manufacturing

Netefatso ea Ts'ebetso ea Thermal

Teko e felletseng e netefatsa boleng ba tlhahiso ea PCB ea koporo ka litlhahlobo tse ngata tsa mocheso:

• Tlhahlobo ea libaesekele tse futhumetseng Teko pakeng tsa -40 ° C le 150 ° C bakeng sa lipotoloho tse 1000 e senola litšekamelo tsa delamination le ho senyeha ha sebopeho tlas'a khatello ea ts'ebetso.
• Tekanyo ea ho hanyetsa mocheso - Tekanyo e tobileng e bapisa ts'ebetso ea 'nete khahlanong le sepheo sa moralo, ho netefatsa katleho ea litekanyetso tse boletsoeng tsa mocheso oa mocheso.
• Tlhahlobo ea infrared thermography - E hloaea libaka tse chesang tse sebakeng sa heno tse bontšang hore ho na le mocheso o sa fellang libakeng tsa coin-substrate interface tse hlokang ho lokisoa.
• Teko ea mocheso oa mocheso - Lithempereichara tsa mocheso o feteletseng li netefatsa botsitso ba sebopeho tlas'a mocheso o potlakileng oa mocheso oo u kopanang le oona lits'ebetsong tsa libaesekele tsa motlakase.

Tlhahlobo ea Botšepehi ba Sebopeho

Microscopy ea likarolo tse fapaneng e hlahloba sebopeho se se nang letho, kabo ea resin, le boleng ba sebopeho ho pholletsa le libaka tsa ts'ebetso ea ho kenya chelete ea koporo. Teko ea shear e sebelisa matla a morao-rao ho lekanya matla a bond ea mochini, ho shebisisa boleng bo kaholimo ho 10 MPa ho thibela ho putlama ha chelete ea tšepe nakong ea khatello ea mocheso. Microsectioning e senola ho kenella ha resin ka har'a lebota la lerako mme e netefatsa ho tlatsoa ka botlalo ho pota-potiloe ke chelete ea tšepe.

Highleap Electronics e etsa tlhahlobo e felletseng ea ts'epo ho netefatsa ts'ebetso e tsitsitseng ea mocheso le mochini ho li-PCB tsa tšepe tsa koporo ho pholletsa le nako ea bophelo e lebelletsoeng ea ts'ebetso.

Qetello: Tlhahiso e nepahetseng bakeng sa ts'episo e phahameng ea mocheso

E atlehileng ho etsa chelete ea tšepe ea koporo ea PCB e itšetlehile ka taolo e thata ea ts'ebetso ho tloha ho machining ho isa tekong ea ho qetela ea ho tšepahala. Ho nepahala ha boemo bo phahameng nakong ea ho cheka ho theha motheo oa ho beha chelete ea tšepe e nepahetseng ea koporo le phetisetso e nepahetseng ea mocheso. Mehato e laoloang ea ho kenya le ho lamination e tiisa hore ho tlamahane ho nepahetseng, ho fokotsa li-warpage, le moralo o tsitsitseng oa holim'a metsi bakeng sa sebopeho se ka tšeptjoang sa potoloho. Netefatso e matla - ka ho palama libaesekele tse futhumatsang, tlhahlobo ea likarolo tse fapaneng, le tlhahlobo ea ho kuta - e tiisa botšepehi ba mochini le ts'ebetso ea mocheso ea nako e telele tlasa maemo a thata a ts'ebetso.

Ho Highleap Electronics , sehlopha sa rona sa boenjiniere se sebelisa boiphihlelo bo boholo ba tlhahiso tlhahisong ea PCB ea lichelete tsa koporo le ntlafatso ea ts'ebetso ea ho kenya. Re kopanya mochini o nepahetseng oa CNC, taolo e tsoetseng pele ea lamination, le liteko tsa ts'epo ea ka hare ho netefatsa hore boto e 'ngoe le e 'ngoe e fihlela litlhoko tsa mocheso le tsa sebopeho tsa lits'ebetso tsa sejoale-joale tsa semiconductor ea matla. Mokhoa ona o tsamaisoang ke ts'ebetso o bonts'a boitlamo ba rona bo tsoelang pele ba bokhabane ba tekheniki, ts'epo ea tlhahiso, le netefatso ea boleng bo pepeneneng bakeng sa bareki ba rona ba lefats'e.