Theknoloji ea Copper Coin PCB bakeng sa Likopo tsa Semiconductor: Moralo, Ts'ebetso, le Ts'ebetso ea Thermal

Selelekela

Indasteri ea semiconductor e ntse e tsoela pele ho sutumelletsa meeli ea matla a matla ka lisebelisoa tse pharalletseng tse kang silicon carbide le gallium nitride, e leng ho theha mathata a neng a e-so ka a bonoa a taolo ea mocheso. Mekhoa ea khale e hatisitsoeng ea ho pholisa boto ea potoloho hangata e haella ha u sebetsana le mocheso o fetang 100 W/cm². Theknoloji ea tšepe ea koporo ea PCB e hlahile e le tharollo ea bohlokoa ea mocheso, e kenya li-block tsa koporo tse phahameng tsa conductivity ka ho toba ka har'a liboto tsa potoloho ho theha litsela tse sebetsang hantle tsa ho fetisa mocheso.

Mokhoa ona o sebetsana le mefokolo ea mantlha ea li-vias tse tloaelehileng tsa mocheso ka ho fana ka libaka tse kholoanyane tse fapaneng bakeng sa ho tsamaisa mocheso. Ha lisebelisoa tsa elektroniki li ntse li falla ho ea ho li-frequency tse phahameng le lintho tse kopaneng, meaho ea PCB ea tšepe e fana ka ts'ebetso ea mocheso e hlokahalang bakeng sa ts'ebetso e tšepahalang ea semiconductor ho li-inverters tsa makoloi, li-drive tsa indasteri le lisebelisoa tsa matla tse nchafalitsoeng.

Ke eng Copper Coin PCB Technology

Theknoloji ea chelete ea tšepe ea koporo e kopanya li-blocks tsa koporo tse tiileng ka har'a substrate ea PCB, ho theha litsela tse kholo tsa mocheso tse tsoang ho likarolo tse hlahisang mocheso ho ea ho litepisi tsa mocheso tse kantle. Ho fapana le mocheso o tloaelehileng ka li-arrays tse itšetlehileng ka masoba a mangata a manyenyane a nang le bophara bo fokolang, chelete ea tšepe ea koporo e theha tsela e tsoelang pele ea tšepe e nang le khanyetso e fokolang ea mocheso. Molao-motheo oa ts'ebetso o hlakile: mocheso o phalla ho tloha mokolokong oa semiconductor ka har'a sephutheloana sa sesebelisoa, ho kena cheleteng ea tšepe ea koporo, 'me qetellong ho ea sebakeng se ntseng se phahama kapa se pholileng.

The katleho phaello ka vias mogote e ba ho totobala ha ho hlahloba makgabane mogote ho hanyetsa. Chelete ea tšepe e tloaelehileng ea bophara ba 5mm e ka khona ho hanyetsa mocheso ka tlase ho 0.5 K/W, ha e lekanang le eona ka mefuta e mengata e ka ngolisa 2-3 K/W kapa ho feta. Ntlafatso ena ea makhetlo a mane ho isa ho a tšeletseng e fetolela ka kotloloho ho lithempereichara tse tlase tsa ts'ebetso le ts'epahalo e matlafalitsoeng ea sesebelisoa bakeng sa lits'ebetso tsa semiconductor ea matla.

Sebopeho sa PCB ea Copper Coin le Mefuta ea Moqapi

Tlhophiso e kentsoeng ea Chelete ea Koporo

Moralo o kentsoeng oa chelete ea tšepe o beha sebaka sa koporo ka har'a sebopeho sa laminate sa PCB, hangata lipakeng tsa likarolo tsa koporo tse kahare. Tlhophiso ena e boloka boto e bataletseng ha e ntse e fana ka conductivity e ntle ea mocheso ka botenya ba boto. Chelete ea tšepe e hokahana le lipampiri tse holimo ka holim'a likarolo tse tšesaane tsa koporo, tse lumellang lits'ebetso tse tloaelehileng tsa kopano ea SMT. Meetso e kentsoeng e sebetsa hantle ha ho hlokahala hore motlakase o itšehle thajana le ts'ebetso ea mocheso.

Mehaho ea Chelete ea Koporo e pepesitsoeng

Mehaho ea tšepe ea koporo e pepesitsoeng e na le sekoaelo sa koporo se phunyeletsang kapa se hlahelletseng ho tloha holim'a PCB, se nolofalletsang ho kopana ka ho toba le likaroloana tsa mocheso kapa licheso tsa mocheso. Moqapi ona o fokotsa khanyetso ea mocheso oa mocheso ka ho felisa likarolo tse bohareng tsa thepa. Sebopeho se pepesitsoeng se sebetsa ka ho khetheha bakeng sa tharollo ea ho pholile ha mochine oa khatiso moo mochine oa semiconductor o kopanang ka ho toba le chelete ea tšepe ea koporo ea PCB.

Mefuta e mengata ea lichelete tsa tšepe bakeng sa Multi-Chip Modules

Li-module tsa matla tse nang le li-semiconductor tse ngata li rua molemo ho tsoa ho lihlopha tsa tšepe tsa koporo tse behiloeng ka mokhoa o hlophisitsoeng. Chelete e 'ngoe le e' ngoe ea tšepe e ikamahanya le li-chips tsa IGBT, SiC MOSFETs, kapa maemo a diode, ho theha litsela tse ka thōko tsa mocheso tse thibelang ho ata ha mocheso pakeng tsa lisebelisoa tse haufi. Array spacing e tlameha ho ikarabella bakeng sa litlhoko tsa clearance ea motlakase ha ho ntse ho eketsa tšireletso ea mocheso. Melao ea moralo hangata e totobatsa karohano e fokolang ea coin-to-coin ea 1-2mm ho latela litekanyetso tsa motlakase.

Mokhoa oa Tlhahiso oa Li-PCB tsa Copper Coin

Tokisetso ea Substrate le Cavity Formation

Ts'ebetso ea ho etsa chelete ea tšepe ea PCB ea koporo e qala ka machining a nepahetseng a li-cavities ka har'a thepa ea substrate. Ho cheka ha CNC kapa ho ablation ka laser ho theha lipokotho tse tsamaellanang le litekanyo tsa tšepe tse nang le mamello e thata, hangata ka har'a ± 50μm. Botebo ba cavity bo tlameha ho lumellana le botenya ba koporo ha u ntse u boloka sepheo sa ho qetela sa boto ka mor'a lamination.

Ho lokisoa ha li-cavities tsena ka ho hloekisa lik'hemik'hale kapa kalafo ea plasma ho netefatsa ho khomarela hantle nakong ea mehato e latelang ea ts'ebetso. Highleap Electronics e sebelisa mokhoa oa ho itlhahloba ka othomathike mothating ona ho netefatsa ho nepahala ha boemo ba sebaka pele ho beoa chelete ea tšepe.

Ho behoa ha Koporo ea Koporo le ho tsamaisana

Li-blocks tsa koporo tse hloekileng haholo, tse entsoeng esale pele ka boholo bo nepahetseng, li behiloe ka har'a likoti tse lokisitsoeng ho sebelisoa lisebelisoa tsa mochini kapa lisebelisoa tsa ho khetha le ho beha sebaka. Sistimi ea ho hokahanya ha laser e netefatsa ho nepahala ha ho beoa ha chelete ea tšepe ho latela matšoao a tšepahalang, ho netefatsa ngoliso e nepahetseng le libaka tsa marang-rang. Ho mamellana ha ho beoa ka kotloloho ho ama ts'ebetso ea mocheso ea ho qetela ea koporo ea PCB le tlhahiso ea kopano.

Ho kopanya Lamination le Koporo

Ho kopanya chelete ea tšepe ea koporo ho etsahala nakong ea potoloho e tloaelehileng ea PCB lamination, moo mocheso le khatello li tlamang likarolo tsa prepreg ha li ntse li boloka lichelete tsa tšepe tse kentsoeng. The coefficient ea mocheso katoloso phapang pakeng tsa koporo (16.5 ppm/°C) le FR-4 laminate (14-17 ppm/°C ka sefofaneng) hloka ka hloko lamination profil optimization ho thibela delamination.

Mekhoa e latelang ea koporo ea koporo e theha maqhama a motlakase le a mocheso pakeng tsa lichelete tsa tšepe le likarolo tsa potoloho, ho theha tsela e feletseng ea mocheso e hlokahalang bakeng sa lisebelisoa tsa ho futhumatsa semiconductor.

Ho Qetella Bokahohle le Taolo ea Bophahamo

Post-lamination sebetsa ho akarelletsa ho sila mechine kapa routing ho finyella botenya boletsweng boto le ho pepesa lichelete tsa tšepe tse kenyellelitsoeng botebo bo hlokahalang. Polane ea bokaholimo ho pholletsa le sebaka sa tšepe ea koporo e tlameha ho fihlela litlhoko tse thata, hangata kahare ho 25-50μm, ho netefatsa sebopeho se tšepahalang sa solder nakong ea kopano ea likarolo.

Liphekolo tsa ho qetela tse kang ENIG, OSP, kapa silevera ea ho qoelisoa li sireletsa bokaholimo ba koporo ha li ntse li boloka ts'ebetso ea sehokelo sa mocheso. Mekhoa ea ho laola boleng ba Highleap e kenyelletsa laser profilometry ho netefatsa lintlha tsa flatness pele li tsamaisoa.

Ts'ebetso ea Mocheso le Motlakase oa li-PCB tsa Copper Coin

Superior Thermal Conductivity

Meaho ea PCB ea tšepe ea koporo e sebelisa conductivity ea mocheso ea koporo ea hoo e ka bang 400 W/m·K, e leng e phahameng ka makhetlo a fetang 200 ho feta thepa e tloaelehileng ea laminate ea FR-4. Phapang ena e kholo ea conductivity e hlahisa tsela ea mocheso e sa hanyetseng mocheso e tsamaisang mocheso ka katleho ho tloha ho li-semiconductor tsa motlakase.

Tlhahlobo e felletseng ea mocheso ha e bapisoa le li-module tsa matla a ts'ebetso e bonts'a hore ts'ebetsong ea chelete ea tšepe ea koporo e ka fokotsa mocheso oa matekoane ka 20-40 ° C ha o bapisoa le mocheso o ntlafalitsoeng ka meralo tlas'a maemo a tšoanang a ho felloa ke matla. Lits'ebetsong tsa SiC MOSFET tse senyang 150W ho tloha maotong a 10mm x 10mm, mocheso oa motsoako o nyolohang ka holim'a baseplate o ka fokotsoa ho 15-20 ° C ka moralo o nepahetseng oa tšepe ea koporo ea PCB, athe mocheso ka lisebelisoa o ka bona phapang ea mocheso oa 40-50 ° C.

Litšobotsi tsa Ts'ebetso ea Motlakase

Ka ntle ho melemo ea mocheso, meralo ea PCB ea tšepe ea koporo e fana ka litsela tsa morao-rao tse sa sebetseng hantle tse loketseng lisebelisoa tsa elektronike tse phahameng tsa hona joale. Sebaka se tiileng sa koporo se fana ka khanyetso e fokolang ha e bapisoa le ka li-arrays, ho fokotsa tahlehelo ea conduction le ho ntlafatsa katleho ea phetoho ea matla.

Lits'ebetsong tsa module tsa IGBT tse nang le li-ampere tse makholo, ho theoha ha motlakase ho pholletsa le khokahanyo ea tšepe ea koporo e ka ba taelo ea boholo bo tlase ho feta meralo e lekanang le eona. Molemo ona oa motlakase o tlatsana le ts'ebetso ea mocheso, ho etsa hore theknoloji ea tšepe ea koporo e be ea bohlokoa bakeng sa li-module tsa motlakase tsa moloko o latelang.

Likopo tsa PCB tsa Copper Coin ho Semiconductor le Power Electronics

Motlakase oa Motlakase oa Likoloi

Li-inverter tsa likoloi tsa motlakase li emela sebaka sa mantlha sa ts'ebeliso bakeng sa theknoloji ea PCB ea chelete ea koporo. Hangata inverter e kholo ea ho hula e na le li-module tse tšeletseng kapa ho feta tsa IGBT kapa SiC tse sebetsang maemong a matla a kilowatt ka har'a bophahamo ba liphutheloana tse koetsoeng ka thata. Meaho ea chelete ea koporo e nolofalletsa meralo ena ea matla a phahameng ka ho ntša mocheso ka katleho ho tloha boemong bo bong le bo bong ba semiconductor ho ea ntlong ea inverter.

Lijaja tse ka har'a board le li-converter tsa DC-DC le tsona li rua molemo taolong ea mocheso oa chelete ea tšepe ea koporo, e lumellang barekisi ba likoloi ho fihlela sepheo sa ts'ebetso le ts'epahalo ho tloha ho -40 ° C ho isa +125 ° C.

Likoloi tsa Liindasteri le Matla a Tsosolositsoeng

Li-drive frequency tse feto-fetohang bakeng sa li-motor tsa indasteri, li-inverters tsa letsatsi, le li-converter tsa turbine tsa moea li ntse li tsoela pele ho amohela meralo ea PCB ea koporo ha litekanyetso tsa matla li nyolohela ho li-kilowatts tse makholo. Lisebelisoa tsena li hloka ts'epo e ikhethang ho theosa le lilemo tse mashome tsa ts'ebetso e tsoelang pele, e leng se etsang hore taolo ea mocheso e be ea bohlokoa ho thibela ho hloleha ha masimo.

Mokhoa oa ho sebelisa chelete ea tšepe ea koporo o lumella lienjiniere ho rala lisebelisoa tse nyane, tse bobebe tsa ho fetola matla ntle le ho beha meeli ea mocheso. Highleap Electronics e fane ka li-PCB tsa tšepe tsa koporo bakeng sa lits'ebetso tsa indasteri moo mocheso oa ts'ebetso o fetang 125 ° C o nang le phallo e felletseng ea mojaro.

Phetoho ea Matla a GaN a Phahameng ka ho Fetisisa

Disebediswa tsa Gallium nitride di sebetsa maqhubung a ho fetola a fihlang megahertz range, e leng se bakang diphephetso tse ikgethang tsa mocheso. Le hoja ditransistor tsa GaN di hlahisa tahlehelo e nyane ya matla ho feta di-silicon, tahlehelo e ipopanya dibakeng tse nyane tsa die, e leng se hlahisang ho phalla ho hoholo ha mocheso.

Mehaho ea PCB ea tšepe ea koporo e fana ka ts'ebetso ea mocheso e hlokahalang ha e ntse e boloka inductance e tlase ea parasitic e bohlokoa bakeng sa ts'ebetso ea maqhubu a phahameng. Theknoloji e nolofalletsa meralo ea converter ea compact GaN bakeng sa likhokahano tsa mehala, lisebelisoa tsa motlakase tsa seva, le lits'ebetso tse tjhajang kapele.

Copper Coin PCB Papiso le Mekhoa e meng ea Tsamaiso ea Thermal

Copper Coin PCB vs Thermal Via Arrays

Mocheso ka li-arrays o tsamaisa mocheso ka mekoti e mengata e menyenyane e nang le bophara ba 0.3-0.5mm. Papiso ea ts'ebetso e bontša phapang e kholo:

• Thermal hanyetsa - Lichelete tsa tšepe tsa koporo li fihlella ka tlase ho 0.5 K / W ha u ntse u sebelisa li-arrays 2-3 K / W kapa ho feta
• Tsela ea mocheso e sebetsang hantle - Boima bo tsoelang pele ba koporo bo felisa likhang tsa letoto ho tloha botenya ba plating le ka bolelele ba moqomo
• Tšusumetso ea botenya ba boto - Vias e hloka ho hanyetsa mocheso ho feta ka bolelele ba yuniti ha lichelete tsa tšepe tsa koporo li boloka conductivity e tsitsitseng
• Matla a matla - Meralo ea PCB ea tšepe ea koporo e sebetsana ka katleho le 50+ W/cm² moo ho nang le mathata a mangata

Sebaka sa ho etsa liqeto hangata se etsahala ho pota 30-50 W/cm² matla a matla a matla bakeng sa meaho e tloaelehileng ea FR-4, moo mocheso o sa khoneng ho fihlela litlhoko tsa mocheso le ka boholo ka ho teteana.

Copper Coin PCB vs Metal Core PCB

Li-PCB tsa mantlha tsa tšepe li nkela sebaka sa substrate e tloaelehileng ea FR-4 ka lera la motheo la aluminium kapa koporo, tse fanang ka ts'ebetso e ntlafalitsoeng ea mocheso bakeng sa mabone a LED le lits'ebetso tsa motlakase. Leha e sebetsa hantle bakeng sa ho jala mocheso ka mahlakoreng, theknoloji ea MCPCB e lekanyetsa ho rarahana ha potoloho ho meralo e bonolo ea mahlakore a le mong kapa a mabeli.

Mehaho ea PCB ea tšepe ea koporo e fana ka maemo a holimo, e ts'ehetsang litsamaiso tse ngata, li-vias tse foufetseng / tse patiloeng, le taolo e rarahaneng ea impedance ha e ntse e fana ka ts'ebetso e bapisang kapa e betere sebakeng sa lichelete tsa tšepe. Lisebelisoa tse hlokang ts'ebetso e phahameng ea mocheso le ts'ebetso e tsoetseng pele ea potoloho li rata mekhoa ea tšepe ea koporo ho feta mekhoa e meng ea mantlha ea tšepe.

Mehopolo ea Moqapi bakeng sa li-PCB tsa Copper Coin

Coefficient ea Tsamaiso ea Katoloso ea Thermal

CTE e sa lumellaneng pakeng tsa koporo (16.5 ppm / ° C) le FR-4 laminate (14-17 ppm / ° C ka sefofaneng, 50-70 ppm / ° C z-axis) e baka khatello ea mechine nakong ea mocheso oa libaesekele. Khatello ea kelello ena e tsepamisitse mohopolo oa lichelete tsa tšepe-to-laminate interface 'me e ka lebisa ho delamination haeba e sa laoloe hantle.

Maano a ho fokotsa moralo a kenyelletsa ho khetha li-laminate tse phahameng tsa Tg, ho ntlafatsa sebopeho sa chelete ea tšepe ka likhutlo tse chitja ho fokotsa khatello ea maikutlo, le ho fokotsa bophara ba chelete ea tšepe ho latela botenya ba boto. Teko ea libaesekele tse futhumetseng ho tloha ho -40 ° C ho ea + 150 ° C e tiisa botšepehi ba mochine oa kopano ea PCB ea tšepe ea koporo pele ho tlhahiso ea tlhahiso.

Bokaholimo ba Planarity le ho Tšepahala ha Kopano

Ho boloka coplanarity pakeng tsa bokaholimo ba chelete ea tšepe ea koporo le libaka tse haufi tsa PCB ho ama ka kotloloho boleng bo kopaneng ba solder nakong ea kopano ea karolo. Phapang ea bolelele bo fetang 50μm e ka baka ho sa phethoe ha solder, sebopeho sa lefeela, kapa tombstone ea likarolo tse haufi.

Taolo ea ts'ebetso ea tlhahiso e tlameha ho ikarabella bakeng sa litekanyetso tse fapaneng tsa ho sila tsa koporo ha li bapisoa le lisebelisoa tsa laminate. Litaelo tsa moralo li khothaletsa ho boloka bonyane sebaka sa 0.5mm pakeng tsa likarolo tsa solder le mephetho ea chelete ea tšepe ho amohela phapang e nyane ea bophahamo ba bokaholimo.

Ketsiso ea Thermal le netefatso

Moetso o nepahetseng oa mocheso oa meralo ea PCB ea koporo e hloka tlhahlobo ea likarolo tse tharo tse felletseng tse ikarabellang bakeng sa thepa ea thepa ea anisotropic, khanyetso ea sehokelo, le maemo a moeli. Mehlala e nolofalitsoeng ea tlhahlobo hangata e nyenyefatsa ts'ebetso ea 'nete ea mocheso ka lebaka la litlamorao tse matla le ho ata ha mocheso ka har'a sebopeho sa chelete ea tšepe.

Highleap Electronics e tiisa meralo e futhumatsang ka ho etsa ketsiso le liteko tsa liteko ho sebelisoa lichipisi tsa tlhahlobo ea mocheso tse phetang mekhoa ea 'nete ea ho felloa ke matla. Mokhoa ona o kopantsoeng o etsa bonnete ba hore li-PCB tsa tlhahiso ea koporo li kopana le lipakane tsa ts'ebetso ea mocheso tlas'a maemo a sebele a ho sebetsa.

fihlela qeto e

Theknoloji ea PCB ea tšepe ea koporo e sebetsana le litlhoko tse ntseng li eketseha tsa tsamaiso ea mocheso ea lisebelisoa tsa semiconductor tsa motlakase oa sejoale-joale ka ho tsamaisa mocheso o phahameng le ho feto-fetoha ha moralo. Bokhoni ba ho kenya bongata ba koporo bo phahameng ka kotloloho ka har'a meaho ea boto ea potoloho bo thusa baenjiniere ba matla a elektroniki ho sutumelletsa meeli ea ts'ebetso ha ba ntse ba boloka ts'epahalo ho pholletsa le mebaraka ea makoloi, ea indasteri le ea likhokahano.

Ha lisebelisoa tsa SiC le GaN li ntse li tsoela pele ho hatela pele ho matla a phahameng a matla le ho feto-fetoha ha maqhubu, litharollo tsa mocheso oa tšepe ea koporo li lula li le bohlokoa bakeng sa ho ntša mocheso ho liphutheloana tse ntseng li eketseha tsa semiconductor.

Highleap Electronics Copper Coin PCB Bokhoni ba

Highleap Electronics e fana ka litharollo tse felletseng tsa tlhahiso ea tšepe ea koporo ea PCB e tšehelitsoeng ke boiphihlelo bo netefalitsoeng ba lisebelisoa tsa elektroniki:

• Tlhahiso e nepahetseng - ± 50μm ho kenyelletsa ho nepahala ka tlhahlobo e ikemetseng ea optical le litsamaiso tsa ho tsamaisana le laser
• Netefatso ea mocheso - Ketsiso e felletseng ea FEA le liteko tsa liteko u sebelisa lisebelisoa tsa tlhahlobo ea mocheso bakeng sa netefatso ea ts'ebetso
• Netefaletso ea boleng - Laser profilometry le taolo e thata ea ho bata e netefatsang lintlha tsa 25-50μm holim'a polane.
• Tšehetso ea boenjiniere - Tšebelisano e tobileng le bareki ho ntlafatsa ho beoa ha chelete ea tšepe ea koporo, botenya le ho kopanya litlhoko tse khethehileng tsa mocheso
• Bopaki ba ho tšepahala - Netefatso ea libaesekele tse futhumetseng ho tloha ho -40 ° C ho isa +150 ° C ho kopana le maemo a likoloi le a indasteri

Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka hore na theknoloji ea PCB ea chelete ea koporo e ka ntlafatsa moralo oa hau o latelang oa lisebelisoa tsa motlakase le ho tobana le liphephetso tsa hau tsa taolo ea mocheso joang.