Moralo oa Power Semiconductor PCB bakeng sa li-Module tsa Matla

Selelekela: Karolo ea Matla a Semiconductor PCB ho Elektronike ea Kajeno

Li-module tsa semiconductor tsa motlakase li sebetsa e le mokokotlo oa likoloi tsa sejoale-joale tsa motlakase, li-inverters tsa indasteri, le lits'ebetso tsa matla tse nchafalitsoeng. PCB ea semiconductor ea matla e sebetsa e le sethala se fetang se bonolo sa khokahano. Ka nako e le 'ngoe e fana ka conductivity ea motlakase, litsela tsa ho senya mocheso, ho itšehla thajana ka dielectric, le botsitso ba mochine tlas'a maemo a thata a ho sebetsa.

Lisebelisoa tse fapaneng tsa matla li fana ka litlhoko tse fapaneng moralong oa PCB. Li-module tsa IGBT li hloka bokhoni bo matla ba ho sebetsana le maemo le taolo e itekanetseng ea mocheso. Meralo e thehiloeng ho MOSFET e hloka tlhokomelo e hlokolosi ho litšoaneleho tsa ho fetoha ha maqhubu a holimo. Li-semiconductors tsa Wide-bandgap tse kang SiC le GaN li sebetsa ka mocheso o phahameng le ho feto-fetoha ha maqhubu, li hloka lisebelisoa tse tsoetseng pele tsa substrate le meralo e ntlafalitsoeng ea mocheso bakeng sa ts'ebetso e tšepahalang ea mojule oa PCB.

Matla a Semiconductor PCB Configurations le Mehaho

Thick Koporo PCB bakeng sa High Current Applications

Li-PCB tse teteaneng tsa koporo li sebelisa boima ba koporo ho tloha ho 3oz ho isa ho 10oz ka lera ho ts'ehetsa maqhubu a phahameng a tsoelang pele a nang le tahlehelo e fokolang ea ho hanyetsa. Liboto tsena li thusa ho tsamaisa matla ka kotloloho ntle le mekoallo ea libese ea kantle ho meralo ea module ea PCB ea IGBT. Boima bo ntseng bo eketseha ba koporo bo tlatsetsa ho ata ha mocheso holim'a boto.

Metal Core PCB le IMS Technology

Li-PCB tsa mantlha tsa tšepe li na le mekhahlelo ea motheo ea aluminium kapa koporo e fanang ka conductivity e phahameng ea mocheso ha e bapisoa le meaho e tloaelehileng ea FR-4. Sebopeho sa substrate ea tšepe e insulated (IMS) se beha lera le lesesaane la dielectric pakeng tsa mohlala oa potoloho le motheo oa tšepe. Sebopeho sena se loketse lits'ebetso tsa motlakase o mahareng moo litlhoko tsa mocheso li fetang bokhoni ba setso.

DBC le AMB Substrates bakeng sa Wide-Bandgap Devices

Copper e kopantsoeng ka kotloloho (DBC) e kopanya likarolo tsa koporo tse teteaneng ka kotloloho ho lisebelisoa tsa ceramic ntle le likarolo tsa sekhomaretsi. Active metal brazing (AMB) e fihlella liphetho tse ts'oanang ka mekhoa e fapaneng ea ho kopanya. Mefuta ka bobeli ea substrate e sebetsana le mocheso o phahameng oa ts'ebetso le litlhoko tsa libaesekele tse futhumatsang tsa lisebelisoa tsa SiC PCB le GaN PCB.

Multilayer le Hybrid Stack-ups

Li-module tsa motlakase tse rarahaneng hangata li sebelisa litlhophiso tsa li-multilayer tse arolang mesaletsa ea matla a phahameng ho tsoa ho matšoao a bobebe a liheke. Mehaho ea Hybrid e kopanya likarolo tse tloaelehileng tsa FR-4 bakeng sa ho tsamaisa lets'oao le li-cores tsa tšepe tse kentsoeng bakeng sa kabo ea matla. Mokhoa ona o ntlafatsa litšenyehelo ha o ntse o kopana le litlhoko tse fapaneng tsa ts'ebetso ho pholletsa le mojule oa matla oa PCB.

Moralo oa Motlakase bakeng sa Power Semiconductor PCB

Bokhoni ba hona joale ba ho jara le taolo ea impedance

Moralo oa PCB oa semiconductor o qala ka lipalo tsa bophara ba trace ho latela litlhoko tsa hajoale le ho phahama ho amohelehang ha mocheso. Botenya ba koporo bo ama ka kotloloho matla a hajoale, ka maemo a koporo a 4oz ho isa ho 6oz bakeng sa litsela tsa mantlha tsa matla. Litsela tse pharaletseng li fokotsa tahlehelo e hanyetsanang le ho theoha ha motlakase tlas'a maemo a tletseng moroalo.

Liphello tsa Phetoho ea Khafetsa e Phahameng ho MOSFET PCB

Sebopeho sa PCB sa MOSFET se tlameha ho sebetsana le ho kenella ha dikokwana-hloko le bokgoni ba ho laola dikokwana-hloko tse amang tshebetso ya ho fetola. Mehlala ya ho kganna ha heke e hloka tsela e laolwang ya impedance e nang le sebaka se senyenyane sa loop. Ho kenella ha dikokwana-hloko tsa motlakase ho baka ho phatloha ho hoholo ha motlakase nakong ya diphetoho tsa ho tima. Ho bewa ha di-capacitor tse kgaolang le ditsela tse ntlafetseng tsa ho kgutlisa ho fokotsa dikokwana-hloko tsena.

Kelvin Connections le Voltage Sensing

Kutlo e nepahetseng ea hajoale e hloka mekhoa ea khokahano ea Kelvin e arohanyang litsela tsa morao-rao le mesaletsa ea maikutlo. Ho utloa ka terata e mene ho felisa tšusumetso ea khanyetso ea khokahano mabapi le ho nepahala ha tekanyo. Kutlo e inehetseng e latela tsela ka kotloloho ho liteminale tsa sesebelisoa ntle le ho arolelana koporo le maqhubu a matla.

Litlhoko tsa ho itšehla thajana tse phahameng haholo

Lisebelisoa tsa elektroniki li sebetsa ka li-voltage tse hlokang hore ho be le sebaka se itseng sa creepage le sebaka sa ho hlaka lipakeng tsa li-conductors. Maemo a polokeho a hlalosa sebaka se fokolang ho ipapisitsoe le maemo a motlakase le likhato tsa tšilafalo. Moralo oa mojule oa matla oa PCB o tlameha ho lumellana le litlhoko tsena ha o ntse o eketsa boima ba potoloho.

Tsamaiso ea Thermal ho Power Semiconductor PCB

Koporo e Kenyellelitsoeng le Via Technologies

Maano a sebetsang a taolo ea mocheso bakeng sa PCB ea semiconductor ea matla a kenyelletsa:

• Ho kenya chelete ea tšepe ea koporo - Bongata bo bongata ba koporo ka tlas'a likaroloana bo jala mocheso ka thōko pele bo fetisetsoa litšeng tsa mocheso.
• Kaho ea ka-ka-pad - Li-vias tsa mocheso tse tletseng koporo li felisa ho hanyetsa lekhalo la moea tlas'a mehato ea lisebelisoa.
• Thermal ka li-arrays - Litsela tse ngata li theha litsela tsa mocheso tse tlase-impedance ka botenya ba boto.
• Metal base integration - Li-spreader tsa mocheso o felletseng oa sefofane li fana ka conductivity e phahameng ea mocheso bakeng sa lits'ebetso tse matla a phahameng.

Lisebelisoa tsa Ceramic tse tsoetseng pele bakeng sa SiC PCB

Li-ceramics tse phahameng tsa mocheso li fana ka ts'ebetso e phahameng bakeng sa lits'ebetso tsa PCB tsa semiconductor ea matla:

• Aluminium nitride (AlN) - Thermal conductivity e atamela 180 W / mK e nolofalletsa ho tlosoa ha mocheso ho tloha lisebelisoa tsa SiC.
• Silicon nitride (Si₃N₄) - E fana ka matla a mochini ka ts'ebetso ea mocheso e loketseng likopano tsa GaN PCB.
• Ho kenya lefi ka kotloloho - E felisa lisebelisoa tse mahareng tsa mocheso oa mocheso ho fokotsa khanyetso e felletseng ea mocheso.

Ketsiso ea Mocheso le Tlhahlobo ea Libaesekele tsa Matla

Finite element thermal modelling e bolela esale pele lithempereichara tsa mateano 'me e tsebahatsa libaka tsa mocheso pele ho etsoa mohlala. Tlhahlobo ea nakoana ea mocheso e lekola ho fetoha ha mocheso nakong ea libaesekele tsa motlakase tse tsamaisang mekhoa ea ho khathala ha mokhathala. Li-coefficient tsa thepa ea ho atolosa mocheso (CTE) li sa lumellane li baka khatello ea kelello nakong ea maeto a mocheso.

Ntlafatso ea Tsela ea ho Fetola Mocheso

Moralo o sebetsang hantle oa mocheso o theha litsela tse hanyetsanang haholo ho tloha ho li-semiconductor junctions ka li-interfaces tsa solder, substrates, le lisebelisoa tsa sehokelo sa mocheso ho isa lits'ebetsong tse pholileng tsa tikoloho. Meralo ea PCB ea ho futhumatsa mocheso e fokotsa palo le botenya ba likhokahano ha e ntse e eketsa libaka tsa ho ikopanya le thepa ea mocheso oa mocheso.

Khetho ea Boitsebiso bakeng sa Mojule oa Matla PCB

Likhetho tsa Dielectric Material

Lisebelisoa tse tloaelehileng tsa FR-4 li lekane bakeng sa li-PCB tsa module ea matla tse sebetsang ka tlase ho 130 ° C ka litlhoko tse itekanetseng tsa maqhubu. Li-laminates tse phahameng tsa Tg joalo ka FR-408HR li atolosa mekhahlelo ea ts'ebetso ho isa ho 180 ° C mocheso oa phetoho ea khalase. Li-substrates tsa Polyimide li mamella ts'ebetso e tsoelang pele ka holimo ho 200 ° C, e hlokahalang bakeng sa ho kenya SiC le GaN die mounting.

Boima ba Koporo le Boleng ba Plating

Khetho ea botenya ba koporo ea motheo e leka-lekanya bokhoni ba hona joale khahlanong le litšenyehelo tsa thepa le ho rarahana ha thepa. Boima ba koporo bo phethiloeng bo etsa hore ho be le plating e eketsehileng nakong ea ho theha le ho qeta bokaholimo. Liboto tse boima tsa koporo li hloka lits'ebetso tse khethehileng tsa etching le linako tse atolositsoeng tsa ts'ebetso.

Khetho ea Qetello ea Bokaholimo bakeng sa Power Semiconductor PCB

Electroless nickel mersion gold (ENIG) e fana ka sebaka se setle sa ho rekisoa le ho kopanya terata bakeng sa kopano ea PCB ea matla a semiconductor. Ho qoelisoa ha silevera le organic solderability preservative (OSP) ho fokotsa litšenyehelo empa ho hloka polokelo e hlokolosi. Ho roala khauta e thata ho fana ka likhokahanyo tse holimo tsa hajoale le lits'ebetso tse thellang.

Theknoloji e tsoetseng pele ea Bonding

Sintered silver die attach e theha maqhama a se nang letho a nang le mocheso o phahameng oa mocheso le motlakase ha o bapisoa le li-solders tsa setso. Li-solders tsa mocheso o phahameng li boloka botšepehi ba mochine tlas'a ho palama baesekele ka mocheso o phahameng. Khetho ea mokhoa oa bonding e ama ts'epo ea mojule oa matla ka kakaretso.

Ho tšepahala le Teko bakeng sa Power Semiconductor PCB

Liteko tsa Libaesekele tsa Matla le Thermal Cycling

Ho tsamaisa libaesekele ka matla ho kenyelletsa meroalo ea motlakase e pheta-phetoang e hlahisang mocheso oa ka hare le potoloho ea ho pholisa e emelang ts'ebetso ea tšimo. Litekanyetso tsa liteko li hlakisa maemo a hajoale, linako, le ho fetoha ha mocheso ho ipapisitsoe le litlhoko tsa ts'ebeliso. Liteko ka bobeli li supa mekhoa ea mokhathala e amang manonyeletso a solder le substrate delamination.

Teko e Phahameng ea Matla a Phahameng

Teko ea HiPot e sebelisa li-voltage tse fetang maemo a tloaelehileng a ts'ebetso ho netefatsa botšepehi ba ho kenella lipakeng tsa lipotoloho tse ikhethileng. Li-voltage tsa liteko hangata li fihla ho makhetlo a 1.5 ho isa ho a 2 ho matla a sebetsang ka nako e behiloeng. Teko e sa fellang ea ho ntša metsi e fumana ho hloleha ha insupient pele ho senyeha ho feletseng.

Mekhoa ea Tlhahlobo ea ho Hloka

Mekhoa ea bohlokoa ea netefatso ea ts'epo bakeng sa matla a semiconductor PCB e kenyelletsa:

• Karohano - E pepesa lintlha tsa kaho ea kahare mme e senola mekhoa ea ho hloleha e sa bonahaleng ho tsoa tlhahlobong ea kantle.
• Litšoantšo tsa X-ray - E khetholla li-voids ho manonyeletso a solder le delamination lipakeng tsa likarolo tsa thepa ntle le liteko tse senyang.
• Ho hlahloba microscopy ea acoustic - E lemoha mapetsong a sefahleho le li-disbonds ho netefatsa ho ts'epahala ha nako e telele.

Lisebelisoa tsa PCB tsa Power Semiconductor

Motlakase oa Motlakase oa Matla a Elektronike

Li-inverter tsa EV li fetola matla a betri ea DC ho ba AC ea mekhahlelo e meraro bakeng sa taolo ea enjene ka katleho e fetang 95%. PCB ea inverter e tlameha ho sebetsana le li-ampere tse makholo ha e ntse e boloka botsitso ba mocheso tlas'a ts'ebetso e tsoelang pele. Ho amoheloa ha carbide ea silicon ho li-inverter tsa traction ho hloka theknoloji e tsoetseng pele ea semiconductor PCB.

Li-Drives tsa indasteri le li-Solar Inverters

Li-driable frequency drives li laola lebelo la liindasteri tse nang le taolo e nepahetseng ea matla ho pholletsa le mefuta e mengata ea ts'ebetso. Li-inverters tsa letsatsi li fetola tlhahiso ea DC photovoltaic ho matla a AC a kopantsoeng le gridi a nang le lintlha tse phahameng tsa ho latela lintlha. Mehaho ea PCB ea motlakase e etselitsoeng morero e sebetsana le litlhoko tsena tse boima.

Mehala ea puisano le UPS Systems

Meralo ea likhokahanyo e hloka phetolo ea matla e tšepahalang ka lipehelo tse matla tse sebetsang hantle. Lisebelisoa tsa motlakase tse ke keng tsa senyeha li sireletsa meroalo e boima ka ho fetoha ho se nang moeli pakeng tsa lisebelisoa le mehloli ea matla a betri. Litsamaiso tsena li sebelisa li-module tsa semiconductor tse tsoetseng pele tse kentsoeng likopanong tse khethehileng tsa inverter PCB.

fihlela qeto e

Moralo oa Power semiconductor PCB o hloka ts'ebetso e hlokolosi ea ts'ebetso ea motlakase, taolo ea mocheso, le ts'epahalo ea thepa ho fihlela litlhoko tse thata tsa lisebelisoa tsa motlakase tsa sejoale-joale. Lisebelisoa tse nang le li-wide-bandgap li ntse li tsoela pele ho sutumelletsa meeli ea ts'ebetso ha meaho e teteaneng ea koporo, litšepe tsa mantlha tsa tšepe, le metheo ea ceramic e sebetsana le litlhoko tse ikhethileng tsa kopo.

Highleap Electronics e fana ka litharollo tse felletseng tsa matla a semiconductor PCB:

• Mekhoa e tsoetseng pele ea ho etsa PCB - Ho kenya koporo e teteaneng, ts'ebetso ea mantlha ea tšepe, le ho kopanngoa ha ceramic substrate bakeng sa litlhoko tse hlokahalang tsa mocheso.
• Tsebo e pharaletseng ea li-bandgap - Mekhoa e ikhethileng ea tlhahiso ea SiC PCB le ts'ebetsong ea GaN PCB ka ts'epo e netefalitsoeng.
• Litifikeiti tsa boleng - Ts'ebetso e netefalitsoeng ea ISO 9001 le IATF 16949 e netefatsa boleng bo tsitsitseng ba lits'ebetso tsa likoloi le tsa indasteri.
• Litšebeletso tse felletseng tsa kopano ea PCB - Ho tloha ho theko ea likarolo ho isa tekong ea ho qetela, ho tšehetsa tlhahiso e felletseng ea mojule oa matla.

Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka litlhoko tsa hau tsa PCB tsa semiconductor ea matla le ho fumana hore na lits'ebetso tsa rona tse pakiloeng li fana ka ts'ebetso eo meralo ea hau e e hlokang joang.