Silicon Nitride Ceramic PCB | Substrate e Matla a Phahameng bakeng sa Li-Module tsa Matla
Selelekela
PCB ea ceramic ea Silicon nitride e emela tsoelo-pele e kholo theknolojing ea substrate bakeng sa litsamaiso tsa elektroniki tse nang le matla a phahameng. Ha matla a motlakase a ntse a eketseha likoloing tsa motlakase, li-drive tsa indasteri, le lits'ebetso tsa matla a nchafatsoang, litlhoko tse behiloeng lisebelisoa tsa boto ea potoloho li eketsehile haholo. Li-substrate tsa ceramic tsa Silicon nitride (Si₃N₄) li sebetsana le liphephetso tsena ka ho tsamaisa mocheso ka mokhoa o ikhethang, matla a mechini le botsitso ba ho kenya mocheso, ho nolofalletsa tsamaiso e sebetsang ea mocheso bakeng sa li-module tsa motlakase tsa moloko o latelang le li-inverter tsa likoloi.
Silicon Nitride Ceramic PCB ke eng?
Silicon nitride ceramic PCB substrates e entsoe ka silicon nitride, thepa e tsoetseng pele ea ceramic e nang le sebopeho sa kristale se fanang ka thepa e ikhethang ea mochini le mocheso. Lintho tse hlahisoang li hlahisoa ka mekhoa e chesang ea mocheso kapa ea khase ea sintering e etsang hore ho be le substrate e teteaneng, e ts'oanang e nang le porosity e fokolang, e leng se etsang hore ho be le conductivity ea mocheso ho tloha ho 70 ho ea ho 90 W / m · K bakeng sa ho senya mocheso o atlehang ho tloha lisebelisoa tsa semiconductor tsa matla.
Substrate hangata e kenyelletsa potoloho ea koporo e kopantsoeng ka mekhoa ea Direct Bonded Copper (DBC) kapa Active Metal Brazing (AMB). Mekhoa ena ea metallization e theha maqhama a matla a metallurgical pakeng tsa lera la koporo le substrate ea ceramic ntle le ho hloka lisebelisoa tsa sekhomaretsi tse mahareng, ho boloka thepa ea motlakase ea motlakase ha e ntse e fana ka litsela tse tlaase tsa ho hanyetsa mocheso bakeng sa ho tlosoa ha mocheso ho tloha likarolong tse bohlokoa.
Silicon Nitride Ceramic PCB vs. Traditional Ceramic Substrates
Ha e hlahlojoa khahlano le li-substrates tsa setso tsa ceramic, lisebelisoa tsa silicon nitride ceramic PCB li bonts'a litšobotsi tse ikhethang tsa ts'ebetso tse li etsang hore li tšoanelehe bakeng sa lits'ebetso tsa motlakase tse batloang.
Property
Si₃N₄
AlN
Al₂O₃
Property
Si₃N₄
AlN
Al₂O₃
Property
Si₃N₄
AlN
Al₂O₃
Property
Si₃N₄
AlN
Al₂O₃
Property
Si₃N₄
AlN
Al₂O₃
Li-substrate tsa PCB tsa ceramic tsa silicon nitride li koala likheo tsa ts'ebetso pakeng tsa alumina le aluminium nitride . Leha ho tsamaisa mocheso ho oela pakeng tsa thepa ena, silicon nitride e fana ka matla a ikhethang a ho tenyetseha a fihlang ho 800 MPa. Matla ana a mechini, hammoho le khanyetso e ikhethang ea ho thothomela ha mocheso, a nolofalletsa liboka tsa PCB tsa ceramic tsa silicon nitride ho mamella potoloho ea mocheso e pheta-phetoang le khatello ea mechini e ka behang li-substrate tse ling kotsing.
Melemo ea Bohlokoa ea Silicon Nitride Ceramic PCB
Theknoloji ea PCB ea Silicon nitride ceramic e fana ka melemo e mengata ea tekheniki e sebetsanang le mathata a bohlokoa ho lisebelisoa tsa motlakase tsa sejoale-joale. Motsoako o ikhethang oa thepa ea thepa o bakoa ke sebopeho sa eona sa kristale le ts'ebetso ea tlhahiso, e hlahisang litšobotsi tsa ts'ebetso tse loketseng likopo tse tšepahalang haholo. Melemo ea mochini le mocheso e kenyelletsa:
- Matla a ikhethang a mochini - Matla a Flexural a haufi le 800 MPa a hanela khatello ea libaesekele tse futhumetseng mme a thibela ho phatloha ha substrate nakong ea ts'ebetso ea kopano.
- Ho hanyetsa mocheso o phahameng oa mocheso - E mamella liphetoho tse potlakileng tsa mocheso ho tloha ho -55 ° C ho isa ho 150 ° C ntle le ho hlahisa li-microcracks kapa delamination.
- Insulation ea motlakase e tsitsitseng - E boloka matla a phahameng a dielectric le maemo a tlase a dielectric ho pholletsa le mefuta e mengata ea mocheso, e thibela ho senyeha ha motlakase lits'ebetsong tse phahameng haholo.
- Matlafatso ea nako e telele ea tikoloho - E hanela ho bola ha lik'hemik'hale 'me e boloka botsitso tlas'a ho sisinyeha, mongobo le mocheso o feteletseng.
Mehaho ena e kopantsoeng e etsa li-PCB tsa silicon nitride ceramic khetho e ratoang bakeng sa lits'ebetso tse hlokang ho tiea ha mochini le ho ts'epahala ha mocheso tlas'a maemo a feteletseng a ts'ebetso.
Tataiso ea Moqapi bakeng sa Silicon Nitride Ceramic PCB
Mehopolo ea Tsamaiso ea Mocheso
Moralo oa taolo ea mocheso bakeng sa likopano tsa silicon nitride ceramic PCB o hloka tlhokomelo e hlokolosi ho botenya ba koporo le sebopeho sa potoloho. Coefficient ea ho se lumellane ha katoloso ea mocheso lipakeng tsa koporo le silicon nitride e hloka khetho e nepahetseng ea botenya ba koporo ho laola khatello ea mocheso nakong ea baesekele ea mocheso. Baqapi ka tloaelo ba hlakisa likarolo tsa koporo lipakeng tsa 0.3 le 0.6 limilimithara tse botenya, tse leka-lekaneng matla a hona joale a ho jara khahlano le menahano ea khatello ea mochini bakeng sa ts'ebetso e nepahetseng ea silicon nitride ceramic PCB.
Litlhoko tsa Ts'ebetso ea Kopano
Ts'ebetso ea ho rekisa le ea ho kopanya e laola lifaele tsa mocheso ho thibela ho bokellana ho feteletseng ha khatello ea maikutlo likopanong tsa silicon nitride ceramic PCB. Litlaleho tsa "Reflow soldering" li lokela ho kenyelletsa litselana tsa ho futhumatsa butle-butle le tse pholileng tse lumellang ho phomola ha khatello ka har'a mohaho oa kopano. Lisebelisoa tsa solder tse se nang loto tse nang le lintlha tse qhibilihang tse loketseng le lisebelisoa tsa mochini li fokotsa tšenyo ea libaesekele tse futhumetseng ha li ntse li boloka likhokahano tse tšepahalang tsa motlakase.
Ntlafatso ea Ts'ebetso ea Litšenyehelo
Mabaka a litšenyehelo a susumetsa liqeto tsa khetho ea thepa, kaha li-substrate tsa PCB tsa ceramic tsa silicon nitride li laela litheko tse phahameng ha li bapisoa le mekhoa e meng ea aluminium oxide . Likopo tse hlokang ts'epo e phahameng le bophelo bo bolelele ba ts'ebetso li lokafatsa letsete lena ka litšenyehelo tse fokotsehileng tsa waranti le ts'ebetso e ntlafetseng ea sistimi. Lihlopha tsa meralo li lokela ho lekola litšenyehelo tsohle tsa beng ho fapana le litšenyehelo tsa substrate feela ha li khetha lisebelisoa bakeng sa lits'ebetso tsa bohlokoa tsa elektroniki tsa motlakase.
Mokhoa oa Tlhahiso bakeng sa Silicon Nitride Ceramic PCB
Tlhahiso ea Substrate
Tlhahiso ea silicon nitride ceramic PCB substrates e qala ka ho lokisa phofo le ho etsa ts'ebetso. Silicon nitride powder e kopantsoe le lithuso tsa sintering ebe e hatelloa ka har'a 'mele e tala e nang le taolo e nepahetseng ea sebopeho. Li-substrates tsena li na le mocheso o phahameng ka tlas'a maemo a leholimo a laoloang, hangata li sebelisa mekhoa ea ho hatisa ka mocheso o chesang kapa oa khase ho finyella tšubuhlellano e feletseng le matla a hlokahalang bakeng sa lisebelisoa tsa motlakase oa motlakase.
Koporo Metallization
Likarolo tsa potoloho ea koporo li hokahantsoe le substrate ea sintered ceramic ka lits'ebetso tse khethehileng tsa metallization. Theknoloji ea Direct Bonded Copper e hloka taolo e nepahetseng ea mocheso ho pota 1080 ° C ho theha ho khomarela metallurgical ntle le ho senya botšepehi ba substrate. Active Metal Brazing e sebelisa likarolo tsa tšepe tse sebetsang tse tlamahanang ka lik'hemik'hale holim'a ceramic, e fana ka mokhoa o mong bakeng sa lisebelisoa tse khethehileng tsa silicon nitride ceramic PCB.
Sebopeho sa Potoloho le Taolo ea Boleng
Phekolo ea holim'a metsi le mokhoa oa potoloho li latela ts'ebetso ea koporo ea koporo. Mekhoa ea Photolithographic e hlalosa mekhoa ea potoloho, 'me mekhoa ea etching e tlosa koporo e sa batleheng ho theha geometry ea potoloho ea ho qetela. Mekhoa ea ho laola boleng e netefatsa khanyetso ea mocheso, motlakase oa ho kenya letsoho, matla a ho khomarela a koporo, le ho nepahala ha silicon pele ho lokolloa likopano tsa silicon nitride ceramic PCB bakeng sa kopanyo ea mojule oa matla.
Likopo tsa mantlha tsa Silicon Nitride Ceramic PCB
Motlakase oa Motlakase oa Matla a Elektronike
Li-substrates tsa silicon nitride ceramic PCB li fetohile karolo ea bohlokoa ho li-inverters tsa motlakase tsa koloi le lisebelisoa tsa ho tjhaja ka holim'a sekepe. Lisebelisoa tsena li hloka li-substrates tse mamellang ho palama baesekele ea mocheso o sa khaotseng ha li ntse li boloka motlakase tlas'a maqhubu a phahameng a ts'ebetso. Matla a mochini a thibela tšenyo nakong ea ho thothomela ha koloi le ho ts'oha tseleng, ho netefatsa ts'ebetso e tsitsitseng bophelong bohle ba koloi.
IGBT le Power Semiconductor Modules
Li-module tsa IGBT le silicon carbide MOSFET li ntse li tsoela pele ho kenyelletsa likaroloana tsa silicon nitride ceramic PCB ho ntlafatsa taolo ea mocheso le ho ts'epahala. Thepa ea thermal ea substrate e etsa hore ho be le likhahla tse phahameng tsa hajoale ha ho ntse ho bolokoa mocheso oa mateano ka har'a meeli e amohelehang, e ts'ehetsa liphutheloana tse tsoetseng pele tse fokotsang inductance ea parasitic le ho hanyetsa mocheso.
Likoloi tsa Liindasteri
Li-drive frequency drives tsa li-motors tsa indasteri li sebetsa tlas'a maemo a thata a feme a nang le ho feto-fetoha ha mocheso, vibrate le lerata la motlakase. Likopano tsa Silicon nitride ceramic PCB li fana ka ts'epo le ts'ebetso ea mocheso e hlokahalang bakeng sa ts'ebetso e tsoelang pele maemong ana a boima, ho thibela ho hloleha lits'ebetsong tsa taolo ea motlakase o phahameng ha o ntse o ts'ehetsa meralo ea compact drive.
Aerospace Power Systems
Litsamaiso tsa kabo ea matla a lifofane, li-transmitters tsa radar, le lisebelisoa tsa elektroniki tsa ts'ireletso li hloka li-module tsa matla tse sebetsang ka ts'epahalo ho theosa le mocheso o feteletseng. Theknoloji ea Silicon nitride ceramic PCB e kopana le litlhoko tsena ka mokhoa o ikhethang oa ho hanyetsa mocheso oa mocheso le matla a mochine, ka botsitso ba thepa tlas'a mahlaseli a mahlaseli a kotsi a atolosang ts'ebetso ea lisebelisoa tsa matla tse thehiloeng sebakeng.
fihlela qeto e
Theknoloji ea Silicon nitride ceramic PCB e itlhomme e le tharollo ea tonakholo ea substrate bakeng sa lits'ebetso tsa motlakase tsa motlakase. Motsoako oa thepa ea matla a mochini, ho hanyetsa mocheso oa mocheso, le ho kenya motlakase o tšepahalang o sebetsana le mathata a bakoang ke ho eketseha ha matla a motlakase le maemo a thata a ts'ebetso. Ha likoloi tsa motlakase, lits'ebetso tsa matla a tsosolositsoeng, le li-automation tsa indasteri li ntse li tsoela pele, likopano tsa silicon nitride ceramic PCB li tla bapala karolo ea bohlokoa le ho feta ho nolofalletsa phetoho e matla, e sebetsang hantle.
Highleap Electronics e fana ka bokgoni bo felletseng ba tlhahiso ya PCB ya ceramic ya silicon nitride :
- Ts'ebetso e tsoetseng pele ea ceramic substrate - Precision DBC le AMB metallization bakeng sa ts'ebetso e nepahetseng ea mocheso le mochini
- Tsebo ea netefatso ea boleng - Liteko tse matla tsa liteko tsa ho hanyetsa mocheso, voltage ea ho kenya letsoho le netefatso ea koporo
- Litšebeletso tsa tšehetso ea boenjiniere - Therisano ea moralo bakeng sa ntlafatso ea taolo ea mocheso le tataiso ea khetho ea thepa
- Tlhahiso e phahameng ea ts'epahalo - Litaolo tsa ts'ebetso tse etselitsoeng litlhoko tsa motlakase oa likoloi, tsa sefofane le tsa indasteri
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Mokhoa oa ho fumana quote bakeng sa li-PCB
Ha re u etsetse tlhahlobo ea DFM/DFA 'me re khutlele ho uena ka tlaleho. U ka kenya lifaele tsa hau ka mokhoa o sireletsehileng ka webosaete ea rona. Re hloka lintlha tse latelang ho u fa quote:
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- Gerber, ODB++, kapa .pcb, spec.
- Lethathamo la BOM haeba o hloka kopano
- bongata
- Nako ea ho fetoha
Ntle le tlhahiso ea PCB, re fana ka mefuta e fapaneng ea lits'ebeletso tsa elektroniki, ho kenyeletsoa moralo oa PCB, PCBA, le tharollo ea turnkey. Hore na o hloka thuso ka prototyping, netefatso ea moralo, ho fumana likarolo, kapa tlhahiso e ngata, re fana ka ts'ehetso ea ho qetela ho netefatsa katleho ea morero oa hau.
Bakeng sa litšebeletso tsa PCBA, ka kopo fana ka BOM ea hau (Bill of Materials) le litaelo tse itseng tsa kopano. Re boetse re fana ka tlhahlobo ea DFM/DFA ho ntlafatsa meralo ea hau bakeng sa tlhahiso le kopano, ho netefatsa ts'ebetso ea tlhahiso e boreleli.
