Taolo ea Mocheso ho Li-PCB tsa Semiconductor: Maano a Moralo oa Likopo tse Matla a Phahameng

Selelekela

Ha matla a disebediswa tsa semiconductor a ntse a eketseha le maemo a kopanyo a ntse a eketseha, taolo ya mocheso e se e le phephetso ya bohlokwa ya moralo boenjiniereng ba sejwalejwale ba PCB. Tsamaiso e sebetsang ya mocheso ho di-PCB tsa semiconductor e bohlokwa ho netefatsa botshepehi le botsitso ba nako e telele ditshebedisong tsa matla a phahameng le tse nang le bongata bo boholo.

Bokhoni ba ho tsamaisa mocheso ka nepo hole le likarolo tsa bohlokoa bo ama ts'ebetso ea sesebelisoa ka kotloloho, botšepehi bo kopaneng ba solder, le bophelo bohle ba sistimi. Sengoliloeng sena se hlahloba maano a meralo ea mocheso a netefalitsoeng ho kenyelletsa kaho ea tšepe ea PCB, ho kenya chelete ea tšepe ea koporo, li-array tsa mocheso oa ka har'a pad, le ts'ebetso e matla ea koporo. Ho utloisisa mahlale ana ho thusa baenjiniere ho khetha tharollo e nepahetseng bakeng sa lits'ebetso tse ikhethileng tsa semiconductor.

Hobaneng ha Tsamaiso ea Thermal e le Taba ho Semiconductor PCBs

Ho bokellana ha mocheso ka har'a li-circuits tsa semiconductor ho senya ts'ebetso ka kotloloho mme ho potlakisa ho hloleha ha likarolo. Lithempereichara tse phahameng tsa matekoane li fokotsa lebelo la ho fetoha ha transistor, li eketsa maqhubu a ho lutla, le ho fetola liparamente tsa motlakase ho feta mamello e amohelehang. Bakeng sa li-semiconductors tsa motlakase tse kang li-IGBT le li-MOSFET, mocheso o feteletseng o baka maemo a mangata a ka senyang lisebelisoa ka har'a milliseconds.

Khatello ea Mocheso le Mekhoa ea ho Hlōleha

Khatello ea mocheso e baka mekhoa e mengata ea ho hlōleha ho pholletsa le kopano. Coefficient of thermal expansion (CTE) e sa tsamaisane lipakeng tsa thepa e baka khatello ea cyclic nakong ea ho fetoha ha mocheso, e tsepamisitse maikutlo manonyeletsong a solder le ho baka ho ata ha crack. Delamination ea sephutheloana e etsahala ha ho khomarela lifahleho tse fapaneng ho hlōleha tlas'a libaesekele tse futhumatsang, ho senya ts'ebetso ea motlakase le ea mocheso.

Litlhoko tsa Mocheso oa ho sebetsa

Li-PCB tsa boemo ba bareki hangata li sebetsa ka tlase ho 85 ° C, ha liboto tsa ho paka tsa semiconductor li tlameha ho boloka ts'ebetso mochesong oa mateano o fetang 150 ° C. Li-module tsa motlakase bakeng sa lits'ebetso tsa likoloi le tsa indasteri li tobana le mocheso o fihlang ho 125 ° C 'me libaka tse chesang tsa lehae li atamela 175°C. Maemo ana a boima a etsa hore moralo o matla oa ho qhala mocheso oa PCB e be oa bohlokoa bakeng sa lits'ebetso tsa bohlokoahali.

Mekhoa ea ho Felisa Mocheso ho PCB Design

Ho utloisisa litsela tsa mantlha tsa mocheso ho thusa moralo o sebetsang oa PCB oa taolo ea mocheso. Mocheso o phalla ka mekhoa e meraro ea mantlha ho li-PCB tsa semiconductor, e 'ngoe le e' ngoe e hloka ntlafatso e khethehileng ea moralo.

Ho tsamaisoa ka Mekhahlelo ea Koporo

Likarolo tsa koporo li sebetsa e le li-conductors tsa mantlha tsa mocheso meahong ea PCB. Ho eketseha ha botenya ba koporo ho tloha ho 1 oz ho isa ho 3 oz kapa boima bo boholo ho fokotsa ka kotloloho ho hanyetsa mocheso ka lifofane tse tšekaletseng. Mocheso o ata ka lehlakoreng le leng ho pholletsa le lifofane tsa koporo pele o fetisetsoa lits'ebetsong tsa ho pholisa kantle, 'me likarolo tse ka hare li kenya letsoho haholo ha li hokahane hantle ka mocheso ka meaho.

Litsela Tse Otlolohileng tsa Thermal tse nang le Via Arrays

Thermal vias bopa likanale tse otlolohileng tsa mocheso ka mekhahlelo ea dielectric:

• Ho ntša mocheso o tobileng - Meralo ea Via-in-pad ka tlasa likarolo e fokotsa bolelele ba tsela ea mocheso
• Dense array tlhophiso - Lipaterone tsa 0.3mm tsa molumo li sebetsa joalo ka litšiea tse tiileng tsa koporo ha li tlatsitsoe hantle
• Sebaka se nepahetseng - Maemo a mahlale a leka-lekanya litlhoko tsa motlakase le ts'ebetso ea mocheso

Ho Hasoa ha Mocheso ka Lisebelisoa tsa Base

Lisebelisoa tsa dielectric li hlahisa libotlolo tsa mocheso ka lebaka la conductivity e tlase ea tlhaho ha e bapisoa le koporo. Standard FR4 e fana ka conductivity ea mocheso ho pota 0.3 W/m·K, ha li-laminate tse khethehileng tse sebetsang hantle li fihla ho 1-2 W/m·K. Khetho ea lisebelisoa tsa motheo e ama haholo ho hanyetsa mocheso ka kakaretso, haholo-holo libakeng tse tšesaane tsa dielectric pakeng tsa mehloli ea koporo le mocheso.

Theknoloji e tsoetseng pele ea tsamaiso ea mocheso bakeng sa li-PCB tsa Semiconductor

Metal Base PCB (IMS PCB)

Metal base PCB kaho e sebelisa aluminium kapa li-copper substrates joalo ka metheo ea meralo. Mokokotlo o tloaelehileng o na le lera la motheo oa tšepe (1-3mm e teteaneng), mocheso oa dielectric conductive (0.1-0.2mm), le sekhahla sa potoloho ea koporo. Sebopeho sena se finyella litekanyetso tsa mocheso oa mocheso o fetang 2 W / m·K, o fokotsa ka mokhoa o tsotehang ho hanyetsa mocheso.

Meaho ea IMS PCB e fana ka ts'ebetso e ikhethang ka mekhoa e 'maloa:

• Tsela e khuts'oane ea mocheso - Phallo e tobileng ea mocheso ho tloha likarolong ho ea motheong oa tšepe e fokotsa mocheso oa matekoane
• Ho jala mocheso o tšoanang - Substrate e kholo ea tšepe e aba meroalo ea mocheso sebakeng sohle sa boto
• Kenyelletso e kopaneng - Metal base e sebetsa ka nako e le 'ngoe e le sethala sa mocheso le sebaka sa sehokelo sa chassis

Meaho ena e ipabola ka har'a liboto tsa bakhanni ba LED, likopano tsa MOSFET tsa matla, le li-module tsa taolo ea makoloi tse hlokang mocheso o ts'oanang o phatlalla le libaka tse kholo.

Copper Coin PCB Technology

Ho kenya chelete ea tšepe ea koporo ho rarolla mathata a mocheso sebakeng sa heno ka ho beha li-block tsa koporo tse teteaneng (0.5-3mm) ka tlas'a lisebelisoa tse matla haholo. Lichelete tsena tsa tšepe tsa koporo li etsa litsela tse kholo tse hanyetsanang le mocheso ho tloha liphatlalatsong tsa lisebelisoa ho ea holimo ho PCB, ho ipaka ho sebetsa ka ho khetheha bakeng sa mehloli ea mocheso e tsitsitseng moo likarolo tse tloaelehileng tsa koporo li ke keng tsa fana ka ts'ebetso e lekaneng ea mocheso.

Tlhahiso e hloka mekhoa e nepahetseng ea ho hatella le ho lamination ho netefatsa ho bata le ho tlamahanngoa hantle. Lichelete tsa tšepe tsa koporo li tlameha ho behoa ka nepo le ho lekanngoa le lisebelisoa tsa dielectric tse potolohileng ho thibela ntoa. Ho sa tsotellehe ho rarahana ha thepa, ho kopanya lichelete tsa tšepe tsa koporo ho fokotsa khanyetso ea mocheso ho ea ho 40-60% ha e bapisoa le mehaho e tloaelehileng.

Ts'ebetsong ea Lera le Letenya la Koporo

Meetso ea PCB e teteaneng e sebelisa boima ba koporo ba 3 oz (105 μm) ho isa ho 10 oz (350 μm) kapa boima ho feta. Likarolo tsena li sebeletsa merero e 'meli: ho jara meroalo e phahameng ea hona joale ha ho ntse ho fana ka conduction e phahameng ea mocheso. Li-circuits tsa phetoho ea matla, bakhanni ba IGBT, le li-inverter tse tsamaisang likoloi hangata li sebelisa koporo e teteaneng bakeng sa ho laola litlhoko tsa motlakase le tsa mocheso.

Ts'ebetso ea ho etsa e hloka mekhoa e khethehileng ea ho thaepa le li-parameter tse lokisitsoeng tsa lamination ho lefella mefuta e fapaneng ea bophahamo ba z-axis. Ho sa tsotellehe litšenyehelo tse eketsehileng tsa ho etsa thepa, liqapi tse teteaneng tsa koporo li felisa tlhokahalo ea mehaho e fapaneng ea tsamaiso ea mocheso lits'ebetsong tse ngata tse phahameng tsa morao-rao.

Thermal Via Arrays le Heat Sink Interface

Thermal ea maano ka ho bea e theha litsela tse felletseng tsa mocheso ho tloha ho karolo ho ea ho sistimi ea ho pholisa kantle. Ka mekhoa e ka tlas'a liphutheloana tsa BGA le lisebelisoa tsa motlakase hangata li sebelisa masoba a bophara ba 0.3-0.5mm ho sebaka sa 0.8-1.2mm. Li-vias tse tlatsitsoeng tse nang le li-plug tsa koporo li fana ka ts'ebetso e nepahetseng, leha ho le joalo ka capping e fana ka khetho e ntle haholo.

Khokahano lipakeng tsa PCB le lisinki tsa mocheso tsa kantle e hloka lisebelisoa tsa mocheso oa mocheso (TIMs) ho tlatsa likheo tse nyane tsa moea tse ka sitisang phetisetso ea mocheso. Li-module tsa matla tsa SiC le li-amplifiers tse phahameng haholo li rua molemo ho mocheso o ntlafalitsoeng ka marang-rang a bolokang mocheso oa mateano ka har'a mekhahlelo e sireletsehileng ea ts'ebetso.

Litlhaloso tsa Boitsebiso bakeng sa ho Felisa Mocheso o Atlehileng

Khetho ea thepa ea substrate e khetholla meeli ea ts'ebetso ea mocheso tsamaisong ea mocheso ea PCB ea semiconductor:

• FR4 e tloaelehileng - 0.3 W / m · K conductivity ea mocheso, e lekaneng bakeng sa lisebelisoa tsa matla a tlaase
• Polyimide ea ts'ebetso e phahameng - 0.5-0.8 W / m · K, e loketseng meroalo e itekanetseng ea mocheso
• Substrate ea aluminium - 1.5-2.0 W / m · K, e ntle haholo bakeng sa ho jala mocheso o tšoanang
• Substrate ea koporo - 3.5-4.0 W / m · K, ts'ebetso e phahameng ea mocheso bakeng sa meralo ea motheo ea tšepe

Lisebelisoa tsa Ceramic tse tsoetseng pele

Li-substrate tsa ceramic li emela tharollo ea boleng bo holimo bakeng sa litlhoko tse feteletseng tsa mocheso. Aluminium nitride (AlN) e fihlella 170-180 W/m·K, ha alumina (Al₂O₃) e fana ka 24-28 W/m·K. Likhetho tsena tsa ceramic PCB li boloka thepa e ntle ea dielectric mochesong o phahameng, e leng se etsang hore e be tse loketseng li-amplifiers tsa matla a RF le li-module tsa matla a phahameng.

Sekhahla sa dielectric insulation meralo ea motheo ea tšepe se theha botlolo ea mantlha ea mocheso. Meetso e tsoetseng pele ea polymer e nang le li-ceramic fillers e fihletse boleng ba conductivity ea mocheso oa 2-5 W/m·K ka thepa e lokiselitsoeng tlhahiso, leha ho leka-lekanya conductivity ea mocheso le matla a dielectric le litšenyehelo e ntse e le khoebo ea bohlokoa ea boenjiniere.

Ntlafatso ea Moqapi le Teko ea ho Tšepahala ho Thermal

Thermal Simulation ho PCB Design

Computational thermal modelling e khetholla libaka tse chesang le ho netefatsa mekhoa ea moralo pele ho etsoa. Finite element analysis (FEA) software e lekanya kabo ea mocheso ho pholletsa le meaho ea PCB, e ikarabella bakeng sa geometry ea koporo, ka lipaterone, le ho felloa ke matla ka likarolo. Ketsiso ea mohato oa pele e etsa hore ho be bonolo ho ntlafatsa ntle le ho bitsa chelete e ngata ea mohlala.

Lintlha tsa Moqapi oa Bohlokoa bakeng sa Tsamaiso ea Thermal

Khetho ea botenya ba koporo e lekanya ts'ebetso ea mocheso le lithibelo tsa tlhahiso le litšenyehelo. Ka ho behoa ho tlameha ho fana ka litsela tse tobileng tsa mocheso ho tloha ho likarolo tsa likarolo ho ea ho lihlopha tse hasang mocheso. Bophahamo ba liphahlo tsa mocheso bo tlameha ho fetela ka nģ'ane ho likarolo tsa maoto ho thusa hore mocheso o kene ka har'a koporo e potolohileng, ha sebaka se arohaneng se tlameha ho ikarabella bakeng sa ho kopana ha mocheso pakeng tsa lisebelisoa tse haufi.

Netefatso ea Ts'ebetso ea Thermal

Liteko tsa libaesekele tse futhumetseng li netefatsa ho ts'epahala ha kopanelo ea solder le botsitso ba thepa ho pholletsa le mefuta ea mocheso oa ts'ebetso. 'Mapa oa infrared thermal o senola kabo ea 'nete ea mocheso nakong ea ts'ebetso ea motlakase, e netefatsa mehlala ea papiso le ho tseba libaka tse chesang tse sa lebelloang. Netefatso ea mocheso oa khalase (Tg) e tiisa hore lisebelisoa tsa dielectric li boloka botšepehi ba sebopeho ho mocheso o phahameng oa ho sebetsa.

Libaka tsa Kopo tsa Li-PCB tsa Tsamaiso ea Thermal

Di-module tsa semiconductor tsa matla bakeng sa ditshebediso tsa IGBT le MOSFET di hloka ditharollo tse matla tsa mocheso ho sebetsana le tshebetso e tswelang pele ya motlakase o phahameng. Di-inverter tsa ho hula ha motlakase tsa dikoloi le di-drive tsa dienjini tsa diindasteri hangata di sebedisa meralo ya motheo wa tshepe kapa ya koporo e teteaneng hammoho le ho kenya tjhelete ya koporo tlasa disebediswa tsa ho tjhentjha.

Litsamaiso tsa mabone a LED le lihlopha tsa mabone a likoloi li sebelisa li-PCB tsa mantlha tsa tšepe ho ntša mocheso ho tsoa ho li-LED tse tletseng batho ba bangata. Li-amplifier tsa matla a RF litsamaisong tsa puisano le tsa radar li hloka li-substrate tsa PCB tsa ceramic ho laola meroalo e kopaneng ea mocheso ha li ntse li boloka botšepehi ba lets'oao maqhubung a phahameng.

Dimojule tsa converter tsa DC/DC le diboto tsa inverter di rua molemo ho thermal ka di-array tse etsang ditsela tse ngata tsa ho ntsha mocheso. Ho qhala ha mocheso disebedisweng tsa semiconductor ho ba bohlokwa haholo ha bongata ba matla bo ntse bo eketseha meralong ya converter e nyane bakeng sa ditshebediso tsa motlakase wa diindasteri.

fihlela qeto e

Taolo e sebetsang ea mocheso ho li-PCB tsa semiconductor e etsa qeto ea ho ts'epahala ha sistimi le ts'ebetso lits'ebetsong tse matla a phahameng. Khetho pakeng tsa tšepe ea tšepe ea PCB, ho kenya chelete ea tšepe ea koporo, likarolo tse teteaneng tsa koporo, kapa mocheso o tsamaeang ka lihlopha o itšetlehile ka litlhoko tse khethehileng tsa mocheso, mekhoa ea kabo ea matla le lithibelo tsa litšenyehelo. Moralo o atlehileng oa mocheso o hloka ho kopanngoa kapele ha lintlha tsena ho liqeto tsa moralo oa PCB, ho netefatsa ho beoa ha likarolo, kabo ea koporo, le ka ho beha mosebetsi hammoho e le sistimi e felletseng ea mocheso.

Highleap Electronics e fana ka litharollo tse felletseng tsa taolo ea mocheso:

• Ho kenya chelete ea tšepe ea koporo - Ho beoa ka nepo le ho lamination bakeng sa taolo ea sebaka se chesang
• Metal base PCB e entsoeng ka tšepe - Meetso ea aluminium le koporo ea substrate e nang le likarolo tse ntlafalitsoeng tsa dielectric
• Meetso e boima ea koporo - Ho fihla ho 10 oz boima ba koporo bakeng sa lits'ebetso tsa morao-rao le tse nang le mocheso o phahameng haholo
• Thermal ketsiso tšehetso - Ntlafatso ea moralo le netefatso pele o etsoa
• Litšebeletso tse felletseng tsa kopano - Ho tloha tlhahiso ea PCB ka kopano ea ho qetela le liteko

Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka litlhoko tsa mocheso bakeng sa projeke ea hau e latelang ea motlakase oa motlakase. Re fana ka boeletsi ba moralo le boiphihlelo ba tlhahiso ho netefatsa hore li-PCB tsa hau tsa semiconductor li fihlella ts'ebetso e ntle ka ho fetisisa ea ho qhala mocheso.