Lisebelisoa tsa PCB tsa Semiconductor: Tataiso ea Khetho ea Setegeniki

Selelekela

Lisebelisoa tsa Semiconductor PCB li tobane le litlhoko tse sa tloaelehang phetisong ea RF, ho tsamaisa mats'oao a lebelo le holimo, taolo ea matla le maemo a mocheso a phahameng. Thepa ea substrate ka ho toba e etsa qeto ea botšepehi ba pontšo, ts'ebetso ea mocheso, le ho tšepahala ha kopano.

Tataiso ena e hlahloba thepa ea semiconductor PCB ka lilense tse tharo tsa bohlokoa: mekhahlelo ea thepa le thepa ea tsona ea 'mele, matšoao a bohlokoa a ts'ebetso a susumetsang khetho ea thepa, le meralo ea liqeto tse sebetsang bakeng sa ho bapisa thepa le lits'ebetso tse itseng.

Ke Hobane'ng ha Semiconductor PCB Materials e le Bohlokoa

Methati ea Ts'ebetso ea Motlakase

Dielectric constant (Dk) le dissipation factor (Df) ha e le hantle e laola boleng ba phetiso ea mats'oao ho lisebelisoa tsa PCB tsa semiconductor. Litekanyetso tsa Dk tse tlase li fokotsa tieho ea phatlalatso ea mats'oao le ho fokotsa phapang ea impedance, ha Df e tlase e amana ka kotloloho le tahlehelo e fokotsehileng ea ho kenya maqhubu a phahameng. Tahlehelo ea tahlehelo e ba ea bohlokoa ka holimo ho 10 GHz, moo le mefuta e sa tšoaneng ea thepa e bakang liphoso tse lekantsoeng.

Litlhoko tsa Tsamaiso ea Mocheso

Thermal conductivity e etsa qeto ea bokhoni ba ho qhala mocheso ho tloha likarolong tse sebetsang ho ea ho li-heatsink tse ka ntle kapa moea o potolohileng. The coefficient of thermal expansion (CTE) mismatch pakeng tsa thepa ea semiconductor PCB le silicon e shoa e hlahisa khatello ea kelello nakong ea mocheso oa libaesekele. Khatello ena e lebisa tlhokomelo ho manonyeletso a solder le li-wire bonds, ho potlakisa ho hlōleha ha mokhathala. Lisebelisoa tse nang le litekanyetso tsa CTE tse haufi le silicon (hoo e ka bang 2.6 ppm/°C) li bontša botšepehi bo phahameng ba nako e telele.

Litlhoko tsa ho paka tsa Substrate

Li-substrate tsa ho paka tsa semiconductor li beha litlhoko tse thata ho feta li-PCB tse tloaelehileng. Bophara ba mela bo ka tlase ho li-micrometer tse 25, mamello ea ngoliso ea lera ho isa ho lera e ka tlase ho li-micrometer tse 15, le lipotoloho tse ngata tsa mocheso o phahameng li hloka thepa e nang le botsitso bo ikhethang ba litekanyo. Mocheso oa phetoho ea khalase o fetang 170°C o thibela ho warpage le delamination nakong ea lits'ebetso tsa kopano e se nang loto ho fihlela ho 260°C.

Mefuta ea Lisebelisoa tsa Semiconductor PCB

Phahameng-Tg FR-4 le Modified Epoxy Laminates

Mefuta e phahameng ea Tg FR-4 e fana ka mocheso oa phetoho ea khalase pakeng tsa 170 ° C le 180 ° C ha e bapisoa le mefuta e tloaelehileng ea FR-4's 130-140 ° C. Lisebelisoa tsena tsa PCB tsa semiconductor li boloka botsitso ba sebopeho ka li-profiles tse se nang lead. Li-constants tsa dielectric hangata li tloha ho 4.2 ho isa ho 4.6 ho 1 MHz, ka lintlha tsa ho qhala ho pota 0.020.

E boloka litšenyehelo bakeng sa li-circuits tsa digital tse sebetsang ka tlase ho 1 GHz, high-Tg FR-4 e lumellana le liboto tsa phepelo ea motlakase le li-interfaces tsa lebelo le itekanetseng. Leha ho le joalo, phapang ea Dk ka makhetlo a mangata le mocheso o fokotsa ho nepahala ha lits'ebetso tsa RF. Thermal conductivity e lula e itekanetse ho 0.3-0.4 W/m·K, e hlokang moralo o hlokolosi oa sefofane sa koporo bakeng sa ho hasana ha mocheso o lekaneng.

Li-Laminates tsa Polyimide le Mocheso o Phahameng

Lisebelisoa tsa PCB tse thehiloeng ho semiconductor tse thehiloeng ho polyimide li mamella ts'ebetso e tsoelang pele ho 200°C ka mocheso oa phetoho ea khalase o fetang 250°C. Ho tsitsa hona ha mocheso ho nolofalletsa lipotoloho tse ngata tsa ho phalla hape ntle le ho aroloa kapa ho sotha ha boholo. Litekanyetso tsa CTE tse ka bang 12-16 ppm/°C li fana ka ho lumellana hamolemo le liphutheloana tsa ceramic ho feta li-resin tse tloaelehileng tsa epoxy.

Lisebelisoa tsena li ipabola ho lisebelisoa tsa elektroniki tsa likoloi tsa underhood, lisebelisoa tsa sefofane, le liphutheloana tse tsoetseng pele tsa flip-chip moo ho palama libaesekele tse futhumetseng ho fetang lipotoloho tse 1000. Thekiso ea khoebo e kenyelletsa ho monya mongobo o phahameng ho feta lisebelisoa tsa PTFE le lintlha tse phahameng ka ho fetesisa tsa 0.008-0.012 ho 10 GHz.

PTFE le PTFE-Composite Materials

PTFE e hloekileng e fana ka ts'ebetso e ikhethang ea motlakase ka boleng ba Drk ba 2.1 le lintlha tsa ho qhalana ka tlase ho 0.0002 ho pholletsa le maqhubu a microwave. Li-composites tsa PTFE-ceramic li eketsa Drk ho 2.2-10.2 bakeng sa meralo ea impedance e laoloang ha li ntse li boloka Df e le ka tlase ho 0.002. Lisebelisoa tsena tsa PCB tsa semiconductor li bontša ho qhalana ho fokolang ha dielectric ho fihlela ho 77 GHz.

Li-antenna tsa millimeter-wave, liamplifiers tse lerata le tlase, le litsela tse nepahetseng tsa RF tse tsamaisanang le mekhahlelo li hloka botsitso ba PTFE. Mathata a kenyelletsa ho khomarela koporo e fokolang e hlokang phekolo e khethehileng ea holim'a metsi le katoloso e phahameng ea mocheso (CTE 70-100 ppm/°C bakeng sa PTFE e hloekileng). Lisebelisoa tsa PTFE tse tletseng ka ceramic li fokotsa CTE ho 24-30 ppm/°C ha li ntse li ntlafatsa matla a mochine.

Lisebelisoa tsa Ceramic

Lisebelisoa tsa Alumina (Al₂O₃) li fana ka tsamaiso ea mocheso ea 24-28 W/m·K ka CTE ea 6.5-7 ppm/°C. Aluminium nitride (AlN) e fihlella tsamaiso ea mocheso e fetang 170 W/m·K ha e ntse e boloka insulation ea motlakase e kaholimo ho 10¹⁴ Ω·cm. Lisebelisoa tsena tsa PCB tsa semiconductor li nolofalletsa ho hokela ka kotloloho ntle le lisebelisoa tsa sebopeho sa mocheso oa polymer.

Li-amplifiers tsa RF tse matla a phahameng, li-module tsa IGBT, le liphutheloana tsa LED li phahamisa ts'ebetso ea mocheso oa ceramic. Alumina e bitsa chelete e fokolang empa e hloka litšepe tse teteaneng bakeng sa ho hasa mocheso o lekaneng. Khokahano e phahameng ea AlN e lumella meralo e mesesane e nang le khanyetso e tlase ea mocheso. Mechine ea brittle fracture e hloka ho tšoaroa ka hloko nakong ea kopano.

Li-laminates tse khethehileng tsa RF

letoto la laminate le nang le tahlehelo e tlase le thepa e tšoanang ea hydrocarbon-ceramic e leka-lekanya ts'ebetso le tlhahiso. Litlhaloso tse tloaelehileng li kenyelletsa Dr ea 3.38-3.48 ka li-coefficients tsa mocheso tse ka tlase ho 50 ppm/°C, le Df e ka tlase ho 0.004 ho 10 GHz. Lisebelisoa tsena tsa semiconductor PCB li sebetsa ka ho sebelisa lisebelisoa tse tloaelehileng tsa PCB ha li ntse li fana ka botsitso ba sehlopha sa RF.

Marang-rang a sefa, li-circuits tse tsamaisanang le amplifier ea matla, le li-radar-end-end li rua molemo ho mamello ea Dk (± 0.05) le ho monya mongobo o tlase ka tlase ho 0.06%. Ho fapana le PTFE e hloekileng, li-laminate tsena li lumella hore ho be le ho pata ka lesoba le kaho ea li-multilayer ka prepreg e tloaelehileng. Maemo a theko lipakeng tsa li-composite tse phahameng tsa Tg FR-4 le PTFE li etsa hore e be tse nepahetseng bakeng sa tlhahiso ea RF.

Metal-Core le Insulated Metal Substrates

Lipoleiti tsa motheo tsa aluminium kapa tsa koporo li tsamaisa mocheso ka kotloloho ho tloha libakeng tse holang ho ea ho heatsinks kapa chassis. Likarolo tsa dielectric ho tloha ho li-micrometer tse 50 ho isa ho tse 200 li arola mesaletsa ea potoloho ho tloha mokokotlong oa tšepe. Maemo a ho hanyetsa mocheso a fihla ho 0.5-2 °C·cm²/W ho latela botenya ba dielectric le conductivity ea mocheso.

Lisebelisoa tsa matla a LED, li-drive tsa likoloi, le li-circuits tse nang le lehlakore le le leng le phahameng li sebelisa lisebelisoa tsa PCB tsa tšepe-core semiconductor bakeng sa tsamaiso ea mocheso. Li-substrates tsena hangata li tšehetsa li-circuits tse nang le mahlakore a mabeli feela, li fokotsa ho rarahana ha litsela ha li bapisoa le li-multilayer ceramic kapa organic substrates.

Moralo oa Qeto ea ho Khetha Lintho

Khetho e Thehiloeng khafetsa

Maqhubu a ts'ebetso a theha meeli ea mantlha ea lisebelisoa tsa semiconductor PCB:

• Ka tlase ho 1 GHz - High-Tg FR-4 e fana ka botsitso bo lekaneng ba dielectric bakeng sa lipotoloho tse ngata tsa analoge tsa dijithale le tse itekanetseng tse nang le melemo ea litšenyehelo.
• 1-10 GHz sebaka – Thepa e nang le Df e tlase e nang le di-laminate tsa mofuta wa laminate tse nang le tahlehelo e tlase le di-composite tsa PTFE e le bakhethoa ba mantlha ba ho boloka lets'oao.
• Ka holimo ho 20 GHz - Lisebelisoa tsa PTFE-based semiconductor PCB li fokotsa tahlehelo ea ho kenya le ho sotha ha mekhahlelo lits'ebetsong tsa millimeter-wave.
• Lisebelisoa tsa Broadband - Lisebelisoa tse nang le khaso e fokolang ea Dk ho potoloha khafetsa li thibela ho lieha ha sehlopha ho litsamaiso tse pharaletseng.

Mehopolo ea Matla a Matla

Litlhoko tsa mocheso oa mocheso li khanna khetho ea thepa ea mocheso. Dissiption e ka tlase ho 5 W/cm² e lumella li-substrates tse tloaelehileng tse nang le li-vias tse futhumetseng le lifofane tsa koporo. Mocheso o tsoang ho 5-15 W/cm² o hloka meralo ea mantlha ea tšepe kapa meaho ea koporo e tenya e nang le mocheso o matlafalitsoeng ka lihlopha. Lisebelisoa tse fetang 15 W/cm² li hloka likaroloana tsa ceramic kapa meaho e nyalisitsoeng e kopanyang lihlekehleke tsa lehae tsa ceramic le likarolo tsa organic routing.

Litlhokahalo tsa Range ea Mocheso

Mekhahlelo ea mocheso oa tikoloho e tsebisa litlhoko tsa thepa bakeng sa thepa ea semiconductor PCB. Litekanyetso tse tloaelehileng tsa indasteri (-40 ho isa ho 85 ° C) li lumellana le lisebelisoa tsa epoxy tse phahameng tsa Tg. Lisebelisoa tsa likoloi tse ka tlas'a lefatše le tsa sefofane tse hlokang -55 ho 150 ° C ts'ebetso e tsoelang pele li laela litsamaiso tse thehiloeng ho polyimide. Lithempereichara tse phahameng ka holimo ho 260 ° C kapa li-cycle tse ngata tsa mocheso li rata polyimide kapa lisebelisoa tse phahameng tsa epoxy tse nang le khanyetso e netefalitsoeng ho delamination.

Ho lumellana ha Mokhoa oa Tlhahiso

Bokhoni ba ho kopanya bo koala sekgoqetsane sa kgetho. Methapo e tloaelehileng ya SMT e sebetsana le di-laminate tsa laminate tse nang le tahlehelo e tlase tsa FR-4 le tse ikgethang ntle le phetoho ya disebediswa. Disebediswa tsa PTFE di hloka diparamithara tse fetotsweng tsa ho tjheka, kalafo ya plasma bakeng sa kgomarelo, le dipotoloho tsa kgatiso tse laolwang. Di-substrate tsa ceramic di hloka disebediswa tse ikgethang tsa ho etsa tshepe le ditshebetso tsa ho betla kapa ho sothela tse sa tsamaellaneng le dikarolo tsa tlhaho.

Lintlha tsa Tlhahiso bakeng sa Lisebelisoa tsa Semiconductor PCB

Copper Foil le Surface Qetella

Khetho ea foil ea koporo e ama ts'ebetso ea motlakase le ea mocheso ho lisebelisoa tsa PCB tsa semiconductor. Koporo e tloaelehileng ea electrodeposited (0.5-2 oz) e lekane bakeng sa ho tsamaisa lipontšo, ha koporo e boima (3-10 oz) e fokotsa tahlehelo e thibelang matla kabong ea matla. Li-foil tsa koporo tsa boemo bo tlase haholo li fokotsa litlamorao tsa bokaholimo ba tahlehelo ea ho kenya ka holimo ho 10 GHz, e leng ea bohlokoa bakeng sa ho boloka melemo e tlase ea Df.

Khemistri ea ho qetela ea sefahleho e ama solderability le ts'epahalo ea nako e telele. Electroless nickel mersion gold (ENIG) e fana ka bophelo bo botle ba lishelefo le khokahano ea terata empa e hlahisa tahlehelo ea mats'oao ka maqhubu a phahameng. Silivera e qoelisoang kapa organic solderability lintja tse bolokang li fokotsa tahlehelo ea ho kenya empa li hloka polokelo e hlokolosi le netefatso ea tumellano ea solder e se nang lead.

Mathata a Ts'ebetso ea Lintho

Liphephetso tsa ho kopanya PTFE li hloka plasma kapa sodium etching ho khothaletsa ho khomarela pele ho lamination. Ho cheka ho hlahisa lithōle tse likhoele tse hlokang lijeometri tse khethehileng tsa lisebelisoa le lebelo le holimo la spindle ho feta FR-4 e tloaelehileng. Machining a Ceramic a sebelisa laser ablation kapa ultrasonic drilling ho fapana le mekhoa e tloaelehileng ea mochini, e fokotsang ka ho feto-fetoha ha maemo.

Teko ea netefatso ea Moqapi

Moralo oa litlhahlobo tsa tlhahiso o lokela ho etsahala qalong ea khetho ea lisebelisoa tsa PCB tsa semiconductor. Meaho ea mohlala e netefatsa ts'ebetso ea potoloho ea mocheso, bokhoni ba ngoliso ea lera ho isa lera, le ka ts'epahalo ka tlhahlobo ea mocheso-mongobo-leeme. Litekanyo tsa paramethara ea S li tiisa ts'ebetso ea motlakase li tsamaisana le mehlala ea ketsiso e thehiloeng maqepheng a data a thepa, e senola liphapang life kapa life lipakeng tsa boleng bo boletsoeng le ba 'nete ba Dk kapa Df.

Mehlala ea Kopo

RF Front-End Module Design

Mojule oa X-band front-end radar o ne o hloka litsela tsa matshwao tse tsamaellanang le mekhahlelo ka tahlehelo ea ho kenngoa ka tlase ho 0.5 dB ho pholletsa le 8-12 GHz. Sehlopha sa boenjiniere se khethile laminate e ikhethang e nang le tahlehelo e tlase (Dk 3.48, Df 0.004) bakeng sa likarolo tsa RF, e kenya tšebetsong mela ea microstrip e laoloang ea impedance e nang le mamello ea ±5 ohm. Tlhahlobo ea mocheso e senotse ho qhala ha 8 W ho tsoa ho amplifier ea matla, e shebaneng le letoto la li-vias tsa mocheso tsa 0.3 mm tse hokahaneng le sefofane sa koporo sa kahare.

Power Module Thermal Management

Moralo oa silicon carbide power module o tsepamisitsoeng holim'a substrate ea aluminium nitride e fihlelletseng ho hanyetsa mocheso oa 0.15 °C/W ha o ntse o sebetsana le matla a tlhōrō ea 15 kW. The AlN substrate (0.63 mm botenya, 170 W/m·K thermal conductivity) e ne e e-na le li-circuits tsa koporo tse tlanngoeng ka kotloloho tse tšehetsang 200 A density hajoale. CTE e ts'oanang le SiC die (4.5 ppm/°C) e felisitse mokhathala oa terata ea bond e bonoang meralong ea pejana e thehiloeng ho alumina.

fihlela qeto e

Khetho ea thepa ea Semiconductor PCB e etelletsa pele karabelo ea khafetsa le taolo ea mocheso ha e ntse e hlompha lithibelo tsa tlhahiso le lipheo tsa litšenyehelo. Bapisa thepa ea dielectric ho bontša litlhoko tsa botšepehi pele, ebe u netefatsa ho lekane ha moralo oa mocheso ka ho etsisa le tlhahlobo ea prototype. Litlhaloso tsa thepa li lokela ho kenyelletsa lintlha tse felletseng tsa Dk le Df ho maqhubu a ts'ebetso, litekanyo tsa conductivity ea mocheso, sebopeho sa CTE, le liphetho tsa liteko tsa thuto.

Matla a Tekheniki a Highleap Electronics

• Tsebo ea lintho tse bonahalang - Ts'ehetso ea boenjiniere bakeng sa ho khetha lisebelisoa tsa PCB tsa semiconductor tse ipapisitseng le litlhoko tsa motlakase, mocheso, le ts'epahalo ho pholletsa le FR-4, polyimide, PTFE, ceramic, le specialty RF laminates.
• Tlhahiso e tsoetseng pele ea PCB - Ho cheka ka mokhoa o nepahetseng le ho sebetsa ka laser bakeng sa PTFE le li-ceramic substrates tse nang le bophara ba mela ho fihla ho li-micrometer tse 75 le ho nepahala ha ngoliso ka har'a li-micrometer tse 25.
• Moqapi oa tsamaiso ea mocheso - Botenya ba koporo bo fihla ho 10 oz, e futhumatsang ka li-arrays, le kopanyo ea tšepe ea mantlha bakeng sa lisebelisoa tsa elektroniki tsa matla le lits'ebetso tsa LED tse khanyang haholo.
• RF bokhoni - Tsela e laoloang ea impedance e nang le mamello ea ± 5 ohm, ts'ebetso ea thepa ea tahlehelo e tlase, le netefatso ea S-parameter bakeng sa maqhubu a fihlang ho 40 GHz.
• Litšebeletso tsa kopano - Phallo e se nang lead le mocheso o phahameng, ho tlama mohala ka terata, ho kopanya li-die, le ho fana ka li-substrate tse tsoetseng pele tsa ho paka.

Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka likhothaletso tsa thepa le ntlafatso ea moralo bakeng sa projeke ea hau e latelang ea PCB ea semiconductor. Re fana ka tataiso ea khetho ea thepa, tlhahlobo ea moralo oa ho bokellana, le tšehetso ea nts'etsopele ea mehlala ho potlakisa potoloho ea nts'etsopele ea sehlahisoa sa hau.

Lipotso Asked hangata

1. Ke neng moo li-ceramic substrates li lokelang ho nkela thepa ea motheo ea tšepe sebaka?

Ceramic e fetoha tlamo ka holimo ho mocheso oa 15-20 W/cm² kapa ha CTE e bapisa le lefu le sa roaloang e le bohlokoa bakeng sa likopano tsa flip-chip. Lisebelisoa tsa PCB tsa tšepe-core semiconductor ha li khone ho finyella mocheso oa mocheso o fetang 5 W/m·K ka lera la dielectric. Ho feta moo, ceramic e mamella mocheso o sebetsang ka holimo ho 200 ° C moo li-organic dielectrics li senyehang.

2. Tahlehelo tangent e ama ts'ebetso ea sistimi joang?

Keketseho e 'ngoe le e' ngoe ea 0.001 ho Df e kenya letsoho hoo e ka bang tahlehelo ea ho kenya 0.05 dB/inch ho 10 GHz bakeng sa mela ea 50-ohm microstrip. Bakeng sa tsela ea 4-inch RF, ho khetha lisebelisoa tsa PCB tsa semiconductor tse nang le Df ea 0.004 khahlano le 0.001 ho eketsa tahlehelo ea 1.2 dB, ho fokotsa ka kotloloho kutlo ea moamoheli. Sistimi e sa tsotelleng joalo ka li-arrays tse hahelletsoeng, li na le liphoso tse amanang le tahlehelo e fapaneng lipakeng tsa likanale.

3. Na lisebelisoa li ka fihlella ka bobeli Tg e phahameng le Df e tlase?

K'hemistri e tloaelehileng ea epoxy e baka phapanyetsano pakeng tsa botsitso ba mocheso le ts'ebetso ea motlakase, kaha li-retant tsa malakabe tse nang le brominated li eketsa Df. Lisebelisoa tse tsoetseng pele tsa PCB tsa semiconductor joalo ka polyimide le metsoako ea PTFE-ceramic li hlola moeli ona, li fana ka Tg kaholimo ho 250°C ka Df ka tlase ho 0.003. Li-laminate tsa CLTE-XT tse ikhethileng tse nang le tahlehelo e tlase li bontša tekano ena ka litsamaiso tsa resin ea hydrocarbon.

4. Ke mamello efe ea Dk e hlokahalang bakeng sa impedance e laoloang?

Ho nepahala ha tšitiso ka har'a ±10% ho hloka mamello ea Dk ea ±0.2 bakeng sa lijeometri tse tloaelehileng tsa stripline le microstrip. Lisebelisoa tsa maqhubu a phahameng ka tlase ho ± 5 ohm mamello li hloka lisebelisoa tsa PCB tsa semiconductor tse totobatsang mamello ea Dk ± 0.05 kapa e thata ho feta. Litlaleho tsa lisebelisoa li tlameha ho kenyelletsa ho fapana ha D ka frequency, mocheso, le phanele ho thusa ho etsa mohlala o nepahetseng oa impedance.

5. Ke lokela ho hlahloba barekisi ba thepa eo ke sa ba tsebeng joang?

Kopa lintlha tsa tlhahlobo ea motho oa boraro ho li-lab tse ikemetseng tse bontšang Dk le Df tse lekantsoeng ka mekhoa ea li-split-post dielectric resonator ka IPC-TM-650. Netefatsa CTE ka tlhahlobo ea thermomechanical 'me u netefatse Tg ka phapang ea khalorimetri. Theha li-coupons tsa liteko tse kenyelletsang li-vias tsa boleng bo holimo, mesaletsa e laoloang ea tšitiso, le likoloi tsa tlhahlobo ea libaesekele tse futhumetseng pele ho boitlamo ba tlhahiso.