Semiconductor Substrate vs PCB: Tataiso ea Papiso ea Tekheniki

Selelekela

Semiconductor substrate (eo hape e bitsoang IC packaging board) le li-PCB tse tloaelehileng li shebahala li tšoana ha u habanya, empa li entsoe ka melao e fapaneng. Li-substrates li etelletsa pele routing e ntle haholo, botsitso ba mocheso le boholo bakeng sa ho paka li-chip, ha li-PCB li etelletsa pele khokahanyo ea boemo ba sistimi le ts'ebetso.

Tataiso ena e bapisa lisebelisoa, botenya, bophara ba mela / sebaka, lits'ebetso tsa tlhahiso, le lits'ebetso tse tloaelehileng ho thusa baenjiniere ho lemoha kapele phapang ea qeto ea "substrate vs PCB" le ho etsa likahlolo tsa khetho tse nang le tsebo.

Semiconductor Substrate vs PCB: Tlhaloso le Phapano ea Karolo

Semiconductor Substrate ke eng?

Semiconductor substrate, kapa IC packaging board, e sebetsa e le sethala sa khokahanyo e phahameng haholo se tsamaisang ka ho toba li-bare die, libolo tsa solder, le maqhubu. Liboto tsena li sebetsa maemong a 2nd le 3rd a ho paka, a hokahanya lefatše le sa bonahaleng la silicon sebakeng sa macroscopic sa lisebelisoa tsa elektroniki.

PCB ke eng?

Boto ea potoloho e hatisitsoeng e sebetsa maemong a sistimi, li-module tse hokahanyang, likaroloana, le li-subsystems ka har'a sehlahisoa. Li-PCB li sebetsa maemong a holimo a ho paka, li fana ka tšehetso ea mochini le khokahano ea motlakase bakeng sa likarolo tse kopaneng ho kenyeletsoa li-IC tse pakiloeng, lihokelo le likaroloana tse sa sebetseng.

Boemo ba Hierarchical

Li-Semiconductor substrates li sebetsana le phetoho ea chip-to-package moo boima ba I/O bo fihlelang likete tsa likhokahano ka square centimeter. Li-PCB li laola ho kopanya liphutheloana-to-system moo matla a khokahanyo a fokotsehang empa ho rarahana ha boto ho ntse ho eketseha. Phapang ena ea mantlha e tsamaisa liphapang tsohle tse latelang, ts'ebetso le moralo.

Likhetho tsa Semiconductor Substrate Material: BT, ABF, le Ceramic

BT (Bismaleimide-Triazine) Substrates

BT resin e fana ka botsitso bo botle ba mocheso ka mocheso oa phetoho ea khalase ka holimo ho 180 ° C le coefficient ea katoloso ea mocheso e tsamaellanang le silicon. Sesebediswa sena se thata sa semiconductor substrate se laola lits'ebetso tse sa tsotelleng litšenyehelo tse hlokang boima ba I/O bo itekanetseng bakeng sa liphutheloana tse tloaelehileng tsa BGA le li-processor tsa mahareng.

ABF (Ajinomoto Build-Up Film) Substrates

ABF e emela lisebelisoa tsa premium semiconductor substrate bakeng sa lits'ebetso tse sebetsang hantle haholo. Dielectric ena ea filimi e tšesaane e nolofalletsa bophara ba mela e ka tlase ho 15 μm mme e ts'ehetsa boima ba I/O bo phahameng haholo bo hlokoang ke li-CPU tse tsoetseng pele le li-GPU. Dielectric e tlase ea ABF e lula e boloka botsitso ba matšoao ho maqhubu a li-gigahertz tse ngata ha e ntse e boloka khokahano ea laser-drill bakeng sa micro-vias.

Mekhoa e meng ea Ceramic le Metal-Core

Di- substrate tsa letsopa di fana ka phallo e phahameng ya mocheso le CTE e tlase haholo bakeng sa ditshebediso tsa matla a maholo empa di tobana le ho robeha le dithibelo tsa ditjeo. Dikgetho tsa motheo wa tshepe di fana ka ho qhala ha mocheso ho ntlafaditsweng ka dikarolo tsa motheo tsa aluminium kapa koporo, tse shebaneng le di-elektroniki tsa motlakase moo taolo ya mocheso e fetang ditlhoko tsa ho tjhesa ka tsela e nyane.

Lisebelisoa tse Tloaelehileng tsa PCB (FR-4)

FR-4 e ntse e le thepa e sebetsang bakeng sa li-PCB tse tloaelehileng, e fanang ka thepa e amohelehang ea motlakase le katleho e ikhethang ea litšenyehelo. FR-4 e tloaelehileng e sebeletsa liboto tsa boemo ba sistimi moo bophara ba mela bo fetang 75 μm 'me litlhoko tsa mocheso li lula li le maemong a itekanetseng. Mefuta ea PCB e sebetsang hantle e kenyelletsa Tg e phahameng FR-4 le polyimide bakeng sa lits'ebetso tse ikhethileng empa e ke ke ea lekana le bokhoni ba substrate ea semiconductor.

Lethathamo la Papiso ea Lintho

Litlhaloso tsa Geometric tsa Semiconductor Substrate: Botenya, Bophara ba Mola, le Via Technology.

Bophara ba Mola le Bokhoni ba Sebaka

Semiconductor substrate line bophara le sebaka sa sebaka se fihla ho 30 μm kapa ho feta, ka lihlahisoa tse tsoetseng pele tse fihlelang 10-15 μm bakeng sa lits'ebetso tse tsoetseng pele. Li-PCB tse tloaelehileng tsa khoebo tsa FR-4 li sebetsa ka matla a 75-150 μm (3-6 mil), ha HDI PCBs e ka atamela 50 μm empa e ntse e salla morao ho ts'ebetso ea semiconductor substrate.

Litlhoko tsa Botenya ba Boto

Li-packaging substrates tsa IC hangata li lekanya botenya ba 0.3-0.5 mm ho latela mofuta oa sephutheloana, ho fokotsa bolelele ba tsela ea matšoao le ho fokotsa inductance ea parasitic. Li-PCB tse tloaelehileng hangata li sebelisa botenya ba 0.6-1.6 mm, ka maemo a 1.6 mm bakeng sa lisebelisoa tsa bareki le tsa indasteri. Profaele e tšesaane ea semiconductor substrate e fokotsa kotsi ea warpage nakong ea ho phalla hape.

Micro Via Technology le Pitch

Li-semiconductor substrates li sebelisa laser-drilled micro-vias tse nolofalletsang ho phonyoha tsela ea ho baleha:

• Ka bophara - 25-50 μm khahlano le 200-400 μm ho li-PCB tse tloaelehileng
• Ka lentsoe - Ka tlase ho 100 μm e nolofalletsang ho tsamaea ka tlas'a mehato ea maoto
• Bokhoni ba ho bokella - Sequential build-up e tšehetsa li-vias tse ngata tse pakiloeng
• tšobotsi karo-karolelano - Likarolo tse tlase ka lebaka la likarolo tse tšesaane tsa dielectric li ntlafatsa ho ts'epahala

Palo ea Lera le Sebopeho sa ho Aha

Likarolo tsa sejoale-joale tsa semiconductor li kenyelletsa likarolo tse 4-20 tse nang le theknoloji ea ho aha ka tatellano e eketsang likarolo tsa dielectric tse tšesaane haholo. Karolo e 'ngoe le e' ngoe ea ho haha ​​​​e lekanya 15-30 μm ha e bapisoa le 50-100 μm prepreg layers ho li-stackups tse tloaelehileng tsa PCB. Sena se lumella li-substrates hore li fihlele palo e phahameng ea litsamaiso ka har'a li-profiles tse nyane ka kakaretso.

Mokhoa oa Tlhahiso ea Semiconductor Substrate: MSAP vs Mekhoa e Tloaelehileng

Mokhoa o fetotsoeng oa Semi-Additive (MSAP)

MSAP e nolofaletsa semiconductor substrate e ntle ea line line ka ho beha likaroloana tse tšesaane tsa peo ea koporo, ho sebelisa lipaterone tsa photoresist, mesaletsa ea conductor ea electroplating, ebe e tlosa lera la peo lipakeng tsa mesaletsa. Mokhoa ona oa tlatsetso o hlahisa bophara ba mela e ka tlase ho 30 μm hobane mokhoa oa ho etsa mohlala o tlosa koporo e fokolang ho fapana le ho hlalosa likarolo ka koporo e ngata.

Mokhoa o Tloaelehileng oa ho tlosa PCB

Tlhahiso e tloaelehileng ea PCB e sebelisa mekhoa ea ho tlosa moo ho koaheloa ha koporo e felletseng ho tlosoang ka mokhoa o ikhethileng ho sebelisoa limaske tsa photoresist. Mokhoa ona o sebetsa ka katleho bakeng sa bophara ba mela e kaholimo ho 75 μm empa o thatafalloa ke li-geometri tse tšesaane ka lebaka la meeli ea lintlha tsa etch. Mokhoa oa ho tlosa o fana ka tlhahiso e potlakileng le litšenyehelo tse tlase bakeng sa lits'ebetso tsa bongata bo itekanetseng.

Advanced Surface Finishes

Li-substrates tsa semiconductor li sebelisa haholo ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) holimo ho fana ka thekiso e ntle haholo, e tsamaellanang le terata, le ho hanyetsa kutu bakeng sa lits'ebetso tse hlakileng. Li-PCB tse tloaelehileng hangata li sebelisa HASL, ENIG, kapa OSP ho latela litšenyehelo le litlhoko tsa ts'ebetso.

Laser Drilling le Sequential Lamination

Ho etsa semiconductor substrate ho itšetlehile ka CO2 kapa UV laser drilling bakeng sa sebopeho se nepahetseng sa micro-via ntle le khatello ea mochine. Lamination e latellanang e haha ​​lihlopha ka bonngoe, e netefatsa ho nepahala ha ngoliso le ho lumella botenya bo fapaneng ba mantlha. Tlhōlisano e tloaelehileng ea PCB le ho phunya ka mochine ho lumellana le likarolo tse kholoanyane empa e ke ke ea finyella ho nepahala ha semiconductor substrate.

Semiconductor Substrate Performance: Motlakase, Thermal, le Tšepahala

Litlhoko tsa Ts'ebetso ea Motlakase

Li-substrate tsa semiconductor li laola tsela ea bohlokoa ea ho tsamaisa li-inch tsa pele ho tloha libolong tsa die ho ea ho liphutheloana, tse hlokang taolo e tiileng ea impedance (±10%) le tahlehelo e fokolang ea lets'oao maqhubung a multi-gigahertz. Lisebelisoa tse tlase tsa dielectric constant le dissipation factor li boloka botšepehi ba lets'oao ho pholletsa le likhokahano tse khutšoane empa li teteaneng. Li-PCB li sebetsana le li-trace tse telele ka mamello e phutholohileng moo taolo ea impedance e shebaneng le ±15-20%. Bakeng sa liphutheloana tsa organic build-up, li-substrate tsa ABF build-up le sebopeho sa tsona sa PCB li hlalosa phapang pakeng tsa khokahano ea liphutheloana le boto ea sistimi.

Mehopolo ea Tsamaiso ea Mocheso

Moqapi oa mocheso oa substrate o totobatsa litsela tse tlase tsa ho hanyetsa mocheso ho tloha ho lefu ho ea ho mocheso oa mocheso ka likarolo tse tšesaane tsa dielectric, li-vias tsa mocheso, le mehaho e tletseng tšepe. Boemo bo tšesaane le bo phahameng ka bongata bo thusa ho hasana hantle ha mocheso. Li-PCB li kenyelletsa li-vias tse futhumatsang le lifofane tsa koporo empa li tsepamisitse maikutlo ho felisoeng ha mocheso oa likarolo ho fapana le taolo e tobileng ea mocheso.

Tšepahala ea Mechini le Matching CTE

Li-semiconductor substrates li kena libaesekeleng tse futhumetseng haholo nakong ea ho phalla hape (260 ° C tlhoro) le ho fetoha ha mocheso oa ts'ebetso:

• CTE e tšoana - Lisebelisoa tse tlase tsa CTE tse tsamaellanang le silicon (2.6 ppm/°C) li thibela mokhathala o kopaneng oa solder
• Warpage control - Seqha sa boto se lekanyelitsoe ho <0.3% ea boholo ba diagonal
• Khatello ea maikutlo - Lipotoloho tse ngata tsa phepelo le mocheso o feteletseng li hloka botsitso bo holimo
• Ho tšepahala ha kopanelo ea solder - Likhokahano tse hlakileng li hloka polane e tsitsitseng le boleng ba boleng bo holimo

Teko e Tloaelehileng ea ho Tšepahala

Semiconductor substrate qualification e kenyelletsa JEDEC-standard standard cycling cycling (-55 ° C ho + 125 ° C, 500-1000 cycles), tlhahlobo ea boemo ba boemo ba mongobo, le polokelo e phahameng ea mocheso. Ho tšepahala ho kopaneng ha solder ho hlahlojoa ka ho khetheha ka ho kuta le tlhahlobo ea ho hula. Teko ea ts'epo ea PCB e akaretsa maemo a ts'oanang le mekhoa ea kamohelo e khutsitseng e bonts'ang litlhoko tsa boemo ba sistimi.

Maemo a Kopo a Semiconductor Substrate

Likopo tse Phahameng tsa Ts'ebetso ea Khomphutha

Li-CPU le li-GPU tsa maemo a holimo li sebelisa li-substrate tsa ABF ka kakaretso ho amohela likhokahano tse likete tsa I/O ka lebelo le lenyenyane ha li ntse li boloka botšepehi ba lets'oao bakeng sa DDR5, PCIe Gen5, le li-interface tse ling tsa lebelo le phahameng. Liphutheloana tsa memori ea bandwidth e phahameng (HBM) li hloka li-substrate tsa semiconductor tse nang le lebelo le phahameng tse nolofalletsang khokahano ea through-silicon-via (TSV). Li-module tsa sistimi-in-package le li-chip tse ngata li kopanya li-dies tse ngata holim'a li-substrate tse arolelanoang.

Likopo tse Tloaelehileng tsa PCB

Maboto a bo-mme le maboto a sistimi a kopanya dikarolo tse pakilweng, dihokelo, le dimmojule ho sebediswa theknoloji ya PCB ya setso moo bongata ba kgokelo bo dumellang ditshebetso tse tloaelehileng tsa tlhahiso. Di-elektroniki tsa motlakase di rata di-PCB tse boima tsa koporo kapa di-PCB tsa motheo wa tshepe tse fanang ka bokgoni ba ho jara motlakase le ho qhala mocheso ntle le ho hloka ho tsamaisa motlakase ka tsela e nepahetseng. Di-elektroniki tsa bareki le ditsamaiso tsa dikoloi di sebedisa haholo-holo di-PCB tsa FR-4 tse leka-lekaneng tshebetso le ditjeo.

Mehlala ea Khetho ea Theknoloji

Motlakase oa li-flagship o hloka substrate ea ABF hobane likhokahano tsa 4000+ I/O ho 0.35 mm ball pitch li hloka bophara ba mela e ka tlase ho 30 μm le ts'ebetso e phahameng ea motlakase. Sesebelisoa sa motlakase se sebelisa FR-4 PCB e teteaneng ea koporo hobane likhokahano tsa eona tsa 100-200 li etelletsa pele ts'ebetso ea hajoale ho feta tekano ea litsela. Smartphone e sebelisa theknoloji ea HDI PCB e atamelang bokhoni bo kang ba substrate bakeng sa ho kopanya likaroloana empa e emisa ho finyella litlhoko tsa 'nete tsa semiconductor substrate.

Litaelo tsa Khetho ea Boenjiniere: Semiconductor Substrate vs PCB Decision Factors

I/O Density le Ball Pitch Evaluation

Likopo tse hlokang bophahamo ba bolo ka tlase ho 0.5 mm ka lipalo tsa khokahanyo tse fetang 1000 I/O hangata li laela theknoloji ea semiconductor substrate. Bala likanale tse sebetsang hantle tsa ho tsamaisa tse teng lipakeng tsa libolo u sebelisa bophara ba mela le sekhechana ho fumana hore na tsela ea ho baleha e ntse e khoneha ka theknoloji ea PCB.

Bophara ba Mola le Litlhoko tsa Sebaka

Ha melao ea moralo e batla bophara ba mohala ka tlase ho 50 μm, lits'ebetso tse tloaelehileng tsa PCB li fetoha tse sa sebetseng mme theknoloji ea semiconductor substrate kapa substrate-joaloka PCB (SLP) theknoloji ea hlokahala. SLP e emela mokhoa o mahareng o sebelisang lits'ebetso tse ntlafalitsoeng tsa PCB ho fihlela likarolo tsa 30-50 μm ka theko e tlase ho feta li-substrates tse felletseng tsa semiconductor.

Mehopolo ea Mocheso le ho Tšepahala

Ts'ebeliso ea matla a phahameng (> 1 W/mm²) e kopantsoeng le mats'oao a utloang khafetsa a rata li-semiconductor substrates tse nang le ts'ebetso e phahameng ea mocheso le motlakase. Lisebelisoa tse nang le libaesekele tse futhumetseng haholo kapa tse hlokang ho ts'epahala ha boemo ba JEDEC li hloka lisebelisoa tsa substrate le CTE e bapisang. Lisebelisoa tse sa tsotelleng litšenyehelo li amohela ho hanyetsa mocheso oa PCB 'me li sebelisa litharollo tse ntlafalitsoeng tsa ho pholisa.

Litšenyehelo le Bokhoni ba Tlhahiso

Lintlha tsa bohlokoa tsa moruo le tsa tlhahiso ha u khetha li-semiconductor substrates:

• Phapang ea litšenyehelo - Li-substrates li bitsa 3-10 × ho feta li-PCB tse lekanang ka lebaka la thepa e tsoetseng pele le ts'ebetso.
• nako etella pele - Libeke tse 8-12 bakeng sa li-substrates khahlano le libeke tse 2-4 bakeng sa li-PCB li ama potoloho ea nts'etsopele
• Ho nahanisisa ka molumo - Tlhahiso e phahameng haholo e ka lokafatsa matsete a substrate ha litlhoko tsa ts'ebetso li ke ke tsa finyelloa ka tsela e 'ngoe
• Bokhoni ba mofani oa thepa - Netefatsa bokhoni ba MSAP, boiphihlelo ba ENEPIG ba ho pola, le boiphihlelo ba ho cheka ka micro-ka ho cheka pele o etsa

fihlela qeto e

Ho khetha pakeng tsa semiconductor substrate le PCB ho ipapisitse le sekhahla sa I/O, litlhoko tsa bophara ba mela, litlhoko tsa mocheso, le lithibelo tsa litšenyehelo. Li-semiconductor substrates li ipabola ho paketeng ea boemo ba chip moo molumo o phahameng haholo, khokahanyo e phahameng, le ts'ebetso e phahameng ea motlakase e lokafatsang litšenyehelo tse phahameng. Li-PCB tse tloaelehileng li lula li le ntle bakeng sa ho kopanngoa ha maemo a tsamaiso moo palo e leka-lekaneng, tlhahiso e netefalitsoeng, le katleho ea litšenyehelo li fihlelang litlhoko tsa kopo.

Selekane le Highleap Electronics

Joaloka moetsi oa PCB ea nang le phihlelo le mofani oa likopano, Highleap Electronics e fana ka tharollo e feletseng ho pholletsa le theknoloji:

• Tlhahiso e tsoetseng pele ea HDI PCB - Bokhoni ba line-line bo atamelang ts'ebetso e kang ea substrate bakeng sa lits'ebetso tse hlokang
• Bokhoni ba PCB ba mefuta e mengata - Li-stackups tse rarahaneng tse tsoang ho li-prototype ka tlhahiso e phahameng haholo
• Moralo bakeng sa manufacturability - Tšehetso ea boenjiniere ho ntlafatsa meralo bakeng sa litšenyehelo le tekanyo ea ts'ebetso
• Ts'ebelisano 'moho ea ho fumana chelete ka substrate - Lihokelo le barekisi ba khethehileng ba substrate bakeng sa tharollo e kopaneng
• Litšebeletso tse felletseng tsa kopano - PCB e entsoeng ka kopano ea ho qetela ea sehlahisoa tlas'a marulelo a le mong

Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka litlhoko tsa projeke ea hau. Re tla thusa ho lekola hore na theknoloji e tsoetseng pele ea PCB kapa kopanyo ea substrate ea semiconductor e sebeletsa kopo ea hau hantle, ebe re fana ka tharollo e nepahetseng bakeng sa ts'ebetso ea hau le lipheo tsa tekanyetso.

Lipotso Tse Botsoang Hangata: Semiconductor Substrate vs PCB Selection

1. Na PCB e ka sebelisoa joalo ka Substrate?

Li-PCB tse tloaelehileng li ke ke tsa nka sebaka sa li-semiconductor substrates bakeng sa lits'ebetso tse phahameng tsa I/O-density ka lebaka la bophara ba mela le ka mefokolo. Theknoloji e kang substrate-joaloka PCB e koala lekhalo bakeng sa lits'ebetso tse leka-lekaneng, ho fihlela likarolo tsa 30-50 μm ka mekhoa e ntlafalitsoeng. Ts'ebetso ea 'nete ea semiconductor substrate e hloka lisebelisoa tse inehetseng le tlhahiso ea MSAP.

2. Ho Khetha Neng ABF vs BT Substrates?

Khetha ABF bakeng sa lits'ebetso tse hlokang sekontiri se setle haholo (ka tlase ho 25 μm bophara ba mela), pontšo ea lebelo le holimo ka holimo ho 10 Gbps, kapa I/O e bala ho feta likhokahano tsa 2000. Khetha BT bakeng sa lits'ebetso tse baballang litšenyehelo tse nang le I/O e itekanetseng le liphutheloana tse tloaelehileng tsa BGA. ABF e bitsa 30-50% ho feta BT empa ea hlokahala bakeng sa processor e tsoetseng pele le lits'ebetso tsa memori.

3. Ke Eng e Hlalosang Substrate-Joaloka PCB (SLP)?

PCB e kang substrate e sebelisa lits'ebetso tse fetotsoeng tsa PCB ho fihlela likarolo tse ntle ho feta tlhahiso ea setso empa e se na bokhoni bo felletseng ba MSAP. Hangata SLP e fana ka bophara ba mola oa 40-60 μm ho sebelisoa koporo e tšesaane le mekhoa e laoloang ea ho betla kapa mekhoa e sa tlatsetseng karolo e itseng. Mokhoa ona o lumellana le lits'ebetso tse hlokang ts'ebetso e betere ea PCB ntle le ho lokafatsa litšenyehelo tse felletseng tsa substrate ea semiconductor.