Substrate-Joaloka PCB (SLP) ke eng? Tlhaloso, Theknoloji, le Lisebelisoa

Utloisisa Substrate-joaloka PCB Technology

PCB e kang Substrate (SLP) e emela phetoho ea bohlokoa tlhahisong ea boto ea potoloho e hatisitsoeng, e koalang lekhalo pakeng tsa liboto tsa setso tsa High-Density Interconnect le li-substrate tsa potoloho tse kopantsoeng . Kaha lisebelisoa tsa elektroniki li hloka lintlha tse ntseng li eketseha tsa foromo e nyane le bongata bo phahameng ba khokahano, theknoloji ea SLP e fana ka ts'ebetso e batlang e le haufi le substrate ha e ntse e boloka moruo oa tlhahiso ea PCB.

Theknoloji ena e thusa ho latella bophara le sebaka se atamelang ho 30/30 µm, se tšehetsa mekhoa ea miniaturization ea bohlokoa bakeng sa li-smartphone, tse aparoang, le li-module tse tsoetseng pele tsa khomphutha. Bakeng sa bahlahisi ba hlahlobang ts'ebetsong ea SLP, bokhoni ba ts'ebetso ea ho utloisisa le ho kopa livideo tsa tlhahiso ea feme hammoho le litlaleho tsa bokhoni li netefatsa hore ho na le mangolo a nepahetseng a mofani oa thepa.

Tlhaloso ea Tekheniki le Maemo a Substrate-Joaloka PCB

PCB e kang Substrate e nka sebaka sa botekgeniki pakeng tsa diboto tse tswetseng pele tsa HDI le di-substrate tsa nnete tsa IC. Le hoja HDI e tlwaelehileng e atisa ho sebetsa ka bophara ba mola le sebaka sa 50/50 µm kapa se sephara, SLP e sutumelletsa meedi ena ho 30/30 µm le ka tlase, ka diketso tse tswetseng pele tse fihlellang 25/25 µm kapa dijiometri tse betere.

Theknoloji e sebelisa li-microvia tse teteaneng haholo, li-dielectric layers tse tšesaane (40-60 µm ha li bapisoa le HDI's 75-100 µm), le mamello e nepahetseng haholoanyane ea boingoliso. Tlhahiso ea setso ea PCB e sebelisa mekhoa e fokolang e loantšanang le likarolo tse ntle, ha Substrate-Like PCB e sebelisa mekhoa e fetotsoeng ea semi-additive e nolofalletsang tlhaloso e phahameng ea ho batla le ho lumella likarolo tsa likarolo tse ka tlase ho 0.4 mm.

Litheknoloji tsa Tlhahiso ea Core bakeng sa Substrate-Joaloka PCB

Semi-Additive Process e fetotsoeng (mSAP)

Mokhoa oa mSAP o theha motheo oa tlhahiso e ngata ea Substrate-Like PCB. Ts'ebetso ena e qala ka lera le lesesaane la peo ea koporo (0.5-2 µm), e lateloe ke electroplating e khethiloeng ho aha paterone ea conductor e lakatsehang, 'me e phethela ka ho eketsoa ha flash ho tlosa lera la peo. Tatelano ena e hlahisa mesaletsa e nang le mabota a haufi a emeng le ho fokotsa ho honyenyane, ho bohlokoa bakeng sa ho boloka botšepehi ba matšoao ho routing e ntle haholo e khethollang SLP ho mekhoa e tloaelehileng ea tlhahiso.

Advanced Microvia Formation le Stacking

Theknoloji ea ho phunya ka laser e nolofalletsa li-microvia tse foufetseng tse nang le litšobotsi tsa meaho ea PCB e kang Substrate. Li-laser tsa CO₂ kapa UV li phalla ka har'a mekhahlelo e mesesaane ea dielectric ho etsa masoba a manyane a 50 µm ao hamorao a tla etsoa tšepe ka ho kenngoa ha koporo e se nang motlakase le ea electrolytic. Meaho ea HDI efe kapa efe e fana ka ho tenyetseha ha tsela ho hlokahalang bakeng sa meralo e rarahaneng ea SLP, ha litlhophiso tsa microvia tse pakiloeng le tse sarolohang hammoho le ts'ebetsong ea via-in-pad li eketsa bongata ba tsela le ho fokotsa bolelele ba tsela ea lets'oao.

Tlhokomelo ea Boleng le ho Tšepahala

Ho hlahisa Substrate-Joaloka PCB ho hloka taolo e matla ea ts'ebetso ho mekhahlelo e mengata ea bohlokoa:

• Bophara ba mela le ho tsitsana ha sebaka - Mamello e tlameha ho lula ka har'a ± 10% ho netefatsa ts'ebetso e tšepahalang ea motlakase le ponts'o ea ponts'o ho mesaletsa eohle.
• Microvia koporo plating - Ho tlatsa ka ho feletseng kapa ho laola ho thibela ho hlōleha ho tšepahala 'me ho tiisa khokahanyo e tsitsitseng ea motlakase ka liphetoho tsa lera.
• Taolo ya bokahodimo - Ho shebana le Rz <3 µm holim'a bokaholimo ba koporo ho ama ka kotloloho tahlehelo ea ho kenya ka maqhubu a phahameng le ho ntlafatsa ts'ebetso ea impedance.
• Lamination boleng - Lera le se nang letho le tlamahaneng ntle le phallo e feteletseng ea resin e boloka botšepehi ba microvia mme e thibela ho hloleha ha delamination.

Khetho ea Lisebelisoa le Meaho ea Stack-Up bakeng sa Substrate-Like PCB

Dielectric le Copper Material Systems

Sistimi ea thepa ea Substrate-Joaloka PCB e fapana haholo le meaho e tloaelehileng ea FR-4. Lisebelisoa tsa dielectric tse nang le tahlehelo e tlase tse nang le lintlha tsa ho qhala ka tlase ho 0.005 le li-contants tsa dielectric lipakeng tsa 3.0-3.5 li fana ka ts'ebetso ea motlakase e hlokahalang bakeng sa lits'ebetso tsa dijithale tse potlakileng le tsa RF. Khetho ea foil ea koporo hangata e rata likhetho tse phekotsoeng ka morao kapa tse tlase haholo tse nang le bokaholimo bo fokotsehileng ho fokotsa tahlehelo ea letlalo ka maqhubu a li-gigahertz tse ngata, tse amang ka kotloloho bokhoni ba ts'ebetso ea Substrate-Joaloka PCB lits'ebetsong tse boima.

Melao-motheo ea Moqapi oa Stack-Up

Meralo ea li-stack-up bakeng sa Substrate-Joaloka PCB hangata e sebelisa meaho ea asymmetric e nang le li-dielectric tse tšesaane libakeng tse nang le mekhoa e metle haholo le li-cores tse teteaneng bakeng sa botsitso ba mochini. SLP e tloaelehileng ea 6-layer e ka sebelisa 50 µm dielectric layers lipakeng tsa lipara tsa ka hare tse nang le boima ba koporo ba 0.5 oz ha e ntse e boloka motheo oa 200 µm bakeng sa botšepehi ba sebopeho. Lisebelisoa tsa maske tsa solder li tlameha ho ts'ehetsa menyetla ea molumo o hlakileng (150 µm kapa tse nyane) ka ngoliso e nepahetseng, athe menahano ea taolo ea mocheso hangata e tsamaisa kopanyo ea lichelete tsa tšepe tse kentsoeng tsa koporo kapa lisebelisoa tse ntlafalitsoeng ka mocheso.

Ho Amoheloa ha Lits'ebetso tsa ho khanna Substrate-Joaloka PCB

1. Li-mainboard tsa li-smartphone - Sebeletsa e le sesebelisoa se seholo ka ho fetisisa sa theknoloji ea Substrate-Like PCB. Meeli e fetelletseng ea sebaka le likhokahano tse teteaneng har'a li-processor, memori, li-PMIC, le li-transceivers tsa RF li hloka hore ho be le lits'oants'o tse fetang matla a liboto tsa setso tsa HDI.
2. Liboto tsa module tsa khamera - E nolofalletsa ho hokahanya ha li-sensor tsa litšoantšo, li-lens actuators, le li-processor tsa matšoao a setšoantšo. SLP e lumella taolo e nepahetseng ea impedance le compact ka meaho e fokotsang tahlehelo ea matšoao le ho ntlafatsa lebelo la ho sebetsana le litšoantšo.
3. Lisebelisoa tsa elektroniki tse ka roaloang - Push miniaturization le ho feta ka botenya ba boto bo ka tlase ho 0.4 mm ha o ntse o boloka likarolo tse 6-8 tsa litsela. Theknoloji ea SLP e netefatsa ts'epahalo ea mochini ho sa tsotellehe ho kobeha khafetsa le lisebelisoa tse koaletsoeng.
4. Li-module tse tsoetseng pele tse se nang mohala le tsa 5G - Kopanya likarolo tse ka pele tsa RF ka har'a sebopeho se le seng se kopaneng. Thepa ea tahlehelo e tlase le mehala e metle ho SLP e fana ka tšitiso e tsitsitseng le ponts'o ea matšoao ho maqhubu a millimeter-wave.

Ka bokhutšoanyane, ho amoheloa ha theknoloji ea Substrate-Like PCB ho tsamaisoa ke lits'ebetso tse batlang hore ho be le lithapo tse phahameng haholo, ts'ebetso e phahameng ea motlakase le miniaturization e feteletseng. Ha mekhoa ena e ntse e tsoela pele, SLP e sebetsa e le sesebelisoa sa bohlokoa sa ho koala lekhalo lipakeng tsa HDI PCB le tlhahiso ea substrate ea IC.

Tataiso ea Moralo bakeng sa Substrate-Joaloka PCB

Melao ea Moralo oa Microvia le Trace

Baenjineri ba etsang moralo oa Substrate-Joaloka PCB ba tlameha ho ikamahanya le mekhoa ea bona ho lumellana le bokhoni le mathata a theknoloji. Li-diameter tsa Microvia hangata li lokela ho boloka karolo ea 1:1 lipakeng tsa bophara bo felileng le botenya ba dielectric, ka boholo ba pad ea ho hapa bonyane 50 µm e kholoanyane ho feta bophara ho netefatsa mamello e lekaneng ea ngoliso.

Ho latela sebaka ho lokela ho boloka bonyane ba 30 µm bakeng sa meralo ea tlhahiso ka 40-50 µm e ratoang bakeng sa ho ntlafatsa chai, ha taolo ea impedance e hloka khokahanyo e qaqileng ea qubu ho fihlela litšitiso tse lebisitsoeng tsa 50Ω tse sa feleng kapa 90-100Ω phapang.

Letšoao la Botšepehi le Tsamaiso ea Thermal

Ho cheka ka morao ha li-pass-hole tse tšelang likarolo tsa mats'oao a lebelo le phahameng ho thusa ho fokotsa molumo oa li-stub tse senyang botšepehi ba lets'oao ka holimo ho li-gigahertz tse 'maloa, ha baqapi ba lokela ho theha litlhoko tsa mehala ea selemo ka ho hlokomela hore tlhahiso ea Substrate-Like PCB e ts'ehetsa bonyane bo fokolang (25-30 µm) ho feta mekhoa e tloaelehileng.

Moralo oa pad ea mocheso bakeng sa liphutheloana tsa QFN le BGA o tlameha ho leka-lekanya litlhoko tsa molumo oa solder paste khahlano le ho beoa bakeng sa ho tsamaisa mocheso ho lifofane tse ka hare, ho thibela ho futhumala ha karolo ha ho ntse ho bolokoa lintlha tsa compact form tse tsamaisang ho amoheloa ha theknoloji ea SLP.

Tekolo ea Bokhoni ba Tlhahiso le Theko

Bohlokoa Bokhoni Metrics

Ho tšoaneleha moetsi oa PCB ea Substrate-Joaloka PCB ho hloka tlhahlobo e phethahetseng ea bokhoni ba ts'ebetso ho feta lipampiri tse tloaelehileng tse boletsoeng:

• Bonnyane bo ka fihlellwang bophara ba mela le sebaka - Bokhoni ba sebele ba tlhahiso bo nang le chai e amohelehang, hangata 30/30 µm ho isa ho 40/40 µm bakeng sa tlhahiso ea bongata.
• E nyenyane ka ho fetisisa e ka tšeptjoang ea microvia bophara - Litekanyo tse netefalitsoeng ka tlhahiso tse nang le boleng bo tsitsitseng ba ho pola, hangata bophara ba 50-75 µm bo felileng.
• Boholo ba palo ea layer e nang le meaho ea lera efe kapa efe ea microvia - Khōlo ea ts'ebetso bakeng sa li-stack-ups tse rarahaneng ho feta mekhoa ea motheo ea ho aha ka tatellano.
• Mamello ea taolo ea botenya - Tsamaiso e nepahetseng ea liboto tse tšesaane tsa ho qetela ha o ntse o boloka botsitso ba mochini le litlhoko tsa ho bata.

Netefatso ea Boleng le Mehopolo ea Litšenyehelo

Litšoaneleho tsa boto ea sampole li lokela ho kenyelletsa tlhahlobo e felletseng ea likarolo tse fapaneng ho netefatsa boleng ba koporo ea koporo, botenya ba dielectric, le ho nepahala ha ngoliso ea lera, ha litšoantšo tsa X-ray li senola kahare ka boleng le ho senyeha ho ka bang teng. Lintlha tsa tlhahlobo ea motlakase tse bonts'ang ho nepahala ha taolo ea tšitiso le tlhaiso-leseling ea tlhahlobo ea libaesekele tse futhumatsang (hangata -40°C ho ea ho +125°C bakeng sa lipotoloho tse 500-1000) e tiisa ho tiea ha meaho ea Substrate-Like PCB.

Lits'enyehelo tsa SLP hangata li e beha 40-80% ka holim'a liboto tse lekanang tsa HDI ka lebaka la lits'ebetso le lisebelisoa tse ikhethang, ka linako tse etellang pele tse fetang libeke tse 2-4 ho feta HDI e tloaelehileng, leha tlhahiso ea molumo e fokotsa litšenyehelo tse ngata ha lihlahisoa li ntse li ntlafala.

fihlela qeto e

Theknoloji ea Substrate-Like PCB (SLP) e koala lekhalo lipakeng tsa tharollo ea HDI le IC, e nolofalletsang ho tsamaisa mekhoa e metle haholo, litlhophiso tse kopaneng, le likhokahano tse tšepahalang bakeng sa lihlahisoa tsa elektroniki tsa moloko o latelang. Motsoako oa eona oa ts'ebetso ea mSAP, theknoloji ea microvia, le lisebelisoa tse tsoetseng pele li fana ka sekhahla le ts'ebetso ea meralo ea sejoale-joale e hlokang ho pholletsa le li-smartphones, li-wearable le li-module tsa khomphutha tse lebelo haholo.

Highleap Electronics e ikhethile ka ho hlahisa le ho kopanya li-PCB , e fana ka litharollo tse felletseng ho tloha tlhahisong ea mohlala ho isa tlhahisong e felletseng:

• Tlhahiso e felletseng ea SLP - Ts'ehetso e felletseng ea mehala e metle (≤30 µm) le microvia (≤75 µm) meaho.
• Tshebetso ponaletso - Livideo tsa tlhahiso ea feme le litlaleho tse qaqileng tsa bokhoni ba netefatso ea boenjiniere.
• DFM le tšehetso ea tekheniki - Maikutlo a meralo ea litsebi ho ntlafatsa ts'epahalo, poelo, le ts'ebeliso ea litšenyehelo.

Na u batla ho lekola kapa ho hlahisa li-PCB tse kang Substrate? Ikopanye le Highleap Electronics ho fumana litharollo tsa rona tsa tlhahiso ea SLP ho tloha qalong ho isa qetellong le ho netefatsa hore meralo ea hau ea bongata bo phahameng e fihlela ts'ebetso le tlhahiso e ntle.

Lipotso Asked hangata

1. Na PCB ea Substrate-Joaloka PCB e ka nka sebaka sa IC ka botlalo?
Le ha SLP e ntse e atamela ts'ebetso ea boemo ba substrate likarolong tse ngata, li-substrate tsa 'nete tsa IC li ntse li boloka melemo ka boholo ba likarolo (ka tlase ho 20 µm L/S), sebopeho sa sephutheloana se ikhethileng,' me palo e phahameng haholo e feta likarolo tse 12. SLP e sebeletsa lits'ebetso moo ts'ebetso ea substrate e lakatsehang empa litšenyehelo tse felletseng tsa substrate le nako ea ho etella pele ha li na mabaka.

2. Bophara ba mela e tloahelehileng ke efe le bokhoni ba ho arohana bakeng sa Substrate-Like PCB?
Bokhoni ba tlhahiso ea SLP ka kakaretso bo tloha ho 30/30 µm ho isa ho 40/40 µm bakeng sa bophara ba mela le sebaka, ka mekhoa e tsoetseng pele e fihlelang 25/25 µm. Bokhoni bo khethehileng bo fapana ho ea ka moetsi 'me bo lokela ho netefatsoa nakong ea mangolo a lengolo la mofani oa thepa, kaha likarolo tse fokolang tse phatlalalitsoeng li ka bontša bokhoni ba laboratori ho fapana le tlhahiso ea tlhahiso.

3. Litjeo tsa Substrate-Joaloka PCB li bapisoa joang le li-substrate tsa HDI le IC?
SLP hangata e bitsa 40-80% ho feta liboto tsa HDI tse bapisoang ka lebaka la lits'ebetso tsa mSAP le lisebelisoa tse ikhethileng, ha e ntse e le 50-70% e theko e tlase ho feta li-substrates tsa 'nete tsa IC. Ho hlahisa molumo le ho ntlafatsa moralo ho ka ama litšenyehelo tsa ho qetela haholo, ho etsa hore tšebelisano ea pele ea barekisi e be ea bohlokoa bakeng sa mananeo a hlokang litšenyehelo.