K'hamera ea Drone PCB Manufacturing: Moqapi oa Maqhubu a Phahameng le Kopano e nepahetseng

Selelekela

K'hamera ea drone PCB e sebetsa e le motheo oa bohlokoa bakeng sa bokhoni ba ho nahana ka UAV, e nolofalletsang phetisetso ea video ea nako ea sebele, ho qoba litšitiso, le ho tsamaea ka bolokolohi. Lisebelisoa tsa sejoale-joale tsa drone li hloka li-module tsa kh'amera tse fanang ka ho nkuoa ha litšoantšo tse hlakileng ha li ntse li boloka lintlha tsa sebopeho se kopaneng le kaho e bobebe.

Ho kopanngoa ha li-sensor tsa litšoantšo tsa lebelo le holimo, litsamaiso tsa phetisetso e se nang mohala, le ts'ebetso e tsoetseng pele ea lipontšo li baka mathata a ikhethang a tlhahiso. Tsamaiso ea mats'oao a maqhubu a phahameng, phokotso ea tšitiso ea motlakase, le mamello ea kopano ea limilimithara tse nyane li hloka mekhoa e ikhethileng ea masela a PCB e fetang mekhoa e tloaelehileng ea tlhahiso ea boto ea potoloho.

Karolo ea Ts'ebetso ea Drone Camera PCB ho UAV Systems

Mehaho ea ho Kopanya Lipontšo

Khokahano ea kh'amera PCB e hokahanya li-sensor tsa setšoantšo sa CMOS ho li-unit tsa ts'ebetso ka liprothokholo tse emeng ho kenyelletsa MIPI CSI-2, LVDS, kapa li-interfaces tse tšoanang. Li-circuits tsa tsamaiso ea matla li laola phepelo ea motlakase bakeng sa ts'ebetso ea sensor, ha mekhahlelo e ikemiselitseng ea boemo ba matšoao e netefatsa phetiso e hloekileng ea data ho molaoli oa sefofane kapa processor ea onboard.

Ts'ebetso le Phetiso ea Lintlha

Li-processor tsa matšoao a litšoantšo (ISPs) kapa li-FPGA li sebetsana le ntlafatso ea setšoantšo sa nako ea nnete, khatello le khouto ka kotloloho ho PCB ea pono ea drone. Li-module tse kopantsoeng tse se nang mohala tse sebetsang ho 2.4GHz kapa 5.8GHz li thusa ho theola video ho liteishene tsa taolo ea fatše. PCB ea phetisetso ea litšoantšo e tlameha ho ts'ehetsa litefiso tsa data tse fetang 100Mbps bakeng sa melapo ea video ea HD ha e ntse e boloka botsitso ba matšoao ho fapana ha mocheso.

Litlhoko tsa Moralo oa Maqhubu a Phahameng bakeng sa Drone Camera PCB

Phethahatso ea Taolo ea Impedans

Moralo oa PCB o nang le maqhubu a phahameng bakeng sa li-module tsa khamera o hloka mesaletsa ea impedance e laoloang e tsamaellanang le boleng bo itseng ba sepheo. Lipara tse fapaneng bakeng sa li-interface tsa MIPI hangata li boloka impedance ea 100Ω±10%, ha mela ea phetisetso ea RF e nang le pheletso e le 'ngoe e hloka ho tsamaellana ha 50Ω. Sebopeho sa stackup se nang le botenya bo hlalositsoeng ba dielectric le boima ba koporo se netefatsa impedance e tsitsitseng ho pholletsa le tsela ea lets'oao.

Khetho ea Lintho bakeng sa Ts'ebetso ea HD Camera PCB

Lisebelisoa tse tloaelehileng tsa FR-4 li lekane bakeng sa li-interface tsa khamera tse ka tlase ho 1GHz, empa lits'ebetso tsa maqhubu a phahameng li rua molemo ho li-substrate tse nang le tahlehelo e tlase. laminate e khethehileng ea tahlehelo e tlase kapa Panasonic Megtron 6 e fana ka tahlehelo e fokotsehileng ea dielectric (tanδ < 0.004) le li-constant tsa dielectric tse tsitsitseng ho pholletsa le mefuta ea maqhubu. Lisebelisoa tsena tsa PCB tsa khamera ea HD li ama ka kotloloho ho fokotseha ha lets'oao, haholo-holo bakeng sa mela ea phetisetso e fetang bolelele ba 100mm.

Lekola lintlha tsa Routing

Bolelele ba ho lumellana pakeng tsa matšoao a mabeli a fapaneng ho boloka ho nepahala ha nako bakeng sa phetiso ea data e tšoanang. Bolelele bo sa lumellaneng hangata bo lula ka har'a 5mm bakeng sa likhokahano tsa MIPI tse sebetsang ka holimo ho 500Mbps. Ka ho bea ho hloka tlhokomelo e hlokolosi, ka ho phunya ka morao kapa ho patoa ka tsela e fokotsang molumo oa stub o theolang boleng ba lets'oao.

Taolo ea EMI le Botšepehi ba Letšoao ho Drone Camera PCB

Ground Plane Architecture

Lifofane tse felletseng tsa fatše holim'a mekhahlelo e ka hare li fana ka litsela tsa ho khutla tse nang le impedance e tlase tse hlokahalang bakeng sa meralo ea PCB ea taolo ea EMI . Ho arola lifofane tsa fatše ho sitisa phallo ea hona joale ea ho khutla 'me ho eketsa mesi e hlahisoang ke mahlaseli. Moralo oa PCB oa botšepehi ba lets'oao o boloka lifofane tsa litšupiso tse tsoelang pele tlas'a mekhoa e potlakileng, ho sebelisoa li-vias tse ngata ho hokahanya motlakase le lihlekehleke tsa fatše.

Phapang Pair Symmetry

Ho boloka symmetry ea jiometri ka litsela tse fapaneng ho fokotsa phetoho ea lerata le tloaelehileng. Bophara ba trace bo tšoanang, sebaka, le bend radii e netefatsa tieho e leka-lekaneng ea phatlalatso. Asymmetry efe kapa efe e hlahisa skew e fokotsang moeli oa lerata le ho eketsa ts'oaetso ea tšitiso ea motlakase.

Leano la Phatlalatso ea Phepelo ea Matla

Ho sefa matla ho mojule oa khamera PCB ho hloka mekhoa e mengata:

• Ho beha haufi - Decoupling capacitor ka har'a 3mm ea likhoele tsa matla li hatella lerata le phahameng haholo
• Kabo ea boleng ba capacitor - Maemo a mangata ho tloha ho 100nF ho isa ho 10µF filthara ho pholletsa le DC ho isa ho 500MHz
• Lifofane tsa motlakase tse inehetseng - Lisebelisoa tse arohaneng tsa analog le tsa dijithale li thibela crosstalk likarolong tse fapaneng tsa lipontšo
• Ho tšela koporo sebakeng - Lihlekehleke tse pota-potileng lipotoloho tse bonolo li fokotsa litsela tse kopanyang lerata

Litlhoko tsa Kopano e nepahetseng bakeng sa Module oa Khamera PCB

Ho Nepaha ha Karohano ea Karolo

Kopano ea module ea khamera ea HD e hloka ho nepahala ha ho beha likarolo ka hare ho ±25µm bakeng sa likarolo tse nang le molumo o mosesaane. Mekhoa ea tlhahlobo ea optical e iketsang e netefatsa ho beoa ha likarolo pele li phalla hape, ho lemoha liphoso tsa ho potoloha, maemo a offset, kapa tataiso e fosahetseng ea likarolo. Liphutheloana tsa sensor ea khamera tse nang le BGA tsa bolo ea 0.4mm li hloka moralo o nepahetseng oa pad le ts'ebeliso ea solder paste.

Taolo ea Ts'ebetso ea Soldering

Lifaele tsa mocheso oa Reflow li hloka ho ntlafatsoa ka hloko ho thibela tšenyo ea mocheso ho li-sensor tsa setšoantšo ha u ntse u netefatsa sebopeho se kopaneng sa solder. Dithempereichara tse phahameng ka tlwaelo di dula di le ka tlase ho 245°C le ditekanyetso tse laolwang tsa mapheo ka tlase ho 3°C/motsotswana. Mefuta e fokolang e sa hloekang e sa hloekang e fokotsa ho silafala ka mor'a kopano e ka amang likarolo tsa optical kapa lithapo tsa phetisetso ea maqhubu a phahameng.

Mekhoa ea ho netefatsa boleng

Tlhahlobo ea X-ray e senola boleng bo patehileng ba manonyeletso a solder ka har'a liphutheloana tsa BGA le likarolo tse kentsoeng thebeng. Tlhahlobo ea optical e iketsang (AOI) e netefatsa boleng ba ho kenya holim'a metsi, e lemoha ho koala, ho seha ho sa lekaneng, kapa tšenyo ea likarolo. Kopano ea SMT PCB bakeng sa lits'ebetso tsa drone e etsoa liteko tsa motlakase ho netefatsa botšepehi ba lets'oao pele ho kopanngoa ha module ea optical.

Khetho ea Boitsebiso le Bokaholimo bakeng sa Drone Camera PCB

Surface Finish Performance Papiso

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) e fana ka ts'epo e phahameng ea ho kopanya le ho lumellana ha terata ha ho bapisoa le liphetho tse tloaelehileng tsa ENIG. Lera la palladium le thibela mathata a ho bola ha nickel ha le ntse le boloka motlakase o motle bakeng sa lits'ebetso tsa maqhubu a phahameng. OSP (Organic Solderability Preservative) e fana ka litšenyehelo tse tlase empa e hloka polokelo e hlokolosi ka lebaka la bophelo bo fokolang ba shelefo ba likhoeli tse 6-12.

Lintlha tsa Thepa ea Dielectric

Khetho ea lisebelisoa tsa khamera ea PCB e leka-lekanya ts'ebetso ea motlakase le botsitso ba mochini le litšenyehelo. Standard FR-4 e nang le dielectric constant e laoloang (Dk = 4.3 ±0.1) e sebeletsa boholo ba lisebelisoa tse ka tlase ho 2GHz. Meetso e phahameng haholo e hloka lisebelisoa tse khethehileng tse nang le Dk ka tlase ho 3.5 le tahlehelo e tlase ho 0.004 ho boloka botsitso ba matšoao bakeng sa lits'ebetso tsa HD signal PCB tse sebetsang ka holimo ho 5GHz.

Ho tšepahala le ho Fetola Tikoloho ea Drone Camera PCB

Mekhoa ea Tšireletso ea Tikoloho

Lisebelisoa tsa PCB tsa ho roala ka mokhoa o hlophisitsoeng li sireletsa li-module tsa kh'amera tse kopaneng ho tloha mongobo, lerōle le ho pepesehela lik'hemik'hale nakong ea ts'ebetso ea kantle. Liaparo tsa Acrylic kapa urethane li fana ka tšireletso e lekaneng ha li ntse li boloka reworkability bakeng sa tokiso. Ho roala ha Parylene ho fana ka thepa e phahameng ea thibelo ea mongobo bakeng sa ho tsamaisoa ha tikoloho e thata empa e thatafatsa liphetoho tse latelang tsa kopano.

Mekhoa ea Tsamaiso ea Mocheso

Li-processor tsa litšoantšo tse matla a phahameng li hlahisa mocheso o hlokang ho qhalana ka katleho ho thibela ho senyeha ha ts'ebetso. Mocheso ka li-array o fetisetsa mocheso ho tloha liphuthelong tsa likarolo ho ea ho lifofane tsa koporo tsa kahare kapa li-heat sinks tsa kantle. Botšepehi ba PCB ea drone bo itšetlehile ka ho boloka mocheso oa li-junction o ka tlase ho 85°C ho pholletsa le libaka tsa ts'ebetso ho tloha ho -20°C ho isa ho +70°C.

Moqapi oa Mechanical Durability

Kaho ea PCB e hananang le vibration e sebetsana le maemo a sefofane a sa feleng le khatello ea tikoloho:

• Libaka tse matlafalitsoeng tsa ho hola - Botenya bo eketsehileng ba koporo le ho eketsoa ka tšehetso ho likoti tsa screw
• Botenya ba boto bo laoloang - 1.0-1.6mm mefuta e leka-lekaneng e leka-lekanya litlhoko tsa ho tenyetseha le ho tiea
• Tlatsetso e tlase ea karolo - Ts'ebeliso ea Epoxy tlasa BGAs e eketsa ho hanyetsa mokhathala ka 5-10x
• Ho kopanya ho feto-fetohang - E arola li-sensor tsa kh'amera ho thothomela ha taolo ea sefofane ha e ntse e boloka khokahano

fihlela qeto e

Ho etsa likopano tsa PCB ea khamera ea drone e sebetsang hantle ho hloka taolo e nepahetseng ea botšepehi ba matšoao a maqhubu a phahameng, phokotso e felletseng ea tšitiso ea motlakase, le ho nepahala ha kopano ea boemo ba micron. Khokahano ea tekheniki ea tsamaiso ea taolo ea impedance, khetho e tsoetseng pele ea lisebelisoa, le lits'ebetso tsa kopano tse netefalitsoeng li etsa qeto ea ho ts'epahala le ts'ebetso ea lits'ebetso tsa sejoale-joale tsa UAV.

Katleho e ipapisitse le bokhoni ba ho kopanya boqapi le litlhoko tse ikhethileng tsa khafetsa, ho kenya ts'ebetsong taolo e nepahetseng ea mocheso, le ho boloka taolo e matla ea boleng nakong eohle ea tlhahiso.