Flexible PCB Materials Solutions
Selelekela ho Flexible PCB Materials
Ho boloka laminate ka tlung ho Highleap Electronic
Flexible PCB Materials ke eng?
Lisebelisoa tsa PCB tse feto-fetohang li bua ka li-substrates tse khethehileng le likarolo tse tsamaisang tse sebelisoang ho etsa liboto tsa potoloho tse hatisitsoeng (flex PCBs). Lisebelisoa tsena li lumella potoloho hore e kobehe, e menahe, 'me e sothe ha e ntse e boloka ts'ebetso ea motlakase, e etsa hore e be e loketseng bakeng sa lits'ebetso moo ho bolokoang sebaka, ho sisinyeha ho matla, kapa lintlha tse sa tloaelehang.
Ke Eng Seo u ka se Fanang ka Phatlalatso ea Elektronike?
Highleap Electronics e fana ka lisebelisoa tse phahameng tsa Flex PCB tse fanang ka phetoho e ikhethang, thepa ea motlakase e babatsehang, ho feto-fetoha ha mocheso o pharaletseng, le ho tšepahala ha nako e telele bakeng sa lisebelisoa tse tsoetseng pele tsa elektroniki.
Mefuta ea mantlha ea Lisebelisoa tsa PCB tsa Flexible
Polyimide (PI) Filimi
PCB e feto-fetohang e etellang pele 'marakeng e nang le botsitso bo ikhethang ba mocheso le thepa ea ho kenya motlakase. Mocheso o pharalletseng oa ts'ebetso o tloha ho -269 ° C ho isa ho 400 ° C, o loketse lits'ebetso tse hlokang indasteri.
Matlotlo a bohlokoa
- Dielectric Constant: 3.4-3.5
- Tahlehelo ea Dielectric: <0.003
- Lisebelisoa: Sepakapaka, libaka tse nang le mocheso o phahameng
Filimi ea Polyester (PET).
Khetho ea substrate e theko e tlaase e fana ka thepa e ntle ea mochini le botsitso ba sebopeho. E sebelisoa haholo ho lisebelisoa tsa elektroniki tsa bareki tse nang le khanyetso e ikhethang ea lik'hemik'hale. E loketse bakeng sa ho feto-fetoha ha maemo a phahameng, lisebelisoa tse tšepahalang.
Matlotlo a bohlokoa
- Mocheso o sebetsang: -40 ° C ho isa ho 120 ° C
- Dielectric Constant: 3.0-3.2
- Lisebelisoa: Lisebelisoa tsa elektroniki tsa bareki, maqhubu a mahareng a tlase
Polyethylene Naphthalate (PEN) Filimi
Substrate e tsoetseng pele e kopanyang melemo ea litšenyehelo le ts'ebetso e ntlafalitsoeng ea mocheso. Mocheso oa ho sebetsa o fihla ho 150 ° C, o bonts'a litebello tse ntle tsa lisebelisoa tsa motlakase tsa likoloi le taolo ea indasteri.
Matlotlo a bohlokoa
- Mocheso oa ho sebetsa: 30 ° C holimo ho feta PET
- Likarolo: Matla a phahameng a mochine
- Likopo: Lisebelisoa tsa elektronike tsa likoloi, taolo ea indasteri
Liquid Crystal Polymer (LCP) Filimi
Matlotlo a bohlokoa
- Dielectric Constant: ~ 2.9
- Tahlehelo ea Dielectric: <0.002
- Lisebelisoa: 5G puisano, millimeter-wave
Flexible PCB Material Properties
| Category | Property | Boleng bo Tloaelehileng / Tlhaloso |
|---|---|---|
| Mechanical Properties | Matla a tšepe | 100–300 MPa |
| Flex Mokhathala | > 100,000 lipotolohong | |
| Elongation | 20-150% | |
| Matla a Kgapha | Excellent | |
| Thepa ea Motlakase | Kamehla ea Dielectric | 2.9-3.5 |
| Tahlehelo ea Dielectric | ||
| Ho hanyetsa ho kenya letsoho | >10¹² Ω | |
| Matla a Dielectric | Tekanyetso e phahameng | |
| Thepa ea Thermal | bueloang Mocheso | -269 ° C ho 400 ° C |
| Keketseho ea Thermal | Ho tsamaisana hantle | |
| Ho khanna ho chesang | Mosebetsi o motle | |
| Glass Transition Temp | Tekanyetso e phahameng | |
| Botsitso ba Lik'hemik'hale | Khanyetso ea Lik'hemik'hale | Excellent |
| Khanyetsano ea Oxidation | E tsitsitseng nako e telele | |
| Phephetso ea UV | Mamello e phahameng | |
| Ho monya mongobo | Boemo bo tlase |
Li-Brand le Mefuta e Tšeptjoang ea Flexible PCB Materials
| Brand/Moetsi | Letoto la lintho tse bonahalang | Mehlala e Khethehileng | Mofuta oa Boitsebiso | Litšobotsi tsa bohlokoa | Lisebelisoa tsa mantlha |
|---|---|---|---|---|---|
 |
Letoto la Pyralux® AP | AP7163E, AP7164E, AP8515R, AP9111R, AP8525R, AP9121R, AP9131R, AP9141R, AP9151R | All-Polyimide | Boemo ba indasteri, ho tšepahala ho phahameng, ho hanyetsa mocheso o babatsehang | Aerospace, sesole, lisebelisoa tsa elektroniki tsa maemo a holimo |
| Letoto la Pyralux® LF | LF0100, LF-B (e ntšo) | E thehiloeng ho Acrylic | Tekanyetso ea lisebelisoa tsa elektroniki tsa bareki, e boloka chelete | Li-smartphone, matlapa, lisebelisoa tsa bareki | |
| Pyralux® AG | AG (Anti-ghosting) | All-Polyimide | Prototyping ho tlhahiso, ho fumaneha ha lefatše | Ho etsa lihlahisoa tse phahameng | |
| Letoto la Pyralux® FR | FR coverlay, FR bondply | E bolokang mollo | UL94-V0 e lekantsoe, e tsamaellana le polokeho | Likopo tse hlokang polokeho ea mollo | |
| Pyralux® TK | TK e apereng mocheso | Fluoropolymer/PI | Litšobotsi tse tlase tsa tahlehelo, maqhubu a phahameng | 5G, mmWave, dijithale tsa lebelo le phahameng | |
| Letoto la Pyralux® TA | TAH, TAHS | All-Polyimide | Lisebelisoa tsa li-antenna tse phahameng haholo | RF / microwave, tsamaiso ea li-antenna | |
| Letoto la Kapton® | HN, FN, VN mefuta | Filimi ea Polyimide | Lisebelisoa tsa filimi tsa motheo, mefuta e fapaneng ea botenya | Kakaretso tenyetsehang potoloho mohaho | |
 |
Letoto la SF | SF202 | FCCL e sa khomareleng | Halogen e se na halogen, e mahlakore a mabeli, e boloka chelete | Elektronike ea bareki, likoloi |
| SF305, SF305C | FCCL e se nang Halogen | Phetolelo e ntlafalitsoeng, e bonolo haholo | Lisebelisoa tsa mohala, lits'ebetso tse akaretsang | ||
| Lethathamo la lintlha tsa SF201 | Li-configs tse fapaneng | Mefuta e mengata ea lisebelisoa | Lisebelisoa tse fapaneng tsa indasteri | ||
 |
Letoto la Felios® FCCL | Lihlahisoa tse tloaelehileng tsa FCCL | Seaparo sa koporo se tenyetsehang | Mohala o felletseng oa lihlahisoa tsa FCCL, ts'ebetso e tšepahalang | Lisebelisoa tse akaretsang tsa PCB tse feto-fetohang |
| Felios® Polyimide | R-F775 (mahlakore a mabeli) | Adhesiveless PI | Ho hanyetsa mocheso o phahameng, botsitso ba dimensional | Mobile, likoloi, sefofane | |
| R-F770 (ka lehlakore le le leng) | Adhesiveless PI | Lisebelisoa tse nang le lehlakore le le leng | Meetso e khethehileng ea potoloho | ||
| R-F800, R-F731 | PI ea ts'ebetso e phahameng | Litlhaloso tse ntlafalitsoeng | Likopo tse batlang | ||
| Felios® LCP | R-F705S | Mokelikeli oa Crystal Polymer | Tahlehelo e tlase haholo, ts'ebetso e phahameng ea maqhubu | Li-antenna tsa 5G, data e potlakileng haholo | |
| Felios® Bonding | R-BM17 | Letlapa la bonding la Dk | Lisebelisoa tse khethehileng tsa bonding | Mehaho e mengata | |
| R-FR10 | Koporo e entsoeng ka resin | Flexible koporo foil tharollo | Mekhoa e tsoetseng pele ea potoloho | ||
 |
Malapa a laminate a PTFE a nang le DD e tlase | laminate ea PTFE e nang le Dk e tlase, laminate e ikhethang e nang le tahlehelo e tlase, laminate e ikhethang e nang le tahlehelo e tlase | PTFE e tletseng ka ceramic | Lintho tse lumellanang tsa mechine, maqhubu a phahameng | RF/microwave, mehala ea puisano |
| malapa a laminate a nang le tahlehelo e tlase ea hydrocarbon-ceramic | laminate e nang le tahlehelo e tlase ea hydrocarbon-ceramic, laminate e nang le tahlehelo e tlase ea hydrocarbon-ceramic, laminate e ikhethang e nang le tahlehelo e tlase | Keramiki ea hydrocarbon | Theko e tlase ho feta PTFE, ts'ebetso e ntle | Lisebelisoa tsa RF tse sa tsotelleng litšenyehelo | |
| laminate® e thehiloeng ho PTFE e nang le tahlehelo e tlase | 6006, laminate e ikhethang e nang le tahlehelo e tlase | PTFE e feto-fetohang | Mehaho e tšesaane haholo, e tenyetsehang | Sefofane, sesole | |
| ULTRARAM® | 3850 | Lifilimi tsa LCP | Boemo bo phahameng bo nang le maemo a bonolo | Lipuisano tse tsoetseng pele |
Limmaraka tsa Kopo tsa Bohlokoa bakeng sa li-PCB tse Flexible
Consumer Electronics
Likarolo tsa bohlokoa tsa khokahanyo ho li-smartphones, matlapa le lisebelisoa tse aparoang, tse fanang ka boholo ba komporo le tharollo e bolokang chelete e ngata.
Likoloi tsa Elektroniki
Mechine ea Bongaka
Aerospace
Hobaneng u Khetha Highleap Electronics bakeng sa li-PCB tse lebelo le holimo?
Khetho ea Lintho tsa Premium
Re fana ka polyimide ea boemo bo holimo, koporo ea RA, le li-laminate tse se nang likhomaretsi tse tsoetseng pele bakeng sa ho tenyetseha le ho ts'epahala.
Ts'ebetso e Phahameng ea Motlakase le Thermal
Lisebelisoa tsa rona li na le tahlehelo e tlase ea dielectric, khanyetso e ntle ka ho fetesisa, le ts'ebetso e tsitsitseng ho tloha -269 ° C ho isa 400 ° C.
Tšehetso e Ikemetseng ea Stack-Up & Engineering
Sehlopha sa rona se fana ka meralo e hlophisitsoeng le likhothaletso tsa thepa tse ipapisitseng le litlhoko tsa sehlahisoa sa hau sa motlakase, mochini le tikoloho.
Tiisetso ea Boleng bo Tiileng
Lisebelisoa tsohle le lits'ebetso li lumellana le litekanyetso tsa ISO le IPC, li netefatsa ts'ebetso e ts'oanang le ho latelloa.
Proven Applications Across Industries
E tšeptjoa ke bareki ho lisebelisoa tsa elektroniki tsa bareki, lisebelisoa tsa bongaka, le litsamaiso tsa likoloi bakeng sa litharollo tse tšepahalang tsa flex PCB.
Ts'ehetso ea Boenjiniere
Sehlopha sa rona se thusa ka khetho ea thepa le ntlafatso ea li-stackup ho latela litlhoko tsa hau tse ikhethileng. Ikutloe u lokolohile ho ikopanya le rona ho [email protected] kapa u letsetse +86 135 0306 2089 bakeng sa thuso ea motho ka mong.
Kopana le Highleap
Ka phihlelo ea lilemo tse ngata, re sebetsa ka ho khetheha ho sebetsana le lisebelisoa tse sa tšoaneng tsa PCB laminate. Re fana ka litšebeletso tsa boleng bo holimo, tse tšepahalang tsa ho etsa le ho kopanya PCB ho etsa hore moralo oa hau o phele.
Tsebo ea Lintho Tse Fapaneng
Re na le boiphihlelo bo pharaletseng ba ho sebetsana le li-laminate tsa PCB tse sebetsang hantle bakeng sa liphetho tse ntle tsa projeke.
Ka thata-thata Quality Control
Mehato e matla ea taolo ea boleng ho pholletsa le tlhahiso e netefatsa li-PCB tsa maemo a holimo, tse tšepahalang.
Theknoloji e tsoetseng pele ea tlhahiso
Ho sebelisa theknoloji e tsoetseng pele le lisebelisoa ho etsa hore tlhahiso ea PCB e be e nepahetseng le e sebetsang hantle.
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