E Tšepahalang HDI Flex PCB Manufacturer | Highleap Electronic

Ka lilemo tse fetang leshome, Highleap Electronics esale e le moetapele oa moloko o latelang oa µVia technologies. Ha laser ea setso ka plating e ntse e atamela meeli ea eona, li-PCB tsa rona tsa HDI flex li tsamaisa bokamoso ba ts'ebetso ea motlakase le ts'epahalo. Ka ho sebelisa µVia e nyane joalo ka 50 μm le koporo e le tšesaane joalo ka 8 μm, re sutumelletsa meeli ea letsoalo ka har'a liphutheloana tsa elektroniki tse kopaneng.

Ka pele ho theknoloji ea FPC (Flexible Printed Circuit), Highleap Electronics e nolofalletsa ho fokotsa lisebelisoa tsa 3D tse nang le mahlaseli a tlase haholo a kobehileng le bokhoni ba Ultra-HDI. Katleho ena e lumella ho thehoa ha liaparo tse nyane, tse kopantsoeng haholo le lits'ebetso tsa matšoao a nang le bongata bo phahameng.

Ka rekoto e netefalitsoeng ea li-circuits tse feto-fetohang, re fana ka lihlahisoa tse nang le lipalo tsa layer ho tloha ho 1 ho isa ho 16, tse sebetsang ka li-foil tsa polyimide tse tšesaane haholo (tse tšesaane joalo ka 12.5 µm) le li-bond bond tse nepahetseng. Li-vias tsa rona tse entsoeng ka laser tse nyane joalo ka 35 µm ka bophara li ka tlatsoa ka koporo ho theha meaho e tsoetseng pele ea ka-ka-pad, e netefatsang ts'epo e phahameng le ho pheta-pheta sehlahisoa se seng le se seng.

Melemo ea HDI Flex PCBs

Li-circuits tse feto-fetohang tsa High-Density Interconnect (HDI) li fana ka mefuta e mengata ea melemo ho feta lipotoloho tse feto-fetohang, ho kenyelletsa:

1. Litšenyehelo tse Tlase le Boholo bo Bonyenyane: Ho eketseha ha bongata ba potoloho ho ka tlosa mekhahlelo e eketsehileng, ha boloka ho fihlela ho 40% ha ho bapisoa le meralo e seng ea HDI.

2. Sephutheloana se Tsoetseng Pele sa Likarolo: HDI e dumella bokgoni ba ho hlahisa dibopeho tse phahameng tsa I/O le tse ntle.

3. Dikgetho tse Eketsehileng tsa Moralo le ho Tenyetseha: Di-microvia tse foufetseng le tse patilweng di dumella ho tsamaisa di-conductor hodima dikarolo tse ka hare tlasa di-via, e leng se etsang hore ho be le sebaka se sebetsang haholoanyane sa moralo ka lera.

4. Tshebetso e Ntlafetseng ya Motlakase le Botshepehi ba Matshwao: Di-microvia tse dipotolohong tse lebelo le hodimo di ntlafatsa tshebetso ya motlakase ka ho dumella ditsela tse kgutshwane tsa potoloho, phokotso ya stub, le ho fokotsa ho bua le lerata.

5. Tshebetso e Ntlafetseng ya Thermal le Botshepehi: Di-Microvia di fokotsa kgatello ya mocheso ya z-axis pakeng tsa dikarolo tse haufi.

6. Katleho e Ntlafetseng ea Litšenyehelo: Boholo ba phanele ea Highleap Electronic ea 18” x 24” (45.7 cm x 61 cm) bo eketsa bongata ba phanele, bo eketsa katleho ea ts'ebetso ea ho kopanya.

Kakaretso ea Bokhoni ba HDI Flex PCB

Ho Highleap Electronics, theknoloji ea rona ea HDI Flex PCB e etselitsoe meralo e matla haholo, e nang le ts'ebetso e ikhethang. Re fana ka li-PCB tse tenyetsehang ho tloha ho 3 ho isa ho 16, tse etselitsoeng ho fihlela litlhoko tsa lisebelisoa tsa elektroniki tsa sejoale-joale.

Li-PCB tsa rona tsa HDI Flex li na le boholo ba microvia tse nyane joalo ka 50 μm e felile, ka mola o motle le sebaka sa 50 μm. Theknoloji e tsoetseng pele ea tatellano ea ho haha ​​e lumella li-vias tse ka tšeptjoang le tse patiloeng, athe koporo ka ho tlatsa e tiisa nako e telele. Sheba tafole e ka tlase bakeng sa kakaretso e felletseng ea bokhoni ba rona ba HDI Flex PCB, e ntlafalitsoeng bakeng sa lits'ebetso tse sebetsang hantle haholo.

Lisebelisoa tse sebelisoang ho HDI Flex PCBs

Thepa e sebelisoang ho HDI Flex PCBs e khethiloe ka hloko ho netefatsa ts'ebetso e phahameng le ho ts'epahala lits'ebetsong tse fapaneng. Ka tlase ke kakaretso ea lisebelisoa tsa bohlokoa tse sebelisoang ts'ebetsong ea tlhahiso:

• Sekoahelo/Substrate
• Filimi ea Polyimide: E fumaneha ka botenya ba ½ mil (12μm), 1 mil (25μm), 2 mil (50μm), 3 mil (75μm), le 5 mil (125μm)
• Liquid Photoimageable Coverlay (LPI): E sebelisoa bakeng sa tšireletso e nepahetseng le e tšoarellang ea holim'a metsi.
• mokhanni
• koporo: E fanoa ka botenya bo fapaneng: 1/8 oz. (5μm), 1/4 oz. (9μm), 1/3 oz. (12μm), 1/2 oz. (18μm), 1 oz. (35μm), 2 oz. (71μm), 3 oz. (107μm)
• Stiffener
• Epoxy-Glass (FR-4), Polyimide-Glass, Polyimide, Copper, Aluminium: E sebelisoa ho matlafatsa botšepehi ba sebopeho le ho feto-fetoha ha maemo.

Lintlha-khōlō tsa Theknoloji tsa HDI Flex PCBs

• Litharollo tsa Turnkey flex tse shebileng 3D miniaturization
• E tšepahalang haholo, e matla haholo ea multilayer flex/microvia substrates
• Lisebelisoa tsa motheo tse tšesaane haholo
• E tlatsitsoe ka tsela le ka stacked ka mokhoa o teng
• Lisebelisoa tse rarahaneng tsa mochini / kopano, ho kenyeletsoa li-profiles tse ikhethileng, mela e menaneng, likheo, le libaka tse kobehang tse tšesaane.
• Mapolanka a pota-potileng
• Chip-on-flex (COF), liphutheloana tsa chip-scale packaging (CSP), le BGAs
• Mefuta e mengata e fapaneng ea ho qetela, ho kenyelletsa OSP, ENIG, ENEPIG, E-AU, le DIG.
• Lieta tse fofang
• Teko ea ho kobeha bakeng sa lipotoloho tse feto-fetohang
• Ultra-fine line flex cables

Hobaneng U Sebelisa Blind Via Flex PCBs

Meetsong ea sejoale-joale ea PCB, likarolo tse ngata haholo-tse tšoanang le tse fumanoang ho li-PCB tse thata-hangata lia hlokahala. Ho amohela likarolo tsena, lifofu le/kapa li-vias tse patiloeng li bohlokoa bakeng sa mela ea mats'oao ea ho tsamaisa ka nepo ka har'a moralo. E 'ngoe ea bakhanni ba atileng haholo bakeng sa tlhoko ena ke sephutheloana sa 0.4mm pitch BGA.

Li-vias tse foufetseng li lumella matšoao ho tsamaisoa ho tloha ho BGA SMT pad ho ea mokatong o latelang ebe o fetela ka ntle. Lisebelisuoa tse phahameng tsa ho bala li-pin, li-vias tse eketsehileng tse foufetseng le tse patiloeng hangata lia hlokahala ho netefatsa tsela e nepahetseng ea pontšo le ts'ebetso e tšepahalang.

Leha ho le joalo, ho kenya tshebetsong vias tsena ka meralo flex PCB hlahisa mathata a ikhethang bapisoa le PCBs thata, ka lebaka la ho se tšoane ha thepa le dithulaganyo tlhahiso. Ho tenyetseha ha substrate, hammoho le mekhoa e nepahetseng ea ho phunya le ho polaea e hlokahalang, ho etsa hore ho etsa bofofu ka li-PCBs e be mokhoa o ikhethileng haholoanyane.

Karolo ea Via-in-Pad ho Meetso e Phahameng ea Layer Count Flex PCB

Bakeng sa meralo ea PCB e tenyetsehang e nang le lipalo tse phahameng tsa lera tse sebelisang lera le phahameng la kantle, sebaka se eketsehileng se sebelisoang bakeng sa li-pad tse arohaneng le likarolo tsa SMT se fokotsa sebaka se fumanehang bakeng sa ho ntša fan ea trace. Ho rala via-in-pad ka li-PCB tse tenyetsehang le tse thata ho ka eketsa bongata haholo ka ho sebelisa li-vias e le li-pad tse hokelang. Li-vias tse bataletseng tse tletseng koporo kapa silevera li lumella likarolo tsa ho kopanya ka kotloloho ka masoba.

Le hoja theknoloji ea via-in-pad e ka lokolla sebaka se eketsehileng sa holim'a metsi bakeng sa litsela tsa litsela, ho na le lintlha tse 'maloa tseo u lokelang ho li ela hloko ha u sebelisa mofuta ona oa mohaho ka flex. Baetsi hangata ba tlatsa li-vias tsa PCB tse thata bakeng sa li-pads tsa SMT ka epoxy e tsamaisang, poleiti ea koporo, ebe ba e hlophisa hore e bataletse. Leha ho le joalo, mokhoa ona ha o sebelisoe hangata ho flex microvias kapa laser vias ka lebaka la mathata a ho tlosa masala a sa batleheng holim'a phanele ea flex PCB.

Ts'ebetso e ncha le e ntlafalitsoeng bakeng sa sephara ka-ka-pad ho multilayer flex PCBs e kenyelletsa ho tlatsa li-vias ka mofuta o khethehileng oa plating ea koporo. K'hemik'hale ena ea plating e tlatsa laser ka ho tloha tlase ho ea holimo, e theha bokaholimo bo bataletseng ka tsela. Leha dimpling e nyane e ka bonoa hangata, ha e hlahise bothata ho ba kopanyang. Theknoloji ena ea plating e sebelisoa ho mefuta e mengata ea li-PCB tse feto-fetohang le tse thata.

Bakeng sa tlhahlobo e felletseng ea tlhahiso, sebelisa sengoloa sena hammoho le tšehetso ea tlhahiso ea lisebelisoa tsa elektroniki le ho tenyetseha ha tlhahiso ea PCB ha u hlahloba litlhoko tsa stackup, kopano, kapa liteko.

fihlela qeto e

Ka kakaretso, li-PCB tsa Highleap Electronic tsa HDI flex le theknoloji e ncha ea blind through li fetola boemo ba potoloho e tenyetsehang, li fana ka keketseho ea ho tenyetseha ha moralo, botšepehi le ts'ebetso bakeng sa lisebelisoa tsa elektroniki tsa moloko o latelang. Ka ho shebana le tsoelo-pele ea theknoloji le khotsofalo ea bareki, Highleap Electronic e ntse e etella pele indasteri ho faneng ka litharollo tsa sejoale-joale bakeng sa litlhoko tse rarahaneng tsa boto ea potoloho ea flex, rigid-flex, le rigid ultra-HDI/microvia ho pholletsa le liindasteri tse fapaneng.