Moqapi oa PIM PCB e tlase: Boenjiniere bo Hloekileng Litsela tsa Letšoao ho Mekhoa e Phahameng ea Maqhubu

Selelekela

Ha litsamaiso tse se nang mehala li sutumelletsa ho maqhubu a holimo le litlhoko tse tiileng tsa mola, moralo o tlase oa PIM PCB o ba bohlokoa ho boloka litsela tse hloekileng tsa matšoao le ho fokotsa khopamiso e sa batleheng. Passive Intermodulation (PIM) e emela tšitiso e hlahisoang ke ha matšoao a RF a sebelisana le likarolo tse sa sebetseng hantle, tse bakang mesi e sa nepahalang e senyang ts'ebetso ea sistimi.

Mehahong ea sejoale-joale ea 5G, likhokahano tsa sathelaete, le lits'ebetso tsa radar tse sebetsang maemong a mangata a gigahertz, esita le li-nonlinearities tsa motsotso li hlahisa tšitiso e ka lekanyetsoang. Moralo o tlase oa PIM PCB o rarolla phephetso ena ka khetho e hlophisehileng ea thepa, ntlafatso ea kalafo ea bokaholimo, le lits'ebetso tse laoloang tsa tlhahiso.

Liteisheneng tsa mehala ea cellular moo lihlopha tse fetisang le tse amohelang li sebetsang ka nako e le 'ngoe, lihlahisoa tsa li-intermodulation tsa tatellano ea boraro li ka oela ka kotloloho liteisheneng tse amohelang maikutlo, tsa fokotsa kutloelo-bohloko ea sistimi ka 10 dB kapa ho feta. Moralo o nepahetseng o tlase oa PIM PCB o netefatsa hore botšepehi ba lets'oao bo lula bo sa thekesele ho ketane eohle ea RF.

Ho utloisisa Passive Intermodulation (PIM)

Mekhoa ea ho theha PIM

Passive Intermodulation e etsahala ha mats'oao a mabeli kapa ho feta a RF a kopana ka har'a mateano a se nang moeli ka har'a meaho eo ho thoeng ke ntho e sa fetoheng, 'me a theha likarolo tse sa nepahalang tsa maqhubu a kopaneng a kopaneng a maqhubu. Ha bajari ba f₁ le f₂ ba haola le sehokelo se seng sa marang-rang, ba hlahisa lihlahisoa ka 2f₁–f₂, 2f₂–f₁, le metsoako ea maemo a holimo. Ho fapana le ho kenella ka mokhoa o sebetsang ho li-amplifiers, PIM e hlaha ho tsoa ho likhokahano tsa tšepe ho isa ho tšepe, bokaholimo bo nang le oxidized, litšila tsa ferromagnetic, le litlolo tse sa bonahaleng tsa bokaholimo tse bonts'ang conductivity e itšetlehileng hona joale.

Phapanyetsano ea Active Versus Passive Intermodulation

Intermodulation e sebetsang e simoloha ho li-semiconductor junctions moo ts'ebetso ea mats'oao ka boomo e etsahalang, ho latela ts'ebetso ea phetisetso e lebelletsoeng esale pele. Passive intermodulation e hlaha ka har'a meaho eo ho nahanoang hore e na le mela ka ho ikopanya le nonlinearity, litlamorao tsa electrochemical libakeng tse sa tšoaneng tsa tšepe, le ho futhumatsa hona joale ho tsamaisang conductivity. PIM e bonahala e na le bothata haholo hobane e bonahala e sa lebelloa, e fapana ho ea ka maemo a tikoloho, 'me e ka hlaha ka lebaka la bofokoli ba tlhahiso bo sa bonahaleng ho liteko tse tloaelehileng tsa motlakase.

Maikutlo a khafetsa ho Libopeho tsa PCB

Bohloko ba PIM bo eketseha ka maqhubu a gigahertz moo phello ea letlalo e tsepamisitseng maikutlo holim'a meeli e holimo, e matlafatsang tšusumetso ea bokaholimo ba bokaholimo le likarolo tsa oxide. Ho 2 GHz ho ea holimo, liphapang tsa sebaka sa submicron li fetoha tsa bohlokoa ka motlakase, li etsa hore boleng ba boleng ba PCB bo be bohlokoa haholo bakeng sa ts'ebetso e tlase ea PIM PCB. Ho palama baesekele ho mpefatsa litlamorao tsena kaha katoloso e fapaneng ea mocheso e etsa hore ho be le motsamao o sa bonahaleng ho li-interfaces, ho fetola khanyetso ea likhokahano.

Lisosa tsa Motso oa PIM ho Moqapi o tlase oa PIM PCB

Bafani ba Tsoelanang le Lintho

Bokhopo ba bokaholimo ba koporo bo ama ka kotloloho tlhahiso ea PIM ka tšubuhlellano ea hona joale ea litlhoro tse nyane haholo le liphula. Koporo e rokotsoeng e nang le li-profiles tse mpe e bonts'a PIM e phahameng ho feta koporo e nang le electrodeposited e nang le topology e laoloang. Lisebelisoa tsa dielectric tse nang le li-monomers tse setseng kapa mongobo li hlahisa bongata bo sa lumellaneng, ha likaroloana tse lahlehileng li hlahisa mocheso o fetolang conductivity ea sebaka ka tlas'a matla a phahameng a RF.

Mehloli e Amanang le Moqapi

Lintlha tsa bohlokoa tsa moralo tse amang ts'ebetso e tlase ea PIM PCB li kenyelletsa:

• Kabo ea hajoale - Litsela tsa Nonuniform li qobella matla a mats'oao ka libaka tse thibetsoeng moo tekano ea hona joale e atamelang meeli ea thepa
• Botšepehi ba sefofane sa fatše - Lifofane tse sa tsoeleng pele li theha loops tsa morao-rao tse shebaneng le masimo metseng ea PCB
• Ka meaho - Boleng ba ho roala barel bo lekanya ts'ebetso ea PIM, haholoholo ho li-stackups tse nang le palo e phahameng
• Bongata ba sefahleho - Tekano e 'ngoe le e' ngoe e eketsehileng e hlahisa lintlha tse ka bang teng tse sa amaneng le marang-rang

Lintlha tsa Tlhahiso le Kopano

Masala a Solder flux a theha litšitiso tse sireletsang libakeng tse mahlonoko, tse qobellang hona joale ka lintlha tse nyane tse bonts'ang boitšoaro bo sa tloaelehang. Khatello ea mochini e tsoang ho sehokelo e bakang likhatello tsa khatello tse hlahisang likhokahano tse sa tsitsang tsa tšepe ho isa ho tšepe. Tšilafalo nakong ea ha e etsoa e hlahisa lisebelisoa tsa kantle tse nang le thepa ea makenete kapa liphapang tse ka bang teng tsa electrochemical tse hlahisang PIM tlas'a tšusumetso ea RF.

Litšusumetso tsa Tikoloho

Thermal cycling drives interface oxidation mme e baka katoloso ea phapang lipakeng tsa lisebelisoa tse sa ts'oaneng, e hlophisang khanyetso ea likhokahano holim'a mekhahlelo ea mocheso o sebetsang. Ho kenella ha mongobo ho khothalletsa ho bola ha electrochemical libakeng tse pepeneng tsa koporo le li-interfaces tse petelitsoeng. Mekhoa ena e itšetlehileng ka nako e bolela hore ts'ebetso ea PIM e fokotseha ho feta bophelo bohle ba sehlahisoa, e leng se etsang hore mekhahlelo ea pele ea moralo e be ea bohlokoa.

Mahlale a Tlase a PIM PCB Moralo le Mekhoa e Metle ka ho Fetisisa

Khetho ea Leano la Lintho

Moralo oa PCB oa PIM e Tlase o qala ka khetho ea substrate e behang pele thepa e bonts'ang ho se be le linearity e fokolang ea dielectric le lintlha tse fokolang tsa ho qhalana. laminate e ikhethang ea tahlehelo e tlase le li-laminate tse thehiloeng ho PTFE li bontša ts'ebetso e phahameng ea PIM ka tumello e tsitsitseng le ho monya mongobo o fokolang. Khetho ea foil ea koporo e totobatsa liprofaele tse boreleli tse fihlellehang ka ho beha li-electrode, ka li-foil tse phekotsoeng morao tse fanang ka ho fokotseha ha bokaholimo. Ho qoba thepa ea ferromagnetic hoa hlokahala, kaha li hlahisa ho se be le linearity e feteletseng esita le maemong a tlase a matla.

Optimized Surface Finishes

Khetho ea ho qetela ea sefahleho e ama haholo ts'ebetso e tlase ea PIM PCB:

• ENIG (Electroless Nickel Immersion Gold) - PIM e phahameng ka lebaka la thepa ea ferromagnetic ea nickel
• EPIG (Electroless Palladium Immersion Gold) - E felisa lisebelisoa tsa makenete ha e ntse e fana ka khanyetso ea oxidation
• Silivera ea ho qoelisoa - Ts'ebetso e ntle haholo empa e hloka ho ts'oaroa ka hloko ho thibela ho silafala
• OSP (Organic Solderability Preservative) - E fokotsa ho rarahana ha sehokelo empa e fana ka bophelo bo lekanyelitsoeng

Laolo ea Stackup le Layout

Ho bokellana ha mealo e lekanang ka difofane tse tswelang pele tsa lefatshe ho fokotsa phapang ya tsela ya hona jwale le ho fokotsa dintlha tsa mahloriso a tshimo. Tsamaiso ya matshwao e boloka impedance e laolwang nakong ya diphetoho, ho qoba diphetoho tse tshohanyetso tsa bophara kapa dikgeo tsa sefofane sa referense tse tsepamisang bongata ba hona jwale. Ka moralo o hatisa meaho e tletseng le e phuthetsweng e tlosang dikgeo tsa moya moo oxidation e ka bang teng. Meralo e tlase ya PIM PCB e fokotsa palo yohle ya sebopeho ka ho fokotsa di-vias tse sa hlokahaleng le ho kopanya ditsela tsa bohlokwa tsa RF hodima mealo e le nngwe.

Precision Connector Integration

Khetho ea sehokelo e shebana le meralo e matla ea mochini e nang le kabo e laoloang ea khatello ea khokahano. DIN 7/16 le li-connectors tsa mofuta o tlaase oa PIM N li na le likhokahano tsa koporo tsa beryllium tse nang le silevera tse nang le silevera tse nang le likamano tse tletseng selemo tse bolokang mokhoa o tsitsitseng oa sebopeho ho pholletsa le mocheso le vibrate. Moralo oa phetoho o felisa ho kobeha ho nchocho 'me o netefatsa phetoho e thellang ho tloha ho coaxial ho ea ho li-geometri tse hlophisitsoeng.

Taolo ea Ts'ebetso ea Tlhahiso

Mekhoa ea kopano bakeng sa tlhahiso e tlase ea PIM PCB e kenyelletsa:

• Litokisetso tsa holimo - Ho hloekisa ka ho qhibiliha le ho phekola moea oa ionized pele u koaleha
• Khetho ea ho peista ea solder - Metsoako e se nang mabifi ea flux e fokotsang masala
• Reflow profil - Ho laola khatello ea maikutlo ha u ntse u etsa bonnete ba hore solder wetting e feletseng
• Tlhahlobo ea kamora kopano - Tlhahlobo ea mahlo ea li-junctions tsa bohlokoa tsa RF le li-coat tse ikhethileng tse ikhethileng

Teko le netefatso ea Ts'ebetso e tlase ea PIM PCB

Mokhoa oa ho hlahloba PIM

Teko e tloaelehileng ea PIM e sebelisa lik'hamera tse peli tsa matla a holimo tse arohaneng ke bandwidth ea kanale, hangata e le 2×20W (43 dBm), ha e ntse e lekanya lihlahisoa tsa intermodulation tsa tatellano ea boraro ho 2f₁–f₂ le 2f₂–f₁ maqhubu. Sistimi ea liteko e hloka karohano e ikhethang e fetang 160 dB lipakeng tsa ho fetisa le ho amohela litsela ho khetholla PIM ea 'nete ho li-artifact tsa litekanyo. Li-module tsa PIM PCB tse tlase li etsa liteko ka likamoreng tse sirelelitsoeng li sebelisa likhokahanyo tse lekantsoeng le meroalo e tlase ea PIM.

Maqhubu le Mekhahlelo ea Matla

Teko ea meaho ea mehala ea mehala hangata e tloha 700 MHz ho 6 GHz ka matla a ho fetisa ho tloha 20W ho isa 80W ka sejari se le seng, e emelang maemo a ts'ebetso liteisheneng tse kholo. Lisebelisoa tsa sathelaete li atolosa liteko ho maqhubu a Ku-band le a Ka-band moo lisebelisoa tsa motlakase tsa sepakapaka li hlahisang matla a maholo a RF. Kamano pakeng tsa matla a ho kenya le lihlahisoa tsa PIM e latela boitšoaro ba molao oa taelo ea boraro kapa ea bohlano, e lumellang ho feta ho tloha maemong a teko ho ea ho maemo a ts'ebetso.

Mekhoa ea ho netefatsa boemo ba PCB

Litokiso tse inehetseng tsa liteko li nolofalletsa sebopeho se tlase sa PIM PCB nakong ea nts'etsopele, ho supa libaka tse nang le mathata pele ho kopanyo ea sistimi. Lisebelisoa tsena li sebelisa likhokahano tse nepahetseng le meaho ea ho qala e laoloang ho arola menehelo ea PCB ho lisebelisoa tsa liteko. Likamore tsa Thermal li beha liboto ho baesekele ea mocheso ha li ntse li shebile phapang ea PIM, li senola mekhoa e itšetlehileng ka mocheso. Mekhoa ea ho hlahloba li-microanalysis e kenyelletsang ho lekola microscope ea elektrone ho supa litšila kapa mefokolo ea sebopeho libakeng tse mahlonoko.

Tšebeliso ea Taolo ea Boleng

Teko ea tlhahiso e theha litlhaloso tsa PIM tse loketseng litlhoko tsa ts'ebeliso, hangata li tloha ho -110 dBc ho isa ho -160 dBc ho latela kutloisiso ea sistimi. Taolo ea ts'ebetso ea lipalo-palo e lekola ts'ebetso ea PIM ho pholletsa le libaka tsa tlhahiso, e lemoha ho sisinyeha ha ts'ebetso pele litlamorao tsa chai li hlaha. Mekhoa ea tlhahlobo ea bokaholimo e netefatsa bohloeki le botšepehi ba ho qetela manonyellong a solder le li-interface tsa lihokelo.

Lisebelisoa tse Sebetsang le Tšusumetso ea Ts'ebetso

Libaka tse Bohlokoa tsa Kopo

Meaho ea mehala ea cellular ea moloko oa bohlano e ipapisitse le moralo o tlase oa PIM PCB ho ts'ehetsa li-antenna tse kholo tsa MIMO moo liteishene tse makholo tsa RF li sebetsang ka nako e le 'ngoe. Sistimi ea puisano ea satellite e hloka maemo a PIM ka tlase ho -150 dBc ho thibela tšitiso ea li-receiver tsa uplink tse sebetsanang le matšoao a haufi le mokatong oa lerata. Lisebelisoa tsa radar tse hlophisitsoeng ka mekhahlelo li kopanya matla a holimo le ts'ebetso e pharaletseng, e leng se etsang hore phokotso ea PIM e be ea bohlokoa bakeng sa ho bona liphofu tse fokolang.

Tlhahlobo ea Tšusumetso ea Ts'ebetso

Ho kenngoa ha masimo ho bontša hore ho fokotsa PIM ho tloha ho –125 dBc ho ea ho –150 dBc ho ntlafatsa kutloisiso ea moamoheli oa seteishene sa motheo ka 3 ho isa ho 5 dB, e leng se fetolelang ka ho toba ho radius e atolositsoeng ea tšireletso kapa ho kenella ho ntlafetseng ha moaho. Liteisheneng tsa fatše tsa satellite, ts'ebetso e phahameng ea PIM PCB e nolofalletsa ts'ebetso ka li-antenna tse nyane kapa matla a fokolang a phetisetso ha ho ntse ho bolokoa meeli ea lihokelo. Litsamaiso tsa radar li rua molemo ho amoheloeng ho ntlafetseng ha lintho tse sa lokelang le khethollo ea sepheo ha likarabo tsa bohata li sa hlole li pata liphetho tsa 'nete.

Mekhoa ea ho Kopanya Moralo

Ts'ebetsong e atlehileng e tlase ea PIM e fetela ka nqane ho moralo oa PCB ka mong ho kenyelletsa meralo e felletseng ea mojule oa RF. Marang-rang a phepelo ea li-antenna a rua molemo ho li-tee tse kopaneng tsa leeme le ho sefa ho kenngoeng tšebetsong ka mehala e tlase ea PIM ea phetisetso. Tlhahlobo ea boemo ba sistimi e supa menehelo ea PIM e kopaneng ho tsoa likopanong tse ngata, ho abela likhakanyo tsa lichelete ho li-module tse ikemetseng ho ipapisitse le boemo ba tsona ketane ea matšoao le maemo a matla a ts'ebetso.

fihlela qeto e

Moralo o tlase oa PIM PCB o emela taeo e hlophisitsoeng ea boenjiniere e kopanyang mahlale a lisebelisoa, mohopolo oa motlakase, le tlhahiso e nepahetseng ho felisa mehloli ea tšitiso e se nang moeli lits'ebetsong tse phahameng haholo. Ha meaho e se nang mohala e ntse e tsoela pele ho ea ho maqhubu a phahameng, li-bandwidth tse pharalletseng, le ho eketseha ha sekhahla sa liteishene, phokotso ea PIM e ba bohlokoa le ho feta. Ho kenya ts'ebetsong ka katleho ho hloka ho ela hloko karolo e 'ngoe le e 'ngoe ea ts'ebetso ea PCB, ho tloha ho khetho ea thepa ea pele ho ea ho mekhoa ea ho qetela ea kopano.

Highleap Electronics e fana ka litharollo tse felletseng tse tlase tsa PIM PCB ka:

• Khetho ea thepa e tsoetseng pele – Li-laminate tse nang le tahlehelo e tlase ho kenyeletsoa le li-substrate tse khethehileng tsa laminate tse nang le tahlehelo e tlase le PTFE tse nang le liprofaele tsa bokaholimo ba koporo tse laoloang
• Optimized surface finishes - Likhetho tse se nang Nickel (EPIG, silevera e qoelisoang) tse felisang likhokahano tsa ferromagnetic
• Tlhahiso e nepahetseng - Mekhoa e laoloang ea ho pola, libaka tsa kopano tse se nang tšilafalo, le ho kenya sehokelo se boletsoeng ka torque
• Li-protocol tse matla tsa tlhahlobo - Netefatso ea PIM ho pholletsa le mekhahlelo ea ts'ebetso ea ts'ebetso ka ho palama baesekele ea mocheso le taolo ea ts'ebetso ea lipalo
• Tšebelisano ea boenjiniere - Ts'ehetso ea moralo bakeng sa ntlafatso ea li-stackup, litlhaloso tsa thepa, le netefatso ea ts'ebetso

Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka litlhoko tsa hau tse tlase tsa PIM PCB le ho ithuta kamoo lits'ebetso tsa rona tse pakiloeng tsa tlhahiso li ka tšehetsang nts'etsopele ea sistimi ea hau ea RF ea moloko o latelang.