Multilayer PCB ke eng: tlhahiso le moralo

Ho fapana le li-PCB tse nang le lera le le leng kapa tse nang le lera le le leng, li-PCB tse nang le lera le le leng li na le lera tse tharo kapa ho fihlela ho tse 60 tsa koporo, tse arotsoeng ka thepa ea ho thibela mocheso le ho laminated hammoho tlas'a mocheso le khatello. Lera tsena tse eketsehileng li lumella meralo ea potoloho e rarahaneng le e teteaneng, e amohelang likarolo tse ngata boto e nyane. Bokhoni bona bo bohlokoa haholo lisebelisoa tsa elektroniki tsa sejoale-joale, moo lisebelisoa li ntseng li e-ba nyane haholo empa li le matla le ho feta. Phetoho ea li-PCB tse nang le lera le le leng e susumelitsoe ke tlhoko ea lihlahisoa tsa elektroniki tse sebetsang hantle, tse tšepahalang le tse nyane. Ka bondply ea RO4450T bakeng sa liboto tsa RF tse nang le lera le le leng , botenya ba lera la bond bo tlameha ho hlahlojoa ka har'a stackup e felileng ho e-na le ho tšoaroa feela e le lebitso la ho reka.

Mehaho e Tloaelehileng ea Multilayer

• Likarolo tse 4-6 - ho rarahana ho tlase ho isa ho tse itekanetseng
• Likarolo tse 8-10 - liboto tse rarahaneng tsa digital
• Likarolo tse 12-16 - RF e tsoetseng pele le ts'ebetso ea data
• Likarolo tse 20+ - likhokahano tse teteaneng haholo
• 60+ layers - boemo ba theknoloji ea HDI ea bonono

Mokhoa oa Tlhahiso oa li-PCB tsa Multilayer

1. Sebopeho sa Lera le ka Hare

Photolithographic patterning e sebelisoa ho laminates koporo-clad ho hlalosa mesaletsa potoloho, lateloa ke etching hole sa batleheng koporo, ho eketsa lipakane tsa ngodiso lera le masoba tooling, liteko tsa motlakase tsa mesaletsa, le holim'a lokisetsa lamination.

2. Layer Lamination

Likarolo tse ngata li hokahanngoa ho sebelisoa likhatiso tsa lamination la sheet, tse nang le tlhophiso ea li-cores, prepregs, koporo le dielectrics, tse folisitsoeng tlas'a mocheso le khatello ho theha laminate e tiileng.

3. Ho cheka masoba

Ho cheka ka mokhoa o nepahetseng ho theha lisebelisoa le ka masoba a nang le ngoliso e nepahetseng bakeng sa karolo ka 'ngoe.

4. Ho roala ha lesoba

Lisebelisoa tsa koporo tse se nang motlakase tse lateloang ke electrolytic copper plating li haha ​​​​koporo ka har'a likarolo tse ka hare le masoba a phuntsoeng.

5. Outer Layer Processing

Tšebeliso ea maske ea solder e nang le setšoantšo se nkiloeng ka metsi , ho hatisa matšoao a boitsebiso, ho etsa lipaterone le ho fata potoloho ea lera le ka ntle, le ho fetisetsa phanele ho li-PCB ka bonngoe.

6. Teko le Tiisetso ea Boleng

E kenyelletsa tlhahlobo e ikemetseng ea optical, tlhahlobo ea khokahano ea marang-rang, impedance, motlakase o phahameng, le tlhahlobo ea ts'ebetso, hammoho le taolo ea boleng bo holimo.

Mehopolo ea Moqapi oa Multilayer PCB

Palo ea Likarolo:

Ho etsa qeto ea palo ea mekato ke mohato oa pele oa moralo oa multilayer PCB. Palo ea lera, e ka tlohang ho mekhahlelo e mene ho isa ho e leshome kapa ho feta, e ipapisitse le ho rarahana ha moralo, palo ea likarolo, le litlhoko tsa ts'ebetso ea motlakase.

Ho Bea Karolo

Ka ho sebelisa software ea sebopeho sa PCB, baqapi ba hlophisa likarolo le ho hlalosa likhokahano tsa motlakase. Tlhophiso e lokela ho ntlafatsa tsela ea mats'oao, ho fokotsa tšitiso, le ho netefatsa hore mocheso o fela.

Ho tsamaisa Letšoao

Tsela ea motlakase e kenyelletsa ho hlakisa bophara, sebaka le sebaka sa ho aroloa ha likhokahano, ho shebana le ho nepahala ha lets'oao, ho fokotsa lipuisano, le ho thibela ponts'o ea lets'oao.

Litlhaloso tsa Layer Stacking:

Likarolo li lokela ho phutheloa ka linomoro tse lekanang, 'me likarolo tsohle tsa matšoao li lokela ho ba haufi le sefofane sa fatše ka hohle kamoo ho ka khonehang. Tataiso ea wiring holim'a lera le ts'oanang la matšoao e lokela ho lumellana. Khetho ea palo ea likhakanyo e boetse e ipapisitse le mofuta oa lets'oao leo ba le hlokang ho le fetisa, le arotsoe ka maqhubu a phahameng, maqhubu a tlase, fatše kapa matla.

Tokiso ea likarolo le Sehokelo:

Ka mokhoa o nepahetseng, likarolo li lokela ho behoa ka lehlakoreng le le leng, 'me boemo le mokhoa oa ho tsamaisa likarolo tsa li-interface li lokela ho hlophisoa ka mokhoa o utloahalang. Likarolo tse nang le likhokahano tse haufi tsa motlakase li beoa hantle hammoho.

Gerber File Generation:

Hang ha litsela tsa motlakase li hlalosoa, lifaele tsa Gerber lia etsoa, ​​​​tse nang le tlhahisoleseding mabapi le sethala sa marang-rang, likhokahano tsa motlakase, ho behoa ha likarolo le lintlha tse ling tsa moralo.

Tlhahiso:

Moetsi o sebelisa lifaele tsa Gerber ho etsa li-photomasks, tse sebelisoang ho theha likarolo tsa PCB ka bomong. Likarolo tsena li entsoe ka laminated ho theha PCB ea ho qetela ea multilayer.

Matšoao a Botšepehi ba Pontšo ea Multilayer PCB

Layer Stack-Up: Ho rera ka nepo sethala sa stack-up ke sa bohlokoa. Likarolo tsa lets'oao le fatše li lokela ho kopanngoa haufi-ufi ho fokotsa ts'oaetso le ho bonahatsa mats'oao.

Trace Routing: Litsela li lokela ho tsamaisoa ho qoba ho kena-kenana le li-crosstalk le electromagnetic interference (EMI). Ho boloka litsela tsa matšoao li le khuts'oane ebile li tobile ho ntlafatsa boleng ba matšoao.

Taolo ea ho se inehele : Ho boloka ho se inehele ho tsitsitseng ho pholletsa le PCB ho thibela ho sotha le ho bonahatsa matšoao.

Decoupling Capacitors: Tsena li bohlokoa bakeng sa ho laola botšepehi ba matla le ho fokotsa lerata la lifofane tsa motlakase.

Via Design: Moralo le ho beoa ha litsela tsa mats'oao a li-vias mme li lokela ho ntlafatsoa ho boloka botsitso ba matšoao.

Litšenyehelo tsa ho nahana ka Multilayer PCB

Ho rarahana le Palo ea Lera: Mekhahlelo e mengata le ho rarahana ha moralo li eketsa litšenyehelo tsa tlhahiso.

Lisebelisoa tse Sebelisitsoeng: Lisebelisoa tsa boleng bo holimo kapa tse khethehileng li ka phahamisa litšenyehelo ka kakaretso.

Mekhoa ea Tlhahiso: Mekhoa e tsoetseng pele ea tlhahiso ea meralo e rarahaneng le eona e ka eketsa litšenyehelo.

Boholo ba PCB: Li-PCB tse kholo li hloka lisebelisoa tse ngata le ho sebetsa, ho eketsa litšenyehelo.

Bongata: Lits'ebetso tse kholo tsa tlhahiso li ka fokotsa litšenyehelo ka yuniti ka 'ngoe ka lebaka la maemo a moruo.