Tlhahiso ea RO4450T Bondply PCB

RO4450T bondply e fetoha karolo ea motlakase e bokellang hang ha e hatelloa ho RF multilayer. Ka hona, sepheo sa tlhahiso ke ho hlahisa geometry le ngoliso ea dielectric e felileng eo moralo oa RF o e nkang. Sebaka sa k'hamphani: Highleap Electronics e etsa le ho kopanya PCB e felileng. Sehlopha sa Rogers se boletsoeng leqepheng lena se khetholla laminate e boletsoeng; Highleap ha e hlahise kapa ha e rekise li-laminate tsa Rogers. RO4450T bondply Tlhahiso ea PCB ke ts'ebetso e laoloang ea lamination ea multilayer bakeng sa li-stackups tsa Rogers PCB tse nang le maqhubu a phahameng. RO4450T ha e sebelisoe e le laminate ea mantlha e ikemetseng. E sebetsa e le lera la bond ho meaho ea RO4000 multilayer, haholo-holo ka li-stackups tsa RO4003C, RO4350B, le tse khethiloeng tsa hybrid Rogers/FR4. Haeba kaho e fetoha ho thepa ena, ts'ebetso ea RO4460G2 bondply e hloka tumello e nchafalitsoeng ea potoloho ea khatiso le botenya ba dielectric.

Bakeng sa tlhahiso ea RF PCB, tlhoko ea bohlokoa ha se feela ho fumaneha ha thepa. Ho bokellana ho felletseng ho tlameha ho hlahlojoa bakeng sa botenya ba dielectric, boima ba koporo, sepheo sa impedance, botsitso ba lamination, ngoliso, ho cheka, ho plating, le ho pheta-pheta ha tlhahlobo. Highleap e hlahloba lintlha tsena pele ho khotheishene e le hore PCB e felileng e ka fihlela litlhoko tsa ts'ebetso ea mechini le ea RF. Highleap e hlahloba bondply hammoho le li-cores, koporo le botenya bo hatelletsoeng ke sepheo. Khatello ea lamination, kabo ea resin le ngoliso li lokela ho tšoaroa e le fensetere e le 'ngoe ea ts'ebetso, haholo-holo moo impedance kapa bolelele ba mohato bo itšetlehileng ka jiometri ea ho qetela. Boleng ba thepa ea thepa bo nepahetseng bo lokela ho hlahlojoa khahlanong le litokomane tsa mofani oa hona joale bakeng sa kereiti e boletsoeng le kaho.

RO4450T bondply e nkuwa e le qeto ya kaho ya lera ho isa ho lera. Diteko tsa bohlokwa tsa tlhahiso ke lera la dielectric tse haufi, botenya bo hatelletsoeng, ngodiso, dibopeho tsa koporo le tatellano ya lamination e sebediswang ho fihlella stackup ya RF e lokollotsweng.

RO4450T Bondply bakeng sa Rogers Multilayer PCB Stackups

RO4450T ke karolo ea pokello ea motlakase.

RO4450T e atisa ho sebediswa e le thepa ya ho kopanya meahong ya PCB e nang le maqhubu a mangata a phahameng. Ho RO4003C, RO4350B, kapa di-stackups tsa Rogers tse kopaneng, lera la bondply le ka ama meaho ya stripline, ho kopanya ka tsela e pharaletseng, diphetoho tsa RF, sebaka sa lera ho ya ho lera, le pheteho ya impedance. Ho bapisa ditlhoko tsa tshebetso ya prepreg ya RO4450F ho thusa feela ka sistimi e nepahetseng ya resin, kaho le stackup e fedisitsweng e boletsweng.

Highleap e hlahloba kaho e felletseng ea PCB pele ho tlhahiso, ho kenyeletsoa thepa ea mantlha, callout ea bondply, botenya ba koporo, botenya ba boto e felileng, tatellano ea lamination, le litlhoko tsa impedance. Sena se thusa ho netefatsa hore na moralo o ka etsoa ka mokhoa o ts'oanang ho tloha tlhahisong ea mohlala ho ea ho e pheta-phetoang.

• Li-PCB tsa RF tsa RO4003C le RO4350B tse nang le mekhahlelo e mengata
• Li-stackup tsa li-PCB tse nang le maqhubu a phahameng a Hybrid FR4/Rogers
• Li-module tsa RF tse nang le likarolo tse laoloang tsa dielectric bonding
• Li-prototype tsa PCB tse nang le mekhahlelo e mengata tse laoloang
• Meaho ea tlhahiso e hlokang ts'ebetso e tsitsitseng ea RF

Bakeng sa liphetho tse ntle ka ho fetisisa, lera la RO4450T le lokela ho bontšoa ka ho hlaka setšoantšong sa stackup. Setšoantšo se lokela ho khetholla motheo o mong le o mong, bondply, lera la koporo, sefofane sa litšupiso, lera la impedance, le tlhoko ea botenya bo felileng.

Lihlooho tse amanang le tlhahiso li kenyelletsa lamination ea PCB , lamination ea PCB e kopantsoeng , le Rogers PCB stackup.

Taolo ea Botenya le Phetisetso ea RO4450T

Lera la bondply le tlameha ho kenyelletsoa mohlaleng oa impedance.

Ho PCB e nang le mekhahlelo e mengata e phahameng, botenya ba RO4450T le boits'oaro ba dielectric li lokela ho kenyelletsoa palong ea stackup. Haeba mohlala oa impedance o nahana feela ka geometry ea koporo empa o hlokomoloha lera la bonding, boto e felileng e ka 'na ea fosa impedance e reriloeng esita le ha mohlala oa potoloho o ngotsoe hantle.

Pele ho disebediswa tsa CAM, Highleap e hlahloba hore na di-traces tse laolwang di supa motheo wa Rogers, lera la bondply la RO4450T, kapa sebopeho se kopaneng sa dielectric. Botenya ba koporo bo fedisitsweng, kabelo ya plating, ho tswela pele ha referense, le moralo wa setlankane sa impedance le tsona di a hlahlojwa.

• Botenya ba bondply le sesupo sa thepa
• Sebopeho sa dielektri sa lera ka lera
• Boleng ba impedance e laoloang le mamello
• Botenya ba koporo bo felileng le tšusumetso ea plating
• Boemo ba setlankane sa Impedance le tlhoko ea teko

Liphetoho tse nyane bophahamong ba dielectric, boima ba koporo, phallo ea resin, kapa moralo oa sefofane sa litšupiso li ka ama sephetho sa motlakase. Ka lebaka lena, tafole ea stackup le impedance e lokela ho amoheloa pele lifaele tsa tlhahiso li lokolloa.

Taolo ea Lamination ea RO4450T

Ho tsitsa ha lamination ho etsa qeto ea hore na RF e ka phetoa joang.

Lamination ea RO4450T e hloka taolo ea khatello, mocheso, phallo ea resin, ngoliso, kotsi ea lefela, le botenya ba ho qetela ba dielectric. Tsena ke lintlha tsa tlhahiso tse susumetsang ka kotloloho boleng ba boto e felileng, haholo-holo tlhahisong ea PCB ea RF ea mekhahlelo e mengata.

Bakeng sa li-stackup tsa hybrid Rogers/FR4, Highleap e hlahloba ho lumellana ha thepa, ho se lumellane ha CTE, ho leka-lekana ha koporo, boleng ba ho phunya, le ho lumella li-substitution tsa thepa pele ho khotheishene. Sena se thibela stackup ho ba moaho o sa laoleheng oa hybrid nakong ea tlhahiso.

• Fensetere ea ts'ebetso ea potoloho ea khatiso le lamination
• Taolo ea ngoliso bakeng sa liboto tsa RF tse nang le mekhahlelo e mengata
• Kotsi ea ho se be le letho, ho qhaqhoa ha metsi le ho phalla ha resin
• Tlhahlobo ea tekanyo ea koporo le sebopeho sa phanele
• Ho khoneha ha ho lamination ka tatellano ha ho hlokahala
• Ho lumellana ha thepa ea Hybrid Rogers/FR4

Haeba moralo o hloka lamination e latellanang, libaka tse khethehileng tsa masoba, kabo ea koporo e sa lekanang, kapa taolo e tiileng ea botenya bo felileng, litlhoko tsena li lokela ho thathamisoa setšoantšong sa tlhahiso. Litokomane tse hlakileng li thusa ho fokotsa ho bolokoa ha boenjiniere, kotsi ea ho nkeloa sebaka ha thepa, le tieho ea tlhahiso.

Litlhoko tsa Khoutu ea RO4450T PCB 

Sephutheloana se felletseng sa RFQ se ntlafatsa ho nepahala ha khotheishene.

Ho qotsa PCB ea bondply ea RO4450T, Highleap e hloka data e felletseng ea tlhahiso. Faele ea Gerber feela hangata ha ea lekana bakeng sa tlhahlobo e nepahetseng ea stackup, netefatso ea impedance, moralo oa lamination, kapa tlhahlobo ea litšenyehelo.

• Lifaele tsa Gerber, ODB++, kapa IPC-2581
• Setšoantšo sa tlhahiso
• Setšoantšo sa ho bokellana ha lera
• RO4003C, RO4350B, RO4450T, kapa kopo ea thepa e kopantsoeng
• Boima ba koporo le tlhoko ea koporo e felileng
• Tafole ea impedance e laoloang le mamello
• Tlhokahalo ea ho qeta holim'a metsi
• Tlhokahalo ea botenya ba boto e felile
• Tlaleho ea thibelo, setlankane sa teko, kapa tlhoko e khethehileng ea tlhahlobo
• Difaele tsa kopano haeba tshebeletso ya PCBA e hlokahala

Romela sephutheloana sa tlhahiso ka foromo ea khotheishene ea Highleap PCB . Highleap e ka hlahloba ho fumaneha ha thepa, ho khoneha ha ho bokellana, kotsi ea ho lamination, taolo ea impedance, boemo ba tlhahlobo, le nako ea ho etella pele pele e netefatsa khotheishene. Bakeng sa RFQ, kenyelletsa kaho e felletseng ea lera, botenya ba sepheo, koporo, boholo ba boto le bongata. Ho bokellana ho felletseng hoa hlokahala bakeng sa khotheishene e nang le moelelo e thehiloeng ho bondply.