Tataiso e Feletseng ea Hybrid Lamination: Ho Laola Warpage ka High-Frequency le FR-4 Materials

Ho laminate e kopantsoeng ea thepa e nang le maqhubu a phahameng, joalo ka CORE (mohlala, laminate ea hydrocarbon-ceramic low-loss , RF-35A), le thepa e tloaelehileng ea FR-4 e se e le ts'ebetso ea bohlokoa tlhahisong ea PCB (Printed Circuit Board). Laminate ea hybrid PCB e kopanya thepa e phahameng ea motlakase ea li-laminate tse nang le maqhubu a phahameng le theko e tlase le botsitso ba mechini ba FR-4. Sena se etsa hore li-PCB tsa hybrid laminate e be tharollo e loketseng bakeng sa lits'ebetso tsa lebelo le phahameng, RF, le microwave moo ts'ebetso le ts'ebetso li lokelang ho leka-lekana. Bakeng sa kaho ea boto ea hybrid Rogers le FR-4 , sistimi ea bond, potoloho ea khatiso le ho hokahanya lera li lokela ho hlahlojoa e le stackup e felletseng pele ho etsoa.

Leha ho le joalo, ho etsa li-PCB tsa hybrid laminate ho hlahisa liphephetso tse kholo ka lebaka la phapang ea tlhaho ea thepa ea thepa, joalo ka coefficient of thermal expansion (CTE), dielectric constant (Dk), le thermal stability. Liphapang tsena hangata li baka khatello ea maikutlo nakong ea ts'ebetso ea lamination le libaesekele tse futhumatsang tse latelang, tse ka lebisang ho warpage, delamination, kapa ho hloleha ha mochini. Litaba tse joalo ha li sekisetse feela ts'epo ea sebopeho le motlakase oa PCB empa hape li ka fokotsa lihlahisoa tsa tlhahiso le ho eketsa litšenyehelo tsa tlhahiso ka kakaretso.

Sengoloa sena se fana ka sete e qaqileng ea likhothaletso le mekhoa e metle ea ho ntlafatsa lits'ebetso tsa laminate tsa PCB tse kopantsoeng, ka ho shebana le ho laola warpage le ho netefatsa botšepehi. Puisano e kenyelletsa maano a li-stackup tsa PCB tsa laminate tse kopantsoeng tse nang le mekhahlelo e mene, tse atisang ho etsoa e le CORE (thepa e phahameng ea maqhubu) + PP (prepreg) + CORE (FR-4), 'me e hlahloba kamoo khetho e nepahetseng ea thepa, ho leka-lekana ha stackup, le taolo ea ts'ebetso li ka ntlafatsang liphetho tsa tlhahiso haholo. Ha ho sebelisoa li-bonding layers tsa RO4460G2 ho li-stackups tsa RF , potoloho ea khatiso, kabo ea koporo le sebaka se felileng sa dielectric li lokela ho lumellanoa le moetsi.

Mathata a Hybrid Lamination

Ho kopanngoa ha thepa e nang le maqhubu a phahameng, joalo ka laminate ea hydrocarbon-ceramic low-loss le RF-35A, ka FR-4 ho li-lamination tsa PCB tse kopantsoeng ho bohlokoa bakeng sa lits'ebetso tse hlokang ts'ebetso e phahameng le ea RF. Leha ho le joalo, thepa e fapaneng ea thepa e baka liphephetso tse lokelang ho rarolloa ho netefatsa li-PCB tse tšepahalang le tse ka hlahisoang. E 'ngoe ea lintho tse ka sehloohong tse tšoenyang ke ho se lumellane ha katoloso ea mocheso. Lisebelisoa tse nang le maqhubu a phahameng hangata li na le coefficient e tlase ea katoloso ea mocheso (CTE) ho feta FR-4. Ho se lumellane hona ho baka khatello e kholo ea mechini nakong ea lits'ebetso tsa lamination le thermal cycling, e leng se ka lebisang ho warpage, delamination, kapa esita le ho petsoha ha li-via le li-microvia. Khetho e hlokolosi ea thepa le ntlafatso ea stackup li bohlokoa ho rarolla bothata bona.

Phapang ea Katoloso ea Mocheso

E 'ngoe ea liqholotso tsa bohlokoa ka ho fetisisa ho lamination e nyalisitsoeng ke ho se lumellane ho li-coefficients of thermal expansion (CTE) pakeng tsa lisebelisoa tse phahameng tsa maqhubu le FR-4. Lisebelisoa tsa maqhubu a phahameng ka kakaretso li bonts'a boleng bo tlase ba CTE ha bo bapisoa le FR-4, e bakang khatello ea maikutlo nakong ea ts'ebetso ea lamination le libaesekele tse latelang tsa mocheso (mohlala, nakong ea reflow ea solder). Khatello ea kelello ena e ka lebisa litabeng tse matla, tse kang warpage ea PCB ea ho qetela, delamination at interfaces material, le microvia cracking. Mathata ana a ka senya botšepehi ba mochine le ts'ebetso ea motlakase ea PCB. Khetho ea thepa le moralo o hlokolosi oa li-stackup li bohlokoa ho fokotsa litlamorao tsa ho se lumellane ha katoloso ea mocheso.

Khetho ea Prepreg le Symmetry

Prepregs (PP) e bapala karolo ea bohlokoa ho laminations e nyalisitsoeng, e sebetsa e le sekhomaretsi le likarolo tsa dielectric lipakeng tsa laminate. Leha ho le joalo, khetho e fosahetseng kapa tšebeliso e fosahetseng ea prepregs e ka baka ho se leka-lekane ho hoholo ha khatello ea maikutlo, ho lebisang ho warpage. Li-stackups tsa prepreg tse sa tsitsang hangata li etsa hore ho be le phallo e sa lekanang ea resin nakong ea lamination, e leng ho mpefatsang khatello ea maikutlo le deformation ea mochini. Meralo ea li-symmetrical stackup e khothaletsoa ho netefatsa kabo e tšoanang ea resin le khatello ea maikutlo. Likahare tse nepahetseng tsa resin le khetho ea botenya ba prepreg le tsona li bohlokoa ho boloka botsitso ba mochini le ho fokotsa ho khopama kahare.

Khatello e Amanang le Qetello ea Bokaholimo

Khetho ea ho qeta bokaholimo e ka ama haholo leqephe la ntoa le botsitso ba mochini oa li-PCB tse nyalisitsoeng. Mekhoa e kang ho fafatsa ka tin (HASL) e kenyelletsa mocheso o phahameng o ka hlahisang khatello e eketsehileng ea mocheso ho boto ea laminated. Sena se na le bothata ka ho khetheha bakeng sa li-laminations tse nyalisitsoeng, moo ho se lumellane ha CTE pakeng tsa lisebelisoa tse phahameng tsa maqhubu le FR-4 ho etsa hore li amehe haholo khatellong e joalo. Ka lebaka leo, HASL hangata ha e khothalletsoe bakeng sa liboto tse nyalisitsoeng. Ho e-na le hoo, ho khethoa mefuta e meng e kang ENIG (Electroless Nickel Immersion Gold) kapa OSP (Organic Solderability Preservatives) kaha e fokotsa khatello ea mocheso 'me e loketse haholoanyane lits'ebetso tse nyalisitsoeng.

Phapang ea Lintho

Ho fapana ha thepa ke phephetso e 'ngoe e kholo ho li-lamination tse tsoakiloeng. Esita le ka har'a sehlopha se le seng sa thepa, lihlahisoa tsa FR-4 tse tsoang ho bahlahisi ba fapaneng li ka bontša liphetoho litšobotsing tsa bohlokoa, joalo ka litaba tsa resin, mocheso oa phetoho ea khalase (Tg), le botsitso ba mocheso. Ho se lumellane hona ho ka lebisa ho qhetsoeng, ho eketseha ha warpage, le ho fokotseha ha botšepehi ba mechini ho PCB ea ho qetela. Ho sebelisa thepa ea FR-4 e netefalitsoeng, joalo ka Shengyi S1141 le S1170, tse lekiloeng bakeng sa ho lumellana le thepa ea maqhubu a phahameng, ho netefatsa ts'ebetso e tšepahalang le e tsitsitseng ho li-lamination tse tsoakiloeng.

Li-hybrid laminations tsa lisebelisoa tsa maqhubu a phahameng le FR-4 li tobane le liphephetso tse 'maloa, ho kenyeletsoa ho se lumellane ha katoloso ea mocheso, khetho ea prepreg le symmetry, khatello ea maikutlo e amanang le ho qetela, le phapang ea thepa. Ho rarolla mathata ana ho hloka khetho e hlokolosi ea lisebelisoa, meralo e netefalitsoeng ea prepreg, le taolo e nepahetseng ea ts'ebetso nakong ea tlhahiso. Ka ho latela mekhoa e metle le ho sebelisa meralo e ntlafalitsoeng, bahlahisi ba ka hlahisa li-PCB tse nyalisitsoeng tse tšepahalang le tse sebetsang hantle tse nang le li-warpage tse fokolang le tse tšoarellang nako e telele.

Litlhahiso bakeng sa Moralo oa Hybrid Lamination

1. Khetho ea Lintho

Khetho e nepahetseng ea thepa e bohlokoa ho fokotsa warpage ho laminations e nyalisitsoeng. Ho ipapisitsoe le boiphihlelo bo sebetsang le tlhaiso-leseling e sebetsang, ho khothaletsoa litataiso tse latelang:

• Bakeng sa 20mil 25FR + FR-4 Laminations : Nka sebaka sa 25FR ka laminate e nang le tahlehelo e tlase ea hydrocarbon-ceramic. laminate e nang le tahlehelo e tlase ea hydrocarbon-ceramic e fana ka tšebelisano e betere ea mechini le mocheso le FR-4 'me e sebetsa hantle haholo lits'ebetsong tsa maqhubu a phahameng.

• Bakeng sa 20mil laminate e nang le tahlehelo e tlase ea hydrocarbon-ceramic + FR-4 Laminations : Khetha thepa ea FR-4 e nang le botenya ba 0.51mm, 0.36mm, kapa 0.18mm. Har'a tsena, 0.51mm le 0.36mm lia khethoa ka lebaka la botsitso ba tsona bo phahameng ba mechini le sekhahla se tlase sa warpage.

• Bakeng sa 20mil RF-35A + FR-4 Laminations : Sebelisa thepa ea FR-4 e nang le botenya ba 0.10mm, 0.18mm, kapa 1.0mm. Likhetho tsena li bontšitsoe li fokotsa ho se lumellane ha khatello ea maikutlo ka katleho, li fokotsa ho oa ha leqephe.

2. Symmetrical Prepreg Stackup Design le Order-Specific Adjustments

Prepreg (PP) e phetha karolo ea bohlokoa ho leka-lekanya likhatello tsa mochine mohahong oa laminated. Moralo o sa tsitsang oa prepreg hangata o fella ka kabo e sa lekanang ea khatello ea maikutlo, e lebisang ho warpage ea bohlokoa le ho se tsitse ha mochini. Ho rarolla bothata bona, ho khothaletsoa meralo e latelang ea symmetrical prepreg stackup e le litataiso ho netefatsa phallo e nepahetseng ea resin le khatello ea maikutlo nakong ea lamination:

• 1080+2116+1080
• 3313+7628+3313
• 2116 × 2

Litlhophiso tsena li thusa ho fokotsa ho se leka-lekane ha khatello ea maikutlo, ho fokotsa ntoa, le ho boloka botsitso ba mochini ho pholletsa le mefuta e nyalisitsoeng.

Leha ho le joalo, ho bohlokoa ho hlokomela hore taelo e 'ngoe le e' ngoe e ikhethileng e ka hloka liphetoho ho ipapisitsoe le lethathamo la lisebelisoa tsa boenjiniere, litlhoko tsa impedance, le tsoelo-pele ea tlhahiso. Mohlala, litaelo tse kenyelletsang taolo ea impedance li ka hloka stackup e eketsehileng kapa litokiso tsa ts'ebetso ho fihlela lintlha tse nepahetseng tsa motlakase. Litlhahiso tse fanoeng mona ke litlhahiso tse akaretsang bakeng sa li-laminations tsa lebasetere tse 'nè' me li ka 'na tsa se ke tsa koahela litlhoko tse ikhethang tsa meralo eohle.

Bakeng sa tlhahlobo e felletseng ea ts'ebetso e ikhethileng le litlhoko tsa thepa bakeng sa odara ea hau, re u khothaletsa ho ikopanya le sehlopha sa rona. Baenjiniere ba rona ba tla ntlafatsa moralo oa li-stackup le liparamente tsa ts'ebetso ho ikamahanya le maemo a sebele a tlhahiso le ho netefatsa sephetho se setle ka ho fetisisa bakeng sa PCB ea hau.

3. Surface Qetella Litlhahiso

Ho Fafatsa ka Tin (HASL) :

• • Ho fafatsa ka tin ka kakaretso ha ho khothalletsoe bakeng sa liboto tsa lebasetere tse kopanyang lisebelisoa tse phahameng tsa maqhubu le FR-4 ka lebaka la khatello ea mocheso eo e e hlahisang, e ka lebisang ho eketseha ha warpage.
  • Haeba ho fafatsa ka thini ho ke ke ha qojoa, hoa amoheleha feela bakeng sa laminate e nang le tahlehelo e tlase ea hydrocarbon-ceramic + FR-4 hybrid laminations. Thepa ea mocheso le ea mechine ea laminate e nang le tahlehelo e tlase ea hydrocarbon-ceramic e etsa hore e hanele haholoanyane khatello e hlahisoang ke qetello ena ea bokaholimo.

4. Ts'ebetso e Lebeletsoeng ea Warpage

Ka ho latela litataiso tse kaholimo, ts'ebetso e lebelletsoeng ea warpage bakeng sa laminations e nyalisitsoeng ke e latelang:

• Bakeng sa laminate e nang le tahlehelo e tlase ea hydrocarbon-ceramic + FR-4 Hybrid Laminations: Warpage e ka laoloa ka hare ho 0.7%.
• Bakeng sa RF-35A + FR-4 Hybrid Laminations: Warpage e ka bolokoa ka tlase ho 1.0%.

Liphetho tsena li ntlafatsa haholo botsitso ba mochini le ho ikamahanya le maemo a indasteri bakeng sa tlhahiso e tšepahalang ea PCB.

5. Lisebelisoa tse amohelehang tsa FR-4

Ke lisebelisoa tse khethehileng feela tsa FR-4 tse lekiloeng le ho netefatsoa bakeng sa li-laminations tse nyalisitsoeng tse nang le lisebelisoa tse phahameng tsa maqhubu. Lisebelisoa tse latelang tsa FR-4 lia khothaletsoa:

• S1141
• S1170

Lisebelisoa tsena ka bobeli, tse entsoeng ke Shengyi Technology, li bonts'a tšebelisano e ntle haholo le lisebelisoa tsa maqhubu a phahameng, ho netefatsa liphetho tse tšepahalang ka li-warpage tse fokolang.

6. Tloaelo Tharollo bakeng sa Lisebelisoa tse ling

Bakeng sa li-lamination tse kopantsoeng tse kenyeletsang thepa e nang le maqhubu a phahameng ntle le laminate ea hydrocarbon-ceramic low-loss le RF-35A, likhothaletso tse kaholimo li kanna tsa se sebetse hohle. Nyeoe ka 'ngoe e lokela ho hlahlojoa ho latela thepa e itseng ea thepa e amehang, joalo ka:

• Coefficient of Thermal Expansion (CTE)
• Mocheso oa Phetoho ea Khalase (Tg)
• Dielectric Constant (Dk)
• Litaba tsa Resin

Baetsi ba eletsoa ho sebelisana le barekisi ba thepa le ho etsa liteko ka botlalo ho fumana moralo o nepahetseng oa li-stackup le mokhoa oa ho lamination bakeng sa maemo ana.

Litlhahiso tsa Ts'ebetso bakeng sa Hybrid Lamination

1. Phomolo ea Khatello ea Maikutlo ka Mor'a Lamination

Ts'ebetso ea lamination ea li-PCB tse nyalisitsoeng, haholo-holo tse kenyelletsang lisebelisoa tsa maqhubu a phahameng joalo ka 25FR e kopantsoeng le FR-4, e hloka taolo e hlokolosi ea mocheso le mochini ho thibela ntoa le ho netefatsa ts'epo. Ho baka ka mor'a lamination ke mohato oa bohlokoa oa ho lokolla likhatello tsa ka hare tse hlahisoang nakong ea ts'ebetso ea lamination. Ke habohlokoa ho lumella boto ho tsitsisa tikolohong e laoloang ea mocheso ntle le ho sebelisa khatello e eketsehileng. Sena se qoba ho senyeha ho eketsehileng mme se lumella tsamaiso ea resin hore e phekole ka botlalo, e leng ho fokotsang khatello ea kelello e setseng. Ho futhumatsa ka mokhoa o ts'oanang le ho phomola butle ha mocheso nakong ena ho thusa ho boloka botsitso ba boto le ho leka-lekana ha sebopeho, haholo ha ho sebetsanoa le lisebelisoa tse nang le li-coefficients tse fapaneng tsa katoloso ea mocheso, joalo ka li-laminates tsa maqhubu a phahameng le FR-4.

2. Tlhahlobo ea ho Qetela e Lokisang Baking

Maemong ao ho ona warpage e fumanoang nakong ea tlhahlobo ea ho qetela, ho baka ho lokisa ho ka fetola boto hantle le ho tsosolosa ho bata. Ho baka boto ea lebasetere ka 150 ° C bakeng sa lihora tse 2 ntle le ho sebelisa khatello ho lumella likarolo tsa laminate hore li phutholohe le ho arolelana likhatello hape ka ho lekana. Nakong ena ea mocheso o laoloang, resin ea laminate e nolofatsa hanyenyane, e thusa ho imolla khatello ea kelello pakeng tsa lihlopha. Ho thibela deformation e hlahang hape, ho pholile hang-hang le ka mokhoa o ts'oanang ho bohlokoa. Ho beha boto holim'a 'mabole bakeng sa ho pholile ho tiisa sethala se bataletseng le se tsitsitseng, ho lumella laminate hore e tiee ka ho lekana ha e ntse e boloka ho bata ha eona ho lokisitsoeng. Mohato ona o bohlokoa ka ho khetheha bakeng sa li-stackups tse nyalisitsoeng, kaha ho pholisa ka mokhoa o sa leka-lekaneng ho ka mpefatsa ntoa ka lebaka la thepa e fapaneng ea thepa lipakeng tsa "high-frequency core" le FR-4.

3. Ho netefatsa botsitso ba Dimensional le ho tšepahala ha nako e telele

Ka bobeli mekhoa ea ho baka ka mor'a ho lamination le ho lokisa e bapala karolo ea bohlokoa ho netefatsa ho ts'epahala le ho nepahala ha li-PCB tse nyalisitsoeng. Ka ho latela lits'ebetso tsena, bahlahisi ba ka fihlela phomolo e laoloang ea khatello ea maikutlo, ba matlafatsa botsitso, 'me ba thibela ho hloleha kapa ho hloleha ha mochini nakong ea likopano tse latelang. Lintlafatso tsena tsa tekheniki li bohlokoa haholo bakeng sa lits'ebetso tse batlang ts'ebetso ea maqhubu a holimo, kaha li netefatsa hore hybrid stackup e boloka ts'ebetso ea eona ea mochini le motlakase nakong eohle ea bophelo ba sehlahisoa.

Ho Finyella Mokhoa o Molemo oa Hybrid Lamination: Melemo ea Bohlokoa le Mekhoa e Tiisitsoeng ea Indasteri

Ka ho kenya tšebetsong khetho ea thepa e kaholimo, moralo oa li-stackup, le likhothaletso tsa taolo ea ts'ebetso, baetsi ba PCB ba ka fihlela melemo e latelang:

1. Warpage e fokotsehileng: Mapolanka a kopantsweng a nang le laminate e nang le hydrocarbon-ceramic low-loss + FR-4 a ka fihlella maemo a warpage ka hare ho 0.7%, ha mapolanka a RF-35A + FR-4 a ka boloka warpage e le ka tlase ho 1.0%. Maemo ana a ka hare ho maemo a indasteri mme a netefatsa tshebetso e tshepahalang.
2. Ho tšepahala ho ntlafalitsoeng: Ho fokotsa warpage ho fokotsa kotsi ea ho hlōleha ha mechine, joalo ka delamination kapa cracking, nakong ea kopano le ts'ebetso.
3. Ts'ebetso e Ntlafetseng ea Motlakase: Ho netefatsa ho bata le ho tsitsisa ha mechine ho boloka botšepehi ba matšoao a phahameng-frequency, e lebisang ts'ebetsong e ntle ea motlakase.
4. Kotulo e Phahameng: Ho fokotseha ha warpage ho lebisa ho liboto tse fokolang tse lahliloeng, ho ntlafatsa lihlahisoa tsa tlhahiso le ho fokotsa litšenyehelo.
5. Ho lumellana ha Lintho: Ho sebelisa tumello Lisebelisoa tsa FR-4 le meralo ea symmetrical stackup e netefatsa ho lumellana pakeng tsa lisebelisoa tse phahameng tsa maqhubu le FR-4 e tloaelehileng.

Litaelo tsena li etselitsoe ho sebetsana le liphephetso tse ikhethileng tsa hybrid lamination mme li thehiloe boiphihlelo bo bongata ba indasteri le netefatso. Bakeng sa lipotso leha e le life tse eketsehileng kapa litlhoko tsa tloaelo, bahlahisi ba khothalletsoa ho sebelisana le barekisi ba thepa le baetsi ba PCB ho hlahisa litharollo tse ntlafalitsoeng bakeng sa litlhoko tsa bona tse khethehileng.