Tlhahiso ea Rogers FR4 Hybrid PCB

PCB ea Rogers FR4 e kopantsoeng ke leano la ho bokella ka boomo: beha likarolo tsa bohlokoa tsa RF moo litlhoko tsa tsona tsa motlakase li leng bohlokoa 'me u sebelise FR4 moo e fanang ka litšenyehelo tse sebetsang kapa melemo ea mechini. Boleng bo tsoa phetohong e laoloang lipakeng tsa litsamaiso tsa thepa. PCB ea Rogers FR4 e kopantsoeng e beha laminate ea maqhubu a phahameng a Rogers holim'a likarolo tsa bohlokoa tsa RF le FR4 e tloaelehileng holim'a likarolo tse setseng - e fokotsa litšenyehelo tsa thepa ka 30-50% ha e bapisoa le kaho ea Rogers kaofela ha eona ha e ntse e boloka ts'ebetso ea RF moo e leng ea bohlokoa. Tataiso ena e akaretsa meaho ea hybrid stackup, melao ea ho lumellana ha thepa, liphephetso tsa lamination, le mekhoa e metle ea tlhahiso bakeng sa li-PCB tsa Rogers/FR4 tse kopantsoeng tsa dielectric.

Tafole ea likateng

1. PCB ea Rogers FR4 Hybrid ke Eng le Hobaneng e ka Sebelisoa
2. Litlhophiso tsa Common Rogers FR4 Hybrid Stackup
3. Ho lumellana ha thepa: CTE, Dr, le Bonding
4. Mokhoa oa ho Lamination bakeng sa Liboto tsa Rogers FR4 tse Kopaneng tsa Dielectric
5. Taolo ea Impedance ho Li-Stackups tsa Hybrid
6. Dikopo Ho Kganna Rogers FR4 Hybrid PCB Tlhokahalo
7. Ho Hlahisa Li-PCB tsa Rogers FR4 Hybrid ho Highleap

1. Rogers FR4 Hybrid PCB ke Eng le Hobaneng e Sebediswa

PCB ea Rogers FR4 e kopantsoeng ke boto ea mekhahlelo e mengata e kopanyang malapa a mabeli a fapaneng a laminate ka har'a sehlopha se le seng: thepa ea maqhubu a phahameng a Rogers (hangata e tsoa letotong la RO4000) holim'a mekhahlelo e jereng matšoao a RF, le FR4 e tloaelehileng kapa e sebetsang hantle holim'a mekhahlelo e sebetsanang le tsela ea dijithale, kabo ea matla, le tšehetso ea mechini.

Tšusumetso e totobetse — litšenyehelo ha li bapisoa le ts'ebetso. Li-laminate tsa Rogers li fana ka tahlehelo e tlase ea dielectric (Df hangata ke 0.0037 bakeng sa RO4350B ho 10 GHz) le phetoho e tsitsitseng ea dielectric (phetoho ea Dk ka hare ho ±2%), e leng tsa bohlokoa bakeng sa ho boloka botšepehi ba lets'oao maqhubung a GHz. Empa thepa ea Rogers e bitsa 3–8× ho feta FR4 ka phanele, 'me ha se lera le leng le le leng ho PCB ea mekhahlelo e mengata le nang le matšoao a maqhubu a phahameng. Moralong o tloaelehileng oa lets'oao le kopaneng la mekhahlelo e 6, ke mekhahlelo e ka holimo le e ka tlase feela e ka fetisang mesaletsa ea RF - mekhahlelo e mene ea ka hare e sebetsana le lifofane tsa motlakase, lifofane tsa fatše, le matšoao a dijithale a lebelo le tlase a sebetsang ka ho tšoana ho FR4.

Ka ho sebedisa Rogers feela moo tshebetso ya RF e e hlokang le FR4 hohle, mokgwa wa ho kopanya o fihlella tshebetso ya RF e tshwanang le ya boto ya Rogers kaofela ka theko e tlase haholo ya thepa. Bakeng sa boto ya mekato e 6, phokotso ya ditjeo tsa thepa hangata ke 30–50% ha e bapiswa le kaho ya Rogers kaofela. Sena se etsa hore Rogers FR4 hybrid PCBs e be mokgwa o tlwaelehileng wa dihlahiswa tsa RF tse nang le ditjeo tse tlase tlhahisong ya bophahamo ba modumo - diyuniti tsa seyalemoya sa 5G, di-module tsa radar tsa dikoloi, di-Wi-Fi 6/7 points, le di-terminal tsa puisano tsa sathelaete.

Phapang: ho etsa li-stackup tse kopantsoeng ho rarahane ho feta ho etsa liboto tsa thepa e le 'ngoe. Lisebelisoa tse fapaneng li na le li-coefficient tse fapaneng tsa katoloso ea mocheso (CTE), mocheso o fapaneng oa lamination, le litšobotsi tse fapaneng tsa ho khomarela. Ho laola liphapang tsena ke phephetso ea mantlha ea tlhahiso.

2. Litlhophiso tsa Common Rogers FR4 Hybrid Stackup

Mekhoa e meraro ea ho kopanya li-stackup e koahetse boholo ba meralo ea PCB ea Rogers FR4:

Kaho ea sekoahelo sa mekhahlelo e 4 (Rogers outer, FR4 core). Sebopeho se tloaelehileng ka ho fetisisa sa hybrid. Li-core tse peli tsa Rogers (hangata RO4350B kapa RO4003C, tse teteaneng ka 10–20 mil) li etsa mekhahlelo e ka ntle, li hokahantsoe le FR4 inner core e tloaelehileng ka FR4 prepreg kapa Rogers 4450F bondply. Lera la 1 le Lera la 4 li jara li-trace tsa RF microstrip holim'a lifofane tsa fatše ho Layers 2 le 3, ha FR4 core e sebetsana le matla a DC le matšoao a taolo a lebelo le tlase. Botebo bohle ba boto: 1.0–1.6 mm. Stackup ena e lekana - ea bohlokoa bakeng sa ho thibela warpage nakong ea lamination le reflow.

Motsoako o nang le mekhahlelo e 6 (Rogers o ka ntle, FR4 kahare). E atolosa kaho ea sekoahelo ho fihlela ho mekhahlelo e 6. Rogers ho Mekhahlelo ea 1 le ea 6, FR4 ho Mekhahlelo ea 2–5. Mekhahlelo e meng e ka hare e fana ka lifofane tse inehetseng tsa fatše, lifofane tsa motlakase, le tsela ea dijithale. E sebelisoa meralong e rarahaneng ea matšoao a tsoakiloeng moo likarolo tsa RF le tsa dijithale li kopanang boto e le 'ngoe - li-radio tsa lisele tse nyane tsa 5G, marang-rang a fepa a antenna a nang le mekhahlelo, le li-module tsa radar tse ka pele tse nang le li-processor tse kentsoeng.

Motsoako o sa lekanang (Rogers ka lehlakoreng le leng feela). Rogers ho Lera la 1 feela, FR4 ho mekhahlelo e meng kaofela. Litšenyehelo tse tlase ho feta kaho ea sekwahelo se lekanang empa e hlahisa asymmetry ea CTE e ka bakang warpage. E loketse meralo e bonolo ea RF moo bokaholimo bo le bong feela bo nang le mesaletsa ea microstrip - mohlala, module ea amplifier ea matla ea sehlopha se le seng. Boholo ba boto bo lokela ho bolokoa bo le bonyenyane (hangata bo ka tlase ho 100 × 100 mm) ho laola kotsi ea warpage.

Ho leka-lekana ha stackup ke molao oa bohlokoa ka ho fetisisa bakeng sa ts'epo ea PCB e kopantsoeng. Layup e lekanang (Rogers holim'a libaka tse peli tse ka ntle, FR4 bohareng) e leka-lekanya ho se lumellane ha CTE ho pholletsa le botenya ba boto, e fokotsa seqha le ho sotha nakong ea potoloho ea mocheso. Melao-motheo ea moralo oa stackup ea PCB bakeng sa taolo ea impedance le botšepehi ba lets'oao e sebetsa ho liboto tse kopantsoeng tse nang le lithibelo tse ling mabapi le ho kopanya thepa.

3. Ho lumellana ha thepa: CTE, Dr, le Bonding

Phephetso ea boenjiniere bo bohareng ba Rogers FR4 hybrid PCB ke ho etsa hore thepa e 'meli e fapaneng e sebetse e le sebopeho se le seng se kopaneng ka ho lamination, soldering, le bophelo bohle ba ts'ebetso ea sehlahisoa. Litekanyo tse tharo tsa ho lumellana li tlameha ho laoloa:

Ho bapisa CTE (Coefficient of Thermal Expansion). Lisebelisoa tsa letoto la Rogers RO4000 li na le X/Y CTE ea 10–14 ppm/°C, ha FR4 e tloaelehileng e le 12–16 ppm/°C — e lumellanang hantle bakeng sa lamination e tšepahalang. CTE ea Z-axis e na le mathata a mangata: FR4 e ka feta 50–70 ppm/°C ka holimo ho Tg, ha RO4350B e lula ka tlase ho 46 ppm/°C. Ho se tsamaisane hona ha Z-axis ho hatella masoba a phuthetsoeng nakong ea potoloho ea mocheso. Bakeng sa liboto tse kopantsoeng tse nang le density e phahameng, khetha FR4 e fetotsoeng e nang le CTE e tlase ea Z-axis (joalo ka IT-180A, Tg ≥ 175°C, kapa Panasonic Megtron 4) ho fokotsa ho se tsamaisane hona.

Tsamaiso ea phetoho ea Dk. Moeling o pakeng tsa Rogers le FR4 layers, phetoho ea dielectric e fetoha ka tšohanyetso - RO4350B e na le Dk = 3.48, ha FR4 e tloaelehileng e na le Dk ≈ 4.2–4.5. Letšoao lefe kapa lefe le fetang moeling ona le na le ho se tsitse ha impedance. Bakeng sa matšoao a RF, sena se baka lipontšo le tahlehelo ea ho kenya. Phokotso ea moralo: boloka tsela ea lets'oao la RF ho Rogers layers feela, 'me u sebelise li-via feela bakeng sa ho roka fatše le likhokahano tsa matla ho pholletsa le FR4 layers. Haeba lets'oao la RF le tlameha ho fetoha pakeng tsa Rogers le FR4 layers, potoloha lets'oao ka terata e thata ea li-via tsa fatše (sebaka ≤ λ/20 maqhubung a ts'ebetso) ho thibela phetoho ea impedance.

Khetho ea Bondply le prepreg. Lera la sekhomaretsi pakeng tsa Rogers le FR4 le tlameha ho hokahana ka mokhoa o tšepahalang le thepa ka bobeli. Rogers 4450F bondply (Dk = 3.54, botenya ba 4 mil) e etselitsoe morero ona ka ho khetheha - e fola mochesong o lumellanang le RO4000 le FR4. Mokhoa o mong: FR4 prepreg e nang le resin e ngata (joalo ka setaele sa khalase sa 1080 kapa 106) e fana ka khokahano e betere holim'a libaka tsa Rogers ho feta 2116 prepreg e tloaelehileng ka lebaka la phallo e phahameng ea resin. Dkt ea bondply e tlameha ho baloa ka lipalo tsa impedance - ke lera le ikhethang la dielectric ka har'a stackup. Moo RF core e sebelisang RO4003C, tlhahiso ea RO4003C mohahong o amohetsoeng e lokela ho hokahanngoa le stackup e setseng ho fapana le ho hlahlojoa ka thoko.

Sekgahla sa thepa: Lebitso la sehlahiswa sa Rogers le sebedisetswa ho hlwaya laminate e boletsweng bakeng sa kaho ya PCB. Highleap Electronics e fana ka tlhahiso le kopano ya PCB, ha laminate e fumanwa mme e netefatswa ka thoko.

4. Ts'ebetso ea ho Lamination bakeng sa Liboto tsa Rogers FR4 tse Kopaneng tsa Dielectric

Lamination ke moo tlhahiso ea PCB e kopantsoeng e atlehang kapa e hlolehang teng. Rogers le FR4 li na le thepa e fapaneng ea mocheso, 'me potoloho ea lamination e tlameha ho amohela ka bobeli.

Tokisetso ea bokaholimo. Lisebelisoa tsa letoto la Rogers RO4000 (hydrocarbon/ceramic composite) li hokahane ka ho lekaneng le tlhoekiso e tloaelehileng ea lik'hemik'hale. Lisebelisoa tse thehiloeng ho Rogers PTFE (RO3000, RT/duroid) li hloka kalafo ea plasma (motsoako oa khase oa CF₄/O₂) pele ho lamination ho kenya tšebetsong bokaholimo ba PTFE bo sa sebetseng ka lik'hemik'hale le ho fihlela matla a tšepahalang a ho peel. Ho tlola kalafo ea plasma linthong tsa PTFE ho fella ka delamination - bothata ba ho feta/ho hloleha, eseng ho senyeha butle-butle. Bakeng sa li-hybrid tse thehiloeng ho RO4000, ho hlafuna ka mechine kapa ho penta ka lik'hemik'hale ho fana ka khokahano e lekaneng ea bokaholimo. Haeba kaho e amohetsoeng ea hybrid e totobatsa bondply ena, moralo oa RO4460G2 bonding-layer o lokela ho ba tlhahlobong ea potoloho ea khatiso le botenya bo felileng.

Boemo ba mocheso oa lamination. FR4 prepreg e folisa ho 175–185°C. Rogers 4450F bondply e folisa ho 190°C. Potoloho ea lamination e tlameha ho tlisa lisebelisoa ka bobeli mochesong oa tsona oa ho folisa ntle le ho fokotsa FR4 kapa ho fokotsa bondply. Boemo ba mocheso o hatelitsoeng - ramp ho fihlela ho 175°C, tšoara, ebe u ramp ho fihlela ho 190°C bakeng sa ho qetela - ke mokhoa o tloaelehileng. Khatello e tlameha ho laoloa ho thibela phallo e feteletseng ea resin ho tloha ho FR4 prepreg ho ea lera la Rogers, e leng se tla sotha botenya ba dielectric le shift impedance.

Ho pholisa ka mor'a ho qhibilihisa. Ho pholisa ka thata bonyane lihora tse 2 kamora ho tobetsa ho imolla khatello ea ka hare. Ho pholisa ka potlako ho tšoasa khatello e setseng e hlahang e le ho oa ha lehare nakong ea ho kopanya hape ha metsi. Bakeng sa mapolanka a masesaane ho feta 1.0 mm, ho pholisa ho laoloang ho bohlokoa - mapolanka a masesaane a kopantsoeng a kotsing e kholo ea khatello e bakoang ke CTE.

Ho tjheka. Li-laminate tse tletseng ceramic tsa Rogers li khorofo ho feta FR4 'me li robeha ka potlako ho feta likotoana tsa ho tjheka. Lebelo la spindle ea drill le sekhahla sa ho fepa li tlameha ho fetoloa - hangata sekhahla sa ho fepa se tlase le lebelo le phahameng la spindle ho feta liboto tsa FR4 feela. Likarolo tsa drille tsa carbide tse inehetseng tse lekantsoeng bakeng sa li-substrate tse tletseng ceramic li fokotsa ho rarahana ha lebota la masoba le ho ntlafatsa ho khomarela ha koporo ka mor'a moo. Litekanyetso tsa ts'ebetso ea ho tjheka ea PCB li tlameha ho ntlafatsoa bakeng sa thepa e thata ka ho fetisisa stackup. Highleap e hlahloba ho kopanya lera, litaba tsa resin, botenya ba dielectric bo felileng le boitšoaro ba mocheso ba stack ea hybrid pele ho etsoa. ​​Impedance ea RF e ke ke ea hlahlojoa ka boikemelo ho tloha kahong e haufi ea FR4 hobane jiometri ea ho qetela e etsa qeto ea mola o felileng. Boleng ba thepa ea thepa bo nepahetseng bo lokela ho hlahlojoa khahlanong le litokomane tsa mofani oa hona joale bakeng sa kereiti le kaho e boletsoeng.

Desmear. Desmear e tloaelehileng ea permanganate e sebetsa bakeng sa mekhahlelo ea FR4 empa ha e lekane bakeng sa metsoako ea ceramic ea Rogers. Plasma desmear (e sebelisang CF₄/O₂) ea hlokahala ho hloekisa masala a resin maboteng a masoba a mekhahlelo ea Rogers, ho netefatsa ho khomarelana ho tšepahalang ha koporo leboteng kamora ho penta koporo e se nang motlakase.

5. Taolo ea Impedance ho Li-Stackup tsa Hybrid

Taolo ea impedance ho PCB ea Rogers FR4 e kopantsoeng e hloka ho sebetsana le lera le leng le le leng la dielectric ka boikemelo — ha ho na "board Dk" e le 'ngoe bakeng sa stackup eohle.

Ho etsa mohlala oa tharollo ea masimo. Li-calculator tse tloaelehileng tsa impedance tse nkang hore ke ntho e sa fetoheng ea dielectric ho pholletsa le mekhahlelo eohle li tla hlahisa liphetho tse fosahetseng bakeng sa liboto tse kopantsoeng. Sebelisa tharollo ea tšimo ea 2D (Polar SI9000, Ansys HFSS, kapa e tšoanang) e amohelang boleng bo fapaneng ba Dk bakeng sa lera le leng le le leng la dielectric ka har'a stackup. Bakeng sa microstrip holim'a lera le ka ntle la Rogers, Dk ea mantlha ea Rogers e etsa qeto ea impedance. Bakeng sa mola o otlolohileng pakeng tsa mekhahlelo ea FR4, Dk ea prepreg ea FR4 e etsa qeto ea eona. Meeling moo lets'oao le fetang lipakeng tsa thepa, etsa mohlala oa phetoho ea impedance ka ho hlaka.

Tokiso ea ho se be le khoele ea koporo. Maqhubung a fetang 5 GHz, ho se be le khoele ea bokaholimo ba koporo ho ama tahlehelo ea ho kenngoa haholo. Li-laminate tsa Rogers hangata li kopantsoe le foil ea koporo e nang le boemo bo tlase (LP) kapa e nang le boemo bo tlase haholo (VLP) (Ra ≤ 1.5 µm) ho fokotsa tahlehelo ea ho se be le khoele. FR4 e tloaelehileng e sebelisa koporo e nang le electrodeposition (ED) e nang le ho se be le khoele e phahameng. Ha u etsa mohlala oa stackup ea hybrid, sebelisa ntlha e nepahetseng ea tokiso ea ho se be le khoele bakeng sa lera ka leng - hangata 1.2–1.5× bakeng sa koporo e tloaelehileng holim'a lera la FR4, le 1.0–1.2× bakeng sa koporo ea LP holim'a lera la Rogers.

Netefatso ea TDR. Sebaka se seng le se seng sa tlhahiso ea PCB e kopantsoeng se lokela ho kenyelletsa li-coupon tsa teko ea impedance tse etsisang stackup ea 'nete - li-coupon tsa microstrip tsa lera la kantle la Rogers le li-coupon tsa FR4 tsa lera la kahare. Litekanyo tsa TDR (Time Domain Reflectometry) ho li-coupon tsena li tiisa hore impedance e entsoeng e tsamaellana le sepheo se entsoeng ka har'a ±5% (USB 3.x spec) kapa ±3% (RF spec, ho latela ts'ebeliso). Tlhahiso ea PCB e laoloang ke impedance ka li-coupon tse netefalitsoeng ke TDR ke mokhoa o tloaelehileng bakeng sa boto efe kapa efe ea hybrid e shebaneng le RF kapa lits'ebetso tsa lebelo le phahameng.

6. Dikopo tsa ho Kganna Tlhoko ya PCB ya Rogers FR4 Hybrid

Seteishene sa motheo sa 5G le diradio tsa disele tse nyane. Karolo e ka pele ya RF (amplifier ya motlakase, amplifier ya lerata le tlase, difilthara, netweke ya phepelo ya antenna) e hloka Rogers RO4350B kapa RO4003C bakeng sa tahlehelo e tlase ya ho kenngwa ho 3.5–6 GHz (sub-6 GHz 5G) kapa 24–40 GHz (mmWave 5G). Karolo ya baseband ya dijithale, tsamaiso ya matla, le sebopeho sa marang-rang di sebedisa FR4. PCB e le nngwe e kopantsweng e kopanya dikarolo ka bobedi, e nkela mokhoa wa kgale wa diboto tse arohaneng tsa RF le tsa dijithale tse hokahantsweng ka dithapo.

Radar ea likoloi (77/79 GHz). Li-module tsa radar tsa ADAS li sebelisa Rogers RO3003 kapa RO4835 holim'a antenna le RF transceiver lera la 77 GHz bakeng sa tahlehelo e tlase ho 77 GHz, ka FR4 inner lera la processor ea radar, phepelo ea motlakase, le sebopeho sa bese ea CAN. Hybrid stackup e tlameha ho phela ka potoloho ea mocheso oa likoloi (−40°C ho isa ho +125°C) le ho fihlela litlhoko tsa AEC-Q100. Tlhahiso ea PCB ea radar ea likoloi e hloka boiphihlelo ba thepa e kopantsoeng hammoho le lits'ebetso tsa boleng ba likoloi.

Libaka tsa phihlello tsa Wi-Fi 6/7. Karolo ea transceiver ea RF e sebetsa ho 2.4 GHz le 5/6 GHz, moo likarolo tse ka ntle tsa Rogers li fanang ka botsitso bo betere ba impedance le tahlehelo e tlase ho feta FR4. SoC, switch ea Ethernet, karolo ea matla a PoE, le memori li sebelisa likarolo tse ka hare tsa FR4. Kaho ea motsoako e boloka BOM e qothisana lehlokoa bakeng sa lihlahisoa tsa marang-rang a bareki tse nang le bongata bo phahameng.

Li-terminal tsa puisano tsa sathelaete. Li-antenna tse bataletseng tsa Ku-band (12–18 GHz) le Ka-band (26–40 GHz) le marangrang a fepa li hloka li-Roger kapa li-PTFE tse nang le tahlehelo e tlase haholo, ha li-processor tsa dijithale tsa beamforming le kabo ea matla li sebelisa FR4. Boholo ba boto bo ka feta 300 × 300 mm, e leng se etsang hore moralo oa stackup o lekanang le tsamaiso ea CTE li be bohlokoa ho thibela warpage ho pholletsa le phanele e kholo.

7. Ho hlahisa li-PCB tsa Rogers FR4 Hybrid ho Highleap

Highleap Electronics e hlahisa li-PCB tsa Rogers FR4 tse kopantsoeng bakeng sa bareki ba likhokahano tsa mohala, tsa likoloi, tsa lifofane le tsa indasteri. Bokhoni ba rona ba PCB bo kopantsoeng bo akaretsa mefuta eohle ea lisebelisoa tsa Rogers tse kopantsoeng le FR4 e tloaelehileng le e sebetsang hantle:

Tsebo ea ho kopanya thepa. Re na le li-core tsa Rogers RO4350B, RO4003C, le RO4835 ka botenya bo tšoanang (8, 10, 20, 30, 60 mil), tse kopantsoeng le li-core tsa FR4 tse tšoanang (IT-180A, S1000-2M, kapa standard high-Tg FR4). Rogers 4450F bondply le high-resin 1080/106 FR4 prepreg li fumaneha bakeng sa ho kopanya lipakeng. Litlhahiso tsa thepa li fanoe nakong ea tlhahlobo ea moralo - re bapisa CTE, Drk, le mocheso oa ho phekola bakeng sa ts'ebeliso e 'ngoe le e 'ngoe. Tlhahiso ea Rogers PCB ho Highleap e kenyelletsa meaho ea Rogers le ea hybrid.

Taolo ea ho lahla le ts'ebetso. Mochini oa ho lahla o nang le li-stepped-profile o nang le li-sensor tsa mocheso tse ka hare ho sebaka bakeng sa lipotoloho tsa pheko ea motsoako. Bokhoni ba kalafo ea plasma bakeng sa thepa ea Rogers e thehiloeng ho PTFE (RO3000, RT/duroid). Ho pholisa ka mor'a ho lahla ho laoloang ho fokotsa khatello e setseng. Ho nepahala ha ngoliso ±50 µm ho pholletsa le mekhahlelo eohle.

Netefatso ea impedance. Mohlala oa tharollo ea tšimo ea 2D bakeng sa stackup e 'ngoe le e 'ngoe ea hybrid. Li-coupon tsa impedance tse netefalitsoeng ke TDR phanele e 'ngoe le e 'ngoe ea tlhahiso. Litlaleho tsa khokahano ea setlankane ho ea moralo lia fumaneha ha ho kopuoa. Mamello ea impedance: ± 5% standard, ± 3% bakeng sa lits'ebetso tse nepahetseng tsa RF.

Teko. Tlhahlobo ea karolo e nyenyane e tiisa ka botenya ba plating (≥20 µm), ngoliso ea mekhahlelo e fapaneng, le botšepehi ba bondline. Teko ea tšilafalo ea ionic (sepheo ≤ 1.56 µg/cm²). Tekanyo ea S-parameter e thehiloeng ho VNA e fumaneha bakeng sa netefatso ea ts'ebetso ea RF. Mekhoa ea liteko tsa tlhahiso ea PCB ea maqhubu a phahameng e netefatsa hore ts'ebetso ea RF e fihlela lipheo tsa moralo.

Kopa khotheishene ea PCB ea Rogers FR4 e kopantsoeng — kenyelletsa moralo oa hau oa stackup (kapa re khothaletse e 'ngoe), mofuta oa thepa ea Rogers, kereiti ea FR4, lipheo tsa impedance, litekanyo tsa boto, le bophahamo ba tlhahiso. Bakeng sa litheko, bapisa lipalo tse tšoanang tsa lera, koporo, liphetho, litlhoko tsa liteko le bongata. Boto e kopantsoeng e ka ba theko e tlase ho feta kaho ea RF eohle, empa poloko e itšetlehile ka stackup e lokollotsoeng le chai ea kaho eo e itseng.