Lethathamo le Felletseng la Tlhahlobo ea PCB DFM bakeng sa Katleho ea Tlhahiso

Lethathamo la Litekanyetso tsa PCB DFM

Tafole ea likateng

  1. Lethathamo la Litšobotsi tsa Koporo
  2. Lethathamo la Likoti le Li-Vias
  3. Lethathamo la Litlhahlobo tsa Maske ea Solder
  4. Lethathamo la Litekolo tsa Silkscreen
  5. Lethathamo la ho hlahloba ho ba le liphanele
  6. Lethathamo la Litekanyetso tse Loketseng ho Kopana

Ho Highleap Electronics, re sebelisa lethathamo lena la tlhahlobo kahare nakong ea ts'ebetso ea rona ea mahala ea tlhahlobo ea DFM . Re le arolelana ho thusa baqapi ho utloisisa mathata esale pele le ho fana ka meralo e loketseng tlhahiso.


1. Lethathamo la Litšobotsi tsa Koporo

Likarolo tsa koporo li lokela ho fihlela bonyane bokgoni ba tlhahiso ha li ntse li boloka ts'ebetso ea motlakase.

1.1 Bophara ba ho Latela le Sebaka

Lekola Ntho Bokgoni bo Tloaelehileng e tsoetseng pele
Bophara bo fokolang ba mohlala 4 limilimithara (0.1mm) 3 limilimithara (0.075mm)
Sebaka se fokolang 4 limilimithara (0.1mm) 3 limilimithara (0.075mm)
Sebaka sa ho tloha mothating ho ea moeling 0.25mm kapa ho feta 0.2mm ka hloko
Sebaka se bulehileng ho tloha mothating ho ea ho lesoba 0.2mm kapa ho feta 0.15mm

☐ Netefatsa hore bophara ba bonyane ba motsu bo fihlella bokgoni
☐ Netefatsa sebaka se senyenyane pakeng tsa mesaletsa
☐ Hlahloba sebaka se pakeng tsa mela e mene le e mene
☐ Netefatsa hore ha ho na maraba a asiti (likhutlo tse matla tse ka tlase ho likhato tse 45)
☐ Netefatsa tekano ea koporo lipakeng tsa lera

1.2 Lintho Tse Lokelang ho Etsoa ka Boima ba Koporo

☐ Boima ba koporo bo boletsweng bakeng sa lera ka leng
☐ Bophara ba mohlala bo lokisitsoe bakeng sa boima ba koporo:

  • Koporo ea 1oz: ho sebelisoa bonyane bo tloaelehileng
  • Koporo ea 2oz: eketsa bonyane ka 50%
  • Koporo ea 3oz+: ikopanye le moetsi bakeng sa tataiso

☐ Bokgoni ba hona joale bo netefalitsoe bakeng sa bophara ba mohlala
☐ Phomolo ea mocheso e boletsoeng bakeng sa likhokahano tsa sefofane

1.3 Mealo ea Sefofane

☐ Libaka tse bulehileng tsa sefofane li lekane ho potoloha masoba
☐ Sebaka se pakeng tsa sefofane le moeli se boletsoe
☐ Bophara ba sebui bo loketseng mocheso (bonyane 8 mil)
☐ Lifofane tse arohaneng li na le karohano e lekaneng (bonyane 10 mil)
☐ Libaka tse arohaneng tsa koporo li hokahane kapa li tlositsoe


2. Lenane la ho hlahloba masoba le li-Vias

Masoba le li-vias li hloka litlhaloso tse hlokolosi bakeng sa tlhahiso e tšepahalang.

2.1 Litlhaloso tsa ho Phunya ka Lesoba

Lekola Ntho Standard e tsoetseng pele
Boholo bo fokolang ba ho phunya 0.25mm (10 mil) 0.15mm (6 mil)
Boholo ba likarolo 10:1 12: 1 ho 15: 1
Bonyane lesale la annular 0.15mm (6 mil) 0.1mm (4 mil)
Sebaka se pakeng tsa masoba le masoba 0.25mm kapa ho feta 0.2mm

☐ Boholo bo fokolang ba ho phunya bo fihlella bokgoni
☐ Karolelano ea ponahalo ka har'a meeli ea botenya ba boto
☐ Lesale le kopaneng le lekane hodima mahlakore ohle
☐ Sebaka se pakeng tsa masoba le masoba se netefalitsoe
☐ Sebaka sa ho tloha lesobeng ho ea morao se netefalitsoe

2.2 Ka Mefuta le Litlhoko

☐ Ka mofuta o boletsoeng (ka, foufetseng, e patiloeng, microvia)
☐ Sefofu/se patiloeng ka span se bontšitsoe ka ho hlaka
☐ Litlhoko tsa microvia li hlalositsoe:

  • Bophara ba ho phunya ka laser (hangata ke 0.1mm)
  • Boholo ba pad e reretsoeng (hangata ke 0.25mm)
  • Boholo ba pad ea ho hapa (hangata ke 0.35mm)

☐ Ka litlhoko tsa ho tlatsa tse boletsoeng (haeba ho hlokahala)
☐ Litlhoko tsa ho sebelisa pad li hlalositsoe

2.3 Mekoti ea Likarolo tsa PTH

☐ Boholo ba lesoba bo loketse li-lead tsa likarolo
☐ Ho mamelloa ha masoba ho boletsoe
☐ Masoba a NPTH (a sa penteloang) a tšoailoe ka ho hlaka
☐ Litekanyo tsa sebaka le mamello li boletsoe
☐ Masoba a ho kenya ka kgatello a hlwailwe ka ditlhoko


3. Lethathamo la Litlhahlobo tsa Maske ea Solder

Maske e sothehang e sireletsa koporo mme e hlalosa libaka tse ka sothehang. Moralo o nepahetseng oa maske o thibela ho hokahanya ha sothehang, o netefatsa manonyeletso a tšepahalang, 'me o sireletsa mesaletsa tšenyo ea tikoloho.

Litlhoko tsa DFM tsa Solder Maske

🎯 Mebala ea Maske
☐

Katoloso ea sebaka sa SMD

Katoloso e tloaelehileng ea 0.05–0.1mm ho tloha pheletsong ea pad
☐

Ka ho etsa litente ho boletsoeng

Li-vias tse koahelang maske moo ho lokelang ho thibeloa ho thiba ha solder
☐

Ho hlalositsoe tumello ea PTH

Sebaka sa maske se pota-potileng masoba a koahetsoeng
☐

Ha ho maske libakeng tsa solder

Libaka tsohle tse ka thekeseletsoang li pepesitsoe ka botlalo
📏 Matamo a Maske a Solder
☐

Matamo a SMD a ≥ 4 mil

Bonyane ba 0.1mm pakeng tsa li-pad tse tloaelehileng tsa SMD
☐

Matamo a nang le sekontiri se setle ≥ 3 mil

0.075mm kapa masoba a kopaneng bakeng sa QFP/QFN
☐

Matamo a ho tsamaya ka tsela e yang ho pad ≥ 4 mil

Kapa u tente ka har'a tente ho thibela ho kobeha ha solder
☐

Li-Bridges li hlahlobiloe

Matamo a masesaane a etsoang ka boomo kapa a tlositsoe moralong
⚙️ Litlhoko tse khethehileng tsa maske
☐

Libaka tsa maske tse ka hlohlorehang

Libaka tsa tšireletso tsa nakoana li khethiloe
☐

Mebala e khethiloeng

Mebala e mengata ea maske e hlalositsoe haeba ho hlokahala
☐

Libaka tsa enke ea carbon

Libaka tsa enke e tsamaisang motlakase li hlalositsoe ka ho hlaka
☐

Koahelo ea koporo e se nang letho

Maske e entsoeng ka boomo e boletsweng hodima koporo setshwantshong se setle
4 tse sekete
Bonyane ba bophara ba letamo bo tloaelehileng
0.1mm
Katoloso e tloaelehileng ea SMD
3 tse sekete
Letamo le fokolang la ho tjhesa ka tsela e otlolohileng

Keletso: Ha bophara ba letamo bo theohela ka tlase ho 3 mil, nahana ka ho kopanya masoba a maske bakeng sa karolo yohle ya letlalo ho ena le ho leka ho boloka ho aroloa ha masela ka bonngoe—masamo a masesaane hangata aa hloleha nakong ya ho apesa leha ho le jwalo.

Fumana Tlhahlobo ea DFM ea Mahala


4. Lethathamo la ho hlahloba Silkscreen

Silkscreen (tšōmo) e fana ka tataiso ea kopano le boitsebiso ba sehlahisoa.

4.1 Mongolo le Litšoantšo

☐ Bophara bo fokolang ba mola: 5 mil (0.125mm)
☐ Bolelele bo fokolang ba mongolo: 32 mil (0.8mm) bakeng sa ho baloa habonolo
☐ Mongolo ha o a beoa hodima di-pad kapa dibakeng tse ka kopanngwang
☐ Sebaka se pakeng tsa mongolo le li-pad: bonyane 6 mil (0.15mm)
☐ Baqapi ba litšupiso ba teng ebile ba ka baloa habonolo

4.2 Matšoao a Polarity le Orientation

☐ Lipontšo tsa Pin 1 li teng bakeng sa li-IC
☐ Matšoao a polarity bakeng sa diode le li-capacitor
☐ Ho bontšitsoe tataiso ea sehokelo
☐ Mehlala ea likarolo e nepahetse

4.3 Tlhahisoleseding ea Tlhahiso

☐ Lebitso la boto/nomoro ea karolo e kenyelelitsoe
☐ Letšoao la tlhahlobo le teng
☐ Sebaka sa khoutu ea letsatsi se hlalositsoe (haeba ho hlokahala)
☐ Letšoao le lebitso la khoebo li behiloe hantle
☐ Matšoao a ho latela melao a behiloe (CE, UL, jj.)


5. Lethathamo la ho hlahloba ho ba le diphanele

Moralo oa phanele o ama katleho ea tlhahiso le ts'ebetso ea kopano. Sheba litlhoko tse qaqileng tsa ho kenya liphanele bakeng sa SMT.

5.1 Tlhophiso ea Phanele

☐ Boholo ba phanele bo ka har'a meeli ea tlhahiso (hangata ke 460×610mm max)
☐ Sebaka sa boto se lekane bakeng sa ho tsamaisa (ka tloaelo ke 2-3mm)
☐ Bophara ba seporo bo lekane bakeng sa ho sebetsana le sona (bonyane 5mm)
☐ Ho shebana le phanele ho ntlafatsa tshebediso ya thepa

5.2 Mokhoa oa ho Hlakola Liphanele

☐ Ho fetisoa ha li-tab kapa lintlha tsa V ho boletsoe
☐ Libaka tsa li-tab ha li sitise likarolo
☐ Botebo ba lintlha tsa V bo boletsoe (hangata botenya ba boto ke 1/3 ka lehlakore)
☐ Li-tab tsa ho phatloha li boholo bo loketseng:

  • Tekanyetso: Bophara ba 3-5mm, tepo e teteaneng ea 0.3mm
  • Ho loma ha toeba: masoba a 0.5mm, 5-8 ka tabo

5.3 Likarolo tsa Phanele

☐ Bahlahlobi ba lefats'e ba teng (bonyane ba 3 phanele ka 'ngoe)
☐ Masoba a lisebelisoa litereneng
☐ Sebaka se fosahetseng sa ho tšoaea boto se hlalositsoe
☐ Boitsebiso ba phanele bo kenyelelitsoe


6. Lethathamo la Litekanyetso tse Loketseng ho Kopana

Bakeng sa liodara tse felletseng tsa PCBA, netefatsa litlhoko tse ikhethileng tsa kopano. Sheba melao ea rona e felletseng ea moralo oa kopano ea PCB.

6.1 Ho bea Karolo

☐ Sebaka se lekaneng pakeng tsa likarolo (bonyane 0.5mm)
☐ Sebaka se pakeng tsa likarolo le boto (2mm bakeng sa lireile)
☐ Ha ho likarolo tse tlas'a likarolo tse ling
☐ Likarolo tse telele ha li sire tse nyane
☐ Lesoba le phunyeletsang le SMT mahlakoreng a fapaneng li hlahlobiloe

6.2 Moralo oa Pad

☐ Boholo ba Pad bo tsamaisana le litlhaloso tsa likarolo
☐ Li-pad tsa mocheso tse entsoeng ho latela litataiso tsa moetsi
☐ Li-vias tsa mocheso tsa QFN/BGA lia lekana
☐ Karolelano ea lesoba la stensele e loketse (bona Tataiso ea moralo oa lesoba la stensele)

6.3 Litsebi tsa Fiducial

☐ Litlaleho tsa lefats'e ka bophara: bonyane tse 3 ka boto/phanele
☐ Difiducial tsa lehae bakeng sa dikarolo tse nang le pitch e nyane (pitch ya 0.5mm le ka tlase)
☐ Boholo ba fiducial: bophara ba 1mm bo tloaelehileng
☐ Ho thiba ha fiducial: Ho buleha ha maske ea solder ea 2mm

6.4 Lintlha tsa Teko

☐ Libaka tsa teko tse fumanehang bakeng sa ICT/sesebelisoa sa ho hlahloba sefofane
☐ Boholo ba ntlha ea teko: bophara ba bonyane ba 1mm
☐ Sebaka sa teko: 2.54mm bakeng sa disebediswa tse tlwaelehileng
☐ Matlo a bohlokoa a na le phihlello ea teko

Sheba DFT bakeng sa PCB bakeng sa litataiso tse felletseng tsa tlhahlobo.

6.5 Lifaele tsa Lintlha

☐ Khetha le ho beha faele e hlahisitsoeng le ho netefatsoa
☐ Faele ea Centroid likhokahano li nepahetse
☐ BOM e feletse ka dinomoro tsa dikarolo tsa moetsi
☐ Setshwantsho se hlakilwe hantle ebile se feletse
☐ Lifaele tsohle li boemong bo tšoanang ba ntlafatso

Sheba litlhoko tsa faele ea kopano ea PCB bakeng sa litlhaloso tse felletseng tsa data.


Khoasolla 'me u iketsetse

Lethathamo lena la lintlha le fana ka ntlha e felletseng ea ho qala. Le etse hore le iketsetse lona ho latela litlhoko tsa hau tse ikhethileng, ho rarahana ha moralo, le bokhoni ba molekane oa tlhahiso.

Bakeng sa tlhahlobo ea mahala ea DFM u sebelisa lethathamo lena la tlhahlobo, romella lifaele tsa hau tsa moralo ho Highleap Electronics. Sehlopha sa rona sa boenjiniere se tla fana ka tlaleho e qaqileng ea DFM e khethollang mathata afe kapa afe khahlanong le litlhoko tsena.

Charles L - Moenjiniere oa PCB CAM le Tlhahiso ho Highleap Electronics

 

About Mongoli
Charles L - Moenjiniere oa PCB CAM le Tlhahiso at Highleap Electronics

Charles o na le boiphihlelo ba lilemo tse fetang 10 boenjiniereng ba PCB CAM le tlhahiso ea lisebelisoa tsa elektroniki, a ikhethile ka ho netefatsa lifaele tsa PCB, tlhahlobo ea DFM, le ho lokisa tlhahiso bakeng sa liboto tse nang le mekhahlelo e mengata, HDI, RF, le lebelo le phahameng. A tseba Genesis, InCAM, le CAM350, o netefatsa hore data e nepahetse, lits'ebetso tse tsitsitseng le chai e ngata ea tlhahiso.

Ho Highleap Electronics, o shebana le ntlafatso ea ts'ebetso le tlhahlobo ea tlhahiso ho thusa bareki ho fokotsa likotsi, ho khutsufatsa linako tsa ho etella pele, le ho fihlela liphetho tse tšepahalang tsa tlhahiso.


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Mokhoa oa ho fumana quote bakeng sa li-PCB

E re re u tsamaise tlhahlobo ea DFM/DFA 'me re khutlele ho uena ka tlaleho.

U ka kenya lifaele tsa hau ka mokhoa o sireletsehileng ka webosaete ea rona.

Re hloka lintlha tse latelang ho u fa quote:

    • Gerber, ODB++, kapa .pcb, spec.
    • Lethathamo la BOM haeba o hloka kopano
    • bongata
    • Nako ea ho fetoha

Ntle le tlhahiso ea PCB, re fana ka mefuta e fapaneng ea lits'ebeletso tsa elektroniki, ho kenyeletsoa moralo oa PCB, PCBA (Printed Circuit Board Assembly), le tharollo ea turnkey. Hore na o hloka thuso ka prototyping, netefatso ea moralo, ho fumana likarolo, kapa tlhahiso e ngata, re fana ka ts'ehetso ea ho qetela ho netefatsa katleho ea morero oa hau. Bakeng sa litšebeletso tsa PCBA, ka kopo fana ka BOM ea hau (Bill of Materials) le litaelo tse itseng tsa kopano. Re boetse re fana ka tlhahlobo ea DFM/DFA ho ntlafatsa meralo ea hau bakeng sa tlhahiso le kopano, ho netefatsa ts'ebetso ea tlhahiso e boreleli.






    Keletso e potlakileng: Sehlopha sa rona se tla u romella lengolo-tsoibila hang ka mor'a tlhahiso. Ho netefatsa hore o fumana karabo ea rona, re khothaletsa ka mosa ho sheba SPAM / JUNK FOLDER ea hau haeba u sa bone molaetsa oa rona ho inbox ea hau.