Moetsi oa PCB oa Seva ea Polokelo ea Khoebo

Highleap Electronics ke moetsi oa PCB oa seva sa polokelo bakeng sa li-OEM tsa polokelo ea likhoebo, li-ODM tsa hyperscaler, bafani ba polokelo ea leru, le bahahi ba sistimi ea polokelo ea bohale. Li-portfolio tsa rona li akaretsa li-mainboard tsa seva sa polokelo (single-controller, dual-controller active/active, scale-out storage cluster nodes), li-backplanes tsa NVMe bakeng sa li-hot-swap drive tsa PCIe Gen4 le Gen5 (U.2, U.3, E1.S, E3.S), li-backplanes tsa SAS le li-expander tsa SAS bakeng sa chassis ea hybrid le bulk-storage, li-carrier tsa HBA le li-switch carriers tsa NVMe , li-carrier tsa RAID controller , li-adapter tsa NVMe-oF host le target , le sete e felletseng ea li-board tsa tsamaiso le tsa meralo ea motheo ka har'a chassis ea sejoale-joale ea polokelo. Li-board tse hahiloeng ho latela maemo a IPC-A-600 Class 2 tse nang le kamohelo ea Sehlopha sa 3 tse fumanehang , tse netefalitsoeng ho IATF 16949 , tse tšoanelehang bakeng sa Tier-1 storage OEM AVL , tse nang le taolo ea liphetoho e ngotsoeng le mananeo a ho fana ka li-platform tsa polokelo ea lilemo tse ngata.

Tafole ea likateng

1. Seo Li-OEM tsa Seva ea Polokelo li se Hlokang ho Moetsi oa PCB
2. Meaho ea Boto e Kholo ea Seva ea Polokelo — Node e le 'Ngoe, e nang le Bolaoli bo habeli, e nang le Sekala-kantle
3. Tlhahiso ea NVMe Backplane — Gen4, Gen5, U.2/U.3/EDSFF
4. Li-backplanes tsa SAS, li-Expander le li-Hybrid Drive Chassis tse hahiloeng
5. HBA, RAID & NVMe Switch Carrier Board Production
6. Meaho ea Boto ea Adaptara ea NVMe-oF le ea Target
7. Ho Kopanya Highleap e le Moetsi oa PCB oa Seva ea Hao ea Polokelo

1. Seo Li-OEM tsa Seva ea Polokelo li se Hlokang ho Moetsi oa PCB

Mananeo a seva sa polokelo a sebetsa ka moruo o fapaneng ho feta li-server tsa k'homphieutha. Hangata bophahamo ba tsona bo phahame ka sethala (mohala o le mong oa sehlahisoa sa polokelo o ka romella li-unit tse fetang 50,000 selemo le selemo ho pholletsa le liteishene tsa hyperscaler le tsa khoebo); lipotoloho tsa bophelo ba sehlahisoa li telele (lilemo tse 5-7 'marakeng li tloaelehile); likarolo tse ling le tšehetso ea li-unit tse ka nkeloang sebaka ke tšimo li nka lilemo tse 7-10 ho feta pheletso ea tlhahiso. Moetsi oa PCB ea tšehetsang lenaneo la polokelo o itlama ho latela linako tseo. Re fana ka ho pholletsa le potefolio ea seva sa polokelo tlas'a phallo ea boleng bo tšoanang e matlafatsang mananeo a rona a maholo a tlhahiso ea PCB ea seva.

Litlhoko tsa sehlopha sa boenjiniere

• Tšebelisano-'moho ea moralo oa backplane ea NVMe: kopanyo ea sehokelo sa ho fetola mocheso, tsela e laoloang ea impedance ho tloha karolong ea drive ho ea ho molaoli, li-vias tse phunngoeng ka morao bakeng sa taolo ea stub ea Gen5 NVMe.
• Kopanyo e teteaneng ea drive DFM: Libaka tsa ho khanna tse 24, 36, 60, esita le tse 90 ka chassis ea 4U — sebaka sa PCB sa backplane se senyenyane ha se bapisoa le sehokelo le bongata ba routing bo hlokahalang.
• Tlhahlobo ea sebopeho sa expander ea SAS: di-expander tse nang le palo e phahameng ya dikou (dikou tse 24 ho isa ho tse 36 ka chip) di hloka ho tsamaiswa ka hloko ho boloka botsitso ba lets'oao la SAS ho 12/22.5 Gbps.
• Koporo e boima bakeng sa kabo ea matla a chessis ea polokelo: Li-drive tse fetang 60 li hula 600W+ ha li sa sebetse, li ngata haholo tlas'a mosebetsi o tsitsitseng; lifofane tsa motlakase tsa backplane li hloka koporo ea 2-3 oz holim'a mealo e inehetseng kahare ho PCB e fapaneng ho bokellana.
• Litokomane tsa ho nkela thepa sebaka: Metsamao e melelele ea bophelo ba sehlahisoa e bolela hore liketsahalo tsa EOL tsa thepa li tla etsahala; litsela tse ngotsoeng tsa ho nkela sebaka lia hlokahala.

Litlhoko tsa sehlopha sa theko

• Boitlamo ba phepelo ea lilemo tse ngata: Li-platform tsa polokelo li romeloa lilemo tse 3-5; likepe tse ling tse 5-7 li romeloa.
• Bokgoni bo susumetsoang ke ponelopele: Tlhoko ea polokelo ea hyperscaler e ka nyoloha ka 5-10× ka kotara sethaleng se secha; kabo ea bokhoni khahlanong le tebello e ntseng e tsoela pele e bohlokoa.
• Litšoaneleho tsa AVL maemong a mangata: Li-OEM tsa polokelo ea Tier-1, balekane ba ODM ba hyperscaler, le bahokahanyi ba bareki ba ho qetela kaofela ba ka boloka li-AVL tse arohaneng.
• Ponaletso ea litšenyehelo boemong ba PCB: thepa, boima ba koporo, palo ea lera, le ho kenngoa ha liphanele kaofela li ama litšenyehelo tsa yuniti; tlhahlobo e hlakileng ea boemo ba BOM e tšehetsa maano a ho theola litšenyehelo.
• Theko ea sehokelo sa ho fetola mocheso: Mananeo a mang a reka lihokelo tsa SAS kapa NVMe e le thepa e rometsoeng; mofani o sebetsana le kopano ntle le ho nka beng ba thepa.
• Litokomane tsa ho latela melao ea EMC: Lihlahisoa tsa polokelo li feta litekong tsa FCC, CE, le tse ling tsa taolo; moralo oa PCB le botsitso ba tlhahiso li tšehetsa ho feta liteko ha li romelloa ka lekhetlo la pele.

Ho latela melao le ho hokahanya sistimi ea boleng

• Setifikeiti sa IATF 16949: motheo bakeng sa bafepedi ba PCB ba maemo a indasteri.
• ISO 9001: motheo oa sistimi ea boleng bo holimo.
• Kamohelo ea UL: bakeng sa dihlahiswa tsa polokelo tse hlokang setifikeiti sa polokeho.
• Tšehetso ea sehlopha sa ECCN: bakeng sa dihlahiswa tsa polokelo tse laolwang ke dinaha tse ding tse sebeletsang mmuso, mebaraka e haufi le tshireletso, kapa mebaraka ya bohlokwa ya meralo ya motheo.
• Tlaleho ea liminerale tsa likhohlano: Karolo ea 1502 ho latela tlaleho ea mofani oa thepa ea maemo a tlase e tlalehiloeng.

2. Meaho ea Boto e Kholo ea Seva ea Polokelo — Node e le 'Ngoe, e nang le Bolaoli bo habeli, e nang le Sekala-kantle

Liboto tse kholo tsa seva sa polokelo li akaretsa mefuta e mengata ea meralo ho feta liboto tse kholo tsa seva tsa ho balla. Mekhoa e meholo eo re e hahang:

Liboto tse kholo tsa taolo e le 'ngoe (ho kena le polokelo ea SMB)

• Mekhoa ea ho haha: sokete e le 'ngoe ea CPU (kapa SoC e le 'ngoe) e nang le khokahano e tobileng ho li-drive backplane le li-interface tsa marang-rang a moamoheli.
• Dikgetho tsa CPU: Intel Atom bakeng sa ho kena; Intel Xeon-D, AMD Ryzen E kentswe bakeng sa dihlahiswa tsa ho kena tse sebetsang hantle.
• Palo ea lera: Mealo e 8-12 e tloaelehileng.
• Ke / O: Likou tsa 2-4 GbE, USB 3.x bakeng sa khomphutha ea tsamaiso, sebaka sa PCIe bakeng sa katoloso ea HBA.
• Buka: polokelo ea SMB e phahameng le ea prosumer; moralo oa PCB o nang le litšenyehelo tse tlase.
• lintho tse bonahalang: 370HR kapa IS410 ho latela sepheo sa theko; FR408HR haeba ho hlokahala PCIe ea sekgahla se phahameng.

Liboto tse kholo tse sebetsang/tse sebetsang tse nang le taolo e habeli (li-array tsa polokelo ea likhoebo)

• Mekhoa ea ho haha: balaoli ba babeli ba polokelo ka har'a chassis e le 'ngoe ba nang le phihlello e arolelanoang ea backplane; ho hloleha le ho leka-lekanya mojaro ka har'a array.
• Palo ea lera la molaoli ka mong: hangata likarolo tse 12-18.
• Sehokelo sa balaoli ba fapaneng: kgokelo ya lebelo le phahameng pakeng tsa balaodi (PCIe Gen4/Gen5, NTB, kapa custom) bakeng sa ho kgokagana ha cache le ho hokahanya boemo ba ho se sebetse.
• Sebopeho sa backplane se arolelanoang: balaoli ka bobeli ba fihlella di-drive tsohle ka litsela tse sa hlokahaleng tsa SAS kapa NVMe.
• Tšehetso ea cache e tšehelitsoeng ke betri: bolulo ba 'mele le ba motlakase bakeng sa bekapo ea cache ea BBU kapa supercapacitor.
• tšepahala: Kamohelo e tloaelehileng ea IPC Class 3; mohloli o tšepahalang haholo bakeng sa li-capacitor, lihokelo le likarolo tse ling.

Liboto tse kholo tsa polokelo tse seketsoang ka tekanyo (polokelo e ajoang)

• Mekhoa ea ho haha: boto e kgolo ya seva e tshwarang pokello ya software ya polokelo (Ceph, MinIO, Lustre, GlusterFS, pokello ya hyperscaler e ikgethileng) e nang le NVMe ya lehae e hoketsweng le sebopeho sa netweke se nang le bandwidth e phahameng.
• Dikgetho tsa CPU: Li-processor tsa Xeon, EPYC, ARM HPC tse nang le sokete e le 'ngoe kapa tse peli.
• Palo ea lera: Mealo e 12-20.
• Khokahano ea marang-rang: 100G kapa 200G NIC bakeng sa sephethephethe sa polokelo; meralo e meng ea hyperscaler e kenyelletsa 400G.
• Li-drive tsa NVMe: ka hara sekepe sa M.2 hammoho le di-drive tsa U.2 kapa EDSFF tse ka pele.
• Ho kenngoa ho tloaelehileng: polokelo ea lintho tse ngata tsa hyperscaler, polokelo e hlalositsoeng ke software ea khoebo, li-backend tsa polokelo ea leru la sechaba.

JBOF (sehlopha feela sa flash) le li-server tse teteaneng tsa NVMe

• Mekhoa ea ho haha: dikoahelo tsa NVMe tse nang le bongata bo boholo tse nang le k'homphieutha e fokolang ea lehae; sepheo sa NVMe-oF bakeng sa balaoli ba kantle ba khomaretsoeng.
• Palo ea li-drive: Di-drive tsa NVMe tse 24, 36, 60, kapa esita le tse 90+ ka chassis.
• Karolo ea Boto e Kholo: Switch le tsamaiso ea NVMe; molaoli o ntšitsoe ho JBOF.
• Mecha: Sebopeho sa 100/200/400G Ethernet kapa InfiniBand NVMe-oF.
• Ho rarahana ha PCB: Backplane ke PCB e rarahaneng ka ho fetisisa tsamaisong; boto e kgolo e bonolo haholo.

Tlhahiso ea JBOD (li-disk feela) boto e kholo

• Boto e kholo ea katoloso ea SAS: hangata ho na le mekhahlelo e 6-10 e nang le chip ea expander ea SAS (letoto la Broadcom SAS3xxx) le lihokelo tsa SAS ho moamoheli (baamoheli ba kantle).
• Tšehetso ea Drive Bay: Libaka tsa ho khanna tsa 24, 60, kapa 90 tsa 3.5″ kapa 2.5″ ka har'a chassis ea 4U kapa 5U.
• Taolo ea motlakase le pholiso: ho pholisa le ho beha leihlo matla ka har'a chassis.

3. Tlhahiso ea NVMe Backplane — Gen4, Gen5, U.2/U.3/EDSFF

Moralo le tlhahiso ea PCB ea backplane ea NVMe ke e 'ngoe ea libaka tse thata ka ho fetisisa ho hardware ea seva ea polokelo. Boima ba drive, botšepehi ba ho fetola mocheso, le matšoao a lebelo le phahameng kaofela lia kopana holim'a backplane.

Tlhahiso ea backplane ea PCIe Gen5 NVMe

• Sekhahla sa lipontšo: 32 GT/s ka tsela; Di-drive tsa 4-lane ke tse tloaelehileng, 8-lane ho di-drive tsa kgwebo.
• Phapang ea impedance: 85Ω ±5% hodima mesaletsa ya bohlokwa.
• Bolelele ba mohlala: Metsamao ya backplane ho tloha ho sehokelo sa drive ho ya ho moamoheli/switch hangata e ka ba di-inchi tse 2-8; tekanyetso e nyane ya tahlehelo ho 16 GHz Nyquist.
• lintho tse bonahalang: I-Tera MT40 e amoheleha bakeng sa dikanale tse kgutshwane tsa Gen5; Tachyon 100G e kgothalletswa bakeng sa difofane tse nang le palo e hodimo ya dikou kapa tse nang le meedi e telele.
• Ho cheka ka morao: tlamo ho li-via tsa lets'oao la Gen5; sekoere sa mokokotlo ho isa ho ≤8 mil stub e setseng.
• Palo ea lera: Mealo e 12-20 ho latela bongata ba drive.

Tlhahiso ea backplane ea PCIe Gen4 NVMe

• Sekhahla sa lipontšo: 16 GT/s ka tsela e 'ngoe le e 'ngoe.
• Phapang ea impedance: 85Ω ± 10% e tloaelehileng.
• lintho tse bonahalang: FR408HR kapa I-Tera MT40 ho latela bolelele le ho teteana ha motsu.
• Ho cheka ka morao: e kgothaletswa empa e phutholohile haholoanyane e amoheleha ho feta Gen5.
• Palo ea lera: Mealo e 10-16 e tloaelehileng.

Kaho ea sefofane sa U.2 le U.3

• Sehokelo sa SFF-8639: sehokelo sa U.2/U.3 se tshehetsa SAS, SATA, le NVMe ka sebopeho se tshwanang.
• Ntlha ea foromo ea drive: Botenya ba 2.5″ × 15mm kapa 7mm; boholo bo tloaelehileng ba seva.
• Litlhophiso tse tloaelehileng: Li-server tsa 2U tse 12-bay, li-server tsa 2U tse 24-bay, li-server tsa 4U tse 36-bay.
• Kopanyo ea sehokelo sa ho fetola mocheso: boemo ba sehokelo se nepahetseng ka mamello ea ± 0.10 mm bakeng sa ts'epo ea blind-mate.

Kaho ea sefofane sa mokokotlo sa E1.S le E3.S EDSFF

• E1.S (eo pele e neng e le E1): ntlha ea sebōpeho sa rula bakeng sa li-drive tsa ho kenya ka pele; likhetho tsa botenya ba 5.9 mm, 9.5 mm, 15 mm, 25 mm.
• E3.S: SSD form factor pakeng tsa U.2 le rula, e leng kamohelo e pharaletseng ka 2024-2025.
• Molemo oa ho ba le sekgahla: EDSFF e dumella palo e phahameng ya ho kganna ka tjhase ho feta U.2.
• Lintlha tsa bohlokoa tsa backplane: sebopeho sa backplane sa drive connector pitch le screws tsa ho kenya; di-specification tsa SFF tse tloaelehileng.
• Bakhanni ba bophahamo ba modumo: meralo ea hyperscaler (EDSFF e ne e tsamaisoa haholo ke litlhoko tsa hyperscaler) hona joale e atoloha ho ea ho lihlahisoa tsa OEM tsa khoebo.

Phallo ea boleng ba tlhahiso ea backplane

• Netefatso ea boemo ba sehokelo: Tekanyo ea CMM sehloohong sa pele se netefatsang boemo ba sehokelo sa SFF-spec.
• Netefatso ea impedance: Setlankane sa TDR ka phanele bakeng sa mesaletsa ea thibelo e laoloang.
• Teko ea ho kenya ka ho chesoa ka ho chesoa: Teko ea potoloho ea ho nyalana lisampoleng tse emelang.
• Netefatso ea bokhoni ba hona joale ba sefofane sa motlakase: karoloana e nyenyane e netefatsang botenya ba koporo lifofaneng tsa motlakase.

4. Li-SAS Backplanes, Expanders le Hybrid Drive Chassis Buildings

SAS e ntse e le sebopeho se seholo sa polokelo e kholo le polokelo e kopaneng moo litšenyehelo tsa NVMe le tšebeliso ea matla li sa tiisetsoeng. SAS-12 (12 Gb/s) le SAS-22.5 (22.5 Gb/s, SAS-4) ke tsa hajoale; SAS-3 (12 Gb/s) e fumaneha hohle tlhahisong.

Tlhahiso ea SAS-12 backplane

• Sekhahla sa lipontšo: 12 Gb/s ka kou.
• Phapang ea impedance: Sepheo sa 100Ω ± 10%.
• lintho tse bonahalang: FR408HR kapa 370HR bakeng sa lifofane tse khutšoane tse ka morao; I-Tera MT40 bakeng sa ho tsamaisa sebaka se selelele.
• Tšehetso ea Drive: SATA, SAS, SAS tse nang le di-port tse pedi kaofela di tshehetswa ka morao o le mong.
• Palo ea lera: Mealo e 8-14 e tloaelehileng.

Tlhahiso ea SAS-22.5 (SAS-4) ea lifolakha tse ka morao

• Sekhahla sa lipontšo: 22.5 Gb/s ka kou.
• lintho tse bonahalang: I-Tera MT40 kapa FR408HR bakeng sa dikanale tse telele; 370HR e ka amoheleha bakeng sa dikanale tse kgutshwane.
• Ho cheka ka morao: e khothaletsoa ho li-via tsa bohlokoa tsa lets'oao.
• Buka: e hlaha polokelong ea likhoebo tsa 2024-2025; e tla fihla ho 2026-2027.

Tlhahiso ea boto ea katoloso ea SAS

• Li-chip tsa expander: Broadcom SAS35x40 (dikou tse 40), SAS35x36 (dikou tse 36), le dihlahiswa tse tshwanang tsa Microchip.
• Palo ea lera: Mealo e 10-14 ho latela palo ea likou le bongata ba litsela.
• e sebetsa joang: Chassis ea polokelo ea li-bay tse 24, li-bay tse 36, li-bay tse 60, li-bay tse 90 e nang le expander e le 'ngoe ka sebaka kapa meralo ea expander e ajoang ka makhetlo a mangata.
• tšepahala: Ho hloleha ha expander ho ama di-drive tsohle tse hoketsweng; ho fumana di-capacitor le dihokelo ka tsela e tshepahalang haholo.

Tlhahiso ea li-backplane tse kopantsoeng (SAS + NVMe)

• Mekhoa ea ho haha: di-drive bay tse ding di tshehetsa di-drive tsa SAS le NVMe ka sehokelo sa bokahohle sa SFF-8639.
• Boitsebiso ba ho khanna: backplane le molaoli li lemoha mofuta oa drive le matšoao a tsela ka nepo.
• Sekhahla sa tsela: li-protocol ka bobeli li fetisetsoa ho palo e 'ngoe le e' ngoe ea likarolo tsa bay drives tse phahameng ho feta meralo ea protocol e le 'ngoe.
• Khetho ea thepa: Litlhoko tsa NVMe routing li laola khetho ea thepa bakeng sa li-backplane tse tsoakiloeng.

Liboto tsa cable tsa SAS / mini-SAS HD tsa kantle

• Chassis ea JBOD ea kantle: mini-SAS HD (SFF-8644) kapa dikheibole tse sebetsang tsa SAS-4 bakeng sa di-drive enclosures tsa kantle.
• Tlhahiso ea boto ea cable: diboto tse nyane tse nang le maqhubu a phahameng tse kenyang dihokelo tsa kantle tse nang le sebopeho sa thibelo e laolwang ho molaoli wa polokelo ya kahare.

5. Tlhahiso ea Boto ea Bakhanni ba HBA, RAID le NVMe Switch

Mokhoa oa taolo ea polokelo — li-adapter tsa bese ea moamoheli, li-controller tsa RAID, le li-switch tsa lesela la NVMe — li ​​kenngoa tšebetsong likareteng tse inehetseng kapa li kopantsoe le li-mainboard tsa seva sa polokelo. Re haha ​​​​li-carrier tse ikemetseng le meralo e kopaneng ea li-mainboard.

Tlhahiso ea boto ea bajari ea SAS HBA

• Li-chips tse tloaelehileng: Broadcom MegaRAID, Adaptec SmartRAID, Microchip SmartIOC.
• Ntlha ea foromo: Karete e tloaelehileng ea slot ea PCIe e nang le lihokelo tsa kantle tsa mini-SAS HD.
• Palo ea lera: Mealo e 8-12.
• lintho tse bonahalang: FR408HR kapa 370HR.
• Buka: likarete tse ngata tse romelloang ho pholletsa le lihlahisoa tsa polokelo ea khoebo.

Tlhahiso ea sesebelisoa sa ho jara switch sa NVMe HBA / NVMe

• Li-chips tse tloaelehileng: Microchip PM8536 SmartIOC, lesela la switjha la Broadcom NVMe, balaoli ba NVMe ba hyperscaler ba ikhethileng.
• mosebetsi: kopanya di-drive tse ngata tsa NVMe ka mora khokahano e le nngwe ya PCIe ya moamoheli.
• Tsela ea PCIe Gen4/Gen5: impedance e laoloang, ho cheka ka morao ho li-via tsa bohlokoa tsa Gen5.
• Palo ea lera: Mealo e 10-14.
• lintho tse bonahalang: I-Tera MT40 e tloaelehileng.

Tlhahiso ea mojari oa taolo ea RAID ea Hardware

• Li-processor tsa RAID-on-chip (RoC): Letoto la Broadcom MegaRAID 9xxx, letoto la Adaptec SmartRAID 3xxx.
• memori ea cache: cache e inehetseng ea DDR4 ho carrier; bekapo ea cache ka supercap kapa BBU.
• Ntlha ea foromo: karete ea slot e tloaelehileng ea PCIe; lihlahisoa tse ling tse nang le OCP NIC form factor.
• Palo ea lera: Mealo e 10-14 e nang le sebopeho sa matshwao a kopantsweng.

Tlhahiso ea likarete tsa polokelo tsa OCP NIC 3.0

• Ntho e tloaelehileng ea foromo: Litaolo tsa polokelo ea carrier hosting ea OCP NIC 3.0 mezzanine, li-adapter tsa NVMe-oF, kapa li-starters tsa lesela.
• Bokhoni ba ho fapanyetsana lintho ka ho chesa: e tšehetsa phetoho e chesang ea likarete tsa polokelo ho li-server tse sebetsang.
• Bongata ba meralo ea hyperscale: e ntseng e eketseha e le ntlha e ka sehloohong bakeng sa balaoli ba polokelo ea hyperscaler.

6. Meaho ea Boto ea Adaptara ea NVMe-oF le ea Target

NVMe holim'a Masela (NVMe-oF) e arola polokelo ea NVMe ho tsoa ho seva ea moamoheli, e nolofalletsa polokelo e arolelanoang ts'ebetsong ea NVMe e haufi le sebaka. Li-adapter tsa NVMe-oF tse reretsoeng (ho li-JBOF le li-array tsa polokelo) le li-adapter tsa moamoheli tsa NVMe-oF (ho li-server tsa k'homphieutha) ke mola o ntseng o hola oa sehlahisoa sa PCB.

Tlhahiso ea boto ea adaptara ea NVMe-oF

• mosebetsi: adaptara e lehlakoreng la moqali e hlahisang polokelo ea NVMe-oF e hole e le NVMe ea lehae ho moamoheli.
• Khokahano ea marang-rang: 25/100/200/400G Ethernet kapa InfiniBand.
• Li-chips tse tloaelehileng: Di-DPU tsa NVIDIA BlueField (hape li sebetsa e le moamoheli oa NVMe-oF ka ho laolla), Pensando DPU, Marvell Octeon, li-ASIC tse ikhethileng.
• Palo ea lera: Mealo e 14-18.
• lintho tse bonahalang: Tachyon 100G kapa I-Tera MT40 ho latela sekhahla sa ho bonts'a le bolelele ba kanale.

Tlhahiso ea boto ea adaptara ea sepheo sa NVMe-oF

• mosebetsi: adaptara e lehlakoreng le shebiloeng e pepesang di-drive tsa NVMe tsa lehae e le dintlha tsa ho qetela tsa NVMe-oF marangrang.
• Mekhoa ea ho haha: hangata e kenyelelitsoe ho JBOF mainboard kapa taolo ya polokelo ya array.
• Ntlafatso ea ts'ebetso: Sepheo se potlakileng sa ASIC kapa FPGA se ntša CPU.

RDMA mabapi le lintho tse lokelang ho nahanoa ka Converged Ethernet (RoCE)

• Taolo ea RoCE v2: RoCE v2 ke sepalangwang se etellang pele sa NVMe-oF ho di-hyperscaler; di-deployment tse ding tsa dikgwebo di sebedisa FC-NVMe kapa NVMe/TCP.
• Litlhoko tsa NIC: Li-NIC tse nang le bokhoni ba RDMA tse 100G kapa ho feta ke tlhoko ea moamoheli.
• Lesela la Ethernet le sa lahleheng: RoCE v2 e hloka tlhophiso e hlokolosi ea lesela la marang-rang; Lihlahisoa tsa polokelo ea OEM hangata li kenyelletsa tataiso ea tlhophiso ea lesela ka lihlahisoa tsa tsona tsa NVMe-oF.

Likarete tsa FC-NVMe (Fibre Channel NVMe-oF)

• Sebelisa nyeoe: Libaka tse teng tsa Fibre Channel SAN tse fallelang ho NVMe-oF holim'a FC.
• Likarete tsa HBA: Li-HBA tsa 32G FC le 64G FC tse tšehetsang li-protocol tsa khale tsa SCSI/FCP le tsa sejoale-joale tsa NVMe-oF.
• Mekhoa ea tlhahiso: Bongata ba diyuniti bo fokotsehang ha bo bapiswa le NVMe-oF e thehilweng ho RoCE, empa tlhoko e tsitsitseng ya kgwebo.

7. Ho Kopanya Highleap e le Moetsi oa PCB ea Seva ea Hao ea Polokelo

Bakeng sa li-OEM tsa seva sa polokelo, li-ODM tse nang le hyperscaler, le barekisi ba taolo ea polokelo ba hlahlobang balekane ba tlhahiso ea PCB, mohlala oa rona oa tšebelisano o fapana ho latela boholo ba lenaneo:

Mananeo a polokelo ea seva sa polokelo

• Meaho ea mohlala: Mohlala oa likarolo tse 25-100 nakong ea matsatsi a 7-10 a mosebetsi bakeng sa liboto tse kholo tsa mekhahlelo e 12-18.
• Mehlala ea mangolo a ho tšoaneleha: Likotoana tse 200-1000 tse nang le litokomane tse felletseng tsa setaele sa PPAP.
• Tlhahiso ea sefofane: ho matha ha moqolo wa pele ho tsamaellana le ho itokisetsa ho qalisoa ha bareki.
• Tlhahiso ea bophahamo ba modumo: ho romelloa ha thepa ho reriloeng khahlanong le ponelopele e ntseng e tsoela pele; bokgoni bo boloketsoe khahlanong le boitlamo.

Mananeo a backplane

• Netefatso ea sehlooho sa pele sa mechini: Tekanyo ea CMM e netefatsang boemo ba sehokelo ho latela lintlha tsa SFF.
• Netefatso ea thepa ea motlakase ea pele: Netefatso ea impedance ea TDR ho latela motsamao o laoloang oa impedance.
• Sampole ea botšepehi ba ho fapanyetsana ka mocheso: Teko ea potoloho ea ho nyalana maemong a ho khanna a emelang.
• Kemiso ea molumo: Tlhoko ea backplane hangata e tsamaea ka karolelano e tsitsitseng ho ea ho palo ea bay e khannang; moralo o thehiloeng ho ponelopele o bonolo.

Mananeo a HBA, RAID, le switch carrier

• Tšebelisano e tiileng ea DFM: Moralo oa litšupiso tsa barekisi ba ASIC hangata ke sebaka sa ho qala; re ikamahanya le moralo o ikhethileng oa moreki.
• Lintlha tse tloaelehileng tsa sebopeho sa PCIe: e fokotsa kotsi ea lisebelisoa le tlhahiso.
• Ho lekanya bophahamo ba modumo: Hangata dikarete tsa bajari di romelwa ka bongata bo hodimo ho feta diboto tse kgolo; kabo ya bokgoni e etelletswe pele.

Highleap e na le setifikeiti sa ISO 9001 le IATF 16949. Re etsa li-PCB tsa seva sa polokelo ho tloha mealong e 4 ho isa mealong e 24, ka bokhoni ba HDI bakeng sa fanout e teteaneng e hlokahalang ho potoloha li-ASIC tse kholo tsa NVMe switch, impedance e laoloang ho fihlela ho ± 5% ho li-traces tsa bohlokoa tsa Gen5, koporo e boima ho fihlela ho 3-4 oz bakeng sa li-backplanes tse teteaneng ka matla, le sekoahelo se felletseng sa PCB sa ho qetela (ENIG, silevera ea ho qoelisoa, OSP, HASL e se nang lebone). Phano e tloaelehileng ea ho potoloha ka potlako bakeng sa li-prototypes tsa seva sa polokelo ke matsatsi a 5-8 a mosebetsi bakeng sa li-backplanes le matsatsi a 7-10 a mosebetsi bakeng sa li-mainboard tsa seva sa polokelo.

Romela difaele tsa Gerber, data ya ho phunya, tlhaloso ya stackup, bongata ba dipheo, le kemiso ya lenaneo ka portal ya rona ya khotheishene ya inthanete bakeng sa karabelo ya dihora tse 24. Bakeng sa mananeo a rarahaneng — phepelo ya malapa a mangata bakeng sa di-platform tse ntjha tsa polokelo, phallo ya AVL e ikgethang ka hyperscaler, mananeo a ts'ehetso ya potoloho e telele — sehlopha sa rona sa polokelo se ka buisana ka kotloloho le boholo le bokgoni. Bakeng sa meaho ya backplane ya polokelo e ntlafaditsweng ka ditjeo moo letshwao la Gen4/Gen3 le lekane, bona bokgoni ba rona ba tlhahiso ya PCB ya FR4.