Phetohelo ea PCB ea AI Server ea 2026

Phetoho ea PCB ea Al Server

NVIDIA Blackwell GB300 e hloka mekhahlelo ea PCB e 28-34 e nang le dielectric tse nang le tahlehelo e tlase ea M7. Vera Rubin (H2 2026) e tla sutumelletsa mekhahlelong e fetang 40 le thepa ea M10 - tlhahlobo e tiisitsoe ka la 13 Hlakubele 2026. Nka sebaka ka setšoantšo sa hau sa fektheri kapa sehlahisoa.

'Maraka oa Lefatše oa PCB oa 2026
$ 100.64B
Mordor Intelligence Pherekhong 2026
AI Server PCB CAGR
> 25%
khahlano le 'maraka ka kakaretso oa 4.83%
Liraka tsa NVIDIA 2026
60,000 +
2x 2025 — Morgan Stanley
8 CSP CapEx 2026
$60B
+40% Selemo le Selemo — TrendForce
Tlhoko ea Mealo ea Batho ba 18+
+ 18.5%
Selemo sa pele kotara ea 2025 — Prismark

Mmaraka oa lefats'e oa PCB o ile oa feta $100.64 bilione ka 2026 - ketsahalo ea bohlokoa e tsamaisoang haholo ke seva ea AI le meralo ea motheo ea k'homphieutha e sebetsang hantle. Basebetsi ba Hyperscale ba ile ba sebelisa li-server tse ka bang limilione tse 1.2 tse ntlafalitsoeng ke AI ka 2025 feela, e 'ngoe le e 'ngoe e kopanya li-accelerator tsa GPU tse 8 ho isa ho tse 16 tse hulang ho feta 1.0 kW ka sokete. Palo e tloaelehileng ea lera la PCB ea seva ea AI e nyolohile ho tloha ho 18 ka 2023 ho ea ho 32 ka 2025 - keketseho ea 78% lilemong tse peli feela.

Ka la 13 Hlakubele, 2026, mohlahlobi oa ketane ea phepelo Guo Mingqi o tiisitse hore NVIDIA le Wus Printed Circuit li qalile ho leka lisebelisoa tsa M10 CCL tsa moloko o latelang tse shebaneng le ntlha ea ho qhalana ka tlase ho 0.002 - e ka tlase ho halofo ea lisebelisoa tsa hona joale tsa M7. Sena se tšoaea qalo ea potoloho ea ntlafatso e tla hlalosa litlhaloso tsa PCB tsa seva sa AI ho fihlela ka 2027 le ho feta.

CHATE EA 1 — 'MARAKA OA LEFATŠE OA PCB
Boholo ba 'Maraka oa Lefatše oa PCB 2021-2026 (USD Bilione)
Mehloli: Mordor Intelligence (tlhahiso ea Pherekhong 2026); Prismark; tumellano ea indasteri
2021
$ 76.7B

2022
$ 81.5B

2023
$ 78.2B

2024
$ 87.6B

2025
$ 95.8B

2026
$ 100.64B
SELEMO SA PELE SA 100B

$0
$ 50B
$ 100.64B

"Ha o ntlafatsa ho tloha ho 400G ho ea ho 800G kapa 1.6T, theko ea li-PCB ha e eketsehe ka 20-30%. E imena habeli."

— Tlhahlobo ea Theknoloji ea Huadian / 36Kr, Pherekhong 2026

Theknoloji ea Lere: Kamoo Moloko ka Mong oa Sethala o Habelisang Theko ea PCB

Moloko o mong le o mong oa sethala sa NVIDIA o hloka litlhaloso tse fapaneng tsa PCB. Ts'ebetso ha e eketsehe - ke ts'ebetso ea mehato e hlokang lisebelisoa tse ncha, lits'ebetso tse ncha, le litheko tse phahameng ka ho fetisisa. Ho 224 Gbps (Blackwell), CCL ea M7 e lahleheloang haholo ke ea bohlokoa ka makhetlo a 6-9 ho feta litšenyehelo tsa FR4 e tloaelehileng. Ho 448 Gbps+ (Vera Rubin), lisebelisoa tsa M9/M10 li tla bitsa 15-20x FR4. Ho imena habeli ha sekhahla sa lets'oao ho fana ka theko e imena habeli.

CHATE EA 2 — PHETOHO EA SEFATOLO
AI Server PCB: Palo ea Mealo le ho Atisa Litheko ka Sethala
Mehloli: 36Kr; UGPCB; EIPC Pherekhong 2026; Phuputso ea Guo Mingqi la 13 Hlakubele, 2026

H100 / H200 (Hopper) · Moqolo: 2022-2024
18-24 Mekhahlelo
112 Gbps
Kereiti ea CCL: M6
Palo ea litekanyo (18-24L karolelano ea 21 = 52.5% ea 40L e phahameng ka ho fetisisa)
Meetso ea 18-24
Theko khahlanong le motheo oa H100
1x ea motheo

GB200 / GB300 (Blackwell) · Buka: 2025-2026
28-34 Mekhahlelo
224 Gbps
Kereiti ea CCL: M7
Palo ea litekanyo (28-34L karolelano ea 31 = 77.5% ea 40L e phahameng ka ho fetisisa)
Meetso ea 28-34
Theko khahlanong le motheo oa H100
~2x — theko e imenne habeli
Tahlehelo e tlase ea M7 Ultra CCL = litšenyehelo tsa 6-9x FR4. Sekhahla sa lets'oao se imena habeli ho tloha ho H100.

VR200 / VR300 (Vera Rubin) · Ramp ea H2 2026
Mealo e 32-40+ + HDI
448 Gbps+
TEKO EA M9/M10
Palo ea litekanyo (32-40+ L = 100% ea sekala)
Mealo e 32-40+ + HDI efe kapa efe ea leraMAX
Theko khahlanong le motheo oa H100
~ 3-4x - theko makhetlo a mararo / quadruples
M9/M10 CCL = 15-20x litšenyehelo tsa FR4 | TEKO EA M10 E TIISITSOE LA 13 Hlakubele, 2026 (Guo Mingqi)

Boitsebiso ba M10: Seo la 13 Hlakubele le se Bolelang Hantle

Netefatso ea phuputso ea ketane ea phepelo ea mohlahlobi Guo Mingqi ea la 13 Hlakubele 2026 ea hore NVIDIA le Wus Printed Circuit li leka lisebelisoa tsa M10 CCL ke lets'oao la pele la potoloho e latelang ea ntlafatso. Lipheo tsa M10 Df li ka tlase ho 0.002 - e nolofalletsang sekhahla sa lipontšo sa 448 Gbps+ se batloang ke meralo ea Vera Rubin e reriloeng bakeng sa tlhahiso ea bophahamo ba H2 2026.

Potoloho ea ho tšoaneleha ha thepa e ntse e hatella: seo pele se neng se nkile likhoeli tse 18-24 joale se ntse se hatelloa ho fihlela likhoeling tse 12 ke khatello ea tlholisano. Bafepedi ba CCL ba seng ba ntse ba nts'etsapele thepa ea boemo ba M10 ba kotsing ea ho qheleloa ka thoko molokong o latelang oa mananeo a ho tšoaneleha ha boto ea seva ea AI.

CSP CapEx: Letšoao la Tlhokeho ea Sebopeho

TrendForce e ntlafalitse kholo ea eona ea CSP CapEx ea 2025 ho tloha ho +61% ho isa ho +65% nakong ea selemo. Bakeng sa 2026, kakaretso ea CSP CapEx e lebelletsoe ho feta $60 bilione - keketseho ea 40% selemo le selemo. IDC e rera hore 'maraka oa lefats'e oa seva ea AI o tla hola ho tloha ho $30.7 bilione ka 2023 ho feta $90 bilione ka 2028 ho 24% CAGR.

Dolara e 'ngoe le e 'ngoe ea chelete e kenang ho seva sa AI e hula ka makhetlo a 3-4 boleng ba litaba tsa PCB ba seva e tloaelehileng ea k'homphieutha. Ena ha se potoloho ea tšebeliso ea chelete - ke phetoho ea sebopeho sa bokhoni ba tlhahiso ea lisebelisoa tsa elektroniki lefatšeng ka bophara.

CHATE EA 3 — LERE EA LITŠENYEHO TSA CCL
Sekasetsi sa Litšenyehelo tsa Thepa ea CCL ha se bapisoa le FR4 e Tloaelehileng (2026)
Bophara ba bara = litšenyehelo khahlanong le FR4 (sekala: 1x ho isa ho 20x). Mehloli: UGPCB; PCBOnline; EIPC Pherekhong 2026; Phuputso ea Guo Mingqi la 13 Hlakubele, 2026

Sekhahla sa Pontšo sa Sehlopha / Df / Max
Litšenyehelo khahlanong le FR4

FR4 (E Tloaelehileng)
Df 0.020-0.025 | <10 Gbps

1x

M4 (Tahlehelo e Tlase)
Df 0.010-0.013 | 56 Gbps

2-3x

M6 (Tahlehelo e Tlase Haholo)
Df 0.005-0.008 | 112 Gbps

4-6x

M7 (Tahlehelo e Tlase ka ho Fetisisa)
Current
Df 0.003-0.005 | 224 Gbps

6-9x

M9
HO PHAHAMA KA 2026
Df <0.003 | 448 Gbps

10-15x

M10
TEKO La 13 Hlakubele, 2026
Sepheo sa Df <0.002 | 448+ Gbps | NVIDIA + Wus Printed Circuit e tiisitsoe

15-20x

Theko e phahameng ka ho fetisisa — thepa ea moloko o latelang

1x (motheo oa FR4)
10x
20x (max ea M10)

LITSEBISO TSA MATSETE A BOKHONI BO BOHOLO BA 2026
RMB 20B
Theknoloji ea Shenghong
HDI + bokgoni ba maemo a hodimo, Chaena
RMB 4.3B
Foxconn FIT Thailand
Setsi se tsoetseng pele sa HDI, Asia Boroa-bochabela
EUR 1.2B
AT&S Malaysia (Tshitwe 2025)
Karolo ea IC, likoloi + li-chip tsa AI
KRW 31T
SK Hynix Yongin (La 1 Tlhakubele, 2026)
Mokhoa o motle oa memori oa HBM / AI ho fihlela ka 2030
+ 10.6%
Sehlopha sa SCHMID (La 11 Tlhakubele, 2026)
Keketseho ea setoko ka letsatsi la odara ea lisebelisoa tsa HDI

'Maraka o Kopantsoeng: Bahlōli khahlanong le Baphonyohi ka 2026

Bahlahisi ba Hlahisitsoeng ke AI — Ho Atleha
+Moputso o felletseng oa boto ea Victory Giant HDI ~ 39% ho Q1 2025
+Litheko tsa PCB tsa maemo a holimo lia nyoloha 37.8% Selemo ka 2025
+Baetsi ba 10 ba ka sehloohong ba tšoere 52% karolo ea 'maraka (+3pp ka 2025)
+Ho pepesehela AI ho fana ka +2-3pp ntlafatso ea phaello e felletseng Selemo
Lihlahisoa tse Tloaelehileng — Tlas'a Khatello
-Lisebelisoa tse tala tse ka bang 60% tsa BOM tse se nang matla a ho fokotsa theko
-Nako ea ho kenya e ekelitsoe ho tloha libeke tse 4-6 ho isa ho tse 10 libeke tse 12-16
-Nako ea ho pepa ea lisebelisoa tse setseng >$12B; Linako tsa ho tlisa tsa likhoeli tse 15-18
-Likhoebo tse nyane le tse mahareng li tsoa 'marakeng o mahareng; ho kopanngoa hoa potlaka

Mabapi le Highleap Electronics: Highleap Electronics e etsa li-PCB tse nang le mekhahlelo e mengata 'me e fana ka lits'ebeletso tse felletseng tsa kopano ea PCBA bakeng sa li-server tsa AI, liindasteri le lits'ebetso tsa puisano. Re tšehetsa meralo ea HDI e nang le mekhahlelo e mengata le litlhaloso tse tsoetseng pele tsa thepa ho kenyeletsoa le li-laminate tsa M6 le M7. Kopa khotheishene ea PCB e nang le mekhahlelo e mengata .

Mehloli: Tlaleho ea 'Maraka oa PCB oa Mordor Intelligence (Ntlafatso ea data ea Pherekhong 2026); Khatiso ea 1 ea EIPC SpeedNews, Pherekhong 2026 (Puisano ea Chiu Shih-fang / TPCA); Phuputso ea ketane ea phepelo ea Guo Mingqi ka la 13 Hlakubele 2026 (ka Futunn News); 36Kr “2026: Li-server tsa AI li Tla ba Theko e Boima Haholo”; Tlhahlobo ea TrendForce CSP CapEx 2026; Lintlha tsa 'maraka oa Prismark Q1 2025; Ponelopele ea tlhoko ea seva ea Morgan Stanley AI; Tlaleho ea 'maraka oa seva ea IDC AI; PCBOnline “Li-PCB: Ho Matlafatsa Li-server tsa AI”; Phatlalatso ea boralitaba ea SCHMID Group ka la 11 Hlakubele 2026; Ho phethoa ha AT&S Malaysia ka Tšitoe 2025; TTM Technologies Pulungoana 2025; Tsebiso ea matsete ea SK Hynix Yongin ka la 1 Hlakubele 2026.

qotsa hanghang

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Mokhoa oa ho fumana quote bakeng sa li-PCB

E re re u tsamaise tlhahlobo ea DFM/DFA 'me re khutlele ho uena ka tlaleho.

U ka kenya lifaele tsa hau ka mokhoa o sireletsehileng ka webosaete ea rona.

Re hloka lintlha tse latelang ho u fa quote:

    • Gerber, ODB++, kapa .pcb, spec.
    • Lethathamo la BOM haeba o hloka kopano
    • bongata
    • Nako ea ho fetoha
Ntle le tlhahiso ea PCB, re fana ka mefuta e fapaneng ea lits'ebeletso tsa elektroniki, ho kenyeletsoa moralo oa PCB, PCBA (Printed Circuit Board Assembly), le tharollo ea turnkey. Hore na o hloka thuso ka prototyping, netefatso ea moralo, ho fumana likarolo, kapa tlhahiso e ngata, re fana ka ts'ehetso ea ho qetela ho netefatsa katleho ea morero oa hau. Bakeng sa litšebeletso tsa PCBA, ka kopo fana ka BOM ea hau (Bill of Materials) le litaelo tse itseng tsa kopano. Re boetse re fana ka tlhahlobo ea DFM/DFA ho ntlafatsa meralo ea hau bakeng sa tlhahiso le kopano, ho netefatsa ts'ebetso ea tlhahiso e boreleli.






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