Thermal Conductivity ho MCPCB | Ho Utloisisa Bottlenecks ea Ts'ebetso ea 'Nete

Selelekela

Tshebetso ya mocheso wa MCPCB ha e itshetlehe feela hodima ho tsamaisa thepa ka hara substrate ya tshepe empa hape e itshetlehile ka botenya ba ho thibela ho kwahela le ho hanyetsa mocheso wa interfacial. Le hoja baqapi ba bangata ba tsepamisitse maikutlo haholo-holo ho kgetheng di-substrate tsa aluminium kapa koporo tse nang le boleng bo hodimo ba ho tsamaisa thepa ka hara mocheso, hangata ba hlokomoloha dithibelo tsa bohlokwa tse etsang qeto ya katleho ya phetisetso ya mocheso. Ditshebedisong tse nang le matla a maholo jwalo ka di-module tsa LED moo phetisetso ya mocheso wa PCB ya aluminium e leng bohlokwa, ho utlwisisa dintlha tsena tse fokotsang ho ba bohlokwa bakeng sa ho fihlella taolo e ntle ya mocheso.

Ho utloisisa Thermal Conductivity ho MCPCB Systems

Tsela ea ho Fetisetsa Mocheso

Tsela ea ho tsamaisa mocheso ka har'a li-MCPCB e latela tsela e ka lebelloang: mocheso o phalla ho tloha lera la potoloho ea koporo ho pholletsa le lera la ho thibela dielectric 'me qetellong o kena ka har'a substrate ea motheo oa tšepe. Leha aluminium e fana ka ho tsamaisa mocheso oa hoo e ka bang 200 W/m·K 'me koporo e fihla ho 400 W/m·K, lipalo tsena tse khahlang li pheta karolo feela ea pale.

Ho phahama ha 'nete ha mocheso likarolong tsa hau hangata ha ho na kamano e nyane le litekanyetso tsena tsa theory. Ts'ebetsong e sebetsang ea mocheso oa MCPCB, lesela la dielectric le fetoha ntho e ka sehloohong e hlalosang ho hanyetsa mocheso ka kakaretso. 'Nete ena e re qobella ho nahanisisa ka mokhoa oa rona oa moralo oa mocheso, ho fetola maikutlo ho tloha ho khetho ea substrate ho ea ho utloisisa stack e feletseng ea mocheso.

Thermal Conductivity ho MCPCB: The Dielectric Bottleneck

Bohlokoa Lera Analysis

Lera la dielectric le fana ka mokoallo oa bohlokoa ka ho fetisisa oa mocheso moralong ofe kapa ofe oa MCPCB. Ka mocheso oa mocheso o tloaelehileng ho tloha ho 0.8 ho isa ho 3 W/m·K, lesela lena la ho kenya letsoho le tsamaisa mocheso ka makhetlo a ka bang 100 ho feta substrate ea aluminium e ka tlas'a eona. Ha botenya ba dielectric bo eketseha ho tloha ho 50 μm ho ea ho 100 μm, ho hanyetsa mocheso ho batla ho imena habeli, ho latela kamano ea motheo R = t / (k × A).

Tšusumetso e sebetsang ho Ts'ebetso

Nahana ka tšusumetso ena e sebetsang: MCPCB e sebetsang hantle e nang le dielectric ea 3 W/m·K ka botenya ba 75 μm e baka khanyetso e matla ea mocheso ho feta substrate ea aluminium ea 5mm. Esita le li-alloy tsa aluminium tsa boleng bo holimo tse nang le thepa e phahameng ea mocheso li ke ke tsa lefella lera la dielectric le sa hlalosoang hantle.

Ho fokotsa botenya ba dielectric kapa ho sebelisa lisebelisoa tse phahameng-conductivity ka ho toba ho ntlafatsa katleho ea ho fetisa mocheso oa aluminium PCB. Molao-motheo ona oa mantlha o tataisa ts'ebetso e sebetsang ea mocheso ho ntlafatso ea MCPCB, leha ho le joalo e lula e sa ananeloe ho latela litlhaloso tse ngata tsa meralo.

Interfacial Thermal Resistance ho Mehaho ea MCPCB

Lepheko le Patiloeng

Ho hanyetsa mocheso oa sefahleho ho hlaha moeling o mong le o mong oa thepa ka har'a sebopeho sa MCPCB. Likheo tsa moea tse sa bonahaleng, ho hlaka holimo, le likarolo tsa oxidation sebakeng sa koporo-dielectric le dielectric-aluminium li theha litšitiso tse eketsehileng tsa mocheso. Likhokahano tsena li ka kenya letsoho ho 20-40% ea khanyetso e felletseng ea mocheso, leha ho le joalo li lula li sa bonahale ho latela litlhaloso tse tloaelehileng tsa mocheso oa mocheso.

Tšusumetso ea Tlhahiso ho Thermal Conductivity

Taolo ea ts'ebetso ea tlhahiso e ama haholo khanyetso ea sefahleho ts'ebetsong ea mocheso oa MCPCB. Khatello ea lamination, ho folisa ho tšoana, le ho lokisa holim'a metsi kaofela li susumetsa boleng ba ho kopana ha mocheso pakeng tsa lihlopha. Baetsi ba tsoetseng pele ba sebelisa liphekolo tse khethehileng le li-adhesives tse nang le mocheso o phahameng oa mocheso ho fokotsa liphello tsena tsa sebopeho.

Le ha o na le matla a ho fetisa mocheso a aluminium PCB, maqhama a sa sebetseng hantle a ka nyenyefatsa haholo ts'ebetso ea mocheso likopanong tsa MCPCB. Phapang ena ea tlhahiso e hlalosa hore na hobaneng meralo e ts'oanang e tsoang ho barekisi ba fapaneng hangata e bonts'a ts'ebetso e fapaneng haholo ea mocheso.

Tlhahlobo ea Palo ea MCPCB Thermal Conductivity

Ho Senya Thermal Resistance

Kakaretso ea ho hanyetsa mocheso ho MCPCB e latela mohlala oa letoto moo karolo e 'ngoe le e' ngoe e eketsang ho hanyetsa ka kakaretso. Ho utloisisa kabo ena ho bohlokoa bakeng sa ho ntlafatsa conductivity ea mocheso meralong ea MCPCB. Ho senyeha ho tloaelehileng ha mocheso oa mocheso ho senola likarolo tse makatsang:

• R_Dielectric hangata e nka 50-70% ea kakaretso ea ho hanyetsa mocheso
• R_Interface e kenya letsoho 20-30% ea kakaretso
• R_Metal_Base e emela feela 5-15% ho sa tsotellehe conductivity ea eona e phahameng

Lintho tse ka sehloohong tsa ho ntlafatsa

Kabo ena e bontša ka ho hlaka moo boiteko ba ho ntlafatsa bo hlahisang meputso e meholo ka ho fetisisa bakeng sa ts'ebetso ea mocheso oa MCPCB. Ho tloha ho aluminium e tloaelehileng ho ea ho substrate ea koporo ho ka fokotsa ho hanyetsa mocheso ka 5%, ha ho ntlafatsa conductivity ea mocheso oa dielectric ho tloha ho 1 ho isa ho 3 W/m·K ho ka e fokotsa ka 40%.

Molaetsa o hlakile: ho ntlafatsa likarolo tsa dielectric le interface ho fana ka tšusumetso e kholo ho hanyetsa mocheso ka kakaretso. Kutloisiso ena e hlile e fetola tsela eo re atamelang tsamaiso ea mocheso ho ntlafatso ea moralo oa MCPCB.

Ts'ebetso ea 'Nete ea Lefatše ea Thermal ho Likopo tsa MCPCB

Liphetho tsa liteko tsa laboratori

Teko ea laboratori ea li-substrates tsa aluminium tse tšoanang tse nang le litlhaloso tse fapaneng tsa dielectric li bonts'a melaoana ena haholo. Li-MCPCB tse peli tse nang le motheo oa aluminium oa 1.6mm empa likarolo tse fapaneng tsa dielectric li bontšitse phapang e tsotehang ea tshebetso. Ea pele, e nang le botenya ba 50 μm ho 2 W/m·K conductivity, e ile ea sebetsa haholo ho feta ea bobeli ka 100 μm ho 1 W/m·K conductivity.

Sebopeho sa dielectric se tšesaane, se phahameng-conductivity se fihletse mocheso oa mateano ka 15 ° C ka tlase ho matla a tšoanang a 10W. Phapang ena ea 3.5x ea ho hanyetsa mocheso e etsahetse leha ho sebelisoa li-substrates tsa aluminium tse ts'oanang, ho paka hore khetho ea substrate feela ha e khetholle ts'ebetso ea mocheso oa MCPCB.

Interface Quality Liphello

Papiso e 'ngoe e senolang e ne e kenyelletsa mekhoa ea ho lokisa holim'a metsi e amang conductivity ea mocheso likopanong tsa MCPCB. Li-stackups tse ts'oanang tsa MCPCB tse sebetsitsoeng ka mokhoa o tloaelehileng ho bapisoa le lamination e ntlafalitsoeng li bonts'itse phapang ea 25% ea ho hanyetsa mocheso ka lebaka la phapang ea boleng ba sefahleho.

Maikutlo ana a sebele a lefats'e a tiisa hore litekanyetso tsa conductivity tsa theory feela li ke ke tsa bolela esale pele ts'ebetso ea sebele ea mocheso. Liphello tse kopantsoeng tsa thepa ea dielectric le boleng ba sebopeho li khetholla hore na ho na le conductivity ea 'nete ea mocheso tsamaisong ea MCPCB ho feta thepa leha e le efe ea thepa e le' ngoe.

Ho ntlafatsa Thermal Conductivity ho Moralo oa MCPCB

Litaelo tse Sebetsang bakeng sa Baenjiniere

Taolo e sebetsang ea mocheso e hloka ho leka-lekanya lintlha tse ngata ka ntle ho khetho ea substrate ho finyella ts'ebetso e nepahetseng ea mocheso oa MCPCB. Qala ka ho hlakisa lesela la dielectric la thinnest le finyellang litlhoko tsa hau tsa ho itšehla thajana tsa motlakase - phokotso e 'ngoe le e' ngoe ea 10 μm e ka ntlafatsa ts'ebetso ea mocheso ka 15-20%.

Khetha lisebelisoa tsa dielectric tse nang le conductivity ea mocheso ka holimo ho 2 W/m·K ha ho khoneha, le haeba sena se eketsa litšenyehelo tsa thepa. Melemo ea ts'ebetso hangata e lokafatsa matsete lits'ebetsong moo ho tsamaisoa ha mocheso lits'ebetsong tsa MCPCB ho leng bohlokoa.

Maano a Ntlafatso ea Sebopeho

Ntlafatso ea sefahleho e hloka tlhokomelo nakong ea mekhahlelo e 'meli ea moralo le ea tlhahiso ho eketsa phetisetso ea mocheso ea aluminium PCB. Hlalosa liphetho tse nepahetseng 'me u sebetse le bahlahisi ba utloisisang taolo ea sehokelo sa mocheso. Kopa litekanyo tsa ho hanyetsa mocheso ho e-na le ho itšetleha feela ka lipampiri tsa thepa ea thepa.

Ak'u nahane ka ho kenya lisebelisoa tsa mocheso moo ho loketseng, kaha tsena li ka feta lera la dielectric ka ho feletseng bakeng sa libaka tse chesang tsa sebakeng seo. Leha ho le joalo, hopola hore ka katleho ho ipapisitse le ho tlatsoa ka nepo le khokahano ea mocheso, ho tiisa bohlokoa ba boleng ba tlhahiso ho fihlela ts'ebetso e nepahetseng ea mocheso likopanong tsa MCPCB.

fihlela qeto e

Ho utloisisa lintlha tsena tse fokotsang ho bohlokoa bakeng sa ho lekola ka nepo ts'ebetso ea mocheso oa MCPCB le ho ntlafatsa phetiso ea mocheso ea aluminium PCB lits'ebetsong tsa lefats'e la nnete. Lera la dielectric le ho hanyetsa sefahleho, eseng karoloana ea tšepe, li khetholla siling ea 'nete ea mocheso oa moralo oa hau.

Ka ho shebana le boiteko ba ho ntlafatsa libotlolong tsena tsa bohlokoa, baenjiniere ba ka fihlela lintlafatso tse kholo taolong ea mocheso ntle le tefiso ea litšenyehelo tsa thepa e sa tloaelehang ea substrate. Katleho ho conductivity ea mocheso ho optimization ea MCPCB e hloka ho shebella stack eohle ea mocheso e le sistimi ho fapana le ho shebana le thepa ea motho ka mong.

Ho Highleap Electronics, re ikhethile ka tlhahiso ea MCPCB ka ts'ebetso e ntlafalitsoeng ea mocheso ka taolo e hlokolosi ea litlhaloso tsa dielectric le boleng ba sebopeho. Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka hore na moralo o nepahetseng oa mocheso o ka ntlafatsa lits'ebetso tsa hau tsa matla a phahameng joang.