Khokahano e Tsoetseng Pele ea Potoloho e nang le Thick Film Ceramic PCBs

Li-PCB tsa Thick Film Ceramic li emela theknoloji e tsoetseng pele le e feto-fetohang e kopanyang likarolo tsa elektroniki tse kang li-resistors, li-capacitor, li-conductor le li-semiconductors ka kotloloho holim'a li-substrates tsa ceramic tse sebelisang mahlale a ikhethang a khatiso le a sintering. Theknoloji ena e loketse bakeng sa lisebelisoa tsa matla a phahameng, tse phahameng-frequency, le tse feteletseng-tikoloho, tse fanang ka botsitso bo phahameng ba mocheso, ho kenya motlakase le matla a mochine. Ka ho kopanya litšobotsi tse matla tsa lirafshoa le ho nepahala le ho feto-fetoha ha lisebelisoa tsa elektronike tse hatisitsoeng, li-PCB tse teteaneng tsa ceramic li fetohile tsa bohlokoa haholo liindastering ho tloha ho likoloi ho ea sebakeng sa sefofane. Tataiso ena e fana ka tlhahlobo e tebileng ea sebopeho, melao-motheo ea moralo, lits'ebetso tsa tlhahiso, melemo ea ts'ebetso, le ts'ebeliso ea theknoloji ena e ncha.

Sebopeho sa Core & Mokhoa oa Tlhahiso

Material Foundation

Ts'ebetso le ho lekana ha li-PCB tsa ceramic tsa filimi e teteaneng li khethoa ke khetho ea lisebelisoa tsa substrate le likarolo tsa conductive tse sebelisoang. Lisebelisoa tsa bohlokoa li kenyelletsa:

• Alumina (Al₂O₃): Thepa e tloaelehileng ea substrate, e fanang ka bohloeki ba 96% -98% le conductivity ea mocheso oa 20-25 W / mK. Alumina e theko e tlaase ebile e sebelisoa haholo lits'ebetsong tse akaretsang.
• Aluminium Nitride (AlN): E tsejoa ka mokhoa o phahameng oa ho futhumatsa mocheso (100-200 W / mK), AlN e loketse lisebelisoa tse phahameng tsa matla moo mocheso o sebetsang hantle o leng bohlokoa.
• Beryllium oxide (BeO): E fana ka ultra-high thermal conductivity (ho fihla ho 280 W/mK), empa ka lebaka la chefo ea eona, BeO hangata e lekanyelitsoe lits'ebetsong tse khethehileng tsa sesole le tsa sefofane.

Botenya ba Substrate
Botenya bo tloaelehileng ba substrate bo tloha ho 0.25mm ho isa 2.0mm, ka likhetho tsa tloaelo tse fumanehang bakeng sa litlhoko tse ikhethang.

Lera la Mokhanni

Lera la conductor ka har'a li-PCB tsa ceramic tse teteaneng li entsoe ka thepa e kang silver-palladium (Ag-Pd), gold-palladium (Au-Pd), kapa molybdenum/manganese-nickel (Mo/Mn + Ni) alloys. Litšepe tsena li khethiloe bakeng sa conductivity ea tsona e babatsehang le ho lumellana le sintering e phahameng ea mocheso.

• Botenya ba Mokhanni: Mebala ho tloha 10-20 μm (0.01-0.02mm), ho itšetlehile ka kopo le ts'ebetso e lakatsehang ea motlakase.
• Lintlha tsa Trace: Bakeng sa tlhahiso ea bongata, bonyane bophara ba trace le sebaka ke 0.30mm / 0.30mm, ha li-prototypes li ka finyella liqeto tse ntle (0.15mm / 0.20mm, empa ka litšenyehelo tsa pele).

Mokhoa oa ts'ebetso oa tlhahiso

Ts'ebetso ea ho etsa li-PCB tse teteaneng tsa ceramic e kenyelletsa mehato e 'maloa ea bohlokoa:

1. Tokiso ea Substrate: Substrate ea ceramic e bentšitsoe ka hloko ho etsa bonnete ba hore sebaka se boreleli se na le mahoashe a ka tlase ho 0.1μm.
2. Khatiso ea Screen: Li-pastes tse tsamaisang le tse hanyetsang li hatisitsoe skrineng holim'a substrate ho sebelisoa li-skrini tse phahameng tsa mesh (200-400 mesh), tse lumellang ho behoa ka mokhoa o nepahetseng.
3. Ho Thunya ka Mocheso o Phahameng: Li-substrates tse hatisitsoeng li siiloe ka mocheso ho tloha ho 850 ° C ho ea ho 1000 ° C ka metsotso e 10-60, ho finyella matla a ho khomarela a fetang 20 MPa.
4. Ho fokotsa Laser: Litekanyetso tsa Resistor li hlophisitsoe hantle ka laser trimming, e lumellang hore ho be le liphetoho tse nepahetseng ka mamello ea ± 0.1%.
5. Seboka: Ho kopanngoa ha likarolo tse holimo-limo (SMT), wire bonding, kapa chip-on-board (COB) sephutheloana se phethela mokhoa oa kopano.

Lintlha tsa bohlokoa tsa Tekheniki le Melemo ea Ts'ebetso

Li-PCB tsa Thick Film Ceramic li fana ka melemo e fapaneng ea tekheniki e li etsang hore li phahametse mahlale a setso a PCB:

Melemo Ho Feta Li-PCB Tse Tloaelehileng

• Bokgoni ba Sebaka: Li-resistors tse kentsoeng li lokolla hoo e ka bang 30% ea sebaka se holim'a metsi, e leng se etsang hore li-PCB tsena e be tse loketseng bakeng sa meralo e momahaneng, e phahameng haholo.
• tšepahala: Li bontša zero delamination esita le ka mor'a 1,500 mocheso cycles pakeng -40°C le 125°C.
• Phokotso ea litšenyehelo: Ho felisoa ha litlhare tse bitsang chelete e ngata tsa silevera le khauta ho theola litšenyehelo tsa tlhahiso.

Thick Film Ceramic PCB Design Guidelines for Optimal Performance

Khetho ea Substrate

Substrate ke e 'ngoe ea lintlha tsa bohlokoahali tsa ho rala Thick Film Ceramic PCB, kaha e ama ka kotloloho thepa ea PCB ea mocheso, motlakase le mochini. Khetho ea thepa ea substrate e lokela ho ipapisa le litlhoko tsa kopo:

• Meetso ea Maqhubu a Phahameng: Bakeng sa lits'ebetso tse kenyelletsang mats'oao a maqhubu a phahameng, joalo ka maqhubu a 5G le mmWave, Aluminium Nitride (AlN) ke eona substrate e ratoang. AlN e fana ka boemo bo tlaase ba dielectric (εᵣ = 8.8), e leng ho fokotsang tahlehelo ea matšoao haholo le ho matlafatsa botšepehi ba matšoao, e leng se etsang hore e be se loketseng bakeng sa lits'ebetso tsa RF (maqhubu a seea-le-moea) moo phetiso ea data e potlakileng le ho fokotseha ho tlase ho hlokahalang.
• Merero e sa tsotelleng litšenyehelo: Bakeng sa lisebelisoa tse sa hlokeng mocheso o phahameng oa mocheso oa AlN, Alumina (Al₂O₃) ke mokhoa o babatsehang. Alumina e sebelisoa haholo ka lebaka la ts'ebetso ea eona ea theko e tlaase le conductivity ea mocheso (20-25 W / mK). E fana ka ts'ebetso e lekaneng bakeng sa lits'ebetso tse ngata tse akaretsang 'me hangata e sebelisoa ha ho leka-lekanya ts'ebetso le litšenyehelo li le bohlokoa. Ho feta moo, li-conductor tsa silver-palladium (Ag-Pd) hangata li sebelisoa le Alumina bakeng sa ho theha mesaletsa e matla ea conductive.

Ntlafatso ea Moralo oa Layout

Sebopeho se sebetsang hantle sa trace se bohlokoa ho netefatsa phetiso ea mats'oao e tšepahalang le kabo ea matla. Lintlha tsa bohlokoa tse lokelang ho nahanoa molemong oa ho latela mohlala li kenyelletsa:

• Litsela tsa Matla: Bakeng sa lisebelisoa tsa morao-rao, bophara ba trace bo tlameha ho etsoa ho sebetsana le motlakase o lakatsehang ntle le ho futhumatsa ho feteletseng. Mohlala, mesaletsa ea matla e fihlang ho 10A e lokela ho ba le bophara ba bonyane ba 1.5mm, bo lekanang le koporo ea 0.5 oz. Sena se tiisa hore mesaletsa e ka tsamaisa maqhubu a phahameng ka mokhoa o sireletsehileng ha e ntse e boloka mocheso o tlase o nyoloha le ho fokotsa mathata a ka bang teng joalo ka ho baleha ha mocheso.
• Letšoao la Botšepehi: Botšepehi ba lets'oao la maqhubu a holimo bo bohlokoa bakeng sa ho netefatsa hore mats'oao ha a fokotsoe ke lerata, crosstalk, kapa impedance mismatch. Ho fihlela boleng bo nepahetseng ba lets'oao, ho tsamaisana le impedance ho bohlokoa. Mesaletsa e lekantsoeng ea TDR e netefatsa ho ts'oana ka nepo, ha ho ntse ho theha libaka tse arohaneng tsa analog le dijithale tse nang le meaho ea moat li thusa ho fokotsa tšusumetso ea lerata la dijithale mats'oao a bonolo a analog. Sena se tiisa ho sotha ha matšoao a fokolang le ho boloka ho nepahala ha phetiso ea matšoao, haholo-holo lits'ebetsong tse potlakileng haholo.

Tsamaiso ea Thermal

Taolo e sebetsang ea mocheso ke karolo ea bohlokoa ea ho rala Thick Film Ceramic PCBs, haholo ts'ebelisong ea matla a holimo le a maqhubu a holimo. Phallo e nepahetseng ea mocheso e tiisa nako e telele le ho tšepahala ha likarolo tsa PCB.

• Ka Arrays: PTH (Plated through Hole) vias tse tletseng silevera peista ke tharollo e sebetsang bakeng sa ho ntlafatsa ho qhala mocheso. Vias e nang le bophara ba 0.3mm e fana ka khanyetso e tlaase ea mocheso (ka tlase ho 1 ° C / W) le ho thusa ho fetisetsa mocheso ho tloha likarolong ho ea ho substrate, kahoo ho thibela ho chesa.
• Mocheso Spreader Kopanyo: Bakeng sa lits'ebetso moo PCB e hlokang ho senya mocheso o mongata, ho kopanngoa ha lisebelisoa tsa mocheso oa koporo kapa molybdenum (Cu/Mo) ho khothaletsoa. Lisebelisoa tsena li khona ho sebetsana le mocheso o fetang 500W/cm², ho netefatsa hore PCB e boloka mocheso o nepahetseng le tlas'a meroalo e boima ea mocheso. Ho tlamahanngoa ka ho toba ha li-spreaders tsena tsa mocheso ho substrate ea ceramic ho ntlafatsa phepelo ea mocheso ka kakaretso le ho thibela ho futhumala ha libaka, e leng ntho ea bohlokoa lits'ebetsong tse matla tse kang lisebelisoa tsa motlakase le lisebelisoa tsa likoloi.

Moralo oa Li-PCB tsa Thick Film Ceramic o hloka tlhokomelo e hlokolosi khethong ea substrate, moralo oa trace, le tsamaiso ea mocheso. Ka ho khetha thepa e loketseng (joalo ka AlN kapa Al₂O₃ ) bakeng sa lits'ebetso tse ikhethileng, ho ntlafatsa meralo ea trace bakeng sa botšepehi ba lets'oao le ts'ebetso ea matla, le ho kopanya mekhoa e tsoetseng pele ea taolo ea mocheso joalo ka li-vias tsa PTH le li-heat spreader, baenjiniere ba ka netefatsa hore li-PCB tsa ceramic tsa filimi e teteaneng li sebetsa ka mokhoa o tšepahalang libakeng tse hlokang tlhokomelo e ngata. Ebang ke bakeng sa lits'ebetso tsa maqhubu a phahameng, matla a phahameng, kapa tikoloho e feteletseng, ho khomarela litataiso tsena ho tla fella ka li-PCB tse sebetsang hantle le tse tšoarellang, tse itokiselitseng ho fihlela litlhoko tse thata ka ho fetisisa tsa elektroniki.

Likopo Hohle Liindasteri

Li-PCB tsa Thick Film Ceramic li sebelisoa liindastering tse fapaneng ka lebaka la matla a tsona le bokhoni ba ts'ebetso e phahameng:

• Kfz-Händler: Ka har'a li-inverters tsa koloi ea motlakase (EV) tse nang le 200A/cm² density hajoale le li-sensor tsa NOx tse sebetsang mochesong o fihlang ho 800°C.
• Aerospace: Ka li-module tsa radar transmitter/receiver (TR), e fanang ka ts'ebetso ea maqhubu a phahameng ka tahlehelo e tlase ea ho kenya.
• Industrial: Ka li-relay tsa marang-rang tse bohlale, tse fanang ka insulation ho fihla ho 10kV.
• Medical: Ho bakhanni ba MRI gradient, ho boloka ho hoholeha ha khanyetso ho ka tlase ho 1ppm/°C.

Thick Film vs. Ordinary Ceramic PCBs

Li-PCB tsa ceramic tse teteaneng li feta li-PCB tse tloaelehileng tsa ceramic ka likarolo tse 'maloa:

Tsebo ea Highleap ho Advanced PCB Manufacturing: Ho Nolofatsa Ts'ebetso ea Hao ea Theko.

Ho Highleap Electronic, re ikemiselitse ho fana ka li-PCB tsa boleng bo holimo tsa Thick Film Ceramic le mahlale a mang a tsoetseng pele a PCB a kopanang le lits'ebetso tse batloang haholo indastering. Ha re ntse re ipabola ka ho etsa PCB, sepheo sa rona ke ho fana ka litharollo tse sebetsang hantle, tse bolokang chelete e ngata, le tse tšepahalang tse tlosang ho rarahana ha mokhoa oa hau oa ho reka. Boitlamo ba rona ba boleng, boqapi, le khotsofalo ea bareki bo netefatsa hore u ka re tšepa ho sebetsana le litlhoko tsa hau ka hloko le ka nepo.

Hobaneng U Khetha Highleap bakeng sa Litlhoko tsa Hao tsa Tlhahiso ea PCB?

Bokhoni ba Lintho

Re lula re le ka pele ho tlhahiso ea PCB ka ho sebelisa mahlale a morao-rao a thepa. Ebang ke letoto la laminate® le ikhethang le nang le tahlehelo e tlase bakeng sa lits'ebetso tsa RF hybrid kapa liboto tsa Aluminium Nitride (AlN) tsa 6-layer tse nang le li-microvia tsa 0.15mm, re netefatsa hore thepa e sebelisitsoeng e etselitsoe litlhoko tse ikhethileng tsa merero ea hau. Khetho ea rona ea thepa e sebetsang hantle e tiisa ho tsamaisoa ha mocheso hantle, ts'ebetso ea maqhubu a phahameng, le ts'epo e ntlafalitsoeng bakeng sa lihlahisoa tsa hau tsa ho qetela.

Boitlamo ho Tiisetso ea Boleng

Boleng ke motheo oa tsohle tseo re li etsang ho Highleap Electronic. Re latela mekhoa e tiisitsoeng ea ISO 9001 ho netefatsa hore PCB e 'ngoe le e 'ngoe e kopana le maemo a holimo ka ho fetisisa a indasteri. Lisebelisoa tsa rona tsa Automated Optical Inspection (AOI) li fana ka ho nepahala ha 25 μm, ho netefatsa hore mohlala o mong le o mong, ka tsela, le karolo e behiloe ka nepo. Ho feta moo, re etsa liteko tse matla tsa lihora tse 48 tsa Highly Accelerated Stress Testing (HAST) tlas'a maemo a feteletseng a tikoloho (130°C, 85% mongobo) ho etsisa likhatello tsa sebele tsa lefats'e le ho netefatsa nako e telele. Ts'ebetso ena e matla ea tlhahlobo e u fa khotso ea kelello, ho tseba hore li-PCB tseo u li fumanang ke tsa boleng bo holimo.

R&D le Co-Design Support

Re utloisisa hore morero o mong le o mong o ikhethile, ke ka lebaka leo re fanang ka tšehetso e felletseng ea R&D. Sehlopha sa rona se hlomeletsoe ho sebelisana 'moho le lienjineri tsa hau ho fana ka lits'ebeletso tsa meralo e kopaneng bakeng sa li-module tsa moloko o latelang, ho kenyelletsa le tsa lits'ebetso tsa 100+ GHz mmWave. Ka ho sebetsa 'moho ho tloha mokhahlelong oa pele oa moralo, re etsa bonnete ba hore meralo ea hau ea PCB e ntlafalitsoe bakeng sa ts'ebetso, ho boloka litšenyehelo, le ho etsoa. Mokhoa ona o u bolokela nako le boiteko, ho fokotsa ho khutlela morao-rao ka tloaelo ho amehang ka mokhoa oa ho qapa.

Ho nolofatsa mokhoa oa hau oa ho reka

Ho Highleap, rea tseba hore nako ea hau e bohlokoa, ke ka lebaka leo re etsang hore mokhoa oa ho reka o be bonolo le o sebetsang ka hohle kamoo ho ka khonehang:

• Litharollo tsa ho Qetela: Ho tloha lipuisanong tsa pele tsa moralo ho isa kopanong ea ho qetela, re sebetsana le mohato o mong le o mong oa ts'ebetso ea tlhahiso ea PCB, ho netefatsa boiphihlelo bo se nang moeli.
• Phano e nakong: Re utloisisa bohlokoa ba ho kopana le linako le ho sebetsa ka mafolofolo ho u fa linako tsa ho etella pele tse potlakileng le tse tšepahalang, ntle le ho beha boleng.
• Bokgoni ba Litšenyehelo: Ka mekhoa ea rona e tsoetseng pele ea tlhahiso le taolo e ntle ea phepelo ea phepelo, re fana ka li-PCB tsa boleng bo holimo ka litheko tsa tlholisano, ho u nolofalletsa ho lula kahare ho tekanyetso.

Tšepa Highleap Electronic bakeng sa Litlhoko tsa hau tsa PCB

Hore na o sebetsa ka meralo ea maqhubu a holimo a RF, lisebelisoa tsa elektroniki tsa likoloi, kapa lisebelisoa tsa bongaka, Highleap Electronic ke molekane oa hau eo u mo tšepang bakeng sa li-PCB tse tšepahalang le tse sebetsang hantle. Re tlosa ho rarahana ha mokhoa oa hau oa ho reka, ho u fa lihlahisoa tsa boleng bo holimo, linako tsa phetoho e potlakileng, le litharollo tse bolokang chelete e ngata, kaofela li tšehetsoa ke boitlamo ba rona bo sa thekeseleng ba ho sebetsa hantle.

A re sebetsaneng le lintlha ha o ntse o tsepamisitse maikutlo boqaping. Ikopanye le rona kajeno ho buisana ka projeke ea hau e latelang, le ho fumana hore na Highleap Electronic e ka nolofatsa ts'ebetso ea hau ea tlhahiso le ea theko ea PCB joang.

fihlela qeto e

Theknoloji ea Thick Film Ceramic PCB e koala lekhalo pakeng tsa liboto tsa potoloho tse hatisitsoeng tsa setso le li-circuits tse tsoetseng pele tse kopaneng, tse fanang ka ts'ebetso e ke keng ea lekanngoa maemong a boima. Ka bokhoni ba eona ba ho kopanya likarolo tse peli tse sebetsang le tse sa sebetseng, theknoloji ena e ikemiselitse ho bapala karolo ea bohlokoa nakong e tlang ea lisebelisoa tsa elektronike. Ka ho tseba thepa hantle, khatiso e nepahetseng, le taolo ea mocheso, baenjiniere ba ka fumana ts'ebetso e phahameng, ea ts'epahalo le ho baballa litšenyehelo liindastering tse fapaneng.

Ho Highleap Electronic, re kopanya lisebelisoa tse tsoetseng pele tsa DFM le lits'ebetso tse netefalitsoeng ke ISO ho fetola mehopolo ea hau hore e be lihlahisoa tse etelletseng pele indastering. Ikopanye le rona ho hlahloba hore na theknoloji ea PCB e teteaneng ea filimi e ka phahamisa moralo oa hau o latelang joang.