TU-933+ High-Speed PCB Material bakeng sa 100G/400G Backplanes & Networking
PCB e entsoeng ka lebelo le phahameng e nang le TU-933+ laminates. Superior Dk botsitso le tahlehelo e tlase ea ho kenya bakeng sa ho batla setsi sa data le lits'ebetso tsa telecom.
Tlhahiso ea PCB e Potlakileng bakeng sa Merero e Sebelisang TU-933+
Highleap Electronics e fana ka lits'ebeletso tsa tlhahiso ea PCB le kopano ea PCB bakeng sa merero ea boto ea potoloho ea lebelo le phahameng, RF, HDI, le multilayer. Mosebetsi oa rona oa tlhahiso o ipapisitse le moralo oa PCB o amohetsoeng, ho bokellana ha liboto, litlhoko tsa thepa, lipheo tsa impedance le litokomane tsa kopano.
TU-933+, eo hape e hlwailweng ka hara lelapa la thepa la ThunderClad 3+ ho tsoa ho Taiwan Union Technology Corporation (TUC), ke laminate e nang le tahlehelo e tlase haholo e sebediswang meralong ya PCB ya lebelo le phahameng le ya RF. TU-933+ ke lebitso la mantlha la laminate, mme TU-933P+ e le prepreg e tsamaellanang.
Merero ea PCB e amanang le thepa ena e ka kenyelletsa:
- Lifofane tsa morao tse lebelo le phahameng le liboto tsa k'homphieutha
- Li-PCB tsa seva, polokelo le likarete tsa mohala
- Liboto tsa potoloho tsa Telecom le tsa seteishene sa motheo
- Lisebelisoa tsa RF le phetisetso ea matšoao
- Meralo ea PCB ea mekhahlelo e mengata e nang le maemo a holimo
Bakeng sa merero ena, Highleap Electronics e shebana le ditlhoko tsa boemo ba PCB tse kang kaho ya mekgahlelo e mengata, impedance e laolwang, ka meralo, ngodiso ya mekgahlelo, ho tjheka, dikarolo tsa koporo, qetello ya bokahodimo, le kopano ya PCB. Thepa ya thepa le meaho e fumanehang di lokela ho netefatswa kgahlanong le ditokomane tsa hajwale tse fanweng ke moetsi wa thepa.
Litšebeletso tsa rona tsa tlhahiso ea PCB li boetse li akaretsa merero e sebelisang litsamaiso tse ling tse amohetsoeng tsa laminate tse nang le tahlehelo e tlase le tse potlakileng, ho kenyeletsoa TU-883 , TU-872 SLK , thepa e khethehileng e nang le tahlehelo e tlase , le thepa ea Taconic.
Litlhaloso tsa Tekheniki tsa TU-933+ Laminate
| Property | latela boleng ba | Boemo/ Mokgoa |
|---|---|---|
| Tg (DMA) | 220 ° C | E-2/105 |
| Tg (TMA) | 170 ° C | E-2/105 |
| Td (TGA) | 390 ° C | E-2/105 |
| CTE (x/y) | 12/13 ppm/°C | Ambient ho Tg |
| CTE z-axis (α1) | 35 ppm/°C | Pele ho Tg |
| CTE z-axis (α2) | 240 ppm/°C | Post-Tg |
| CTE z-axis (%) | 2.5% | 50 ho 260 ° C |
| Khatello ea Mocheso (288°C) | > 120 metsotsoana | Solder Float |
| T260 / T288 / T300 | > 60 mets (e 'ngoe le e 'ngoe) | E-2/105 |
| Ho tsuba | EA-94V-0 | E-24/125 |
| Tumello (Dk) | 3.08 @ 10 GHz | Mokhoa oa SPC (RC70%) |
| Ketsiso Dr | 2.54 | Ketsiso ea Impedance |
| Tahlehelo Tangent (Df) | 0.0020 @ 10 GHz | Mokhoa oa SPC |
| Ho hanyetsa Molumo | > 10¹⁰ MΩ·cm | C-96/35/90 |
| Resistivity ea bokaholimo | > 10⁸ MΩ | C-96/35/90 |
| Matla a Motlakase | > 40 kV/mm | A |
| Karohano ea Dielectric | > 50 kV | A |
| Modulus ea Bacha | 23 GPa (Warp), 21 GPa (Tlatsa) | A |
| Matla a Flexural | > 60,000 psi (L) / >50,000 psi (W) | A |
| Matla a Peel (1 oz Cu) | 4–7 lb/in | A |
| Ho monya mongobo | 0.06% | E-1/105 + D-24/23 |
HLOKOMELA
- Boleng ba tekheniki bo kaholimo bo fanoe bakeng sa litšupiso tse akaretsang tsa boenjiniere ba PCB. Litlhoko tsa ho qetela tsa kaho le tlhahiso ea PCB li lokela ho netefatsoa ho latela moralo o amohetsoeng, pokello, le litokomane tsa projeke tse sebetsang.
- TU-933+ (ThunderClad 3+) ke sehlahisoa sa laminate se tsoang Taiwan Union Technology Corporation (TUC). Highleap Electronics e etsa le ho kopanya li-PCB 'me ha e hlahise laminate ea TU-933+.
- Highleap Electronics e fana ka tšehetso ea boenjiniere le tlhahiso ea boemo ba PCB, ho kenyeletsoa tlhahlobo ea DFM, tlhahlobo ea ho bokellana ha mekhahlelo e mengata, tlhahlobo ea thibelo e laoloang, moralo oa tlhahiso, kopano ea PCB, tlhahlobo le liteko.
Bakeng sa merero ea TU-933+ PCB, tšehetso ea rona e kenyelletsa:
- Tlhahlobo ea PCB ea lebelo le phahameng le tahlehelo e tlase
- Litlhoko tsa ho thibela ho laoloa le ho tsamaisa matshwao
- Tlhahiso ea mekhahlelo e mengata, HDI, le e rarahaneng ka sebopeho
- Kopano, tlhahlobo le liteko tsa SMT/THT
- Khotheishene ea tlhahiso ea PCB ea mohlala le bophahamo ba modumo
Ikopanye le Highleap Electronics bakeng sa tlhahlobo le khotheishene ea tlhahiso ea PCB.
Hobaneng ha Lienjiniere li Khetha TU-933+ bakeng sa Merero ea PCB e Phahameng ka ho Fetisisa, e Tahlehelo e tlase
Ha re ntse re tšehetsa mefuta eohle ea li-substrates tsa PCB, hangata re khothaletsa TU-933+ laminates bakeng sa bareki ba sebetsang ka matshwao a lebelo le phahameng, haholo-holo ba ralang li-bandwidth tsa 10G, 25G, kapa 56G.
Likarolo tsa bohlokoa tsa TU-933+ li kenyelletsa:
- Dk 3.08 ±2%, Df 0.0020 @ 10 GHz - e loketse ho boloka botsitso ba matšoao
- Katoloso e tlase ea z-axis - e netefatsa li-vias tse tšepahalang ho li-stackups tsa multilayer
- Khanyetso e phahameng ea CAF - e ts'ehetsa ho ts'epahala ha nako e telele libakeng tse thata
- E lumellana le mekhoa e tloaelehileng ea lamination - ho thusa ho fokotsa litšenyehelo
Matlotlo ana a etsa hore TU-933+ e be mokhoa o theko e tlaase ho feta thepa ea premium e phahameng joalo ka MEGTRON6 kapa laminate ea hydrocarbon e nang le tahlehelo e tlase bakeng sa lits'ebetso tse ngata tsa telecom, datacom, server, le liindasteri tsa RF.
Ho Highleap, re fana ka boeletsi ba mahala mme re thusa bareki ho etsa qeto ea hore na TU-933+ kapa thepa e 'ngoe ke eona e ba loketseng hantle bakeng sa ts'ebetso ea bona, litšenyehelo, le litlhoko tsa tlhahiso.
Popo ea PCB e Potlakileng le Kopano ho tloha ho Prototype ho ea ho Tlhahiso
Highleap Electronics e fana ka lits'ebeletso tsa tlhahiso ea PCB le kopano ea PCB bakeng sa merero ea lebelo le phahameng, tahlehelo e tlase, HDI, le e rarahaneng ea mekhahlelo e mengata, ho kenyeletsoa meralo ea PCB e kenyeletsang TU-933+ le litsamaiso tse ling tse amohetsoeng tsa laminate. Sepheo sa rona ke ho fetolela li-stack-up tse amohetsoeng, litlhoko tsa impedance, data ea tlhahiso le litokomane tsa kopano ts'ebetsong ea tlhahiso e laoloang.
Bakeng sa meralo ea PCB e nang le mekhahlelo e mengata le e potlakileng, litlhoko tsa tlhahiso le kopano li ka hlahlojoa hammoho ho ntlafatsa tšebelisano lipakeng tsa boto e se nang letho le PCBA ea ho qetela.
- Tlhahiso ea PCB e laoloang ka impedance le e fapaneng
- Ts'ebetso ea HDI ka li-microvia, ka har'a pad, le meaho e hoketsoeng ka har'a plug
- Ho bokellana ha li-stack-up tse rarahaneng tsa mekhahlelo e mengata le tlhahiso ea PCB ea mekhahlelo e mengata
- ENIG, ENEPIG, khauta e thata, OSP, le liphetho tse ling tse boletsoeng tsa bokaholimo
- Kopano ea SMT/THT bakeng sa BGA, QFN, fine-pitch, le liphutheloana tse ling tsa likarolo
- AOI, X-ray, tlhahlobo ea sefofane, tlhahlobo ea motlakase le liteko tse sebetsang
Ho tloha tlhahlobong ea boenjiniere le meaho ea mehlala ho ea ho tlhahiso le kopano ea li-PCB tsa bophahamo, Highleap Electronics e tšehetsa merero moo botšepehi ba matšoao, kaho ea mekhahlelo e mengata, taolo ea ts'ebetso le botsitso ba tlhahiso li leng bohlokoa.
Haeba projeke ea hau e kenyelletsa TU-933+, laminate e 'ngoe e nang le tahlehelo e tlase, kapa kaho ea FR-4 e tloaelehileng, re romelle lifaele tsa hau tsa Gerber, li-stack-up, BOM, le litlhoko tsa kopano bakeng sa tlhahlobo ea tlhahiso le khotheishene.
Ikopanye le Highleap Electronics bakeng sa projeke ea hau ea tlhahiso le kopano ea PCB e potlakileng.