Hobaneng Li-PCB tse 16 tsa Layer li le Bohlokoa bakeng sa Meralo e tsoetseng pele ea elektroniki

PCB ea lera tse 16 e lokela ho tšoaroa e le kaho e laoloang ea lera le lengata, eseng feela boto e nang le palo e phahameng ea lera. Bakeng sa litsamaiso tse tsoetseng pele tsa taolo, likhokahano tsa mohala, lisebelisoa tsa bongaka, le lihlahisoa tse ling tse nang le bongata bo phahameng, Highleap Electronics e hlahloba symmetry ea stackup, lipheo tsa impedance, sebaka sa dielectric, ka karolelano ea aspect, copper balance, litlhoko tsa backdrill, le bopaki ba tlhahlobo pele ho tlhahiso; likhetho tse amanang le ts'ebetso li koahetsoe ts'ebetsong ea tlhahiso ea PCB le tataisong ea PCB ea lera tse 10.

Ho utloisisa 16 Layer PCB

PCB ea lera le 16 e entsoe ka li-PCB tse ngata tse kopantsoeng hammoho. Ka hona, litlhoko tsa ho tloha lesobeng ho ea ho mola li thata haholo bakeng sa mamello ea maemo a masoba le mamello ea ho hokahanya mahlakore a fapaneng, kahoo boholo bona ba masoba le mamello li bohlokoa haholo bakeng sa ho laola ho rarahana le ho ba le boima bo phahameng ba meralo ea sejoale-joale ea elektroniki. Sehlopha se tloaelehileng sa PCB sa lera le 16 se kenyelletsa mekhahlelo e mengata ea ho tsamaisa, matla le mobu, kaofela li behiloe ka hloko ho netefatsa ts'ebetso e ntle ea motlakase, taolo ea mocheso le bokhoni ba ho e etsa. Joaloka mofani ea ka sehloohong oa lits'ebeletso tsa tlhahiso ea PCB ea lera le 16 , Highleap Electronic e fana ka litharollo tse holimo-limo tsa mekhahlelo bakeng sa lits'ebetso tse rarahaneng, tse potlakileng le tse nang le boima bo phahameng.

Sebopeho le Lisebelisoa

Kaho ea 16 layers PCBs e kenyelletsa lisebelisoa tsa boleng bo holimo, tse se nang halogen joalo ka aluminium, CEM, le FR. Likarolo tsa bohlokoa li kenyelletsa:

• • Prepreg Sheets: Lesela la fiberglass le koahetsoeng ka resin, le sebetsa e le lisebelisoa tse sireletsang pakeng tsa masela a koporo. Prepreg e netefatsa ho kenella ka nepo le ho fokotsa tšitiso ea matšoao.
  • Copper Foil Sheets: Lipampiri tsena li sebetsa e le lisebelisoa tsa mantlha tsa conductive, tse tsamaisang phetiso ea lets'oao le kabo ea matla ho pholletsa le PCB.
  • Lipampiri tsa Laminate: Tsena li fana ka substrate bakeng sa ho kopanya likarolo tsa koporo, ho kenya letsoho haholo ts'ebetsong le ts'ebetsong ea PCB.

Botenya ba boto bo ka atoloha ho fihla ho 8 mm, ka boholo bo phahameng ka ho fetisisa bo felileng ba 500 x 500 mm, e leng se fanang ka sebaka se lekaneng bakeng sa potoloho e rarahaneng le likarolo tse ngata. Ho kgothaletswa ho sebedisa thepa e betere ya PCB bakeng sa di-PCB tse phahameng, mme o se ke wa nahana feela ka theko mme wa hlokomoloha boleng ba ho qetela ba sehlahiswa. Kgetho ya thepa e ka bonwa: Disebediswa tsa substrate tsa PCB.

Melemo ea 16 Layer PCB Manufacturing

16 layer PCB e fana ka melemo e mengata e etsang hore e be khetho e ratoang bakeng sa lits'ebetso tse sebetsang hantle:

1. • Khokahano e Holimo-kholo (HDI): E tšehetsa tse rarahaneng meralo ea elektronike, e etsa hore e be e loketseng bakeng sa lits'ebetso tse tsoetseng pele tse hlokang mekhahlelo e mengata ea ho tsamaisa matšoao.
   • Botšepehi bo Phahameng ba Letšoao: Ho tsamaisa mats'oao ka nepo ho fokotsa tahlehelo ea mats'oao le tšitiso ea motlakase, ho netefatsa ts'ebetso e tšepahalang.
   • Ts'ebetso e Ntlafetseng: E amohela likarolo tse ling le potoloho ka har'a moralo o kopaneng, e ntlafatsang ts'ebetso ea sesebelisoa.
   • Bokgoni ba Sebaka: E fokotsa boholo ba lisebelisoa tsa elektroniki, e etsa hore e tšoanelehe bakeng sa lits'ebetso tse haelloang ke sebaka.
   • Moralo o bobebe: Ka ho tlosa likhokahano bakeng sa li-PCB tse arohaneng, liboto tsa mekato e 16 li kenya letsoho moahong o bobebe oa sesebelisoa.
   • Ho tsitsa ho eketsehileng: Mekhahlelo e mengata ea li-insulation le lisebelisoa tsa ho kopanya li matlafatsa matla le bophelo bo bolelele ba PCB.

Lisebelisoa tsa 16 Layer PCBs

Bokhoni bo tsoetseng pele ba li-PCB tse 16 li etsa hore e be tsa bohlokoa haholo liindastering tse ngata. Lisebelisoa tse tsebahalang li kenyelletsa:

• • Tsamaiso ea Satellite
  • Bolaoli ba Indasteri
  • Theknoloji ea GPS
  • puisano
  • Tsamaiso ea k'homphieutha
  • Thepa ea Bongaka
  • Helmets Test
  • Meteorological Systems
  • Mekhoa ea ho Lemoha Nyutlelie
  • Li-accelerator tsa Atomic

Litaelo tsa Moralo oa Lera bakeng sa 16-Layer PCBs

Moralo o sebetsang oa lera o bohlokoa bakeng sa ho ntlafatsa ts'ebetso ea li-PCB tse 16. Kabo ea li-symmetric tsa lihlopha ke ntho ea bohlokoa, ho li arola ka ho lekana pakeng tsa holimo le tlase ho thibela ho loana le ho netefatsa hore ho na le symmetry. Phatlalatso le kabo ea matla li lokela ho ajoa ka hloko, bonyane 20% ea likarolo tse inehetseng ho e 'ngoe le e' ngoe, e siea 60% e setseng bakeng sa matšoao. Impedans e laoloang e ka finyelloa ka ho beha likarolo tsa fatše le matla haufi le likarolo tsa matšoao, tse thusang ho arohana.

Ho phaella moo, ho fokotsa mocheso ho ntlafatsoa ka ho beha likarolo tsa fatše likarolong tse ka ntle tsa boto, ho nolofatsa tsela e bonolo. Lifofane tsa fatše tse sa sitisoeng li bohlokoa, kahoo ho khothaletsoa ho abela mokato o felletseng oa sefofane lehlakoreng le leng le le leng le bapileng le likarolo tsa matšoao. Lifofane tse arohaneng tsa motlakase li lokela ho hlalosoa ho arola libaka tse fapaneng tsa matla joalo ka analoge, dijithale le tse phahameng hona joale. Qetellong, likarolo tsa matšoao li lokela ho laeloa bakeng sa lihlopha tse ntlafalitsoeng ho latela litlhoko tse khethehileng tsa lebelo le phahameng, RF, kapa likarolo tse ikhethileng tsa sistimi.

Lintlha tsa Moqapi oa Bohlokoa bakeng sa li-PCB tsa 16-Layer

Ha u rala 16 layer PCB, lintlha tse 'maloa tsa bohlokoa li tlameha ho nahanoa:

• • Ka Theknoloji: Li-microvias tse entsoeng ka laser tse nang le masoba a ka bang 0.2mm li lumella likhokahano tse teteaneng pakeng tsa lihlopha. Ho kgutlela morao e hlakola likarolo tse sa sebelisoeng tsa vias.
  • Litsela tsa Tsela: Li-dielectrics tse tšesaane joalo ka 0.008 ″ li-prepreg lipakeng tsa mekhahlelo li fana ka liteishene tse lekaneng tsa ho latela mohlala.
  • Impedans e Laolang: Likarolo tse ka tlas'a lefatše le tsa matla tse bapileng le likarolo tsa matšoao li lumella taolo ea impedance bakeng sa mesaletsa ya lebelo le phahameng.
  • Ho theoha: Lipara tse ngata tse nang le matla a marang-rang tse phatlalalitsoeng ho pholletsa le mekhahlelo li fana ka phihlello ea li-capacitor tsa decoupling.
  • Tsamaiso ea Thermal: Thermal reliefs le thermal core layers thusa ho tsamaisa mocheso hole le likarolo tse ka hare.
  • Letšoao la Botšepehi: Latela litataiso tsa ho nyallana ha bolelele, tokiso, le litataiso bakeng sa mesaletsa ea lebelo le holimo.
  • Boikemisetso ba ho etsa: Sebetsa haufi-ufi le moetsi oa lihlahisoa pele ho nako ho hlahloba moralo bakeng sa manufacturability (DFM), tšebeliso ea liphanele, le mamello ea tlhahiso.

Mokhoa o laolehileng oa hlokahala ha ho raloa meralo e rarahaneng ea mekato e 16, ka tšebelisano e haufi le moetsi oa PCB ho netefatsa tlhahiso.

Litlhaloso tsa Boqapi le Teko

Nakong ea ho etsoa le ho lekoa ha mapolanka a mekato e 16, lintlha tse latelang li bohlokoa:

• • Ho Nepaha ha Ngoliso: Ho etsa bonnete ba hore masoba a phuntsoeng a tsamaisana le liphaephe ho pholletsa le mekato e 16 ha o bokellana.
  • Ho tsamaisana le Lera: Khokahano e nepahetseng holim'a liboto tse kholo tsa boholo bo tloaelehileng ba li-PCB tsa palo e phahameng.
  • Ho Felloa ke Mocheso: Phallo e tšoanang ea mocheso ho pholletsa le stackup ea multilayer e hloka ts'ebetso e hlokolosi nakong ea lamination.
  • Plating Quality: Taolo e tiileng ea boleng ba plating le profiles tsa lebota la lesoba bakeng sa likhokahano tse tšepahalang tsa li-interlayer.
  • Teko ea Motlakase: Ts'ebetso e pharalletseng ea tlhahlobo ea motlakase ka lebaka la palo e phahameng ea li-node ho liboto tse kholo tsa multilayer.
  • Teko e Tsoetseng Pele: Taolo ea impedance, botšepehi ba matšoao, le tlhahlobo ea ts'ebetso ea RF e hloka lisebelisoa tsa tlhahlobo tse tsoetseng pele.

Setsi sa maqiti se tlameha ho ba le boiphihlelo bo netefalitsoeng ba ho etsa li-PCB tse rarahaneng tsa maemo a holimo ka mokhoa o atlehileng. Setsi sa tlhahiso se tlameha ho ba le boiphihlelo bo netefalitsoeng ba ho etsa li-PCB tse nang le mekhahlelo e mengata ka mokhoa o baballang chelete. Bakeng sa mofuta ona oa PCB e rarahaneng ea li-multi-layer, ho kgothaletswa ho etsa taolo ea mamello holim'a likoti le mamello ea boemo ba lesoba. Haholo-holo, mamello ea likoti tsa crimping e lokela ho laoloa ka thata haholoanyane. Moetsi o lokela ho hopotsoa ka mamello ena.

Litlhahiso Ha U Odara

Ho netefatsa tlhahiso e atlehileng ea li-PCB tse 16, nahana ka likhothaletso tse latelang:

• • Ea nang le boiphihlelo Fabricator: Selekane le moetsi oa thepa ea nang le boiphihlelo ho aheng li-PCB tse 16+.
  • Tlhahlobo ea pele ho DFM: Kopa tlhahlobo ea pele ho DFM pele u phethela pokello ea lera.
  • Prototyping: E-ba le li-prototypes tse potlakileng tse entsoeng ho netefatsa moralo le ts'ebetso pele u etsa tlhahiso.
  • Kutloisiso ea Bokhoni: Utloisisa bokhoni ba moetsi mabapi le mamello ea lera, boholo ba masoba, litlhaloso tsa mela/sebaka, jj.
  • Ho netefatsoa ha Botšepehi ba Mocheso le Lipontšo: Buisanang ka moralo ofe kapa ofe oa mocheso le litlhoko tsa netefatso ea matšoao.
  • Tlhahlobo ea Phatlalatso ea Tlhahlobo: Lekola litlhoko tsa tšireletso ea liteko, ho kenyeletsoa tlhahlobo ea motlakase ea boto e se nang letho, tlhahlobo ea lipatlisiso tse fofang, le tlhahlobo ea in-circuit (ICT).
  • Ntlafatso ea Panel: Fumana likhothaletso bakeng sa boholo bo nepahetseng ba phanele, sebopeho, le ho phatloha.

fihlela qeto e

Leano le reriloeng hantle la li-stackup le bohlokoa bakeng sa ho sebelisa meaho ea thekiso ea matlo le meaho e fumanehang ka meralo ea meralo e 16. Tatelano ea lera e tlameha ho leka-lekanya litlhoko tsa ho tsamaisa mats'oao, kabo ea matla, pheliso ea mocheso, le lithibelo tsa tlhahiso. Mokhoa oa tšebelisano lipakeng tsa moqapi le moetsi oa thepa o netefatsa pokello e sebetsang e ntlafalitsoeng bakeng sa litšenyehelo, boleng le ts'ebetso. Litlhahlobo tse matla tsa moralo le liteko li tla netefatsa ts'ebetsong e rarahaneng ea li-multilayer pele ho tlhahiso ea molumo.

Bakeng sa litsebi tsa theko ea thepa, ho bohlokoa ho utloisisa ho rarahana ha li-PCB tse 16-layer. Highleap Electronic e hlahella e le moetsi ea ka sehloohong, ea fanang ka boleng ba boemo bo holimo le ho nepahala ha tlhahiso ea 16 ea PCB. Ikopanye le rona kajeno ho buisana ka litlhoko tsa projeke ea hau le ho utloa phapang ea Highleap Electronic.