Litšebeletso tsa Tlhahiso ea PCB ea Khalase ea Borosilicate

Li-PCB tsa khalase ea borosilicate ke liboto tsa potoloho tse entsoeng ka mokhoa o nepahetseng tse hahiloeng holim'a li-substrate tsa khalase ea borosilicate, tse nkoang e le tsa boleng bo botle ka lebaka la botsitso ba tsona ba boholo bo itseng, ponaletso ea mahlo, tahlehelo e tlase ea dielectric, le ts'ebetso e tšepahalang ea mocheso. Liboto tsena li sebelisoa haholo lipotolohong tsa RF, radar ea likoloi, lisebelisoa tsa elektroniki tse bonaletsang, le liphutheloana tsa IC tsa mantlha tsa khalase. Merero e atlehileng e hloka tlhahlobo e hlokolosi ea ts'ebeliso, khetho ea thepa, tlhahlobo ea DFM, le netefatso ea sebopeho ho netefatsa hore tlhahiso le ts'ebetso lia khoneha. Ho hokahanya ha boenjiniere ba pele ho bohlokoa hobane li-substrate tsa khalase li itšoara ka tsela e fapaneng le FR-4, ka mamello e thata bakeng sa ho ba bataletseng, ka ho beha, le katoloso ea mocheso.

Fumana Khoutu ea PCB ea Khalase ea Borosilicate

Kakaretso le Melemo ea Li-PCB tsa Khalase tsa Borosilicate

Khalase ea borosilicate e na le ~70–80% SiO₂ le 10–15% B₂O₃, e leng se e fang katoloso e tlase ea mocheso, khanyetso e phahameng ea ho thothomela ha mocheso, le tahlehelo e tlase ea dielectric. Borosilicate ea sehlopha sa PCB e etsoa ka mamello e tiileng (botenya ba ±0.01 mm, ho ba bataletse Ra <0.5 µm) le botenya bo fokolang ba sekoli. Botenya bo tloaelehileng bo tloha ho 0.3 mm ho isa ho 3 mm, ka likhetho tse tšesaane haholo ho fihlela ho 0.1–0.2 mm ho sebelisoa tšehetso ea carrier, le liphanele tse teteaneng (4–6 mm) bakeng sa lits'ebetso tsa LED kapa tsa sebopeho.

• CTE e tšoana hantle le silicon (~3.3 ppm/°C vs 2.6 ppm/°C), e fokotsa khatello ea solder le ho ntlafatsa ts'epo ho liphutheloana tsa khalase ea mantlha ea IC.
• Tahlehelo e tlase ea dielectric (Df ~0.004–0.010 ho pholletsa le 1–77 GHz), e loketse meralo ea impedance e laoloang ke maqhubu a phahameng, li-array tse arotsoeng ka mekhahlelo, le lits'ebetso tsa mmWave.
• Botsitso ba litekanyo le ho ba bataletse ho lumella mokhoa o nepahetseng oa ho tsamaisa le ho etsa liphutheloana, e leng tsa bohlokoa bakeng sa lipotoloho tsa khalase tse nang le mekhahlelo e mengata le meralo ea li-interposer tse nang le bongata bo phahameng.
• Ho monya mongobo ho se be teng ho ntlafatsa ts'epo ea nako e telele libakeng tsa lifofane, tsa likoloi le tsa indasteri.
• Ponaletso ea optical (leseli le bonahalang la 91–93%) e nolofalletsa ho kopanngoa ha lisebelisoa tsa elektroniki tse bonaletsang, li-sensor le li-LED arrays.

Ha ho bapisoa le liboto tsa FR-4, li-PCB tsa khalase tsa borosilicate li hloka mehato e khethehileng ea tlhahiso: e thehiloeng ho laser ka sebopeho bakeng sa likhokahano tse otlolohileng, metallization ea PVD bakeng sa ho beoa ha koporo e kopantseng, le patterning ea photolithographic bakeng sa li-geometri tse ntle haholo. Mekhoa ena e netefatsa ts'ebetso e nepahetseng ea motlakase le ea mechini ha e ntse e nolofalletsa meralo e tsoetseng pele ea potoloho.

Litšobotsi tsa Motlakase le Thermal

Khalase ea borosilicate e boloka thepa ea motlakase e tsitsitseng maemong a maqhubu a pharaletseng. Sephetho sa dielectric (Dk) se tloha ho 4.55 ho 1 GHz ho isa ho 4.47 ho 77 GHz, ka ntlha e tlase ea ho qhala (Df) ea ~0.004–0.010, e leng se etsang hore e be e loketseng bakeng sa lipotoloho tsa dijithale tsa RF, 5G mmWave, le lebelo le phahameng. Phapang e nyane ea Drk e nolofatsa moralo oa impedance o laoloang le ho fokotsa ho sotha ha lets'oao.

Thepa ea mocheso e kenyelletsa:

• Ho bapisa CTE: E fokotsa khatello ea mocheso bakeng sa li-flip-chip le lipotoloho tsa setaele sa sephutheloana, e tšehetsa li-bump pitches tsa 50–100 μm. E netefatsa ts'epo ea nako e telele ea li-solder joint radar ea likoloi le liphutheloana tsa IC tse nang le maqhubu a phahameng.
• Thermal shock resistance: E tsitsitse ho tloha ho -40°C ho isa ho +500°C, e loketse lits'ebetso tsa likoloi, tsa lifofane, tsa indasteri le tsa likepe moo ho etsahalang potoloho e potlakileng ea mocheso.
• Thermal conductivity: ~1.2 W/m·K, e lekane bakeng sa ho qhala mocheso ka tekanyo ho li-LED, li-module tsa RF, le likopano tse nyane tsa liphutheloana. Litekanyetso tsa mocheso le tlhahlobo ea matla a motlakase li ka ntlafatsa sebopeho bakeng sa ts'ebetso e tsitsitseng.

Moralo oa motlakase o tlameha ho nahana ka bophara ba mohlala, botenya ba lera, ka capacitance, le leano la khokahano e otlolohileng ho boloka impedance, botšepehi ba lets'oao, le tsamaiso ea mocheso. Tlhahlobo ea DFM e netefatsa hore liparamente tsena li netefatsoa esale pele, e supa bokhoni ba tlhahiso ea PCB ea khalase.

Thepa ea Mekaniki, ea Mahlo le ea Lik'hemik'hale

Li-PCB tsa khalase ea borosilicate li fana ka motsoako oa ho tiea, ho pepeseha ha mahlo le ho hanyetsa lik'hemik'hale:

• Botsitso ba mochini: E tiile, e bataletse, 'me e tsitsitse ka boholo; mehato ea ho sebetsana le ntlha le sekhutlo ea hlokahala ho thibela ho petsoha kapa ho petsoha. Ho ngola ka laser kapa ho seha ka botebo bo felletseng hangata ho sebelisoa bakeng sa ho nyenyefatsa.
• Tshebetso Optical: Phetiso e bonahalang ea 91–93%, 91–95% e haufi le IR, e loketse lisebelisoa tsa elektroniki tse bonaletsang, li-sensor tsa mahlo le liphanele tsa LED. Sena se lumella ho kopanngoa ha libaka tsa mahlo ntle le ho beha tsela ea motlakase kotsing.
• Ho hanyetsa lik'hemik'hale: Sehlopha sa Hydrolytic 1 (ISO 719), se hanela li-acid, li-base, li-solvents le lisebelisoa tse tloaelehileng tsa ho hloekisa. Se tšehetsa lipente tse kobehileng, li-encapsulants le likhomaretsi bakeng sa lits'ebetso tsa kantle le tikoloho e thata.
• Matla a holimo: Matla a holimo a eketsa ho khomarela ha lifilimi tsa tšepe tsa PVD, li-photoresist le li-coat tse nang le sebopeho sa 'mele. Kalafo ea plasma e ka ntlafatsa ts'ebetso ea bokaholimo haholo.

Litšobotsi tsena tsa mechine, tsa mahlo le tsa lik'hemik'hale li lumella ho tsamaisa motlakase ka bongata bo boholo, ho beha mapheo ka nepo, le ho kopanya likarolo tsa mocheso kapa tsa mahlo, ha li ntse li boloka botšepehi ba nako e telele libakeng tse thata.

Moralo, Bokhoni ba ho Etsa, le Lintho Tse Loketseng ho Etsoa

Tlhahlobo ea DFM e bohlokoa ho netefatsa hore meralo ea PCB ea borosilicate e ka etsoa. ​​Khalase e itšoara ka tsela e fapaneng le ea FR-4: e robeha habonolo, e tsitsitse ka boholo, 'me e na le kutloelo-bohloko likhatellong tsa bohale. Lintlha tsa bohlokoa li kenyelletsa:

• Ka ho beha, bophara, le moralo oa khokahano e otlolohileng, ho supa khalase e phunyeletsang ka litlhoko
• Bophara ba ho latela, sebaka, le lipheo tse laoloang tsa impedance, tsa bohlokoa bakeng sa meralo ea maqhubu a phahameng le ea RF
• Jeometri ea Pad, ho leka-lekana ha lera, le kabo ea koporo ho fokotsa ho warpage le khatello ea mechine
• Ho tlosa mathoko, ho seha, le ho sebetsana le substrate bakeng sa ho singulation ea laser kapa boleng ba mathoko a optical
• Libaka tsa mahlo, ponaletso, le lithibelo tsa kopano ho qoba ho se lumellane hantle le ho boloka botsitso

Tlhahlobo ea pele ea DFM e netefatsa hore li-prototype kapa tlhahiso ea sehlopha se senyenyane li fihlela litlhoko tsa motlakase, tsa mechini le tsa mocheso. Maikutlo a tsoang tlhahlobong ena a tataisa liphetoho tsa sebopeho, moralo oa li-pad, le khetho ea ts'ebetso bakeng sa chai e tsitsitseng.

Likopo le Moralo oa Tlhahiso

Li-PCB tsa khalase ea borosilicate li khethoa bakeng sa merero e hlokang ts'ebetso ea motlakase, botsitso ba mocheso, kapa ponaletso:

• Li-module tsa RF tsa 5G mmWave, li-antenna tsa mekhahlelo, le litsamaiso tsa AiP tse hlokang taolo e nepahetseng ea impedance
• Disekete tsa radar tsa dikoloi (77 GHz) le di-module tse nyane tsa sensor
• Liphutheloana tsa IC tsa mantlha ea khalase bakeng sa kopanyo ea flip-chip e nang le molumo o motle
• Liphanele tsa LED tse bonaletsang le lisebelisoa tsa elektroniki tse utloang mahlo
• Lisebelisoa tsa elektroniki tse thata tikolohong: lifofane, likepe, oli le khase, litsamaiso tsa indasteri tse nang le mocheso o phahameng
• Lisebelisoa tsa biosensor tsa mahlo le lisebelisoa tsa laboratori tse hlokang botsitso ba lik'hemik'hale le ho lumellana ha sterilization

Moralo oa tlhahiso o kopanya tlhahlobo ea mehlala, ho itokisetsa kopano, le tlhahiso e pheta-phetoang. Qetello ea bokaholimo, ho beha mapheo, ka ho tlatsa, le tšireletso ea moeli li ntlafalitsoe nakong ea tlhahlobo ea pele ea boenjiniere. Baqapi ba ka romella lifaele ka leqephe la khotheishene bakeng sa maikutlo a qaqileng a ho etsa, ho netefatsa hore projeke e lumellana le lithibelo tsa thepa le tsa ts'ebetso.