Moralo oa PCB oa Boto ea ho Chesa bakeng sa Teko ea Tšepo

Selelekela

Burn-in Board PCB ke sethala sa tlhahlobo sa bohlokoa se sebelisoang tlhahlobong ea ho ts'epahala ha semiconductor, se etselitsoeng ho mamella maemo a nako e telele a mocheso le moroalo o phahameng nakong ea tlhahlobo ea ho chesa. Liboto tsena tse khethehileng tsa potoloho li thusa bahlahisi ho tseba ho hloleha ha bophelo ba pele ho lipotoloho tse kopaneng ka ho li beha tlas'a maemo a khatello ea maikutlo a potlakileng a etsisang lilemo tsa ts'ebetso e tloaelehileng.

Nakong ea tlhahlobo ea ho chesoa, li-chips li sebetsa khafetsa mochesong o phahameng ha li ntse li le tlas'a mojaro o felletseng oa motlakase, li senola mefokolo e ka bang teng pele lisebelisoa li fihla ho bareki ba ho qetela. Sengoliloeng sena se hlahloba lintlha tsa bohlokoa tsa moralo, litlhoko tsa thepa, le litekanyetso tsa tlhahiso tse netefatsang hore Burn-in Board PCBs e fana ka liphetho tse nepahetseng le tse phetoang.

PCB ea Burn-in Board ke eng?

PCB ea Burn-in Board e sebetsa e le setsi sa liteko se inehetseng se etselitsoeng tlhahlobo ea ts'epahalo ea ho chesoa ha thepa ea semiconductor. Ho fapana le liboto tse tloaelehileng tsa liteko, lipolanete tsena li tlameha ho boloka botsitso ba motlakase le mochini ha li ntse li sebetsa li sa khaotse libakeng tse futhumetseng haholo.

Maemo a tlwaelehileng a ho tjha a tloha ho 125°C ho isa ho 150°C bakeng sa dinako tse tlohang ho dihora tse 72 ho isa ho tse 168. Mosebetsi oa mantlha oa liboto tsena ke ho bona ho hloleha ha lefu la masea ka ho beha khatello e tsitsitseng ea motlakase mochesong o phahameng, e leng ho lumellang baetsi ho hlahloba lisebelisoa tse nang le bothata pele li romelloa.

Li-PCB tsa Boto ea ho Chesa li fapane haholo le liboto tsa ho kenya le likarete tsa probe . Leha liboto tsa ho kenya li shebane le liteko tse sebetsang mochesong o tloaelehileng 'me likarete tsa probe li beha pele botšepehi ba lets'oao la maqhubu a phahameng nakong ea liteko tsa boemo ba wafer, Liboto tsa ho Chesa li hatisa mamello ea mocheso le botsitso ba nako e telele tlas'a khatello e tsoelang pele ea mocheso.

Tikoloho ea Teko e Cheleng le Litlhoko tsa PCB

Ho lumellana ha Ovine ea Mocheso o Phahameng

Li-PCB tsa Burn-in Board li sebetsa ka har'a likamore tse khethehileng tsa onto tse etselitsoeng ho boloka taolo e nepahetseng ea mocheso ho pholletsa le liteko tse kholo. Liboto tsena li tlameha ho lekana liraka tsa onto tse emeng ha li ntse li amohela katoloso ea mocheso nakong ea libaesekele tsa mocheso. Ho lumellana ha kamore ho hloka tlhokomelo e hlokolosi ho litekanyo tsa boto, libaka tsa masoba, le ho hlaka bakeng sa phallo ea moea ho potoloha lisebelisoa tse nang le batho ba bangata.

Thermal Cycling le Mechanical Stress

Ho potoloha ha mocheso khafetsa ho amanang le teko ea ho chesa ho hlahisa khatello e kholo ea mechini ka lebaka la ho se lumellane ha katoloso ea mocheso. Liboto li na le lipotoloho tse ngata tsa ho futhumatsa le ho pholisa nakong eohle ea bophelo ba tsona ba ts'ebeletso, 'me potoloho ka' ngoe e ka baka mapetso a manyane manonyellong a solder kapa karohano ea trace. Moralo o tlameha ho ikarabella bakeng sa likhatello tsena tse bokellaneng ka ho bokellana ha lera ka mokhoa o lekanang le ka mokhoa oa maano ka ho beha.

Khetho ea lintho tse bonahalang bakeng sa Li-PCB tsa Boto ea Burn-in

Khetho ea thepa e emela qeto ea bohlokoa ka ho fetisisa moralong oa Burn-in Board PCB, e khethollang ka kotloloho ts'ebetso ea mocheso le nako ea bophelo ea ts'ebetso. Laminate e tlameha ho boloka botšepehi ba mochine le thepa ea motlakase ho pholletsa le lihora tse makholo mocheso o feteletseng.

Leqephe lena le shebane le PCB le hardware ea sesebelisoa e sebelisoang nakong ea teko ea khatello ea ts'epo. Bakeng sa mokhoa o pharaletseng oa teko le phallo ea ts'ebetso, hlahloba kakaretso ea teko ea ho chesa ; bakeng sa netefatso ea boto e kopaneng, hokahanya moralo oa sesebelisoa le tšehetso ea tlhahlobo e sebetsang.

Polyimide Laminate

Lisebelisoa tse thehiloeng ho polyimide li fana ka botsitso bo phahameng ba mocheso ka mocheso oa khalase o fetang 250°C, e leng se etsang hore li be ntle bakeng sa lits'ebetso tse thata ka ho fetisisa tsa ho chesa. Lisebelisoa tsena li bontša botsitso bo botle ba litekanyo le coefficient e tlase ea katoloso ea mocheso ho 30-50 ppm/°C, e fokotsang ho oa ha boto nakong ea ho pepesehela mocheso ka nako e telele.

Mefuta e meng ea FR-408HR le High-Tg

FR-408HR e tsoang ho Isola e fana ka tharollo e 'ngoe e nang le mocheso oa khalase oa 180 ° C le ho monya mongobo o tlase ha o bapisoa le lisebelisoa tse tloaelehileng tsa FR-4. Laminate ena e boloka thepa ea motlakase e tšepahalang mochesong o fihlang ho 150 ° C ha e ntse e fana ka melemo ea litšenyehelo ho feta meaho ea polyimide bakeng sa lits'ebetso tse sa hlokeng letho.

Metal Core Solutions

Bakeng sa lits'ebetso tse hlokang ho qhalana ha matla ka ho feteletseng, meaho ea tšepe ea mantlha kapa e matlafalitsoeng ka mocheso e kopanya li-substrate tsa aluminium kapa tsa koporo tse ntlafatsang ho hasana ha mocheso. Lisebelisoa tsena li fana ka phallo ea mocheso ea 1-5 W/mK ha e bapisoa le 0.3 W/mK bakeng sa li-laminate tse tloaelehileng, ho netefatsa hore mocheso o ts'oana holim'a bokaholimo ba Burn-in Board.

Baenjiniere ba lokela ho kopa litlaleho tsa botsofali ba mocheso ho tsoa ho barekisi ba PCB ba tlalehang ts'ebetso ea laminate ka mor'a lihora tse 500 ho isa ho tse 1000 tsa ho pepeseha ho sa feleng ho mocheso o reriloeng.

Moralo oa Matla a Phahameng le Moralo oa Pad bakeng sa Maboto a Cheleng

Tsamaisa Bophara le Boima ba Koporo

Li-PCB tsa Burn-in Board li tlameha ho fana ka lisebelisoa tse ngata tsa morao-rao ho lisebelisoa tse ngata tse sebetsang ka nako e le 'ngoe ka matla a mangata. Lintlha tse ka sehloohong tsa moralo oa motlakase li kenyelletsa:

• Kaho e boima ea koporo - Boima ba koporo ba 2-ounce kapa 3-ounce bo fokotsa tahlehelo e hanyetsanang le ho phahama ha mocheso nakong ea ts'ebetso e tsoelang pele.
• Lipalo tse pharalletseng tsa mohlala - Lithempereichara tsa tikoloho tse haufi le 150°C li hloka li-conductors tse pharalletseng ho feta meralo e lekanang le ea kamore.
• Thermal ka li-arrays - Ho beoa ka maqheka ka tlas'a mekhoa ea matla ho thusa ho fetisetsa mocheso ho lifofane tsa ka hare tsa koporo.
• Mekhahlelo ea ho hasana mocheso - Lifofane tsa ka hare tsa koporo li etsa litsela tse tlaase tsa ho hanyetsa mocheso ho thibela libaka tse chesang tsa sebakeng seo.

Khetho ea Qetello ea Bokaholimo

Lithako tsa bokaholimo ba liphahlo li tlameha ho mamella oxidation le ho boloka solderability ka lipotoloho tse ngata tsa mocheso. Khauta e qoelisoang ea nickel e se nang motlakase e fana ka nako e telele e tšoarellang ka botenya bo tloaelehileng ba li-microns tse 3-6 le khanya ea khauta ea li-microns tse 0.05-0.1. Ho roala khauta e thata holim'a li-pads tsa sehokelo ho netefatsa khanyetso e tšepahalang ea ho ikopanya ka lipotoloho tse makholo tsa ho kenya libakeng tsa mocheso o phahameng.

Li-preservatives tsa "organic solderability" li fana ka melemo ea litšenyehelo empa li hloka tlhahlobo ea litšobotsi tsa botsitso ba mocheso, kaha mefuta e mengata ea OSP e qala ho senyeha ka holimo ho 130 ° C nakong ea ho pepeseha nako e telele.

Moralo oa Sehokelo le Socket bakeng sa Li-PCB tsa Boto ea Burn-in

Sistimi ea likhokahanyo tsa mocheso o phahameng o emela lintlha tsa bohlokoa tsa ts'epo mabapi le kaho ea Burn-in Board. Mehaho ea likhokahanyo e tlameha ho sebelisa thermoplastic e sebetsang hantle haholo joalo ka polyphenylene sulfide kapa liquid crystal polymer e bolokang matla a mochini ho feta 150°C.

Metallurgy ea ho ikopanya e hloka ho roala khauta holim'a nickel kapa lisebelisoa tsa boronse tsa phosphor ho netefatsa khanyetso e tsitsitseng ea ho kopana nakong eohle ea libaesekele tse futhumetseng. Likhokahano tse tloaelehileng tsa tin-plated li oxidize ka potlako mochesong o cheleng, e lebisang ho likhokahano tsa nakoana le liphetho tsa liteko tse fosahetseng.

Sistimi ea ho boloka metjhini e sireletsa Liboto tse Cheleng ka har'a lionto tse sebelisang lisebelisoa tsa tšepe tse sa hloekang tse lekantsoeng ho tsoela pele ho sebelisoa ho 200°C. Ho tsamaisana le boto ho ea ho sokete ho hloka ho nepahala ho thibela tšenyo ea likhokahano nakong ea katoloso ea mocheso, hangata ho sebelisa meralo ea likhokahanyo tse phaphametseng tse amohelang motsamao o fapaneng.

Moralo oa ho Tšepahala ho Thermal ho Burn-in Board PCBs

Ketsiso ea Mocheso le Tlhahlobo

Ketsiso ea mocheso nakong ea mohato oa moralo e khetholla libaka tse ka bang teng tse chesang 'me e netefatsa maano a taolo ea mocheso pele ho etsoa mehlala ea mohlala. Mehlala ea tlhahlobo ea likarolo tse felletseng e bolela esale pele kabo ea mocheso ho pholletsa le PCB ea Boto ea Burn-in tlas'a ho jara matla a felletseng, e leng se nolofalletsang baqapi ho ntlafatsa kabo ea koporo le sebaka sa likarolo.

Ho laola CTE Mismatch

Coefficient ea ho se lumellane ha katoloso ea mocheso lipakeng tsa lisebelisoa tsa PCB le liphutheloana tsa sesebelisoa ho hlahisa khatello ea seriti ka har'a manonyeletso a solder nakong ea baesekele ea mocheso. Mehaho ea li-symmetrical stack-up e fokotsa matla a ntoa ka ho leka-lekanya kabo ea koporo ho pholletsa le sebopeho sa lera, ka tekanyo e tloaelehileng ea koporo e bolokiloeng ka hare ho 10% pakeng tsa lihlopha.

Melao ea moralo e lokela ho fokotsa phapang ea mahloriso ea koporo ho thibela katoloso e fapaneng e bakang ho sotha ha boto. Sebelisa symmetrical stack-up ho fokotsa warpage ea boto nakong ea nako e telele ea mocheso oa mocheso, ho beha matla le lifofane tsa fatše ka mokhoa o lekanang ka boto ea setsi.

Manufacturing and Quality Control for Burn-in Board PCBs

Litaolo tse khethehileng tsa Ts'ebetso

Ho etsa Burn-in Board PCB ho hloka taolo ea ts'ebetso e fetang litlhoko tse tloaelehileng tsa tlhahiso:

• Lipotoloho tse atolositsoeng tsa lamination - Litaba tsa ho pepeseha ha mocheso li netefatsa pheko e felletseng ea resin le ho fokotsa khatello ea maikutlo botong e felileng.
• Ho tlosa mongobo - Ho baka ka mor'a ho kopanya ka 120 ° C bakeng sa lihora tse 4-8 ho fokotsa mongobo o ka tlase ho 0.2% ho thibela delamination.
• Netefatso e laoloang ea impedance - Teko e tiisa hore lintlha li fihlelleha ho pholletsa le mocheso o sebetsang.
• Teko e phahameng ea bokhoni - Ho netefatsoa ha ho hanyetsa mocheso ka mocheso o phahameng ho tiisa botšepehi ba dielectric.

Tlhahlobo ea Kamor'a Tlhahiso

Teko ea motlakase e netefatsa lits'oants'o tse laoloang tsa impedance le litekanyo tsa khanyetso ea khokahano li netefatsa likhokahano tse tšepahalang pele liboto li kena ts'ebeletso. Tlhahlobo ea ka mor'a ho chesoa e hlahloba liboto bakeng sa ho fetoha ha mebala, delamination, kapa liphetoho tsa dimensional tse bontšang ho senyeha ha thepa e hlokang hore boto e nkeloe sebaka.

Likopo tsa Burn-in Board PCBs

Memori le Lisebelisoa tsa ho Lokisetsa

Li-circuits tse kopantsoeng tsa memori tse kenyelletsang lisebelisoa tsa DRAM le Flash li etsa liteko tse matla tsa ho chesa ho netefatsa ts'epo ea ho boloka data. Li-PCB tsa Burn-in Board bakeng sa tlhahlobo ea memori hangata li amohela lisebelisoa tse 64 ho isa ho tse 256 ka nako e le 'ngoe, tse hlokang marang-rang a tsoetseng pele a kabo ea matla ho boloka mocheso o ts'oanang ho liboto tse nang le baahi ba bangata.

Li-semiconductors tsa matla

Lisebelisoa tsa semiconductor tsa motlakase tse kang MOSFET le IGBT li hloka tlhahlobo ea ho chesoa ke mocheso o phahameng oa mateano ha li ntse li tsamaisa maqhubu a lekantsoeng. Lisebelisoa tsena li hloka Liboto tsa Burn-in tse nang le litekanyo tse ngata tsa koporo tse sebetsanang le ho felloa ke matla ho tloha ho 5W ho isa ho 50W sebakeng se seng le se seng sa sesebelisoa.

Likoloi le Aerospace Electronics

Lisebelisoa tsa elektroniki tsa likoloi le tsa sefofane li laela tlhahlobo e atolositsoeng ea ho chesa ho fihlela litlhoko tsa ts'epo tsa AEC-Q100 le MIL-STD-883 bakeng sa lits'ebetso tsa bohlokoa tsa polokeho. Liindasteri tsena li sebelisa li-PCB tsa Burn-in Board tse etselitsoeng likete-kete tsa potoloho ea mocheso, tse tšehetsang tlhahlobo ea mangolo ho pholletsa le bophelo bo atolositsoeng ba ts'ebetso.

Li-IC tsa Liindasteri tse Tšepahalang Haholo

Lipotoloho tse kopaneng tsa taolo ea liindasteri tse tšeptjoang haholo li hlahlojoa ka har'a ho chesoa ho fihlela litekanyetso tsa ho hloleha tse ka tlase ho 10 FIT (ho hloleha ha nako ka lihora tse bilione tsa sesebelisoa). Li-PCB tsa Burn-in Board tse sebelisoang lits'ebetsong tsena li tlameha ho fana ka botsitso ba nako e telele ho pholletsa le lotho ea tlhahiso e nkang likhoeli kapa lilemo.

fihlela qeto e

Moralo o atlehileng oa Burn-in Board PCB o kopanya taolo ea mocheso, khetho ea thepa, le melao-motheo ea moralo oa motlakase o ntlafalitsoeng bakeng sa ts'ebetso e atolositsoeng ea mocheso o phahameng. Ho khetha lisebelisoa tse nepahetseng tsa laminate tse nang le litšobotsi tse tiisitsoeng tsa ho tsofala ha mocheso ho theha motheo oa ts'ebetso e tšepahalang, ha marang-rang a matla a kabo ea matla le litsamaiso tsa likhokahanyo li netefatsa botšepehi bo sa fetoheng ba motlakase nakong eohle ea ts'ebetso e tsoelang pele.

Highleap Electronics Burn-in Board bokhoni ba PCB

Ho Highleap Electronics, re fana ka litharollo tse khethehileng tsa tlhahiso bakeng sa ho batla lits'ebetso tsa tlhahlobo ea ho chesa:

• Tsebo ea thepa ea mocheso o phahameng - Polyimide le high-Tg FR-408HR laminate sebetsa ka ts'ebetso e netefalitsoeng ea botsofali.
• Kaho e boima ea koporo - 2-ounce ho isa ho 6-ounce boima ba koporo bo nang le taolo e nepahetseng ea ho latella bophara bakeng sa kabo ea matla.
• Advanced surface finishes - ENIG le mekhoa ea ho roala khauta e thata e ntlafalitsoeng bakeng sa ho ts'epahala ha mocheso o phahameng.
• Thermal ketsiso tšehetso - Netefatso ea moralo pele ho tlhahiso ho ntlafatsa ts'ebetso ea mocheso le ho tseba mathata a ka bang teng.
• Litokomane tsa boleng - Ts'ebeliso e felletseng ea lisebelisoa le litlaleho tsa tlhahlobo ea botsofali ba mocheso bakeng sa lits'ebetso tsa bohlokoa.

Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka litlhoko tsa hau tsa liteko tse chesang le ho ithuta kamoo lits'ebetso tsa rona tse ikhethileng tsa tlhahiso li ka tšehetsang mananeo a hau a ts'epo ea semiconductor.