Probe Card PCB: E nepahetseng ea Boenjiniere bakeng sa Teko ea Wafer-Level

Selelekela

Tekong ea boemo ba wafer, karete ea probe PCB e sebetsa e le sehokelo sa bohlokoa lipakeng tsa sistimi ea ATE le semiconductor wafer, ho netefatsa khokahano e nepahetseng ea motlakase le ponts'o ea matšoao. Ha chip geometries e ntse e honyela le litlhoko tsa liteko li ba thata le ho feta, li-interfaces tse khethehileng tsa liteko li fetohile tsa bohlokoa haholo. Karete ea phuputso ea PCB e koala lekhalo lipakeng tsa lisebelisoa tsa linale tsa probe le lisebelisoa tsa tlhahlobo tse ikemetseng, e nolofalletsa baetsi ho netefatsa ts'ebetso ea morao-rao pele ba qoelisoa le ho paka.

Probe Card PCB ke Eng?

Tlhaloso le Mosebetsi oa Motheo

Karete ea probe PCB ke boto e khethehileng ea liteko e hokahanyang mefuta e mengata ea linalete tsa probe le lisebelisoa tsa liteko tse iketsang. E nolofalletsa phetiso ea matšoao, kabo ea matla le ho thella ha e ntse e boloka botsitso ba matšoao a liteko ho pholletsa le libaka tse makholo kapa tse likete tsa ho kopana. Boto ena e sebetsa e le sebopeho sa tšehetso ea mechini le marang-rang a kabo ea motlakase bakeng sa liteko tsa parametric le tsa ts'ebetso tsa boemo ba wafer.

Likarolo tsa Bohlokoa tsa Probe Card PCB

Kopano e tloaelehileng ea karete ea probe ea PCB e kopanya lintlha tse 'ne tsa mantlha: lethathamo la nale ea probe bakeng sa ho kopana le wafer, sethala sa sebopeho sa PCB se nang le mesaletsa e laoloang ea impedance, sistimi ea sehokelo sa ATE, le foreimi ea tšehetso ea mochini. Karolo e 'ngoe le e' ngoe e tlameha ho sebetsa ka konsarete ho fihlela khokahano ea motlakase e pheta-phetoang ka li-die pads tse ka tlase ho li-micrometer tse 100 ka molumo.

Probe Card PCB vs. Load Board PCB

Moralo oa Sebopeho sa Probe Card PCB

Multi-Layer Stack-Up Architecture

Meralo ea PCB ea karete ea probe hangata e sebelisa mekhahlelo e 6 ho isa ho e 20 kapa ho feta ho amohela litlhoko tse rarahaneng tsa ho tsamaisa matšoao le ho sireletsa. Sehlopha sa mekhahlelo se arola lifofane tsa matšoao ho tloha mobung le kabong ea matla, ka mekhahlelo e ikhethileng ea taolo e laolang matšoao a tatellano ea liteko. Khetho ea thepa e kenyelletsa li-laminate tse nang le Tg FR-4 e phahameng, BT, kapa li-laminate tse ikhethileng tsa letoto la laminate tse nang le tahlehelo e tlase ho latela litlhoko tsa maqhubu le litlhoko tsa botsitso ba mocheso.

E tsoetseng pele ka Theknoloji

Likarolo tsa lipatlisiso tse hlakileng li hloka litharollo tse rarahaneng tsa khokahano:

• Li-microvia tse entsoeng ka laser - Numella tsela e teteaneng e nang le li-diameter tse nyane joalo ka 75 micrometer bakeng sa kabo ea mats'oao a phahameng haholo.
• Lifofu le ho patoa vias - Hokela likarolo tse kahare ntle le ho sebelisa sebaka se ka holimo, ho holisa sekhahla sa probe pad.
• Kaho ea ka-ka-pad - E fokotsa boholo ba pad ha e ntse e boloka ts'ebetso ea motlakase, e bohlokoa bakeng sa lits'ebetso tse tlase tsa 100µm.

Taolo ea Impedans ho Probe Card PCB

Moralo o laoloang oa impedance o bohlokoa ts'ebetsong. Mesaletsa ea matšoao e entsoe ho isa ho 50-ohm e le 'ngoe kapa 100-ohm e fapaneng, e nang le mamello ea botenya ho isa ho ± 10% ho boloka botsitso. Lifofane tse ka tlas'a lefatše tse behiloeng haufi le likarolo tsa matšoao li fana ka litsela tse khutlang tse fokolang tse fokotsang tšitiso ea motlakase.

Mathata a Moralo o Botle le Maqhubu a Phahameng

Litlhokahalo tsa Pitch e Ntle haholo

Lisebelisoa tsa sejoale-joale tsa memori le kelello hangata li hloka li-probe pitches tse ka tlase ho li-micrometer tse 50, li hatella meeli ea tlhahiso. Sena se hloka ho nepahala ha ngoliso ho feta li-micrometer tse 25 ho phanele eohle, e fihlelletsoeng ka lits'ebetso tse tsoetseng pele tsa ho nka litšoantšo le matšeliso a mocheso nakong ea tlhahiso. Ho se lumellane hofe kapa hofe ho fetolela ka kotloloho liphoso tsa boemo ba lintlha le tšenyo e ka bang teng.

Botšepehi ba Pontšo ea Maqhubu a Phahameng

Ha u etsa liteko tsa lisebelisoa tse lebelo le holimo tse sebetsang ho feta 10 GHz, moralo oa karete ea probe ea PCB o tlameha ho sebetsana le tahlehelo ea phello ea letlalo, ho monya ka dielectric, le ho khaotsa ho se sebetse. Li-laminates tsa tahlehelo tse tlase tse nang le mabaka a ho qhalana ka tlase ho 0.004 li hlokahala. Tsela e fapaneng ea lipalangoang e hloka taolo e nepahetseng ea sebaka, e nang le bolelele bo lekanang bo ts'oaroang ka har'a millimeter e le 'ngoe ho thibela liphoso tse bakoang ke skew.

Crosstalk Mitigation Strategies

Mekhahlelo e teteaneng ea probe e baka kotsi e kholo lipakeng tsa litsela tsa matšoao tse haufi:

• Tsela e tlase-tlase - E arola mats'oao a bohlokoa ka mesaletsa ea fatše e inehetseng lipakeng tsa li-conductor tse sebetsang.
• Embedded capacitance thepa - Fana ka li-decoupling tse ajoang ntle le ho ja boto ea thekiso ea matlo le meaho.
• Lifofane tse tiileng tsa litšupiso - Sireletsa likarolo tsa mats'oao a kahare ho tsoa ho khokahano ea motlakase ka mahlakoreng ka bobeli a dielectric.

ATE System Interface bakeng sa Probe Card PCB

Khokahano e Khethehileng ea Platform

Likopano tsa karete ea Probe ea PCB li tlameha ho lumellana le litlhaloso tsa mochini le tsa motlakase tse hlalosoang ke baetsi ba ATE joalo ka li-platform tsa Advantest V93000 kapa Teradyne UltraFlex. Lihokelo tsa li-interface li etselitsoe ho tsamaisana le lipalo tsa phini ho tloha ho makholo ho isa ho mashome a likete, ka 'mapa o hlalositsoeng o hokahanyang liteishene tsa liteko ho hlahloba maemo. Likarolo tsa ngoliso ea mochini li netefatsa ho lokisoa ha docking ho phetoang.

Ho kopanya Mehaho ea Mehaho ea Grounding

Ho theha ka nepo lipakeng tsa karete ea probe PCB le sistimi ea ATE ho bohlokoa bakeng sa ho itšireletsa ha lerata le ho nepahala ha tekanyo. Lithakhisa tse ngata tsa fatše tse ajoang ho pholletsa le sehokelo sa lihokelo li fokotsa tšitiso le ho thibela tšubuhlellano ea hona joale. Lifofane tsa fatše tse ajoang li fana ka bokhoni bo tšoanang ba litšupiso ho pholletsa le sebopeho sa teko, ho tlosa li-loops tsa fatše tse senyang boleng ba matšoao.

Litlhaloso tsa Interface Durability

Likhokahano tsa ATE li kena mekolokong ea likhokahanyo tse likete nakong ea bophelo ba bona ba ts'ebeletso. Sistimi ea likhokahanyo e tlameha ho mamella ho roala ha mochini ha e ntse e boloka lintlha tsa ts'ebetso ea motlakase. Likhokahano tse entsoeng ka khauta tse nang le matla a tloaelehileng a tloaelehileng li netefatsa khanyetso e tsitsitseng e ka tlase ho 50 milliohm pini ka 'ngoe, ha lithapo tsa tataiso li thibela ho sisinyeha ha lehlakore ho ka senyang malebela a bonolo a lipatlisiso.

Ho Tšepahala le ho Nahana ka Thermal bakeng sa Probe Card PCB

Litlhoko tsa Tsamaiso ea Mocheso

Ts'ebetso ea tlhahlobo ea probe e ka phahamisetsa mocheso oa karete ea PCB ka holimo ho 125 ° C ka lebaka la ho felloa ke matla ho tsoa ho potoloho ea liteko le lisebelisoa tse tlas'a teko. Khetho ea thepa e tlameha ho ikarabella bakeng sa coefficient ea ho hola ha mocheso pakeng tsa substrate ea PCB, probe substrate, le silicon wafer ho thibela khatello ea maikutlo. Sistimi ea polyimide le high-Tg epoxy e boloka botsitso ba maemo ho pholletsa le libaesekele tsa mocheso.

Material CTE Matching

Ho se tsamaisane ha mocheso pakeng tsa lisebelisoa ho baka khatello ho li-interfaces le manonyeletso a solder:

• Ho lebisoa ho CTE - Li-substrate tsa PCB tsa karete ea probe li khethoa ho lekana katoloso ea kopano ea probe, hangata 12-17 ppm/°C.

• Ho tsitsa ha tekanyo - Ho thibela ho kheloha ha sebaka sa probe nakong ea maeto a mocheso le ho eketsa nako ea ts'ebetso ea kopano.

• Botšepehi ba sebopeho - E boloka ts'epo ea ho kopana le motlakase leha potoloho ea mocheso e baka khatello ea thepa.

Probe Contact Nako e telele

Motlakase tšepahala banyalani ba ka ho toba le probe nale mokhathala mechanical. Ha li-probe li ntse li hokahana khafetsa holim'a letlapa, matšoao a ho hohla a hola mme ho hanyetsa ho hokahanngoa ho eketseha. Karete ea probe PCB e tlameha ho boloka ts'ebetso ea motlakase joalo ka ha malebela a lipatlisiso a nyenyefatsa, a fihlelleha ka marang-rang a hanang haholo le likhokahano tse sa hlokahaleng.

Mekhoa ea Tlhahiso ea Probe Card PCB

Precision Drilling le Ngoliso ea Lera

Sistimi ea ho cheka ka laser e theha li-microvias tse nang le li-diameter tse nyane joalo ka li-micrometer tse 75, tse nolofalletsang likhokahano tse phahameng haholo tse hlokahalang bakeng sa li-arrays tsa probe ea boleng bo botle. Ngoliso ea lera-to-layer e tlameha ho finyella ho nepahala ka har'a li-micrometer tse 25 ho pholletsa le phanele, ho hloka mekhoa e tsoetseng pele ea ho hokahanya ha mahlo le matšeliso bakeng sa liphetoho tse bonahalang nakong ea ts'ebetso.

Khetho ea Qetello ea Bokaholimo

Botšepehi ba ho kopana le probe bo hloka lisebelisoa tsa bokaholimo tse hananang le oxidation ha li ntse li fana ka thepa e sa fetoheng ea motlakase. ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) e fana ka khanyetso e ntle ea kutu le bokhoni bo bongata ba ho phalla hape. Lithako tsa khauta tse qoelisoang li fana ka libaka tse bataletseng bakeng sa ho koalloa ha lipatlisiso, leha ho le joalo ho hlokahala litšitiso tsa nickel ho thibela monko oa khauta.

Mekhoa ea ho netefatsa boleng

Bahlahlobi ba probe e fofang ba netefatsa ho tswela pele ha motlakase le ho arolwa ntle le ho hloka disebediswa tse ikgethileng tsa teko, haholo-holo tsa bohlokwa bakeng sa dikarolwana tsa PCB tsa dikarete tsa probe. Bongata ba tlhahiso bo ka lokafatsa disebediswa tsa teko tse ikgethileng tse hlahlobang diparamitha tsa impedance, ho jara capacitance, le ho hanyetsa ho kopana ka nako e le nngwe. Disistimi tsa tlhahlobo ya mahlo di netefatsa boholo ba pad le ho nepahala ha ngodiso pele di kopanngwa.

Likopo le Mekhoa ea Probe Card PCB Technology

Libaka tsa Tšebeliso ea Mantlha

Likopano tsa karete ea Probe ea PCB li sebelisoa ho pholletsa le tlhahlobo ea memori (DRAM, NAND flash), netefatso ea logic ea IC (li-processor, li-GPU), le sebopeho sa sesebelisoa sa RF (li-amplifiers, transceivers). Sebaka se seng le se seng sa kopo se fana ka litlhoko tse ikhethileng: tlhahlobo ea memori e totobatsa ho kopana ho ts'oanang ho batho ba makholo ka nako e le 'ngoe, athe tlhahlobo ea RF e etelletsa pele ho boloka botšepehi ba matšoao ho maqhubu a millimeter-wave.

Litlhoko tse ntseng li eketseha tsa Pin Count

Meralo ea sejoale-joale e feta khafetsa lintlha tse 10,000 tsa tlhahlobo ha mathata a lefu a ntse a eketseha le maano a tšoanang a liteko a ntse a hola. Sena se khanna karete ea lipatlisiso ea PCB ho ea ho lipalo tse phahameng, bophara ba mela e ka tlase ho li-micrometer tse 50, le marang-rang a tsoetseng pele a kabo ea matla a fanang ka li-voltage tse tsitsitseng ho pholletsa le mefuta e meholo.

HDI le Advanced Integration

Mahlale a khokahanyo e phahameng le a kang a PCB a ntse a fetoloa ho tloha lits'ebetsong tsa lisebelisoa tsa mohala ho ea tlhahisong ea PCB ea likarete tsa probe. Mekhoa ena e nolofalletsa likarolo tse ntle haholo tse nang le li-microvia tse kopantsoeng, e fokotsa bolelele ba tsela ea matšoao le ho ntlafatsa ts'ebetso ea motlakase. Meralo e meng e tsoetseng pele e kopanya substrate ea probe ka kotloloho le PCB, e felisa boemo bo le bong ba khokahanyo le ho ntlafatsa planarity.

fihlela qeto e

Karete ea probe ea PCB e emela sebaka sa bohlokoa sa ho kopana ha tlhahiso ea li-semiconductor, moo boenjiniere bo nepahetseng bo nolofalletsang tlhahlobo e ikemetseng ea lipotoloho tse kopaneng tse tsoetseng pele. Litlhoko tsa moralo li kenyelletsa likhokahano tse ntle tsa molumo, ho tsamaisa mats'oao a maqhubu a phahameng, botsitso ba mocheso, le ho nepahala ha tlhahiso e phephetsang bokhoni bo tloaelehileng ba PCB. Ha li-semiconductor node li ntse li fokotseha le ho rarahana ha liteko ho eketseha, theknoloji ea PCB ea karete ea probe e tlameha ho fetoha ka lisebelisoa tse tsoetseng pele le lits'ebetso tse hloekisitsoeng.

Ho Highleap Electronics, re fana ka tlhahiso e nepahetseng ea PCB bakeng sa lits'ebetso tsa liteko tsa semiconductor:

• Bokhoni ba HDI bo hlakileng - Ho nepahala ha ngoliso ho 25µm bakeng sa li-probe pitches tse ka tlase ho 50µm tse nang le li-microvia tse entsoeng ka laser.
• Moralo oa impedance o laoloang - Mehala ea phetisetso ea 50Ω le 100Ω e nang le li-stack-ups tsa multilayer ho tloha ho 6 ho isa ho 20+ layers.
• Advanced surface finishes - ENEPIG le ho qoelisoa khauta bakeng sa puisano e tšepahalang ea lipatlisiso le bophelo bo atolositsoeng ba ts'ebeletso.
• ATE setsebi sa sethala - Meralo ea sebopeho sa tloaelo e tsamaellanang le Advantest, Teradyne, le liforomo tse ling tse kholo tsa liteko.

Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka hore na bokgoni ba rona ba tlhahiso ya dikarete tsa probe tsa PCB bo ka tshehetsa ditlhoko tsa hao tsa teko ya boemo ba wafer jwang.