Ceramic PCB Material Papiso: Alumina, AlN, Si₃N₄, SiC, BeO

Ceramic PCB Material Papiso
Sehloohong sena
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Selelekela

Li-substrates tsa Ceramic li fetohile tsa bohlokoa ho lisebelisoa tsa elektroniki tsa sejoale-joale moo taolo ea mocheso, botsitso le ts'epahalo li leng bohlokoa haholo. Lits'ebetsong tsa LED tse nang le matla a phahameng, li-inverters tsa likoloi, li-aerospace avionics, le li-amplifiers tsa RF, liboto tsa setso tsa FR-4 ha li khone ho felisa mocheso ka ho lekaneng kapa ho boloka ts'ebetso tlas'a maemo a feteletseng.

Papiso ena ea thepa ea PCB ea ceramic e hlahloba thepa e mehlano e ka sehloohong: aluminium oxide (Al₂O₃), aluminium nitride (AlN), silicon nitride (Si₃N₄), silicon carbide (SiC), le beryllium oxide (BeO). Thepa ka 'ngoe e fana ka melemo e ikhethang ho conductivity ea mocheso, coefficient ea katoloso ea mocheso (CTE), matla a mechini le litšenyehelo.

Hore na ntho ea bohlokoa ka ho fetisisa ea hau ke ho finyella mocheso o phahameng ka ho fetisisa, ho tsamaisana le sesebelisoa sa silicon CTE bakeng sa li-flip-chip assemblies, kapa ho leka-lekanya ts'ebetso khahlanong le likhaello tsa tekanyetso, tataiso ena e fana ka lintlha tsa tekheniki le lintlha tsa ts'ebeliso ho tsebisa khetho ea hau ea thepa.

Kakaretso e Potlakileng: Lisebelisoa tse 5 tsa Ceramic PCB ka Ha U habanya

Tafole e latelang e akaretsa litšobotsi tsa bohlokoa tsa thepa e 'ngoe le e' ngoe ea ceramic PCB ho thusa papiso e potlakileng:

lintho tse bonahalang
Aluminium Oxide
Mefuta ea Lik'hemik'hale
Al₂O₃
Thermal Conductivity (W/m·K)
20-30
Motlakase oa Motlakase
Excellent
Matla a Mechini
e leka-lekaneng
Boemo ba litšenyehelo
Low
Lisebelisoa tsa mantlha
Kakaretso ea mabone a LED, li-module tsa motlakase tse tloaelehileng
lintho tse bonahalang
Aluminium nitride
Mefuta ea Lik'hemik'hale
AlN
Thermal Conductivity (W/m·K)
170-230
Motlakase oa Motlakase
Excellent
Matla a Mechini
Good
Boemo ba litšenyehelo
Bohareng-Holimo
Lisebelisoa tsa mantlha
Li-LED tse nang le matla a phahameng, li-amplifiers tsa RF, diode tsa laser
lintho tse bonahalang
Silicon Nitride
Mefuta ea Lik'hemik'hale
Si₃N₄
Thermal Conductivity (W/m·K)
70-90
Motlakase oa Motlakase
Excellent
Matla a Mechini
E Phahameng haholo
Boemo ba litšenyehelo
Bohareng-Holimo
Lisebelisoa tsa mantlha
Li-inverters tsa likoloi, libaesekele tse matla tsa mocheso
lintho tse bonahalang
Silicon e Carbide
Mefuta ea Lik'hemik'hale
SiC
Thermal Conductivity (W/m·K)
120-200
Motlakase oa Motlakase
E futsanehile (e sebetsang)
Matla a Mechini
E Phahameng haholo
Boemo ba litšenyehelo
High
Lisebelisoa tsa mantlha
Lisebelisoa tse khethehileng tsa mocheso o phahameng tse nang le likarolo tsa insulation
lintho tse bonahalang
Beryllium oxide
Mefuta ea Lik'hemik'hale
Phela
Thermal Conductivity (W/m·K)
250-300
Motlakase oa Motlakase
Excellent
Matla a Mechini
e leka-lekaneng
Boemo ba litšenyehelo
Holimo haholo (e thibetsoe)
Lisebelisoa tsa mantlha
Sesole / sefofane (ts'ebeliso e lekanyelitsoeng ka lebaka la chefo)

Tafole ena ea papiso ea thepa ea ceramic PCB e senola hore ha ho na thepa e le 'ngoe e laolang liparamente tsohle. Aluminium oxide e sebetsa e le motheo oa moruo, ha aluminium nitride le beryllium oxide li fana ka ts'ebetso e phahameng ea mocheso ka litšenyehelo tse phahameng.

Tlhahlobo e qaqileng ea Ntho e 'ngoe le e 'ngoe ea Ceramic PCB

1. Aluminium Oxide (Al₂O₃): The Industry Standard

Kakaretso ea Boitsebiso le Thepa ea Bohlokoa

Aluminium oxide e emela thepa ea letsopa e amohetsoeng ka ho fetesisa ka lebaka la tekatekano ea eona ea ts'ebetso, tlhahiso le litšenyehelo. Ka conductivity ea mocheso ho tloha ho 20 ho ea ho 30 W/m·K, Al₂O₃ substrates e khona ho qhala mocheso ka mokhoa o itekanetseng oa matla a matla moo silicon kapa FR-4 e ka hlōlehang.

Thepa e bonts'a mohatsela o motle haholo oa motlakase o nang le matla a dielectric a fetang 10 kV/mm le ho hanyetsa molumo ka holimo ho 10¹⁴ Ω·cm. Coefficient ea eona ea katoloso ea mocheso (hoo e ka bang 6.5-7.5 ppm/K) e lumellana hantle le lisebelisoa tse tloaelehileng tsa semiconductor, ho fokotsa khatello ea mocheso ka har'a manonyeletso a solder nakong ea ho palama baesekele.

Litšobotsi tsa Tlhahiso le Ts'ebetso

Ho etsa li-PCB tsa aluminium oxide ho kenyelletsa mekhoa e thehiloeng hantle e kenyelletsang ho lahla theipi, khatiso ea skrineng ea li-metallization pastes, le ho thunya hammoho mochesong o ka bang 1600 ° C. Matla a Flexural hangata a fihla ho 300-400 MPa, a fana ka matla a lekaneng a mochine bakeng sa mekhoa e tloaelehileng ea kopano.

Phepelo e ntseng e hola le ts'ebetso e otlolohileng e kenya letsoho molemong oa eona oa litšenyehelo. Lisebelisoa tse tloaelehileng li kenyelletsa likarolo tse akaretsang tsa mabone a LED, li-converter tsa motlakase tse tlase ho isa ho tse mahareng, le li-circuits tsa hybrid microelectronic moo ho sa hlokeheng ho sebetsa ha mocheso o feteletseng.

Meeli ea Ts'ebetso

Moeli o ka sehloohong oa Al₂O₃ papisong ena ea thepa ea ceramic PCB ke mokhoa oa eona o itekanetseng oa mocheso, o fetohang o sa lekaneng bakeng sa lisebelisoa tse nang le matla a phahameng a matla kapa lisebelisoa tse fetang 5-10 W / cm² matla a matla.

Alumina PCB

Alumina PCB

2. Aluminium Nitride (AlN): High Thermal Conductivity Champion

Ts'ebetso e Phahameng ea Thermal le Motlakase

Aluminium nitride e hlahile e le sesebelisoa se ratoang bakeng sa lits'ebetso tse hlokang ho tsamaisoa hantle ha mocheso le ho kenya motlakase. Ka boleng ba conductivity ea mocheso ho tloha ho 170 ho isa ho 230 W/m·K, li-substrates tsa AlN li fana ka hoo e batlang e le taelo ea boholo bo betere ba ho qhala mocheso ho feta aluminium oxide ha li ntse li boloka thepa e phahameng ea dielectric.

Coefficient ea thepa ea katoloso ea mocheso (hoo e ka bang 4.5 ppm/K) e tšoana hantle le silicon (2.6 ppm/K), e etsang hore AlN e lokele ka ho khetheha bakeng sa likopano tsa flip-chip, lisebelisoa tse tobileng tsa "die attach", le li-module tsa matla tse tšepahalang haholo moo CTE e sa lumellaneng e ka lebisang ho hlōleha pele ho nako.

Litšobotsi tsa Motlakase le Likopo tsa RF

Motlakase o lula o le motle haholo, o na le dielectric kamehla ho pota 8.8 le tahlehelo ea tangent ka tlase ho 0.001 ho maqhubu a RF. Motsoako ona o thusa aluminium nitride ho ipabola ho lisebelisoa tsa elektronike tsa matla le lits'ebetso tse phahameng haholo.

Mehopolo ea Tlhahiso

Ho sebetsana le nitride ea aluminium ho hloka taolo e hlokolosi ea maemo a leholimo a sintering le mocheso (hangata 1700-1900 ° C) ho fihlela ts'ebetso e nepahetseng ea mocheso. Boitsebiso bo na le maikutlo a mongobo nakong ea ho thunngoa, 'me mekhoa ea metallization e tlameha ho lumellana le k'hemistri ea eona.

Leha ho na le mathata ana a tlhahiso, AlN e se e sebetsa khoebong bakeng sa tlhahiso ea molumo oa liphutheloana tsa matla a phahameng a LED, liamplifiers tsa matla a RF, li-submounts tsa laser diode, le lisebelisoa tsa motlakase tsa likoloi. Lintlha tsa mantlha ke tefiso ea eona e itekanetseng ea litšenyehelo ho feta Al₂O₃ le matla a tlase a mochini ha a bapisoa le silicon nitride.

Aluminium Nitride PCB

Aluminium Nitride PCB

3. Silicon Nitride (Si₃N₄): Superior Mechanical Reliability

Matla a Ikhethileng le Ho hanyetsa Thermal Shock Resistance

Silicon nitride e ikhetholla ka matla a ikhethang a mochini le ho hanyetsa mocheso oa mocheso, e etsa hore e be e loketseng lits'ebetso tse tlas'a khatello e matla ea libaesekele kapa khatello ea mochini. Thepa e finyella matla a flexural a fetang 700-900 MPa, hoo e batlang e le habeli ea aluminium oxide, ha e ntse e boloka conductivity ea mocheso sebakeng sa 70-90 W / m·K.

Coefficient ea katoloso ea mocheso bakeng sa Si₃N₄ (hoo e ka bang 3.2 ppm/K) e fana ka tšebelisano e ntle haholo le lisebelisoa tsa silicon, e fokotsa khatello ea maikutlo ho li-interface tsa die attach. Motsoako ona oa CTE, o kopantsoeng le boima bo phahameng ba ho robeha, o nolofalletsa likaroloana tsa silicon nitride ho phela maetong a phepelo ea mocheso ho tloha -40 ° C ho ea + 150 ° C kapa holimo ntle le ho phatloha.

Mokhoa oa Tlhahiso le Melemo ea Moralo

Ho etsa li-PCB tsa silicon nitride hangata li sebelisa ho hatella ho chesang kapa ho kenya khatello ea khase ho fihlela li-microstructures tse teteaneng tse nang le thepa e nepahetseng. Matla a phahameng a thepa a lumella meralo e menyenyane ea substrate, e fokotsang khanyetso ea mocheso ha e ntse e boloka botšepehi ba sebopeho.

Mekhoa ea ho kopanya tšepe e thehiloe hantle, e sebelisa lisebelisoa tse thehiloeng ho tungsten kapa molybdenum tse ka mamellang ts'ebetso e matla ea mocheso. Papisong ena ea thepa ea ceramic PCB, silicon nitride e sebetsa e le khetho e tsepamisitsoeng ho ts'epahalo bakeng sa li-inverters tsa likoloi tsa likoloi, li-drive tsa liindasteri le lisebelisoa tsa matla tsa avionics.

Silicon Nitride Ceramic PCB

Silicon Nitride Ceramic PCB

4. Silicon Carbide (SiC): Setsebi sa Mocheso o Phahameng

Thepa e Ikhethang le Meeli ea Motheo

Silicon carbide e fana ka conductivity e ikhethang ea mocheso (120-200 W/m·K) 'me e khona ho sebetsa ka mocheso o fetang 600 ° C, empa e fana ka moeli oa bohlokoa: thepa ka boeona e tsamaisa motlakase ho e-na le ho sireletsa. Tšobotsi ena e khetholla haholo SiC ho lisebelisoa tse ling papisong ena ea thepa ea ceramic PCB.

Ho sebetsa joalo ka substrate ea PCB, silicon carbide e hloka likarolo tse ling tsa dielectric kapa meaho e ikhethileng ho fana ka karohano ea motlakase lipakeng tsa mesaletsa ea potoloho. Mekhoa e tloaelehileng e kenyelletsa ho kenya silicon dioxide kapa aluminium nitride insulation layers motheong oa SiC, ho theha sebopeho se kopaneng.

Maemo a Kopo le Mathata a Tlhahiso

Ts'ebetso e phahameng ea mocheso oa thepa, katoloso e tlase ea mocheso (hoo e ka bang 4.0 ppm/K), le botsitso bo feteletseng ba mocheso li etsa hore e khahle bakeng sa lits'ebetso tse ikhethileng tse kang li-sensor tsa mocheso o phahameng, lisebelisoa tsa tlhahlobo ea lisebelisoa tsa matla, le lisebelisoa tse itseng tsa sepakapaka moo mocheso o sebetsang o fetang meeli ea lisebelisoa tse tloaelehileng tsa ceramic.

Leha ho le joalo, ho rarahana ho kenyellelitsoeng ho kopantseng lera la insulation, ho kopantsoe le litšenyehelo tsa tlhaho tsa SiC, ho fokotsa ts'ebeliso ea eona ho lits'ebetso tsa niche. Lintlha tsa tlhahiso li kenyelletsa boenjiniere bo hlokolosi ba sehokelo pakeng tsa SiC le likarolo tsa insulation, metallization e khethehileng e tsamaellanang le sebopeho se kopaneng, le taolo e matla ea boleng ho netefatsa botšepehi ba dielectric.

SiC Ceramic PCBs

SiC Ceramic PCBs

5. Beryllium Oxide (BeO): Tšebetso ea ho qetela e nang le mathata a bohlokoa

Ts'ebetso e Ntle ea Thermal

Beryllium oxide e emela tlhōrō ea conductivity ea mocheso har'a lisebelisoa tsa ceramic PCB, ho finyella litekanyetso ho tloha ho 250 ho ea ho 300 W / m·K ha e ntse e boloka motlakase o babatsehang. Motsoako ona oa thepa ha o bapisoe ke lisebelisoa life kapa life tsa ceramic substrate papisong ena ea thepa ea ceramic PCB.

CTE ea thepa (hoo e ka bang 7.5 ppm/K) e ka bapisoa le aluminium oxide empa e na le matla a phahameng haholo a ho felisa mocheso. Lits'ebetsong tse hlokang ts'ebetso e phahameng ea mocheso, BeO e ka nolofalletsa matla a matla le meralo ea mocheso e sa khoneheng ka lisebelisoa tse ling.

Bohloko bo Bohlokoa le Matšoenyeho a Tšireletseho

Leha ho le joalo, beryllium oxide e na le ts'oaetso e kholo ea chefo e thibelang tšebeliso ea eona haholo. Lerōle la Beryllium le hlahisoang nakong ea machining, ho tšoara, kapa ho robeha ha substrate le baka likotsi tse tebileng tsa bophelo bo botle, ho kenyeletsa lefu le sa foleng la beryllium, boemo bo ka 'nang ba bolaea matšoafo.

Melao e matla ea tšireletso mosebetsing e laola tlhahiso le ho sebetsana le BeO, e hlokang lisebelisoa tse khethehileng, lisebelisoa tsa tšireletso le mekhoa ea ho lahla. Ka lebaka la lithibelo tsena tsa polokeho le taolo, li-substrates tsa beryllium oxide li lekanyelitsoe haholo-holo ho sesole, sefofane, le mekhoa e meng ea puisano e sebetsang hantle.

Mekhoa e meng e Sebetsang

Lits'ebetsong tse ngata tsa khoebo ka har'a papiso ena ea thepa ea ceramic PCB, aluminium nitride e tlohile haholo beryllium oxide, e fana ka 70-80% ea ts'ebetso ea mocheso ea BeO ntle le mathata a chefo, e leng se etsang hore AlN e be khetho e ratoang bakeng sa litlhoko tse phahameng tsa mocheso oa mocheso.

Li-PCB tsa BeO Ceramic

Li-PCB tsa BeO Ceramic

Papiso ea Ts'ebetso: Tlhahlobo ea Thermal Conductivity

1. Thermal Conductivity Hierarchy

Thermal conductivity e emela phapang ea bohlokoa ka ho fetisisa papisong ena ea thepa ea ceramic PCB, kaha e khetholla ka ho toba matla a ho qhala mocheso le matla a matla a tsitsitseng a matla. Boemo ba tšebetso bo latela tatellano ena:

  • Beryllium oxide - 250–300 W/m·K e fana ka phallo e phahameng ea mocheso empa ka lithibelo tse matla tsa chefo
  • Aluminium nitride – 170–230 W/m·K e fana ka tshebetso e babatsehang ya mocheso ntle le mathata a polokeho
  • Silicon carbide - 120–200 W/m·K e fana ka conductivity e phahameng empa e hloka likarolo tsa ho pata
  • Silicon nitride - 70–90 W/m·K e lekanya tshebetso ya mocheso ka matla a phahameng a motjhini
  • Aluminium oxide – 20–30 W/m·K e sebetsa e le motheo oa moruo bakeng sa lisebelisoa tsa motlakase tse itekanetseng

2. Litaelo tsa Tšebeliso ea Matla a Matla

Bakeng sa lisebelisoa tse hlokang matla a matla a ka holimo ho 15 W/cm², aluminium nitride kapa beryllium oxide lia hlokahala ho boloka mocheso oa mateano ka har'a meeli e amohelehang. Silicon nitride e sebeletsa lits'ebetso sebakeng sa 5-15 W/cm² moo ts'epo ea eona e holimo ea mochini e eketsang boleng bo fetang ts'ebetso e hloekileng ea mocheso.

Aluminium oxide e lula e lekane bakeng sa matla a matla a ka tlase ho 5 W/cm² kapa moo sebaka sa lisebelisoa se lumellang ho hasana ho matla ha mocheso. Meeli ena e fana ka tataiso e sebetsang bakeng sa khetho ea thepa e thehiloeng ho litlhoko tsa mocheso.

3. Coefficient ea Thermal Katoloso Matching

Ntle le ts'ebetso e felletseng ea mocheso, ho bapisa CTE le lisebelisoa tsa silicon ho ama haholo ts'epo ea nako e telele. Aluminium nitride (4.5 ppm/K) le silicon nitride (3.2 ppm/K) li fana ka boleng bo phahameng ba CTE ho silicon (2.6 ppm/K) ha e bapisoa le aluminium oxide (6.5–7.5 ppm/K) kapa beryllium oxide (7.5 ppm/K).

Papali ena e haufi e fokotsa ho bokellana ha khatello ea mocheso nakong ea mocheso oa libaesekele, e leng taba ea bohlokoa bakeng sa lisebelisoa tsa likoloi le tsa indasteri ka 50,000 kapa ho feta nako ea bophelo ba sehlahisoa. Matla a ikhethang a mochini oa Silicon nitride le ho hanyetsa mocheso oa mocheso li tlatselletsa ts'ebetso ea eona e itekanetseng ea mocheso, e nolofalletsang ts'ebetso e ts'eptjoang ka nako e matla ea mocheso.

Litšenyehelo, Boteng, le Tlhahiso

1. Sebopeho sa Litšenyehelo tsa Lintho

Litsenyehelo tsa thepa le ho rarahana ha tlhahiso li fapana haholo likhethong tsa papiso ena ea thepa ea ceramic PCB. Aluminium oxide e emela khetho e theko e boima ka ho fetisisa, e nang le liketane tsa phepelo tse thehiloeng, barekisi ba bangata ba tšoanelehang, le mekhoa e tobileng ea tlhahiso e nolofalletsang tlhahiso e phahameng ka theko ea tlhōlisano.

Aluminium nitride le silicon nitride li lula maemong a theko e phahameng, hangata a theko e menahaneng habeli ho isa ho a mane ho feta litšenyehelo tse lekanang tsa aluminium oxide substrates. Tefiso ena e bonts'a lits'ebetso tse thata ho feta tsa sintering, litlhoko tse thata tsa taolo ea ts'ebetso, le lits'ebetso tse fokolang tsa barekisi.

2. Lisebelisoa tse Khethehileng le Ketane ea Phepelo

Li-substrates tsa Silicon carbide tse nang le likarolo tse kopaneng tsa insulation li laela litheko tsa pele ka lebaka la litšenyehelo tsa thepa le ts'ebetso e eketsehileng e hlokahalang bakeng sa deposition ea dielectric layer le boenjiniere ba sebopeho. Ho fumaneha ho fokolang ha mofani oa thepa ho boetse ho thibela phepelo, ho etsa hore SiC e lokele haholo lits'ebetso tse ikhethileng.

Beryllium oxide e tobane le litšenyehelo tse matla ka ho fetisisa le lithibelo tsa ho fumaneha. Ka ntle ho litšenyehelo tsa tlhaho, lits'ebetso tse khethehileng tsa tlhahiso, liprothokholo tse thata tsa polokeho, le motheo o fokolang oa bafani ba thepa li fella ka linako tsa loto tse lekantsoeng ka likhoeli le litheko tse ka fetang makhetlo a leshome theko ea aluminium oxide.

3. Tšusumetso ea Tlhahiso ea Kotulo

Lintlha tsa tlhahiso ea tlhahiso li boetse li ama litšenyehelo tse sebetsang hantle. Aluminium oxide e finyella lihlahisoa tse phahameng ka ho fetisisa ka lebaka la mekhoa e hōlileng ka ho fetisisa, ha aluminium nitride le silicon nitride li hloka taolo e hlokolosi haholoanyane ea ts'ebetso. Likarolo tse kopaneng tsa silicon carbide le ts'ebetso ea beryllium oxide li hlahisa liphephetso tse kholo tsa chai, tse kenyang letsoho litefellong tsa bona tsa litšenyehelo.

Li-PCB tsa Ceramic

Li-PCB tsa Ceramic

Mehopolo ea Polokeho, Tikoloho, le Taolo

1. Matšoenyeho a Chefo ea Beryllium Oxide

Lintlha tsa tikoloho le polokeho li emela litekanyetso tsa bohlokoa tsa liqeto papisong ena ea thepa ea ceramic PCB, haholo-holo bakeng sa beryllium oxide. Chefo ea metsoako ea beryllium e baka likotsi tse kholo tsa bophelo bo botle mosebetsing nakong ea tlhahiso, ho lokisa le ho sebetsana le li-substrates tsa BeO.

Ho hema lerōle la beryllium ho ka baka pneumonitis e matla le lefu le sa foleng la beryllium, e leng se lebisang ho senyeha ho tsoelang pele ha matšoafo. Ka lebaka leo, mebuso e mengata e beha melao e thata mabapi le tšebeliso ea BeO, e hlokang mekhoa e khethehileng ea moea, lisebelisoa tsa ts'ireletso, mananeo a tlhokomelo ea bongaka, le mekhoa e laoloang ea ho lahla.

2. Phatlalatso e 'ngoe ea Tšireletso ea Boitsebiso

Litlhoko tsena tsa ts'ireletso li baka mathata a boikarabello le mathata a ts'ebetso a tsamaisitseng lits'ebetso tse ngata tsa khoebo ho aluminium nitride e le mokhoa o sireletsehileng ka ts'ebetso e tšoanang ea mocheso. Mekhatlo e nahanang ka beryllium oxide e tlameha ho lekola ka hloko hore na ts'ebetso e ntseng e eketseha ea mocheso e lokafatsa moroalo oa taolo.

Lisebelisoa tse setseng papisong ena ea thepa ea ceramic PCB li fana ka mathata a fokolang a bophelo bo botle kapa tikoloho ho feta mehato e tloaelehileng ea ho sebetsana le ceramic. Aluminium oxide, aluminium nitride, silicon nitride, le silicon carbide ha li hlahise mathata a bohlokoa a chefo, leha mehato e tloaelehileng ea taolo ea lerōle nakong ea mochini e lula e nepahetse.

3. Tšusumetso ea Tikoloho le ho Lahloa

Li-substrates tsohle tsa ceramic li hloka lits'ebetso tse phahameng tsa mocheso tse sebelisang matla a mangata, ho nahanoa ka mekhatlo e nang le lipheo tsa ts'ireletso ea tikoloho. Likhetho tsa ho lahla tsa ho qetela li fapana ho ea ka thepa.

Aluminium oxide substrates hangata e ka sebelisoa hape kapa ea lahloa ka melapo e tloaelehileng ea litšila tsa indasteri. Aluminium nitride, silicon nitride, le silicon carbide li ka hloka ho lahla ka mokhoa o khethehileng ka lebaka la tlhaho ea tsona ea ho hanyetsa empa ha li hlahise mathata a kotsi a litšila. Beryllium oxide e hloka ho lahloa ha litšila tse kotsi tse laoloang, 'me e eketsa litšenyehelo tsa bophelo.

Litlhahiso tsa Maemo a Kopo

1. Lisebelisoa tsa Leseli tsa LED tse Matla a Phahameng

Bakeng sa mabone a tloaelehileng a khoebo a LED moo litšenyehelo li leng bohlokoa, li-substrates tsa aluminium oxide li fana ka ts'ebetso e lekaneng ea mocheso ka litšenyehelo tse nepahetseng. Lisebelisoa tse hlokang khanya e phahameng ea khanya li rua molemo ho lisebelisoa tse fapaneng.

Mabone a likoloi, mabone a lebala la lipapali, le lisebelisoa tsa liindasteri tse holimo-limo li rua molemo ho aluminium nitride's superior conductivity, e nolofalletsang mefuta e menyenyane le bophelo bo atolositsoeng ba LED ka mocheso o tlase oa matekoane. Khetho ea thepa e ama ka kotloloho ts'ebetso le litšenyehelo tsohle tsa beng.

2. Matla a Electronics le Motor Drives

Li-inverters tsa likoloi tsa traction le li-drive tsa liindasteri li hloka lisebelisoa tse pholohang mashome a likete a potoloho ea mocheso ho pholletsa le mefuta e mengata ea mocheso. Motsoako oa silicon nitride oa mocheso o itekanetseng oa mocheso (70–90 W/m·K) le matla a ikhethang a mochini o etsa hore e be khetho e ratoang papisong ena ea thepa ea ceramic PCB.

Bakeng sa li-converter tsa DC-DC tse nang le matla a tlase le lisebelisoa tsa motlakase ka kakaretso, aluminium oxide e fana ka ts'ebetso e lekaneng ka litšenyehelo tse tlase. Phapang ea bohlokoa ke ho teba ha tikoloho ea ts'ebetso le bophelo bohle bo hlokahalang.

3. RF le Microwave Amplifiers

Li-amplifiers tsa radio frequency power tse sebetsang ka maqhubu a ka holimo ho 1 GHz li rua molemo ho tsoa ho aluminium nitride e kopantsoeng le mocheso o phahameng oa mocheso, tahlehelo e tlase ea dielectric, le katoloso e ntle ea mocheso e tsamaellanang le lisebelisoa tsa gallium nitride kapa gallium arsenide.

Thepa e etsa hore ho tlosoe mocheso hantle ho li-transistors tsa RF tse pakiloeng ka bongata ha o ntse o boloka botsitso ba matšoao. Bakeng sa lits'ebetso tsa RF tsa matla a tlase, aluminium oxide e lula e sebetsa ebile e boloka chelete e ngata.

4. Sefofane le Mekhoa ea Tšireletso

Lisebelisoa tsa sesole le tsa sefofane hangata li hlakisa lisebelisoa tse tsoang papisong ena ea thepa ea ceramic PCB e ipapisitseng le litlhoko tse phahameng tsa ts'ebetso ho fapana le ho ntlafatsa litšenyehelo. Aluminium nitride e sebeletsa li-avionics tse tšepahalang haholo le litsamaiso tsa puisano ka katleho.

Beryllium oxide e lula e hlalositsoe bakeng sa litsamaiso tse itseng tsa sesole tsa lefa le maemo a feteletseng a taolo ea mocheso moo likotsi tsa chefo li ka laoloang ka liprothokholo tse laoloang tsa tlhahiso le ho sebetsana. Leha ho le joalo, meralo e mecha e ntse e rata aluminium nitride ho qoba mathata a BeO.

Ceramic Circuit Board Manufacturing

Ceramic Circuit Board Manufacturing

Tataiso ea Moralo le Tlhahiso

1. Litlhaloso tsa Tlhahiso ea Tsela ea Mocheso

Baenjiniere ba khethang thepa ho tsoa papisong ena ea lisebelisoa tsa ceramic PCB ba lokela ho nahana ka lintlha tse 'maloa tsa moralo ho feta litlhaloso tsa mantlha tsa mocheso le motlakase. Moralo oa tsela ea mocheso o tlameha ho ikarabella bakeng sa ho tsamaisa mocheso oa substrate, ho kenyelletsa libaka tse lekaneng tsa ho hasana tsa koporo le ka meaho ho tsamaisa mocheso ho tloha lisebelisoa ho ea ho lisinki tsa mocheso.

Botenya ba substrate bo tlameha ho leka-lekanya ho tiea ha mochini, ho hanyetsa mocheso, le lithibelo tsa tlhahiso, hangata ho tloha ho 0.25 mm ho isa ho 1.5 mm ho latela boholo ba boto le ts'ebeliso. Li-substrates tse tšesaane li fokotsa ho hanyetsa mocheso empa li hloka ho tšoaroa ka hloko nakong ea kopano.

2. Metallization Selection le Processing

Khetho ea tšepe e ama ts'ebetso le ts'epahalo. Likhetho tse latelang li fana ka litlhoko tse fapaneng:

  • Metallization ea filimi e teteaneng - Tungsten, molybdenum, kapa lipente tsa koporo li fana ka litharollo tse theko e tlaase tse nang le botenya ho tloha ho li-micron tse 10 ho isa ho tse 25 bakeng sa likaroloana tse ngata tsa ceramic.
  • Koporo e kopantsoeng ka kotloloho (DBC) - Likopo tse hlokang ho hanyetsa motlakase o tlase li sebelisa lits'ebetso tsa DBC, ho fihlela botenya ba koporo ea li-micron tse 200-400 ka ho khomarela hantle.
  • Matlapa a tšepe a sebetsang (AMB) - Mokhoa o mong o phahameng oa conductivity oa tšepe o fanang ka ts'ebetso e ts'oanang ho DBC e nang le litšobotsi tse fapaneng tsa ts'ebetso

3. Phetoho ea Tsamaiso ea Kopano

Mekhoa ea ho kopanya le ea ho kopanya e tlameha ho amohela boima bo phahameng ba mocheso oa "ceramic substrates" ha bo bapisoa le liboto tsa manyolo. Liprofaele tsa Reflow li ka hloka libaka tse atolositsoeng tsa preheat le lithempereichara tse phahameng hanyane ho netefatsa ho qhibiliha ho lekaneng ha solder le ho koloba.

Matla a phahameng a Silicon nitride a thusa ho ts'oaroa ka mabifi, athe aluminium oxide le aluminium nitride li hloka moralo o hlokolosi haholoanyane ho thibela ho putlama ha bohale nakong ea kopano. Ntlafatso ea ts'ebetso e tlameha ho ikarabella bakeng sa litšobotsi tse ikhethileng.

4. Litlhoko tse Khethehileng tsa ho Tšoara Lintho

Bakeng sa li-substrates tsa silicon carbide tse nang le li-insulation layers, baqapi ba tlameha ho netefatsa botšepehi ba dielectric ka tlhahlobo ea matla a phahameng le ho netefatsa hore mekhoa ea metallization e boloka sebaka se lekaneng sa creepage le sebaka sa ho hlaka. Sebopeho sa motsoako se hloka netefatso e eketsehileng ho feta li-substrates tse tloaelehileng tsa ceramic.

Li-substrates tsa Beryllium oxide li hloka lits'ebetso tse khethehileng tsa ho sebetsana, libaka tse inehetseng tsa tlhahiso, le liprothokholo tse felletseng tsa polokeho ea basebetsi tse lokelang ho theoa pele ho khetho ea thepa. Ho rarahana ha ts'ebetso hangata ho feta melemo ea ts'ebetso ea mocheso bakeng sa lits'ebetso tse ngata tsa khoebo.

Kakaretso ea Khetho ea Lintho tsa Ceramic PCB

Papiso ena ea thepa ea ceramic PCB e bonts'a hore khetho e nepahetseng ea thepa e ipapisitse le lintho tse tlang pele ho ts'ebeliso ho fapana le bophahamo ba bokahohle. Moralo o latelang oa liqeto o fana ka tataiso e sebetsang:

  • Aluminium oxide - Khetha bakeng sa lits'ebetso tse baballang litšenyehelo tse nang le matla a mahareng a tlase ho 5 W/cm² moo ho ts'epahala ho netefalitsoeng ho leng bohlokoa ho feta ts'ebetso ea mantlha ea mocheso.
  • Aluminium nitride - Hlalosa hore na mocheso oa mocheso o ka holimo ho 150 W/m·K o hlokahala neng, haholo-holo bakeng sa li-LED tse nang le matla a phahameng, li-amplifiers tsa RF, kapa lisebelisoa tse hlokang hore CTE e bapise lisebelisoa tsa silicon.
  • Silicon nitride - Khetha bakeng sa lits'ebetso tsa likoloi le tsa indasteri moo matla a mochini, ho hanyetsa mocheso oa mocheso, le ts'epahalo ea nako e telele ka ho palama baesekele e matla ho lokafatsang litšenyehelo tse phahameng tsa mahareng.
  • Silicon carbide - Ak'u nahane feela bakeng sa lisebelisoa tse khethehileng tsa mocheso o phahameng o fetang 300 ° C moo ho rarahana ha likarolo tse kopantsoeng tsa ho kenya letsoho le litšenyehelo tsa pele li amohelehang.
  • Beryllium oxide - Qoba ntle le haeba ho se na lisebelisoa tse ling tse fihlelang litlhoko tsa mocheso le bokhoni ba mokhatlo bo teng ho laola chefo, ho latela melao le liprothokholo tse khethehileng tsa ho sebetsana

Maemong a mangata, nitride ea aluminium e fana ka ts'ebetso e lekaneng ea mocheso ntle le tšireletso ea beryllium oxide le moroalo oa taolo, e leng se etsang hore e be khetho e sebetsang bakeng sa litlhoko tse phahameng tsa mocheso oa mocheso.

Selekane le Highleap Electronics bakeng sa Ceramic PCB Manufacturing

Ho Highleap Electronics, re ikhethile ka ho hlahisa li-PCB tsa ceramic tse tšepahalang haholo ho pholletsa le aluminium oxide, aluminium nitride, le silicon nitride substrates. Sehlopha sa rona sa boenjiniere se fana ka tataiso ea khetho ea thepa, ketsiso ea mocheso, le tšehetso ea moralo bakeng sa tlhahiso ho ntlafatsa meralo ea hau ea PCB ea ceramic bakeng sa ts'ebetso, ts'epo le litšenyehelo.

Ikopanye le rona ho buisana ka litlhoko tsa hau tse khethehileng tsa taolo ea mocheso le ho fumana likhothaletso tsa litsebi tse ipapisitseng le tlhahlobo ena ea papiso ea thepa ea ceramic PCB. Re fana ka li-substrates tsa ceramic tse nepahetseng tse fihlelang litlhoko tse boima tsa lisebelisoa tsa elektroniki tsa motlakase, lisebelisoa tsa RF, le lits'ebetso tse ts'epahalang haholo.

Lipotso Asked hangata

1. Ke lisebelisoa life tsa ceramic PCB tse fanang ka conductivity e phahameng ka ho fetisisa ea mocheso?

Beryllium oxide e fana ka conductivity e phahameng ka ho fetisisa ea mocheso ho 250-300 W/m·K har'a lisebelisoa tsa ceramic PCB. Leha ho le joalo, chefo ea eona le lithibelo tsa taolo li fokotsa tšebeliso e sebetsang. Aluminium nitride e emela khetho e khethiloeng ea high-thermal-conductivity ho 170–230 W/m·K ntle le matšoenyeho a chefo, e etsa hore e tšoanelehe bakeng sa lits'ebetso tsa khoebo tse hlokang ho qhaloa ha mocheso o babatsehang.

2. Ke thepa efe e theko e boima ka ho fetisisa ea ceramic PCB?

Aluminium oxide (Al₂O₃) e fana ka tekanyo e ntle ka ho fetisisa ea ts'ebetso ea litšenyehelo bakeng sa lits'ebetso tse akaretsang, ka conductivity ea mocheso ea 20–30 W/m·K e lekaneng bakeng sa matla a matla a ka tlase ho 5 W/cm². Lits'ebetso tsa eona tse holileng tsa tlhahiso le ketane ea phepelo e thehiloeng li thusa tlholisano ea litheko tsa tlhahiso ea molumo, e leng se etsang hore e be khetho ea mantlha ha litlhoko tsa mocheso li lekanyelitsoe.

3. Ke thepa efe e loketseng matla a motlakase a likoloi?

Silicon nitride (Si₃N₄) e fana ka ts'ebetso e nepahetseng bakeng sa lits'ebetso tsa likoloi ka matla a eona a ikhethang a mochini le ho hanyetsa mocheso oa mocheso. Thepa e pholoha ka ts'epahalo ea ho palama baesekele e matla e fumanehang tikolohong ea likoloi ha e ntse e fana ka mocheso o lekaneng oa 70–90 W/m·K. Motsoako ona o sebetsana le litlhokahalo tsa taolo ea mocheso le ho ts'epahala ha nako e telele bakeng sa li-inverter tsa traction le li-motor drive.

4. Na silicon carbide e ka sebelisoa ka kotloloho e le substrate ea PCB?

Silicon carbide e na le motlakase 'me e ke ke ea sebetsa e le karoloana e sireletsang ntle le likarolo tse ling tsa dielectric. Likopo tse sebelisang SiC li hloka likarolo tse kentsoeng tse kang silicon dioxide kapa aluminium nitride setsing sa SiC, ho theha sebopeho se kopaneng se matlafatsang thepa ea mocheso ea SiC ha se ntse se fana ka karohano e hlokahalang ea motlakase lipakeng tsa mesaletsa ea potoloho.

5. Aluminium nitride e bapisoa joang le aluminium oxide?

Papisong ena ea thepa ea ceramic PCB, aluminium nitride e fana ka mocheso o phahameng ka makhetlo a tšeletseng ho isa ho a robeli (170-230 W / m · K khahlanong le 20-30 W / m · K) le CTE e ntle e bapisoang le lisebelisoa tsa silicon (4.5 ppm / K khahlanong le 6.5-7.5 ppm / K). Leha ho le joalo, AlN e bitsa makhetlo a mabeli ho isa ho a mane ho feta Al₂O₃. Tefiso e nepahetse bakeng sa lits'ebetso tsa matla a phahameng a matla a fetang 10 W/cm² moo phallo e phahameng ea mocheso e amang ts'ebetso le ts'epahalo ka kotloloho.

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Mokhoa oa ho fumana quote bakeng sa li-PCB

Ha re u etsetse tlhahlobo ea DFM/DFA 'me re khutlele ho uena ka tlaleho. U ka kenya lifaele tsa hau ka mokhoa o sireletsehileng ka webosaete ea rona. Re hloka lintlha tse latelang ho u fa quote:

    • Gerber, ODB++, kapa .pcb, spec.
    • Lethathamo la BOM haeba o hloka kopano
    • bongata
    • Nako ea ho fetoha

Ntle le tlhahiso ea PCB, re fana ka mefuta e fapaneng ea lits'ebeletso tsa elektroniki, ho kenyeletsoa moralo oa PCB, PCBA, le tharollo ea turnkey. Hore na o hloka thuso ka prototyping, netefatso ea moralo, ho fumana likarolo, kapa tlhahiso e ngata, re fana ka ts'ehetso ea ho qetela ho netefatsa katleho ea morero oa hau.

Bakeng sa litšebeletso tsa PCBA, ka kopo fana ka BOM ea hau (Bill of Materials) le litaelo tse itseng tsa kopano. Re boetse re fana ka tlhahlobo ea DFM/DFA ho ntlafatsa meralo ea hau bakeng sa tlhahiso le kopano, ho netefatsa ts'ebetso ea tlhahiso e boreleli.






    Keletso e potlakileng: Sehlopha sa rona se tla u romella lengolo-tsoibila hang ka mor'a tlhahiso. Ho netefatsa hore o fumana karabo ea rona, re khothaletsa ka mosa ho sheba SPAM / JUNK FOLDER ea hau haeba u sa bone molaetsa oa rona ho inbox ea hau.