Mefuta ea Sebopeho sa Lichelete Tsa Koporo: Liqapi tsa Press-Fit, Embedded, le Inlay

Selelekela: Ho Utloisisa Mehaho ea PCB ea Copper Coin

Litšebelisong tsa semiconductor ea matla le tsa mocheso o phahameng, theknoloji ea sebopeho sa lichelete tsa koporo e se e le ea bohlokoa bakeng sa ho laola liphephetso tsa ho qhala ha mocheso. Ha likarolo li hlahisa matla a mangata a motlakase, mekhoa ea setso ea taolo ea mocheso ea PCB e fihlela meeli ea eona. Ho kopanngoa ha lichelete tsa koporo ho sebetsana le sena ka ho theha litsela tse inehetseng tsa mocheso tse otlolohileng tse tsamaisang mocheso ka kotloloho ho tloha lisebelisoa tsa motlakase ho ea lisinki tsa mocheso kapa metheo ea tšepe.

Mefuta e meraro ea mantlha ea lichelete tsa tšepe e laola tlhahiso ea hajoale: meralo ea PCB e lekanang, e kentsoeng le e kentsoeng. Sebopeho se seng le se seng se fapana haholo ka tsela eo koporo e kopantsoeng ka eona le lisebelisoa tsa dielectric, likarolo tsa koporo le li-substrates. Sengoliloeng sena se fana ka baenjiniere ba meralo ka mekhoa e sebetsang ea ho khetha sebopeho se nepahetseng sa chelete ea tšepe ea koporo ho leka-lekanya ts'ebetso ea mocheso, ts'epo ea nako e telele, le litšenyehelo tsa tlhahiso.

Kakaretso ea Kopano ea Sebopeho sa Copper Coin ho PCBs

Molao-motheo oa tsamaiso ea mocheso oa tšepe ea koporo o shebana le ho theha litsela tsa ho tsamaisa mocheso. Mocheso o phalla ho tloha karolong ka chelete ea tšepe ea koporo ka ho toba ho ea setsing sa tšepe, ho feta likarolo tse phahameng tsa ho hanyetsa mocheso oa dielectric. Tsela ena e otlolohileng e fokotsa haholo khanyetso ea mocheso ho ea ho nyeoe ha e bapisoa le meaho e tloaelehileng ea PCB.

Phapang ea bohlokoa har'a mefuta e fapaneng ea sebopeho sa tšepe ea koporo ke mekhoa ea ho kopanya li-interface. Mehaho e lumellanang le khatello e itšetlehile ka khatello ea mochine, mefuta e kentsoeng e finyella maqhama a metallurgical ka lamination, 'me meralo ea inlay e sebelisa machining a nepahetseng bakeng sa li-cores tsa mocheso tse phahamisitsoeng. Phapang ena ea li-interface e ama ka kotloloho ho se sebetse ha mocheso, kabo ea khatello ea mochini, le ho rarahana ha tlhahiso.

Tobetsa-Fit Copper Coin Sebopeho

Process difeme

Mehaho ea tšepe ea koporo e lekanang ka ho tobetsa e sebelisa ho kenya mochine ho beha lisilindara tsa koporo ka har'a likoti tse kentsoeng ka har'a PCB. Chelete ea tšepe ea koporo e kopana ka ho toba le likarolo tse pota-potileng tsa koporo, ho theha likanale tsa mocheso ntle le lisebelisoa tse eketsehileng tsa tlamahano. Botenya bo tloaelehileng ba chelete ea tšepe bo tloha ho 1.0mm ho isa ho 3.0mm, ka bophara bo bapisitsoeng le mehato ea likaroloana.

Melemo ea bohlokoa

Mokhoa ona oa sebopeho sa tšepe ea koporo o fana ka melemo e mengata ea tlhahiso:

• Litsenyehelo tse tlase tsa tlhahiso - Litlhoko tse fokolang tsa lisebelisoa tse sebelisang lisebelisoa tse tloaelehileng tsa CNC li fokotsa matsete a lichelete.
• Linako tse khutšoane tsa ho etella pele - Ha ho na lipotoloho tse khethehileng tsa lamination tse hatellang kemiso ea tlhahiso haholo.
• Ho bonolo ho sebeletsa - Kopano ea mechini e lumella phetoho ea lehae ntle le ho hlakola liboto kaofela.

Meeli ea Ts'ebetso

Khokahano ea ho kopana le mocheso oa ho hanyetsa o feta oa mefuta e meng e kopantsoeng ka metallurgically. Lenonyeletso la mochini le hlahisa tšitiso ho tsoa likheong tse nyane tsa moea le ho ba mahoashe holimo. Ho palama libaesekele tse futhumetseng ho baka khatello e fapaneng ea katoloso ho likhokahano tsa coin-to-cavity, tse ka 'nang tsa theola boleng ba ho ikopanya ha ts'ebetso e atolositsoeng.

Liketso tse tloaelehileng

Mehaho ea tšepe ea koporo e lekanang le khatiso e fumana tšebeliso libotong tsa motlakase tsa mehala ea mehala, li-module tsa taolo ea likoloi, le li-circuits tsa liindasteri moo ho felloang matla ka mokhoa o itekanetseng. Ho sebetsa hantle ha litšenyehelo ho etsa hore sebopeho sena se khahle bakeng sa lits'ebetso tse hlokang ntlafatso ea mocheso oa lehae ka tlase ho 50 W/cm².

Mofuta oa Sebopeho sa Koporo e Kenyelitsoeng

Process difeme

Meaho ea mofuta oa chelete ea koporo e kentsoeng e kopanya bongata ba koporo ka har'a substrate ea PCB ka ho kopanya mocheso nakong ea ho lamination. Lichelete tsa tšepe li behiloe ka nepo ka har'a likoti tse entsoeng ka mochini, ebe li laminated ka mekhahlelo ea prepreg le ea koporo tlas'a mocheso le khatello e laoloang. Ts'ebetso ena e theha likamano tsa tšepe pakeng tsa chelete ea tšepe le mekhahlelo ea koporo ea ka hare.

Melemo ea bohlokoa

Khokahano e tobileng ea tšepe le tšepe mohahong ona oa tšepe ea koporo e fana ka ts'ebetso e phahameng:

• E babatsehang mogote conductivity - Metallurgical bonding e felisa likheo tsa moea, e fokotsa khanyetso ea sebopeho.
• Kabo e tšoanang ea khatello ea maikutlo - Mocheso o hasana ka mokhoa o ts'oanang libakeng tse hokahaneng, o fokotsa sebopeho sa libaka tse chesang.
• Mamello e phahameng ea mocheso oa libaesekele - E boloka botšepehi ka lipotoloho tse fetang 3000 ho pholletsa le -40°C ho isa ho 150°C.

Litlhoko tsa Tlhahiso

Ho rarahana ha tlhahiso ho eketseha haholo ha ho bapisoa le mekhoa ea khatiso. Ho nepahala ha boemo ba CNC ho ba bohlokoa ho thibela ho se lumellane ha lera nakong ea lamination. Ts'ebetso e ikhethileng e hloka likhatello tse laoloang le maemo a mocheso, ho eketsa nako ea tlhahiso le ho eketsa litšenyehelo tsa yuniti ka liperesente tse mashome a mararo ho isa ho tse mashome a mahlano ho feta mefuta e meng ea khatiso.

Liketso tse tloaelehileng

Mehaho ea mofuta oa tšepe ea koporo e kentsoeng e sebeletsa silicon carbide le gallium nitride power modules, li-server voltage regulator modules, le 5G base station RF amplifiers. Ts'ebetso ea mocheso e lokafatsa litšenyehelo tse phahameng moo ho ts'epahala ha karolo le mocheso oa ts'ebetso li amang ts'ebetso ea sistimi ka kotloloho.

Inlay Copper Coin PCB Design

Process difeme

Inlay koporo meralo PCB sebelisa ho sebetsa ka nepo sekotjana machining ho bopa recesses amohela liboloko koporo ho tloha bokaholimo kapa tlaase. Mohaho oa koporo o lula o le mosesaane le likarolo tse potolohileng, o hokahane le lifofane tse teteaneng tsa koporo ho theha meaho e nyalisitsoeng ea mocheso. Mamello ea mochini e tlameha ho boloka boemo bo nepahetseng ho feta 0.05mm.

Melemo ea bohlokoa

Mehaho ea Inlay e fana ka bokhoni bo nepahetseng ba taolo ea mocheso:

• Tsela e khuts'oane ea mocheso - Phallo e tobileng ea mocheso ho tloha likarolong ho ea motheong oa tšepe e fokotsa mocheso oa matekoane.
• Boholo ba ho hasana ha mocheso - Moralo o kentsoeng ka Flush o thusa tlhophiso ea ho tlosa mocheso ka mahlakoreng a le mong kapa a mahlakore a mabeli.
• Tlhōrō ea mocheso oa mocheso - E atamela ts'ebetso e tiileng ea koporo ea koporo e nang le khanyetso e nyane ea sehokelo.

Mathata a Tlhahiso

Sebopeho sena sa tšepe ea koporo se hloka ho nepahala ho feteletseng le taolo e hlokolosi ea khatello ea mocheso nakong ea kopano. Taolo ea maemo e ba ea bohlokoa ho thibela warpage kapa delamination tlas'a libaesekele tse futhumetseng. Ts'ebetso e khethehileng ea masela e fokotsa tlhahiso ho lisebelisoa tse nang le bokhoni bo tsoetseng pele ba CNC.

Liketso tse tloaelehileng

Li-module tsa motlakase tsa IGBT, li-converter tsa DC-DC ho li-inverters tsa likoloi, le li-drive tse phahameng tsa hajoale li phahamisa meaho ea PCB ea tšepe ea koporo. Likopo tse hlokang ho felloa ke mocheso ho feta 100 W/cm² ha li ntse li boloka lithempereichara tsa mateano ka tlase ho menyako ea bohlokoa li lokafatsa matsete a tlhahiso.

Tlhahlobo e Bapisang: Ts'ebetso ea Sebopeho sa Chelete ea Koporo

Thermal Performance Papiso

Ho sebetsa hantle ha tsela ea mocheso ho eketseha butle-butle ho pholletsa le mefuta ea sebopeho sa tšepe ea koporo. Meralo e lekanang le khatiso e fana ka ntlafatso ea moruo bakeng sa lisebelisoa tsa motlakase tse itekanetseng. Mehaho e kentsoeng e leka-lekanya ts'ebetso le litšenyehelo bakeng sa li-semiconductors tsa motlakase tse tloaelehileng. Litlhophiso tsa inlay li fihlella boleng bo nepahetseng ba mocheso bakeng sa matla a matla a matla.

Tšepahala le Litšenyehelo Lintlha

Ho tšepahala ho hokahane ka matla le boleng ba khokahano ea khokahano meahong ea tšepe ea koporo. Meralo e kentsoeng le e kentsoeng ka hare e bonts'a mamello e phahameng ea libaesekele tse futhumatsang, ho mamella lipotoloho tse fetang 3000 ho pholletsa le mocheso oa indasteri. Mehaho e lekanang le khatiso e bonts'a ts'ebetso e amohelehang bakeng sa li-cycles tsa mosebetsi tse sa hlokeng boima empa li ka hloka ho fokotsoa maemong a feteletseng.

Litlhahiso tsa Moqapi bakeng sa Khetho ea Sebopeho sa Copper Coin

Litlhoko tsa Mocheso

Litlhoko tsa ho tsamaisa mocheso li tlameha ho leka-lekana khahlanong le botenya ba tšepe ea koporo le bophara. Lichelete tsa tšepe tse teteaneng li fokotsa ho hanyetsa mocheso empa li eketsa ho rarahana ha tlhahiso. Baenjineri ba lokela ho bala ho kenella ha mocheso ho ipapisitseng le ho felloa ke matla ha motlakase le ho phahama ho lumelletsoeng ha mocheso.

Moralo oa Motlakase le Mechini

Karohano ea motlakase e hloka tumello e lekaneng lipakeng tsa sebopeho sa chelete ea tšepe ea koporo le mesaletsa ea matšoao ho thibela ho kopana ha capacitive kapa ho putlama ha voltage. Lisebelisoa tsa motlakase o phahameng li ka hloka sebaka se eketsehileng sa dielectric ho pota-pota li-perimeters tsa chelete ea tšepe. Lintlha tsa matla a mochine li kenyelletsa ho boloka chelete ea tšepe tlas'a ho thothomela le ho se tsamaisane ha mocheso.

Tšebelisano ea Pakete

Li-MOSFET tsa matla le li-module tsa IGBT tse nang le li-pads tse ka tlase tse pepesitsoeng li rua molemo haholo ho tsoa ho meralo e kentsoeng kapa e kentsoeng ea koporo ea PCB e holisang ho hokahanya ha mocheso ka kotloloho. Lisebelisoa tsa silicon carbide tse sebetsang mochesong o phahameng oa mateano hangata li hloka ts'ebetso e phahameng ea mocheso ea mefuta ea tšepe ea koporo e kentsoeng ho boloka mehala e tšepahalang.

Ho khoneha ho Etsa

Khetho ea sebopeho e tlameha ho nahana ka netefatso ea bokhoni ba mofani oa thepa, haholo bakeng sa meaho e kentsoeng e hlokang boemo bo nepahetseng ba CNC le lits'ebetso tse laoloang tsa lamination. Litlhoko tsa nako ea ho etella pele le molumo li susumetsa hore na meralo e tsoetseng pele ea tšepe ea koporo e lula e le litšenyehelo bakeng sa lits'ebetso tse itseng.

Qetello: Ho Khetha Sebopeho se nepahetseng sa Chelete ea Koporo

Khetho ea sebopeho sa chelete ea tšepe ea koporo e emela khoebo ea mantlha ea boenjiniere har'a ts'ebetso ea mocheso, ho ts'epahala le litšenyehelo tsa tlhahiso. Meralo e lekanang le khatiso e fana ka ntlafatso ea moruo bakeng sa lisebelisoa tsa motlakase tse itekanetseng. Mehaho ea mofuta oa tšepe ea koporo e kentsoeng e fana ka ts'ebetso e leka-lekaneng bakeng sa li-module tsa mantlha tsa semiconductor ea matla. Litlhophiso tsa PCB tsa inlay tsa koporo li fihlella hantle ho tsamaisa mocheso bakeng sa matla a matla a matla moo taolo ea mocheso e nolofalletsang ts'ebetso ea sehlahisoa ka kotloloho.

Highleap Electronics e fana ka tlhahiso e nepahetseng ea tšepe ea koporo:

• Tlhahiso e tsoetseng pele e kentsoeng - Lits'ebetso tse laoloang tsa lamination tse nang le boemo bo nepahetseng ba CNC bakeng sa tlamo e nepahetseng ea mocheso.
• Tsebo ea sebopeho sa inlay - Matla a machining a phahameng a mamello a tšehetsa li-cores tsa mocheso tse phahamisitsoeng bakeng sa ho qhala mocheso o phahameng.
• Litharollo tse tloaelehileng tsa mocheso - Moralo oa moralo o ikhethileng oa koporo o tsamaellanang le litlhoko tsa hau tsa elektroniki.

Ikopanye le Highleap Electronics ho buisana ka ditharollo tsa PCB tsa tjhelete ya koporo bakeng sa ditshebediso tsa hao tsa semiconductor tse matla haholo. Sehlopha sa rona sa boenjiniere se fana ka tshehetso ya ho etsa mohlala wa mocheso le tataiso ya tlhahiso ho ntlafatsa botshepehi le tshebetso.