Mekhoa ea Packaging ea Semiconductor: Ho Tloha ho PCB ea Setso ho ea ho Li-substrates tse Kenyelitsoeng

Selelekela

Ho paka ka semiconductor ho ntse ho fetoha haholo ha di-PCB tse kentsweng ka substrate di ntse di koala lekhalo pakeng tsa diboto tsa potoloho tse hatisitsweng tsa setso le ho paka ka IC ho tswetseng pele. Ha Molao wa Moore o ntse o atamela meedi ya mmele, indasteri e fetotse tlhokomelo ho tloha ho ditekanyo tsa transistor tse fokotsehang ho ya ho meralo ya ho paka e ntjha. Theknoloji ya substrate e kentsweng e emela ntlha ya bohlokwa ya ho phahama ha lebelo moo bokgoni ba tlhahiso ya PCB bo tlwaelehileng bo kopanang le ditlhoko tsa ho nepahala ha semiconductor-grade.

Phetoho ena e tsamaisoa ke litlhoko tsa ho kopanngoa ha heterogeneous, moo li-chiplets tse ngata-logic, memory, le li-processor tse khethehileng-li tlamehang ho buisana ka latency e fokolang le katleho e kholo. Ho utloisisa phetoho ena ea thekenoloji ho bohlokoa bakeng sa baetsi ba lisebelisoa tsa elektroniki le baqapi ba itokisetsang lits'ebetso tsa moloko o tlang ho AI, likoloi le likhomphutha tse sebetsang hantle haholo.

Evolution ho tloha ho PCB ho ea ho Advanced Packaging Substrate

Ho tloha ho Discrete ho ea ho Mehaho e Kopanetsoeng

Li-PCB tsa setso li ne li sebetsa e le sethala sa khokahano se sa sebetseng, se tsamaisang matšoao lipakeng tsa li-chips tse kentsoeng holim'a tsona. Mokhoa ona o ikhethileng o ile oa arola ts'ebetso ea ho paka chip ho tsoa kopanong ea boto, e theha mefokolo ea tlhaho ho botšepehi ba matšoao le sebopeho sa sebopeho. Phetoho ea theknoloji ea PCB e kenelletseng e fetola paradigm ena ka ho kopanya li-chips ka kotloloho ka har'a likarolo tsa substrate, ho felisa tahlehelo ea sebopeho le ho nolofalletsa meralo e kopaneng ea likarolo tse tharo.

Phetoho ea lintho tse bonahalang ho Embedded Substrate PCB

Phetoho ho tloha ho FR-4 laminate ho ea ho litsamaiso tse tsoetseng pele tsa resin e tšoaea sesebelisoa sa bohlokoa bakeng sa lits'ebetso tsa substrate tse kentsoeng. Tloaelo ea FR-4, leha e na le litšenyehelo tse tlase bakeng sa liboto tsa setso, e haelloa ke botsitso ba sebopeho le thepa ea dielectric e hlokahalang bakeng sa likhokahano tse ntle tsa semiconductor. Meetso ea sejoale-joale ea PCB e kenelletseng e sebelisa filimi ea Ajinomoto Build-up Film (ABF), resin ea bismaleimide-triazine (BT), le lisebelisoa tse khethehileng tsa koporo (RCC) tse fanang ka coefficient e phahameng ea katoloso ea mocheso e tsamaellanang le silicon.

Papiso ea Sebopeho ho Feta Melokong

Ho Highleap Electronics, re hlokometse litlhoko tsa bareki ho tloha ho liboto tse tloaelehileng tsa HDI ho ea ho li-packaging-grade tse kenyelletsoeng tse hlokang mamello e laoloang ea impedance tlas'a 5% le litlhaloso tsa holim'a metsi tse lekantsoeng ka li-micrometer tse nang le nomoro e le 'ngoe.

Bakhanni ba Bohlokoa ka Morao Ho Amoheloa ka Substrate ea PCB

Miniaturization e Kopana le Ho phatloha ha I/O

Li-system-on-chips tsa sejoale-joale li na le libilione tsa li-transistors leha ho le joalo li tobane le phephetso ea I/O eo ho tlamahanngoang ka terata e tloaelehileng e ke keng ea e rarolla. Motlakase oa boemo bo holimo o ka hloka likhokahano tse fetang 1,000 sebakeng sa maoto a ka tlase ho limilimithara tse 100. Theknoloji e kenyellelitsoeng ea PCB ea substrate e nolofaletsa ho teteana hona ka mekhahlelo e metle ea ho arola bocha le likhokahano tsa mefuta-futa, tse tšehetsang li-bump pitches ho fihla ho li-micrometer tse 40.

Litlhoko tsa Ts'ebetso ea Mocheso le Motlakase

Li-computing tse sebetsang hantle haholo le li-accelerator tsa AI li senya matla a matla a fetang li-watts tse 500 ka har'a liphutheloana tse kopaneng. Mekhoa e tloaelehileng ea ho paka e baka litšitiso tsa mocheso le ho senyeha ha sesupo se fokotsang ts'ebetso. Li-substrates tse kentsoeng li rarolla mathata ka bobeli ka nako e le 'ngoe:

• tieho e nyane ea lets'oao - Bohole ba li-chip-to-interconnect tse lekantsoeng ka li-micrometer li nolofalletsa litekanyetso tsa data tsa gigahertz tse ngata
• Khokahano e phahameng ea mocheso - Ho ema ka kotloloho haufi le lifofane tse futhumatsang mocheso ho fokotsa khanyetso ea likhohlano ka 30-50%
• Liphello tse tlase tsa parasitic - Capacitance e fokotsehileng le inductance e fokotsa lipontšo le crosstalk

Litlhoko tsa Kopanelo ea Mekhatlo

Indasteri ea semiconductor e amohetse meralo ea li-chiplet moo li-dies tse khethehileng li kopanang ka har'a sephutheloana se le seng. Mokhoa ona oa System-in-Package o hloka substrate PCB e kentsoeng e sebetsang e le lesela le sebetsang le hokahanyang, le tsamaisang likete tsa lipara tse fapaneng tsa lebelo le phahameng ha li ntse li fana ka kabo e hloekileng ea matla. Lisebelisoa tsa likoloi li fana ka mohlala oa mokhoa ona, li kopanya li-processor fusion processors, li-accelerator tsa AI, le balaoli ba bohlokoa ba polokeho ka har'a liphutheloana tse kopaneng.

Khokahano ea Phepelo

Bahlahisi ba PCB ba ne ba sebetsa ka thoko ho tloha matlong a ho paka a semiconductor, empa matla a mmaraka jwale a rata kopanyo e otlolohileng. Baetsi ba PCB ba ka sehloohong ho kenyeletswa le Highleap Electronics ba ntse ba atolosa bokgoni ba ho sebetsana le ditlhoko tsa boemo ba ho paka, ha bafani ba setso ba OSAT ba amohela maqheka a boemo ba boto. Ho kopana hona ho hlahisa menyetla bakeng sa bahlahisi ba ka kopanyang dibaka ka bobedi, ba fana ka diketane tsa phepelo tse nolofaditsweng le nako e fokotsehileng ya ho ya mmarakeng.

Ho phahama ha Theknoloji ea Embedded Substrate PCB

Ho Hlalosa Embedded Substrate Architecture

Theknoloji e kenyellelitsoeng ea PCB ea substrate e kopanya semiconductor e shoa ka har'a likarolo tsa mantlha tsa sebopeho sa multilayer ho fapana le ho li beha holim'a metsi. Substrate ka boeona e fetoha karolo ea sephutheloana, 'me chip e lula sebakeng se nepahetseng kapa e kenngoe ka botlalo ka har'a likarolo tsa dielectric. Moaho ona o thusa liphutheloana tse tšesaane ka kakaretso, ho hokahanngoa ho ntlafalitsoeng ha mocheso, le ts'ireletso ea libaka tse bonojoana tsa makhapetla nakong ea ts'ebetso ea likopano tse latelang.

Lintlha tsa Bohlokoa tsa Tekheniki

1. Mokhoa oa ho kenya Chip

Ts'ebetso ea ho kenya letsoho e qala ka sebopeho se nepahetseng sa cavity ka har'a lisebelisoa tsa mantlha, tse fihletsoeng ka laser ablation kapa CNC routing ho tolerances tlasa 25 micrometer. E shoa ho etsoa opereishene ea ho khetha le ho beha sebaka ho sebelisoa lisebelisoa tse khethehileng tse khonang ho beha ka nepo li-sub-micrometer. Ho Highleap Electronics, ts'ebetso ea rona ea ho kenya letsoho e kenyelletsa litsamaiso tsa pono tsa nako ea nnete le ho qobella maikutlo ho netefatsa ho beoa ha li-chip ka mokhoa o tsitsitseng ho pholletsa le mefuta ea tlhahiso.

2. Sebopeho sa Laser Microvia

Meralo ea PCB e kentsoeng e itšetlehile haholo ka li-microvias tse entsoeng ka laser ho theha likhokahano lipakeng tsa lichifi tse kentsoeng le likarolo tse kantle tsa tsela. Sistimi ea laser ea CO2 kapa ea UV e theha ka ho bula ho tloha ho li-micrometer tse 25 ho isa ho tse 75 ka bophara, 'me boholo ba likarolo hangata bo lekanyetsoa ho 1: 1 bakeng sa plating ea koporo e tšepahalang. Litlhophiso tsa microvia tse pakiloeng le tse thekeselehileng li theha marang-rang a mahlakore a mararo a hokahantsoeng, a nolofalletsang tsela ea ho phonyoha ho tloha ho li-fine-pitch chip pads.

3. Redistribution Layer Architecture

Mehaho ea RDL holim'a li-substrates tse kentsoeng li sebetsa ka mokhoa o ts'oanang le liphutheloana tsa li-wafer-level, li sebelisa photolithography ea line-line ho etsa mekhoa ea litsela ka bophara ba mela le libaka tse ka tlaase ho 10 micrometers. Likarolo tse ngata tsa RDL li theha marang-rang a rarahaneng a hokahaneng, hangata a sebelisa mekhoa ea semi-additive (SAP) kapa mekhoa e fetotsoeng ea semi-additive (mSAP) bakeng sa taolo ea boholo.

Melemo ea Ts'ebetso ea Embedded Substrate PCB

Mokhoa o kenyellelitsoeng oa substrate PCB o fana ka lintlafatso tse ka lekanyetsoang tsa ts'ebetso ho litekanyo tse ngata:

• Ntlafatso ea botšepehi ba pontšo - Ho lieha ha phatlalatso ho fokotseha ka 5-10 × ha ho bapisoa le mekhoa e meng e holimo
• Tshebetso ea mocheso - Junction-to-ambient khanyetso ea mocheso e theoha 30-50% ka ho kopanya tsela e tobileng ea mocheso
• Phokotso ea lintlha tsa foromo - Botenya ba sephutheloana bo fokotseha ka 40% kapa ho feta bakeng sa lits'ebetso tsa mehala le tse ka roaloang
• Ho tšepahala ha mechine - Li-chips tse kentsoeng li qoba ho pepesehela ho feto-fetoha ha maemo a boto le ho tšoha ha mocheso

Mehaho e Hlahang ea Packaging e Sebelisang Li-Substrates tse Kenyelitsoeng

Khokahano ea 2.5D le Silicon Interposeers

Liphutheloana tsa 2.5D li beha li-chips tse ngata ka lehlakoreng le leng holim'a silicon interposer e nang le litsela tse ntle le li-passage tsa silicon. Interposer e nyolohela ho PCB e kenelletseng ea substrate, e fanang ka phano ea matla, setšoantšo sa fanout ho likhokahano tsa kantle, le taolo ea mocheso. Mokhoa ona oa lebasetere o kopanya bokhoni ba silicon bo phahameng ka ho fetesisa le sebaka se sa sebetseng hantle le palo ea li-substrates tse kentsoeng ka tlhaho.

3D Stacking Ka TSV Technology

Liphutheloana tsa 'nete tsa 3D IC li beha likoti tse ngata tse sebetsang tse nang le likhokahano tse tobileng tsa TSV tse kenang ka har'a li-silicon substrates. PCB e kentsoeng ka har'a meralo ea 3D e sebetsa e le motheo oa sephutheloana, e laolang phepelo ea matla ho li-tier tsohle tse pakiloeng le matšoao a tsela a tsoang ka har'a stack e otlolohileng. Mathata a mocheso a matlafala ka har'a meaho ea 3D, ho khanna meralo ea substrate e kenyelletsang li-vias tsa mocheso, li-spreaders tsa mocheso, kapa liteishene tse pholileng tse kentsoeng.

Fan-Out Packaging Evolution

Sephutheloana sa "Fan-out wafer-level packaging" (FOWLP) se felisa li-substrate tse tloaelehileng ka ho haha ​​​​meaho ea RDL ka kotloloho holim'a liphaphatha tse entsoeng bocha kapa liphanele tse kholo. Leha ho le joalo, ha liphutheloana tsa fan-out li fihla ho boholo bo boholo le ho rarahana ho holimo, li ntse li tšoana le li-PCB tse kentsoeng ka har'a sebopeho le litlhoko tsa tlhahiso. Meralo e tsoetseng pele ea fan-out e kenyelletsa likarolo tse ngata tsa RDL le li-passive tse kentsoeng, tse fifatsang phapang lipakeng tsa mekhoa.

E kenyellelitsoe Substrate PCB joalo ka Thekenoloji ea Borokho

Theknoloji e kenyellelitsoeng ea substrate e nka boemo ba bohlokoa lipakeng tsa liphutheloana tse tloaelehileng tsa fan-out le li-substrate tsa setso. E fana ka mekhoa e metle ea ho tsamaisa le ho kenya ts'ebetso e atamelang ts'ebetso ea fan-out ha e ntse e boloka botsitso ba mochini, ho feto-fetoha ha maemo, le likhetho tsa taolo ea mocheso oa liphutheloana tse thehiloeng ho substrate. Bakeng sa lits'ebetso tse hlokang litekanyo tse kholo, li-chips tse ngata tse fapaneng, kapa ho kopanngoa ha likaroloana, li-substrates tse kentsoeng li fana ka tekanyo e nepahetseng ea ts'ebetso ea litšenyehelo.

Mathata a Thepa le Tlhahiso ho PCB ea Embedded Substrate

Mekhoa e tsoetseng pele ea Resin bakeng sa Tsela e Ntle ea Pitch

Ho fihlella bophara ba mela le likhechana tse ka tlase ho li-micrometer tse 10 molemong oa tlhahiso ea PCB e kentsoeng ho hloka lisebelisoa tse nang le botsitso bo ikhethang le bofokoli bo tlase. ABF e lula e le tekanyetso ea indasteri bakeng sa lits'ebetso tse ngata, e fanang ka litšobotsi tse ntle tsa ho phunya laser le ho khomarela ka mokhoa o tšepahalang ho foil ea koporo. Emerging low-dielectric-constant (low-Dk) le low-dissipation-factor (low-Df) li-resin li sebetsana le litlhoko tsa botšepehi ba pontšo ka maqhubu a fetang 50 GHz, ka boleng ba Dk ka tlase ho 3.0 le Df tlas'a 0.005.

Bophara ba Mola le Taolo ea Tsamaiso ea Sebaka

Ho boloka bophara ba mela ea 10-micrometer le ho lumellana ha sebaka ho pholletsa le liphanele tsa tlhahiso ho hloka taolo e nepahetseng ea photolithography le mekhoa ea ho roala koporo. Mekhoa ea semi-additive le e fetotsoeng ea semi-additive e nkela sebaka se tloaelehileng sa ho fokotsa, ho sebelisa likaroloana tse tšesaane tsa koporo le electroplating ho aha li-conductors tse nang le li-undercutting tse fokolang. Ho Highleap Electronics, re sebelisa litsamaiso tsa tlhahlobo tsa mahlo tse ikemetseng tse nang le qeto ea sub-micrometer ho netefatsa ho lumellana ha dimensional nakong eohle ea tlhahiso.

Lisebelisoa tsa Tsamaiso ea Mocheso ka Li-substrates tse Kenyelitsoeng

Meetso ea PCB e kentsoeng ka matla a phahameng e kopanya likarolo tse ikhethang tsa taolo ea mocheso:

• Ho kopanya chelete ea tšepe ea koporo - Li-spreader tsa mocheso ho tloha ho limilimithara tse 0.3 ho isa ho tse 3 li fana ka litsela tse tobileng tsa mocheso ho tloha ho li-chips ho ea ho lithabeng tsa mocheso tse kantle.
• Li-vias tse tlatsitsoeng tsa mocheso - Karo-karolelano e phahameng ka ho sebelisa pente ea koporo e netefatsa phetisetso e nepahetseng ea mocheso ka likarolo tsa substrate
• Li-cores tse lumellanang le CTE - Lisebelisoa tse kopaneng li fokotsa leqephe la ntoa, 'me CTE e sa tsamaisane e bolokiloe ka tlase ho 5 ppm/°C

Litlhoko tsa ho Ikamahanya le Moetsi oa PCB

Baetsi ba setso ba PCB ba kenang 'marakeng oa substrate ba tobane le likheo tse kholo tsa bokhoni ba ts'ebetso. Sistimi ea ho cheka ka laser e tlameha ho fihlela boholo ba matheba le ho beha boemo bo nepahetseng ka tatellano ea boholo bo betere ho feta tlhahiso e tloaelehileng ea HDI. Lits'ebetso tsa ho roala li hloka taolo e nepahetseng ea hona joale ea sets'oants'o ho fihlela kabo e ts'oanang ea koporo meahong ea microvia e nang le likarolo tse atamelang 1: 1. Litlhaloso tsa polane ea boemo ba phanele li tiisa ho tloha ho sephara se tloaelehileng sa 50-micrometer ho ea ho litlhoko tsa micrometer ea nomoro e le 'ngoe bakeng sa kopano ea molumo o motle.

Pono ea Bokamoso: Khokahano e Kenyellelitsoeng ea Substrate PCB

Phallo ea Meeli ea Indasteri

Moeli pakeng tsa tlhahiso ea PCB le liphutheloana tsa semiconductor o ntse o tsoela pele ho qhibiliha ha theknoloji ea PCB ea substrate e kentsoeng e ntse e tsoela pele. Bahlahisi ba ka sehloohong ba ntse ba nts'etsapele limmapa tsa litsela tse lebisang liphuthelong tsa maemo a phanele tse sebelisang lithography ea setaele sa semiconductor le mekhoa ea ho beha li-substrate tsa sebaka se seholo, e leng se ka fokotsang litšenyehelo tsa ho paka ka 40-60%. Meralo ea RDL-on-substrate e kopanya lipalo tsa lera la substrate ea tlhaho le sebaka le lera la kabo ea bocha ea ultrafine-pitch.

AI le Ho potlakisa 'Maraka oa Likoloi

Bohlale ba maiketsetso le lits'ebetso tsa likoloi li potlakisa ho amoheloa ha PCB ea substrate ka ts'ebetso e ikhethang le litlhoko tsa ts'epo. Sistimi ea koetliso ea AI e hloka bandwidth e phahameng ea memori le latency e nyane, e ka fihlellehang feela ka ho paka ka mokhoa o tsoetseng pele ka li-dies tse kenelletseng le likhokahano tse khutšoane haholo. Lisebelisoa tsa elektroniki tsa likoloi li hloka ts'epahalo e ikhethang lipakeng tsa mocheso o atolositsoeng ha li ntse li kopana le lipehelo tse thata tseo liphutheloana tsa setso tsa ceramic li ke keng tsa li rarolla.

Strategic Positioning for Growth

Ha kopano ena e ntse e tsoela pele, bahlahisi ba lisebelisoa tsa elektroniki ba tsebang bokhoni ba PCB e kentsoeng ba tla hapa boleng bo ntseng bo hola ka har'a ketane ea phepelo. Theknoloji ha e eme feela ntlafatso e ntseng e eketseha empa ke tokiso ea mantlha ea kamoo litsamaiso tsa elektroniki li kopanyang mesebetsi ea semiconductor, passive, le interconnect. Likhamphani tse atlehileng ho kopanya sekhahla sa tlhahiso ea PCB le ho nepahala ha boemo ba ho paka li tla hlalosa moloko o latelang oa bokhoni ba sehlahisoa sa elektroniki.