Theknoloji ea HDI PCB: Ho nolofalletsa Litharollo tsa Packaging tse tsoetseng pele tsa Semiconductor

Selelekela: The Evolution Toward Higher Density Interconnects

Liphutheloana tsa semiconductor tsa sejoale-joale li hloka litharollo tse ntseng li eketseha tsa likhokahano tse rarahaneng. Ha li-geometri tsa chip li ntse li honyela 'me lipalo tsa I/O li ntse li phahama, liboto tsa potoloho tse hatisitsoeng tsa setso ha li khone ho ts'ehetsa ka mokhoa o lekaneng meralo ea liphutheloana e tsoetseng pele joalo ka sistimi-in-package (SiP), liphutheloana tsa chip-scale (CSP), le sephutheloana sa wafer-level level (FOWLP).

Theknoloji ea HDI PCB e rarolla lekhalo lena ka ho fana ka bophara ba mela e metle, e menyenyane ka meaho, le sekhahla se phahameng sa litsela se bapisoang le likaroloana tsa liphutheloana. Sengoliloeng sena se hlahloba kamoo mahlale a HDI le a Substrate-Like PCB (SLP) a kopanyang tlhahiso e tloaelehileng ea PCB le masela a substrate a IC, haholoholo bakeng sa bajari ba liphutheloana, likarolo tsa kabo bocha, le likhokahano tsa boemo ba chip.

E hlalosa HDI PCB, SLP, le IC Substrate Technologies

Metheo ea PCB ea High-Density Interconnect

HDI PCB e sebelisa li-microvia tse entsoeng ka ho cheka ka laser, mekhahlelo e latellanang ea ho haha, li-via tse foufetseng le tse patiloeng, le litlhophiso tsa via-in-pad. Hangata liboto tsena li na le bophara ba mela le libaka tse pakeng tsa 75/75 μm ho ea ho 40/40 μm, ka bophara ba microvia bo pakeng tsa 100-150 μm. Ts'ebetso ea ho haha ​​e eketsa mekhahlelo e tšesaane ea dielectric le ea koporo ka tatellano, e nolofalletsang ho tsamaisa lintho ka mokhoa o rarahaneng ka lintlha tse nyane tse hlokahalang bakeng sa lisebelisoa tsa mohala le lits'ebetso tsa k'homphieutha tse sebetsang hantle.

Substrate-Joaloka PCB: Ho Kopanya Mafatše a Mabeli

PCB e kang Substrate e nka sebaka sa moralo pakeng tsa HDI e tsoetseng pele le li-substrate tsa sephutheloana sa 'nete sa IC. SLP e boloka lits'ebetso tsa tlhahiso ea PCB tsa boemo ba phanele ha e ntse e fihlella li-geometri tsa mola/sebaka tse atamelang 20/35 μm ka lits'ebetso tse semi-additive (SAP). Mokhoa ona o fana ka bongata ba sehlopha sa substrate ka litšenyehelo tse tlase ho feta li-substrate tsa setso tsa IC, e leng se etsang hore e khahle lits'ebetsong tse hlokang bongata bo phahameng ba khokahano ntle le matsete a felletseng a boemo ba substrate.

Boemo ba Papiso ea HDI PCB Technologies

Maemo lipakeng tsa mahlale ana a bonts'a bokhoni bo ikhethang ba tlhahiso le meaho ea litšenyehelo:

• HDI PCB - E loketse likarolo tsa 50-100 μm ho sebelisa lisebelisoa le lits'ebetso tse tloaelehileng tsa PCB
• Substrate-joaloka PCB - E fihlella li-geometri tsa 20-35 μm ka ts'ebetso e fetotsoeng ea SAP ho lisebelisoa tsa phanele
• IC Package Substrates - E fana ka likarolo tse ka tlase ho 20 μm tse nang le lisebelisoa tse khethehileng tsa BT/ABF empa e hloka matsete a bohlokoa

SLP e fana ka tharollo ea lipakeng, lisebelisoa tse fetotsoeng tsa PCB ho atamela ts'ebetso ea substrate ha o ntse o boloka moruo oa PCB ka ts'ebetso ea phanele.

HDI PCB Sebopeho le Mekhoa ea Ts'ebetso

Haha-Up Architecture mefuta e fapaneng

Meaho ea sejoale-joale ea HDI PCB e sebelisa litlhophiso tse ngata ho latela litlhoko tsa bongata. Li-microvia tse nang le li-stacked li etsa likhokahano tse otlolohileng ka har'a mekhahlelo e mengata ea ho haha, li fokotsa sebaka sa ho tsamaisa lipontšo bakeng sa lebelo le phahameng. Meralo ea li-microvia tse sa tsitsang e aba khatello ea mechine le ho ntlafatsa ts'epo tlas'a potoloho ea mocheso, ha li-via tse patiloeng ka har'a lera la mantlha li nolofalletsa li-topologie tse rarahaneng tsa ho tsamaisa.

Sebopeho sa Laser Microvia ho HDI PCB

Ho cheka ka laser ho sebelisa CO₂ kapa mahlaseli a UV ho etsa li-microvias tse tebileng tse laoloang tse nang le li-diameter tse nyenyane joaloka 75-100 μm. Ts'ebetso ena e senya lisebelisoa tsa dielectric ho pepesa lipampiri tsa koporo tse ka tlase, tseo ka nako eo li nyenyefatsoang le ho etsoa ka tšepe ka ho beoa ha koporo e se nang motlakase e lateloang ke ho penta. Litekanyetso tsa Laser tse kenyelletsang matla a pulse, frequency, le focus li tlameha ho laoloa ka nepo ho thibela tšenyo ea substrate ha u ntse u netefatsa hore e hloekile ka sebopeho.

Mekhoa ea Semi-Additive le ea Keketso ka Botlalo

Lits'ebetso tsa semi-additive li etsa hore ho be le mehala e metle haholo lits'ebetsong tsa SLP ka ho beha likarolo tse tšesaane tsa peo ea koporo, ho sebelisa photoresist, le lipaterone tsa conductor pele ho tlosa koporo ea peo e feteletseng. Mokhoa ona o fihlella bophara ba 20-30 μm ha o bapisoa le 75-100 μm e tloaelehileng bakeng sa etching ea subtractive. Mekhoa e fetotsoeng ea SAP (mSAP) e tsoela pele ho ntlafatsa bokhoni bona, e atamela lijeometri tsa boemo ba substrate ha li ntse li boloka ho lumellana le lisebelisoa tse tloaelehileng tsa PCB.

Lisebelisoa tsa Material bakeng sa Likopo tse Tsoetseng Pele tsa HDI

Lisebelisoa tse phahameng tsa HDI PCB li hloka lisebelisoa tse nang le coefficient e laoloang ea katoloso ea mocheso (CTE), mocheso o tlase oa dielectric, le mocheso o phahameng oa phetoho ea likhalase (Tg). Mefuta e fetotsoeng ea FR-4 e nang le Tg e ka holimo ho 170 ° C e fana ka ts'ebetso e lekaneng bakeng sa lisebelisoa tsa elektronike tsa bareki, ha lifilimi tsa polyimide li fana ka botsitso bo phahameng ba mocheso bakeng sa mehaho e thata-thata. Lisebelisoa tsa BT le ABF li thusa meralo ea SLP ho fihlela thepa ea motlakase le ea motlakase e atamelang liphutheloana tsa sephutheloana.

Lintlha tsa HDI PCB Design bakeng sa Katleho ea Tlhahiso

Litlhaloso tsa Geometri le Ts'ebetso ea Motlakase

Melao ea moralo bakeng sa HDI PCB e tlameha ho ikarabella bakeng sa bophara ba mola le sebaka se ka finyelloang ha ho bapisoa le boima ba koporo le bokhoni ba ts'ebetso. Meralo e shebaneng le li-geometri tsa 40/40 μm e hloka koporo ea halofo ea ounce e nang le taolo e thata ea ho betla, ha meralo ea SLP e atamela 25/25 μm e hloka ts'ebetso ea SAP.

Taolo ea impedance e ba ea bohlokoa le ho feta ha litekanyo tsa trace li ntse li fokotseha, tse hlokang taolo e nepahetseng ea botenya ba dielectric le taolo ea boemo ba koporo. Litsela tse fapaneng tse fapaneng li tlameha ho ikarabella bakeng sa ho hokahana ho matla le ho ba le ts'enyeho e kholo ho crosstalk e haufi ha letsoalo le ntse le eketseha.

Tšepahalang ea Mocheso le Mechini

Kabo ea koporo e ama haholo leqephe la ntoa meahong ea HDI ka lebaka la ho se lumellane ha CTE lipakeng tsa thepa. Maano a ho etsa bonnete ba ho ts'epahala a kenyelletsa:

• Ho leka-lekanya koporo e lekanang - E abela boima ba koporo ho potoloha bohareng ba boto ho fokotsa ntoa
• E sisinyeha ka mekhoa - E fokotsa khatello ea maikutlo 'me e ntlafatsa botšepehi ba mochine
• Litsela tsa mocheso oa Via-in-pad - E fana ka phallo e tobileng ea mocheso ho tloha likarolong ho ea ho lifofane tsa matla a ka hare
• Li-microvia tse tletseng koporo - E nolofalletsa lipotoloho tse ngata tsa phepelo ntle le ho senyeha lits'ebetsong tsa BGA

Litšitiso tsa Ts'ebetso ea Phanele

Ho etsa liphanele ho thusa tlhahiso ea HDI PCB e theko e tlaase empa e hlahisa mathata a ts'oanang a le sieo tlhahisong ea substrate. Ho nepahala ha ho cheka ka laser ho fapana ho pholletsa le sebaka sa phanele, ho hloka taolo ea ts'ebetso ea lipalo-palo le ho lekanya maemo. Kabo ea botenya ba koporo ho liphanele tse kholo e ama ts'ebetso ea impedance, e hlokang meralo e hlokolosi e behang likarolo tsa bohlokoa ho fokotsa litlamorao.

Ho Kopana le Litlhoko tsa Packaging tsa Semiconductor le HDI PCB

Kopanyo e tsoetseng pele ea Pakete

Theknoloji ea HDI PCB e sebetsa e le sethala se nolofalletsang ho kopanngoa ha mefuta-futa meahong e tsoetseng pele ea ho paka. Ka har'a sephutheloana sa boemo ba fan-out, liboto tsa HDI li fana ka karoloana ea kabo-bocha e nang le likhokahano tsa boemo ba sephutheloana.

Bakeng sa kopanyo ea 2.5D, li-interposer tse phahameng tse hahiloeng ka theknoloji ea SLP li fana ka melemo ea litšenyehelo ho feta li-interposer tsa silicon bakeng sa lits'ebetso tse mamellang letsoalo le itekanetseng la matšoao. Li-substrates tsa mojule tse kenyelletsang likarolo tse ngata tsa ho shoa, tse sa sebetseng, le meaho e sirelletsang li itšetlehile ka bokhoni ba HDI ho fihlela li-I/O tse hlokahalang ka har'a mehato e kopanetsoeng.

Lisebelisoa tsa Mobile le tse Aparehang

Liboto tse kholo tsa li-smartphone li fana ka mohlala oa litlhoko tsa HDI PCB, hangata e nang le likarolo tse 8-12 tsa ho haha ​​​​tse nang le 50/50 μm line/geometries tsa sebaka tse tšehetsang likarolo tse theohelang ho 0.35 mm. Mehaho ea mofuta ofe kapa ofe oa HDI e etsa hore ho be le boikhethelo ka ho beoa, ho holisa bokhoni ba ho tsamaisa meralo e haelloang ke sebaka. Mehaho ea HDI e thata e kopanya likhokahano tse feto-fetohang ka har'a meaho e hahang, e tlosa likhokahano le ho fokotsa botenya ba kopano bakeng sa lisebelisoa tse aparoang le li-smartphones tse phuthoang.

Tiisetso ea Boleng le netefatso ea Ts'ebetso bakeng sa HDI PCB

Mekhoa e Bohlokoa ea Tlhahlobo

Taolo ea boleng bakeng sa tlhahiso ea HDI PCB e sebelisa mekhoa e mengata ea netefatso mehatong e fapaneng ea ts'ebetso:

• Tlhahlobo e ikatisang ea mahlo (AOI) - E netefatsa botšepehi ba mohlala oa conductor, ka ho nepahala ha ngoliso, le boleng ba ho qetela
• Tlhahlobo ea X-ray - E senola ka hare ka boleng ba sebopeho, ho kenyeletsoa ho tsoela pele ha moqomo le ho senyeha ho ka bang teng
• Tlhahlobo ea likarolo - E netefatsa ngoliso ea lera, botenya ba dielectric, ho ts'oana ha koporo ea koporo, le ka boleng ba sebopeho

Mekhoa ena e theha metheo ea bokhoni ba ts'ebetso ea bohlokoa bakeng sa tlhahiso e tšepahalang ea molumo oa meaho e rarahaneng ea HDI.

Teko ea Motlakase le Tšepahala

Litekanyo tsa ho hanyetsa lintlha tse 'nè li netefatsa ka ho tsoela pele ha ketane le khanyetso ea conductor ka har'a meeli e hlalositsoeng. Time-domain reflectometry (TDR) e tiisa li-profiles tsa impedance haufi le litsela tse mahlonoko tsa matšoao, e khethollang ho khaotsa ho tloha ka liphetoho kapa liphapano tsa geometry.

Ho palama libaesekele tse futhumetseng lipakeng tsa -55 ° C le 125 ° C bakeng sa 500-1000 cycles ho hatisa ho hokahana, ho senola mefokolo e patehileng ka ho khomarela barrel kapa pad-to-via interfaces. Teko e potlakileng haholo ea khatello ea maikutlo (HAST) mochesong o phahameng le mongobo e pepesa ho ba le monyetla oa ho etsa sebopeho sa anodic filament (CAF) ka li-geometri tse hlakileng.

Sebopeho sa Litšenyehelo le Lintlha tsa Ketane ea Phepelo

Boemo ba Moruo ba Litharollo tsa HDI PCB

Substrate-Joaloka PCB e fihlela phokotso ea 30-50% ha e bapisoa le li-substrates tsa IC tsa setso ka ho sebetsa ka phanele, lisebelisoa tse tloaelehileng tsa PCB, le meaho e teng ea tlhahiso e nang le lintlafatso tsa lisebelisoa tse lebisitsoeng. Leha ho le joalo, litšenyehelo tsa SLP li feta HDI e tloaelehileng ka 20-40% ka lebaka la litlhoko tse khethehileng tsa ho phunya laser, ts'ebetso ea SAP, le taolo e thata ea ts'ebetso. Tlhahiso ea molumo e fokotsa matsete a lichelete ho pholletsa le palo ea liphanele, e etsa hore HDI le SLP li khahle moruo bakeng sa lits'ebetso tse hlokang likete ho isa ho limilione tsa liyuniti selemo le selemo.

Litlhoko tsa Bokhoni ba Tlhahiso

Ho hlahisa HDI PCB e tsoetseng pele ho hloka lisebelisoa tsa ho cheka ka laser tse nang le taolo e nepahetseng ea botebo le ho nepahala ha maemo, bokhoni ba ho etsa li-ultra-fine line kapa SAP, le lisebelisoa tse ikemetseng tsa tlhahlobo ea optical tse khonang ho lemoha mefokolo ea sub-50 μm. Lintlha tsa ketane ea phepelo li kenyelletsa ho fumaneha ha lisebelisoa tsa dielectric tse nepahetseng, lifolakha tse tšesaane tsa koporo tse ka tlase ho botenya ba 12 μm, le lisebelisoa tse khethehileng tsa bokaholimo tse tsamaellanang le kopano ea molumo o hlakileng. Linako tse etellang pele hangata li tloha ho libeke tse 2-4 bakeng sa HDI PCB ha li bapisoa le libeke tse 6-10 bakeng sa li-substrates tsa sephutheloana.

Tsela ea Bokamoso ea HDI PCB Technology

Moeli o pakeng tsa PCB le IC substrate technologies o ntse o tsoela pele ho ba lerootho ha bokhoni ba tlhahiso bo ntse bo kopana. Lits'ebetso tsa semi-additive li ntse li tsoela pele ho lebisa tlhahiso ea likarolo tse ka tlase ho 20 μm, e leng phephetso ea sebaka sa setso sa substrate. Glass core substrates e hlahang bakeng sa lits'ebetso tsa khomphutha ea ts'ebetso e phahameng e matlafatsa ts'ebetso ea setaele sa PCB ha e ntse e fana ka ts'ebetso ea motlakase ea boemo bo tlase le botsitso ba sebopeho.

HDI PCB e tsoetseng pele e kenyelletsang lefu le kentsoeng, likarolo tse sa sebetseng, le lisebelisoa tse sebetsang ka har'a mekhahlelo ea ho haha ​​​​e emela moeli o latelang, ho fetola liboto tsa potoloho tse hatisitsoeng ho tloha liforomong tse hokahaneng tse sa sebetseng ho ea ho likoloi tse kopanyang tsamaiso. Ha liphutheloana tsa semiconductor li ntse li tsoela pele ho ea ho meralo ea li-chiplet le kopanyo e fapaneng, mahlale a HDI le a SLP a tla bapala karolo e ntseng e eketseha ea mantlha ho nolofalletsang litharollo tsa likhokahanyo tse theko e tlaase, tse sebetsang hantle haholo.

fihlela qeto e

Theknoloji ea HDI PCB e fetohile ho tloha ho bokhoni bo khethehileng ho ea ho tharollo e tloaelehileng bakeng sa liphutheloana tse tsoetseng pele tsa semiconductor le lisebelisoa tsa elektronike tse phahameng haholo. Khokahano ea PCB le lits'ebetso tsa tlhahiso ea substrate ka mekhoa ea Substrate-Like PCB e fa baqapi likhetho tse feto-fetohang ho tloha ho HDI ea setso ho isa maemong a ts'ebetso a haufi-ufi. Ha bophara ba mela bo ntse bo fokotseha 'me meralo ea liphutheloana e ntse e rarahana le ho feta, HDI PCB e tla lula e le bohlokoa bakeng sa ts'ebetsong e bolokang chelete e ngata ea lihlahisoa tsa elektroniki tsa moloko o latelang.

Highleap Electronics: Molekane oa Hao oa Advanced HDI PCB Manufacturing

Highleap Electronics e fana ka litharollo tse felletseng tsa HDI PCB le kopano tse etselitsoeng lits'ebetso tsa ho paka tsa semiconductor:

• Bokhoni ba HDI bo tsoetseng pele - Ho cheka ka Laser microvia, ts'ebetso ea lera, le meaho efe kapa efe ea HDI e tšehetsang lijeometri ho fihlela ho 30/30 μm
• Setsebi sa Substrate-Joaloka PCB - Ts'ebetsong ea ts'ebetso ea semi-additive bakeng sa sebopeho sa mela e metle haholo e atamelang li-substrate-grade densities
• Litšebeletso tse kopanetsoeng tsa kopano - Ho beoa ha BGA ka mokhoa o hlakileng, ho kenya likarolo, le kopano e thata-thata ka tlas'a marulelo a le mong.
• Netefaletso ea boleng - Liprothokholo tsa tlhahlobo tse felletseng tse kenyelletsang AOI, X-ray, tlhahlobo ea likarolo tse fapaneng, le tlhahlobo ea ts'epo.
• Tšehetso ea moralo - Tlhahlobo ea DFM le ts'ebeliso ea li-stack-up ho netefatsa ts'ebetso le ts'ebetso

Ikopanye le sehlopha sa rona sa boenjiniere ho buisana ka hore na bokgoni ba rona ba tlhahiso ya HDI PCB bo ka potlakisa ntshetsopele ya sehlahiswa sa hao jwang le ho ntlafatsa ketane ya hao ya phepelo bakeng sa ditshebediso tse tswetseng pele tsa ho paka.