Boima ba Koporo ea Koporo ea PCB: Ts'ebetso ea Teknoloji le Taolo e Tšoanang

Kenyelletso ea Litlhoko tsa ho Plating tsa Koporo e Matla ea Koporo

Ho maneha ha PCB ea koporo e boima, e hlalosoang e le botenya ba koporo ba 3oz (105μm) kapa ho feta, ho fetohile habohlokoa bakeng sa lisebelisoa tsa motlakase, li-inverter, liteishene tsa ho tjhaja tsa EV le litsamaiso tsa taolo ea indasteri. Lisebelisoa tsena li hloka bokhoni bo ikhethang ba ho jara motlakase le tsamaiso ea mocheso eo boima bo tloaelehileng ba koporo bo ke keng ba e fana.

Ts'ebetso ea electroplating e sebetsa e le mohato oa bohlokoa oa ho fihlela kabo ea koporo e ts'oanang ho pholletsa le libaka tse holim'a metsi le meaho ea lesoba. Bakeng sa lisebelisoa tsa ho fetola matla tse sebetsang ka maqhubu a phahameng, likarolo tsa koporo tsa 6oz (210μm) kapa esita le 10oz (350μm) li boloka mocheso o amohelehang le ho thibela ho theoha ha motlakase. Phephetso ke ho boloka ts'ebetso ea junifomo ho pholletsa le li-geometri tse rarahaneng tse kenyelletsang likarolo tse phahameng tsa karo-karolelano le lifofu.

Maikutlo a Motheo a Koporo e Matla ea Koporo ea PCB

Ho utloisisa phapang pakeng tsa metallization ea pele ho plating le ho bokellana ha koporo ka electrolytic ho theha motheo oa ts'ebetso e boima ea PCB ea koporo . Lera la pele la conductive le fana ka motheo oa ho teteana ha electrolytic ka mor'a moo, ka boholo ba lisebelisoa tsa tlhahiso tse sebelisang litsamaiso tsa electrolyte tsa acid copper sulfate.

Electroless vs Electrolytic Copper

Koporo e se nang motlakase e theha conductivity ea pele ho li-substrates tse se nang conductive, ho kenya 0.5-1.5μm. Mokhahlelo oa electrolytic heavy copper plating ebe o theha botenya ba sepheo ka phokotso ea electrochemical e laoloang, hangata e lelefatsa lihora tse 'maloa ho latela boima ba hajoale.

Mokhoa oa ho Plating oa Koporo oa Boima oa Koporo

Tatelano e feletseng ea electroplating e tiisa ho khomarela le ho ajoa ka mokhoa o ts'oanang ka mokhoa o hlophisitsoeng le mekhahlelo ea ho beha.

Phekolo ea Pele le Ts'ebetso

Ho lokisoa ha bokaholimo ho ama ka kotloloho ho khomarela koporo ka har'a PCB e boima ea koporo. Alkaline degreasing e tlosa masalla a organic ha sulfuric acid micro-etching e etsa hore ho be le mafika a holimo. Mapolanka a tlameha ho kolobisoa ka ho feletseng 'me a hloke lipululana tsa moea, haholo-holo ka har'a masoba, ho thibela sebopeho se se nang letho.

Electrolytic Copper Buildup

Ts'ebetso ea mantlha ea koporo e boima e boloka maemo a laoloang:

• Taolo ea mocheso - 20-28 ° C e ntlafatsa sekhahla sa deposition le ho leka-lekana ha matla.
• Khopolo ea koporo - 60-80g / L e boloka ho fumaneha ha ion e lekaneng nakong ea lipotoloho tse atolositsoeng.
• Boemo ba asiti - 180-220g / L sulfuric acid e etsa bonnete ba hore tharollo e nepahetseng ea conductivity.
• Boima ba hona joale - 15-35 ASF (1.6-3.8 A/dm²) e lekanya sekhahla sa deposition le litlhoko tsa ho tšoana.

Ho hloekisoa ka mokhoa o tsoelang pele le kalafo ea khabone ho boloka ho leka-lekana ho tlatselletsang le ho tlosa tšilafalo e itseng ho pholletsa le nako ea lihora tse ngata tsa deposition.

Kalafo ea Post-Plating

Ka mor'a ho kenngoa ha koporo, liboto li hlatsuoa ka ho feletseng ho tlosa lik'hemik'hale tse hulang. Ho omisa hantle ho thibela matšoao a metsi le oxidation e ka senyang mehato e latelang ea ts'ebetso.

Mekhahlelo ea bohlokoa ka ho Plating ea Koporo e Matla ea Koporo

Boima ba hona joale bo emela phapang ea bohlokoa ka ho fetesisa e amang ho ts'oana ha PCB e boima ea koporo. Amperage e phahameng e potlakisa ho beoa empa e mpefatsa kabo e sa tšoanelang, haholo-holo mathōkong a boto moo motlakase o kenang teng.

Khetho ea Waveform bakeng sa Koporo e Boima

Pulse plating le pulse-reverse plating li ntlafatsa ka mokhoa o ts'oanang botenya ha bo bapisoa le ts'ebetso e tobileng ea hajoale. Nakong ea nako ea ho phomola, li-ion tsa koporo tse senyehileng li tlatsana ka ho hasana, ho fokotsa polarization ea mahloriso.

Li-pulse tse khutlisetsang morao li qhala li-depositi tse hlahelletseng, li theha boemo bo holimo ka tekanyo e phahameng ea likarolo. Mekhoa e tloaelehileng ea pulse e kenyelletsa ka nako ea 5-20ms, nako ea nako ea 2-10ms, le morao-rao ho 10-30% ea morao-rao bakeng sa liphello tse nepahetseng tsa koporo e boima ea PCB.

Khuduego le Phetisetso ya Bongata

Sekhahla sa phallo ea tharollo se laola ka ho toba sekhahla se fokolang sa hona joale sebakeng sa cathode. Ho ferekana ha mechini, ho phatloha ha moea, kapa litsamaiso tsa matichere li fokotsa botenya ba moeli oa phallo, e lumellang litheko tse phahameng tsa ho pola ntle le ho senya matla.

Bakeng sa lisebelisoa tse boima tsa koporo tse hlokang linako tse atolositsoeng tsa plating, litsamaiso tse matla tsa ho ferekana li thibela li-gradients tsa botenya lipakeng tsa setsi sa boto le periphery.

Organic Additive Chemistry

The carrier-brightener-leveler additive system e fana ka taolo ea microstructural nakong ea kopo ea koporo. Limolek'hule tse tsamaisang li khothaletsa lipalangoang tse tšoanang tsa koporo ea koporo, li-lighteners li potlakisa ho beoa libakeng tse theohileng, 'me li-level li thibela ka ho khetheha libaka tse nang le sekhahla se phahameng. Ho leka-lekana ha synergistic pakeng tsa likarolo tsena tse tharo ho etsa qeto ea sebopeho sa lijo-thollo le ho lumellana ha boemo ba micro-level ho bohlokoa bakeng sa likarolo tse boima tsa koporo.

Bath Chemistry Stability

Copper ion concentration le sulfuric acid ratio e tlameha ho lula e le ka har'a tlhophiso ho pholletsa le nako ea lihora tse ngata tse boima tsa koporo. Ho sebetsa hantle ha anode, mouoane, le ho hula li ntse li tsoela pele ho fetola sebopeho sa bate, e hlokang lisebelisoa tse ikemetseng tsa ho noa le tlhahlobo ea kamehla ea tlhahlobo.

Taolo e Tšoanang ka Koporo e Matla ea Koporo ea PCB

Ho fihlella kabo e ts'oanang ea koporo ho liphanele tse kholo ho hloka ts'ebetso e hlophisitsoeng e sebetsanang le phapang ea botenya ho tsoa ho litebello tse kholo le tse nyane haholo.

Phethahatso ea Pulse-Reverse Plating

Maqhubu a pulse-reverse a bonts'a molemo o khethehileng oa ho tlatsa liboto tse boima tsa koporo. Ho fetisetsa koporo pele ka hanong, ha morao-rao o tlosa li-deposit tsena tse khethehileng.

Sena se ntlafatsa karo-karolelano ea botenya bo tlase ho isa ho bula ho tloha ho 60-70% e tloaelehileng le DC ho isa ho 85-95% ka liprothokholo tse ntlafalitsoeng tsa pulse-reverse. Mekhahlelo e khothalelitsoeng e kenyelletsa 20-30 ASF pele hona joale, 3-5 ASF reverse current, le lipotoloho tsa mosebetsi ho pota 70-80%.

Mekhoa ea Ntlafatso ea Acoustic

Matla a Ultrasonic kapa a megasonic a sebelisoang nakong ea koporo e boima ea PCB e senya moeli oa moeli ka katleho ho feta ho ferekanngoa ha mechine feela. Theknoloji ena e ipaka e le ea bohlokoa ka ho khetheha bakeng sa li-microvias tse foufetseng le karo-karolelano e phahameng ka likoti moo ho ferekanngoa ho tloaelehileng ho ke keng ha phunyeletsa. Phello ea acoustic ea ho phallela e ntlafatsa lipalangoang tsa ion ea koporo ha e ntse e ntša li-bubble tsa hydrogen tse qabeletsoeng.

Cathode Shielding Strategy

Ho beha lithebe tse sireletsang tšireletso haufi le mathōko a boto ho fokotsa sets'oants'o se feteletseng sa hona joale libakeng tse phahameng. Shield geometry e hloka ntlafatso ea matla bakeng sa meralo e ikhethileng ea liphanele, athe sebaka sa anode-to-cathode le phetolo ea anode ea nako le nako e thibela phapang ea kabo ea koporo.

Keketso Monitoring Systems

Cyclic voltammetric stripping kapa UV-bonahalang spectroscopy thusa ho latedisa maemo a organic additive. Bakeng sa matšolo a boima a koporo a nkang lichifi tse ngata, taolo ea tlatsetso e ikemetseng e fokotsa haholo phapang ea botenya lipakeng tsa tlhahiso ea pele le ea morao.

Taolo e Tšoanang ka Koporo e Matla ea Koporo ea PCB

Ho fihlella kabo e ts'oanang ea koporo ho liphanele tse kholo ho hloka ts'ebetso e hlophisitsoeng e sebetsanang le phapang ea botenya ho tsoa ho litebello tse kholo le tse nyane haholo.

Phethahatso ea Pulse-Reverse Plating

Maqhubu a pulse-reverse a bonts'a molemo o khethehileng oa ho tlatsa liboto tse boima tsa koporo. Ho fetisetsa koporo pele ka hanong, ha morao-rao o tlosa li-deposit tsena tse khethehileng.

Sena se ntlafatsa karo-karolelano ea botenya bo tlase ho isa ho bula ho tloha ho 60-70% e tloaelehileng le DC ho isa ho 85-95% ka liprothokholo tse ntlafalitsoeng tsa pulse-reverse. Mekhahlelo e khothalelitsoeng e kenyelletsa 20-30 ASF pele hona joale, 3-5 ASF reverse current, le lipotoloho tsa mosebetsi ho pota 70-80%.

Mekhoa ea Ntlafatso ea Acoustic

Matla a Ultrasonic kapa a megasonic a sebelisoang nakong ea koporo e boima ea PCB e senya moeli oa moeli ka katleho ho feta ho ferekanngoa ha mechine feela. Theknoloji ena e ipaka e le ea bohlokoa ka ho khetheha bakeng sa li-microvias tse foufetseng le karo-karolelano e phahameng ka likoti moo ho ferekanngoa ho tloaelehileng ho ke keng ha phunyeletsa. Phello ea acoustic ea ho phallela e ntlafatsa lipalangoang tsa ion ea koporo ha e ntse e ntša li-bubble tsa hydrogen tse qabeletsoeng.

Cathode Shielding Strategy

Ho beha lithebe tse sireletsang tšireletso haufi le mathōko a boto ho fokotsa sets'oants'o se feteletseng sa hona joale libakeng tse phahameng. Shield geometry e hloka ntlafatso ea matla bakeng sa meralo e ikhethileng ea liphanele, athe sebaka sa anode-to-cathode le phetolo ea anode ea nako le nako e thibela phapang ea kabo ea koporo.

Keketso Monitoring Systems

Cyclic voltammetric stripping kapa UV-bonahalang spectroscopy thusa ho latedisa maemo a organic additive. Bakeng sa matšolo a boima a koporo a nkang lichifi tse ngata, taolo ea tlatsetso e ikemetseng e fokotsa haholo phapang ea botenya lipakeng tsa tlhahiso ea pele le ea morao.

Mefokolo e Tloaelehileng ho Heavy Copper PCB Plating

Tlhahlobo ea Phapang ea Botenya

Limmapa tsa botenya ba phanele li senola mekhoa e amanang le kabo ea hajoale. Li-gradients tse bohareng ho isa bohareng li bonts'a matla a sa lekaneng a ho akhela kapa pherekano, athe liphapang tse hlophisehileng lipakeng tsa li-circuits tsa kahare le kantle li fana ka maikutlo a mathata a ho hanyetsa rack. Tlhahlobo ea likarolo tse fapaneng ea mabota e tiisa ts'ebetso ea matla a ho akhela, ka mekhoa e amohelehang ea koporo e boima e fihlelang bonyane 70% ea botenya ka lebitso ka litsi.

Thibelo ea ho Hlophisa Lefeela

Likheo tsa koporo e boima hangata li bakoa ke moea o koaletsoeng kapa khase ea haedrojene ka har'a masoba. Kalafo ea vacuum ea pele ho plating e kopantsoeng le tlatsetso ea ho kolobisa e fokotsa haholo mokhoa ona oa sekoli. Bakeng sa meaho ea likarolo tse phahameng, ho fokotsa sets'oants'o sa hajoale nakong ea metsotso e 15-20 ea pele ho fokotsa ho fetoha ha khase pele koporo e tlala.

Litheknoloji tse tsoetseng pele tsa Copper Plating

Pulse-reverse plating e emela tsoelo-pele e kholo ka ho fetesisa ea matla a koporo a PCB. Ho fapana le plating e tloaelehileng ea DC moo botlaaseng bo fumanang mohlomong 60% ea botenya ba ho bula, lits'ebetso tse ntlafalitsoeng hantle tsa pulse-reverse li fihlella 90% ka li-ratios tsa ho tlatsa esita le ka likarolo tsa 8: 1 kapa ho feta.

Megasonic-Thusa Deposition

High-frequency acoustic energy (0.8-2.0 MHz) e theha litlamorao tse nyane tse kenang ka har'a lifofu le likarolo tsa molumo o motle. Theknoloji ena e ba ea bohlokoa ka ho khetheha bakeng sa liboto tsa HDI tse hlokang koporo e boima holim'a likarolo tse ka ntle tse kopantsoeng le mela e metle ea ka hare. Phetisetso ea bongata e matlafalitsoeng e lumella litheko tse phahameng tsa 30-50% ha li ntse li boloka metrics e ts'oanang.

Taolo ea Ts'ebetso e Bohlale

Li-rectifiers tsa sejoale-joale li kenyelletsa taolo ea nako ea nnete e thehiloeng ho voltage ea lisele, kabo ea hajoale, le litekanyo tsa ho thibela ho hlapa. Litsamaiso tsena ka tsela e iketsang fetola dipholo tsa meedi ho lefella bateng botsofali le ho feto-fetoha ha mocheso. Bakeng sa mosebetsi o boima oa koporo o hlokang lipotoloho tsa lihora tse 4-8, taolo ena e ikamahanyang le maemo e boloka liphetho tse tsitsitseng ho pholletsa le lihlopha tsa tlhahiso.

Mekhoa e Khethehileng ea Additive

Lintlafatso tsa morao-rao tsa k'hemistri li shebane le liphephetso tse matla tsa koporo joalo ka likarolo tse feteletseng kapa li-depositi tse teteaneng haholo. Meetso ena hangata e kenyelletsa li-agent tse lekanyang tse ngata tse nang le boima ba limolek'hule tse fapaneng ho sebetsana le bofokoli bo bonyenyane le kabo e kholo, ka litsamaiso tse ling tsa thepa li tseka ka matla a ho tlatsa likarolo tse fetang 12: 1.

Taolo ea Boleng bakeng sa Plating ea Koporo e Matla ea Koporo

Tlhahlobo ea X-ray fluorescence e fana ka tekanyo e potlakileng ea botenya bo sa senyeheng libakeng tse ngata, e hlahisa limmapa tsa botenya tse senolang litaba tse tšoanang. Lisebelisoa tsa morao-rao tsa XRF tsa letsoho li fihlella ho nepahala ha ± 2μm, tse lekaneng bakeng sa taolo ea ts'ebetso ea likarolo tsa koporo tsa 3-6oz.

Tlhahlobo ea Microsection

Microscopy ea likarolo tse fapaneng e ntse e le mokhoa o hlakileng oa ho lekola ka ho tlatsa le ho khomarela lera ka har'a PCB e boima ea koporo. Tekanyo libakeng tse emeng e lekanya ts'ebetso ea matla a ho akhela, ka mekhoa e amohelehang e bonts'ang bonyane ka botenya ba lebota ba 70% ka lebitso bakeng sa likarohano tse tloaelehileng, e nyolohela ho 60% bakeng sa lijeometri tse mabifi.

Netefatso ea Motlakase

Tekanyo ea ho hanyetsa lintlha tse 'nè e tiisa ho tsoela pele ha koporo le ho lemoha mefokolo e phahameng ea ho hanyetsa e bakoang ke ho se phethehe ka ho tlatsa. Bakeng sa lits'ebetso tsa motlakase oa motlakase, ho palama baesekele e futhumatsang hammoho le tlhahlobo ea khatello ea maikutlo e bonts'a mathata a ipatileng. Meeli ea litlhaloso hangata e kenyelletsa litekanyetso tse phahameng tsa khanyetso le phetoho e lumelletsoeng ea khanyetso kamora ho pepeseha tikolohong.

Tsamaiso ea Ts'ebetso ea Lipalopalo

Tlhokomelo e tsoelang pele ea botenya libakeng tse hlalositsoeng tsa liteko ho thusa ho lemoha kapele ha ts'ebetso e ntse e hoholeha lits'ebetsong tse boima tsa koporo:

• Karolelano ea bohareng ho isa bohareng - Lipina tse lahlelang botsitso ba matla le katleho ea ho ferekana.
• Karolelano ea botenya - E lekola sekhahla sa ho beoa ka kakaretso le botsitso ba ts'ebetso ea bateng.
• Ho kheloha maemo a botenya - E bontša ho tšoana ho pholletsa le sebaka sa marang-rang.
• Ka ho tlatsa peresente - E netefatsa katleho ea pulse plating bakeng sa meaho ea lesoba.

Lits'oants'o tsa taolo li fana ka maikutlo a ka sebelisoang bakeng sa litlhophiso tsa ho lokisa, ho tlatsa, le kemiso ea tlhokomelo.

Ntlafatso e sebetsang ea Heavy Copper Plating

Moetsi oa module oa matla o nang le sekhahla sa 15% se se nang letho ho 8: 1 karo-karolelano ka ho sebelisa vacuum pre-wetting bakeng sa metsotso e 5 ho 25 inches mercury, pulse-reverse waveform e nang le maqhubu a 25/5 ASF pele / morao, le ho atolosoa ha karolo ea pele e tlase ho 10 ASF bakeng sa metsotso e 30. Motsoako ona o fokotsitse liketsahalo tse se nang letho ho ba ka tlase ho 2% ha o ntse o boloka sepheo sa 6oz sa botenya ba koporo.

Khalemelo ea Botenya ba Edge

Tekanyo ea botenya e bonts'itse 35% koporo e phahameng ho liphanele tse bapisoang le setsi ho plating ea 10oz. Patlisiso ea sesosa e bonts'a hore ho na le letsoalo le feteletseng la hona joale ka lebaka la litlamorao tse phahameng. Ho kenya lithebe tsa HDPE tse atolosang 20mm ho tloha mahlakoreng a phanele le ho fokotsa kakaretso ea hona joale ka 12% kabo e lekanang ka hare ho ± 8% ho pholletsa le sebaka sa phanele.

Additive Optimization Results

Setsi sa HDI se loantšanang le li-deposit tse ka har'a likarolo tse ka ntle tsa koporo tse 4oz se kentse tšebetsong tlhahlobo ea tlatsetso ea voltammetric. Patlisiso e bonts'itse ho fokotseha ha mokelikeli nakong ea li-plating tse atolositsoeng. Ho theha kemiso e tsoelang pele ea ho eketsoa ka 15 mL / hora ho felisitse bofokoli ba bofokoli ha khanya le boemo ba boemo bo ntse bo tsitsitse.

fihlela qeto e

Katleho e boima ea koporo ea koporo ea PCB e hloka tlhokomelo e hlophisitsoeng ho kabong ea hona joale, phetisetso ea bongata, le ho leka-lekana ha lik'hemik'hale ho pholletsa le lipotoloho tse atolositsoeng tsa deposition. Phetoho ho tloha ho DC ho ea ho pulse kapa pulse-reverse waveforms e fana ka ntlafatso ea bohlokoa ka ho fetesisa, haholo bakeng sa phephetso ka lijeometri. Ha e kopantsoe le moralo o nepahetseng oa pherekano, tlhahlobo e tlatselletsang, le maano a ho sireletsa, lits'ebetso tsa sejoale-joale tsa ho rala li hlahisa likarolo tsa koporo tsa 3-10oz tse kopanang le litlhoko tsa lisebelisoa tsa motlakase tsa motlakase.

Hobaneng U Khetha Highleap Electronics Joalo ka Molekane oa Hao?

Highleap Electronics e boloka boitseanape bo felletseng ba PCB ea koporo e boima ea ho roala lits'ebetso tse fapaneng tsa lisebelisoa tsa elektroniki:

• Tsamaiso ea ts'ebetso - Sistimi e tsoetseng pele ea pulse-reverse plating e nang le tlhahlobo ea nako ea nnete bakeng sa 3oz ho isa ho 10oz koporo e behiloeng.
• Netefaletso ea boleng - 'mapa oa botenya ba XRF le tlhahlobo ea microsection e netefatsang lintlha tse lumellanang.
• Tšehetso ea tekheniki - Therisano ea boenjiniere bakeng sa kabo e nepahetseng ea koporo e ipapisitseng le lijeometri tse ikhethileng tsa boto.
• bokgoni ba Production - Bokhoni ba ho etsa lintho tse ngata tse nang le taolo ea ts'ebetso ea lipalo-palo le traceability ea batch.
• ditokomane - Lintlha tse qaqileng tsa kabo ea koporo le tlhahlobo ea likarolo tse fapaneng bakeng sa litlhoko tsa mangolo.

Ikopanye le sehlopha sa rona sa boenjiniere mabapi le litlhoko tsa hau tse ikhethileng tsa boto le boima ba koporo bo reretsoeng bakeng sa likhothaletso tse qaqileng tsa ts'ebetso le tlhahlobo ea bokhoni ba tlhahiso ea sampole. Re fana ka litokomane tse felletseng tsa tekheniki tse tšehetsang netefatso ea moralo oa hau le lits'ebetso tsa mangolo a thuto.